Ohmite FC4T Series Data Sheet
FC4T Series
100
Percent Rated Power
Ambient Temperature, °C
60
20
0
80
40
0
-55°
70°
155°
150175°50-75 -50 100
Alumina Substrate
Electrode (Cu+Ni+Sn)Epoxy resin
protection coat
Epoxy resin marking
Cu-alloy resistor
165°~180°
F
Metal Foil Low Value Chip
The FC4T chip features four terminals, also known
as a “Kelvin” configuration. This configuration
enables current to be applied through two opposite
terminals and a sensing voltage to be measured
across the other two terminals, eliminating the resistance and temperature coefficient of the terminals
for a more accurate current measurement. Ohmite’s
proprietary Metal Foil technology offers an excellent
Temperature Coefficient of Resistance (TCR) even
for very low resistance values ( down to 50ppm).
SERIES SPECIFICATIONS
Power Resistance
Pkg. Rating Range TCR
Series Size (W @70°C) (Ω) (ppm/°C) Tolerance
FC4T 1206 0.5W 0.005-0.100 50ppm 0.5%, 1%
Construction
12
Resistance
Operating Temp. Range
Rated Power
Resistance Tolerance
Temperature Coefficient
Coating Material
Terminals
Max. Current
Res. of Electrodes
CHARACTERISTICS
0.005-0.100
-55°C to +155°C
0.5 watt
0.5% and 1% standard
within ±50ppm, ±100ppm for 5mΩ
Epoxy resin
Cu/Ni/Sn
√(Max. power÷ Resistance value)
<5mΩ
Derating
Peeling Strength of Seal Tape
F = Peel-back force: 0.1 - 0.7N (10 - 71gf)
(continued)
FC4T Series
W
1
A
N
A
B
P
P
2
D
0
E
F
W
D
1
P
T
K
T
1
Direction
of feed
W
a
g
b
c
d
e
L
t
f
FC4TR010DER
Series
Tolerance
F= 1%
D=0.5%
Ohms
Tape & Reel
5000/reel
RoHS Compliant
V = sensing terminal
(voltage)
I = current terminal
VV
II
Metal Foil Low Value Chip
PERFORMANCE CHARACTERISTICS
Test Items Performance Test Methods
Short time overload
High Temp. Exposure
Low Temp. Storage
Moisture Load Life
Thermal Shock
Load Life at 70ºC
Solderability
Resistance to Solder Heat
Mechanical Shock
Substrate Bending
(mm ±0.2)
±(1.0%+0.5mΩ) P= 2.5Pr; T=25 ±2ºC, t=5sec.; IEC60115-1 4.13
±(1.0%+0.5mΩ) T=+170 ±2ºC; t=1000h; IEC60115-1 4.25
±(1.0%+0.5mΩ) T=-55 ±2ºC; t=1000h; IEC60115-1 4.25
±(2.0%+0.5mΩ) Vtest=Vmax; T=60 ±2ºC; RH=95%; t= 90min ON, 30min OFF, 1000h; IEC60115-1 4.25
(60℃, 95%RH)
±(1.0%+0.5mΩ) -55ºC 30min. / R.T. 3min. / +150ºC 30min. / R.T. 3min ], 100cycles; IEC60115-1 4.19
±(2%+0.5mΩ) Vtest=Vmax; T=70 ±2ºC; t=90min ON; IEC60115-1 4.25
The covered area >95% Dip into solder at T=245 ±5ºC, t=3 ±0.5sec.; IEC60115-1 4.17
±(1.0%+0.5mΩ) Through Reflow T=275 ±5ºC, t=20 ±1sec.; IEC60115-1 4.18
±(1.0%+0.5mΩ) a=100G, t=11ms, 5 times shock; IEC60115-1 4.21
±(1.0%+0.5mΩ) Span between fulcrums 90mm; bend width 2mm; test board glass-epoxy;
Thickness=1.6mm; IEC60115-1 4.33
DIMENSIONS
Schematic
Layout for
illustration only,
part can be
rotated 180°
without effect to
the circuit.
Part L W a b c t d e f g
FC4T 3.2 1.6 0.6 0.55 0.3 0.6 1.10 0.30 1.2 1.8
Tape and Reel
A 178 ±5
N 60 ±2
W1 9 ±1
Part W P P2 A B D0 F E T T1 K
FC4T 8.00 ±0.30 4.00 ±0.10 2.00 ±0.10 2.05 ±0.20 3.65 ±0.20 1.50 ±0.10 3.50 ±0.10 1.75 ±0.10 0.20 ±0.10 Max. 0.1 0.85 ±0.20
ORDERING INFORMATION
Standard Part Numbers
1%
FC4TR005FER
FC4TR010FER
FC4TR015FER
FC4TR050FER
FC4TR100FER
0.5%
FC4TR010DER
FC4TR015DER
FC4TR050DER
FC4TR100DER
rev 1/18-3
13
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