Octek Hippo DCA2 User Manual

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USER'S MANUAL
HIPPO DCA 2
VESA LOCAL BUS MOTHERBOARD
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Hippo DCA2 486
486 VESA Local Bus Motherboard
User’s Manual
Version 2.25 December 1994
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Copyright Notice
Copyright 1994 Ocean Information Systems, Inc. All rights reserved. Ocean Information Systems, Inc. 688 Arrow Grand Circle Covina, CA 91722 Printed in the Hong Kong
All of the information contained in this manual is copyrighted and all rights reserved. No part of this document, in whole or in part, may be reproduced or copied in any form without prior consent in writing from Ocean Information Systems, Inc. _____________________________________________________________________________________
Limited Warranty
Buyer agrees that if this product has any defects, Ocean Information Systems, Inc. (OISI) is only obligated to replace or refund the purchase price for a period of one year from date of purchase. OISI is not liable for any loss, direct or indirect, that may be incurred as a result of any defects. The warranty does not cover any loss or damage caused by shipping, improper installation or maintenance, or any repairs made by anyone other than an authorized Ocean service center. _____________________________________________________________________________________
Limitations of Liability
While the information in this manual has been carefully reviewed and is believed to be accurate, OISI assumes no responsibility in the event that any inaccuracies are found. In no event shall OISI be held liable for any loss or expenses whether directly or indirectly caused by the support materials provided with this product. It is further acknowledged that OISI is under no obligation to update the manual or to notify purchasers of any forthcoming updates. _____________________________________________________________________________________
Trademarks
AMD is a registered trademark of Advanced Micro Devices AMI is a trademark of American Megatrend, Inc. Fasmath is a registered trademark of Cyrix Corporation Intel i386, i486, i486SX, i486DX, i486DX2 and Intel are registered trademarks of Intel Corporation. MS-DOS, Xenix, Windows and Microsoft are registered trademarks of Microsoft Corporation. MR BIOS is a trademark of Microid Research, Inc. Novell is a registered trademark of Novell, Inc. Octek is a registered trademark of Ocean Information Systems, Inc. OPTi is a registered trademark of OPTi Inc. Unix is a registered trademark of American Telephone and Telegraph Company Bell Laboratories. VESA and VL-Bus are registered trademarks of Video Electronic Standard Association. XT, AT, PS/2, OS/2, & IBM are registered trademarks of International Business Machines Corporation.
All other brand and product names mentioned in this manual are trademarks or copyrights of their respective holders.
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Preface
About the Hippo DCA2
Thank you for purchasing the Hippo DCA2, Ocean Information Systems’new top-of-the­line 486 motherboard. The Hippo DCA2 utilizes DynamiCache, an innovative cache memory technology that takes personal computing to a new level of performance.
DynamiCache was designed to eliminate bottlenecks between the CPU and the memory bank. It does this by replacing traditional DRAM and external L2 cache with a memory bank that runs at CPU speed. With entire memory running at CPU speed the processor can handle multitasking just as easily as it handles single applications.
About the Manual
The content of this manual is for reference only and is intended to provide basic information for the general user. Technical information is also included in the Appendix for hardware and software engineers.
This manual provides information about the installation and maintenance of the Octek Hippo DCA2 motherboard. In-depth explanations concerning the functions and features of this motherboard are provided. Chapter 1 is designed to give the user an overview of DynamiCache, including an in-depth explanation of what it is as well as how it works. Chapter 2 describes the features of the Hippo DCA2 motherboard. It provides important information regarding the main memory system, ISA and VESA slots, the BIOS, and the CPUs supported. Refer to Chapter 3 for instructions on how to setup and install the motherboard. This chapter includes the necessary data for properly setting the pin connectors. Requirements for setting up the BIOS are listed in Chapter 4. An Appendix is also included that provides address maps as well as advanced technical information for hardware and software professionals.
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Table of Contents
Preface.................................................................................................... iii
Chapter 1: DCA2 System Overview
1.1 What is DCA2 ? ..................................................................................................1
1.2 What makes DCA2 so powerful ?.......................................................................1
1.3 What is DynamiCache ? ......................................................................................1
1.4 Why is DCA2 a better choice ? ...........................................................................1
1.5 User advantages of DCA2...................................................................................2
1.6 Technical advantages of DCA2...........................................................................2
1.7 DynamiCache Description ..................................................................................3
1.8 DynamiCache Architecture ................................................................................3
1.9 Distributed Cache ................................................................................................4
1.10 DynamiCache Applications.................................................................................4
1.11 Application Overhead and its effect on External Cache .....................................4
1.12 External Cache Saturation Problem ....................................................................5
1.13 DynamiCache Excels and External Cache Suffers Under
Heavy Processing Loads .....................................................................................5
1.14 Target Operating Environments ..........................................................................5
1.15 L2/ DCA2 Cache Efficiency Versus Application Size .......................................6
1.16 General Specifications Overview ........................................................................7
Chapter 2: Features
2.1 Layout of Hippo DCA2 board..............................................................................8
2.2 System Component Map ......................................................................................9
2.3 Jumper Description Table ..................................................................................10
2.4 DynamiCache .....................................................................................................11
2.5 DRAM Memory. ................................................................................................11
2.6 Memory Configuration Table.............................................................................12
2.7 Total System Memory ........................................................................................13
2.8 ISA Slots ............................................................................................................13
2.9 VESA Local Bus ................................................................................................13
2.10 CPU ....................................................................................................................14
2.11 Processor Types Supported ................................................................................14
2.12 BIOS. ..................................................................................................................14
2.13 Shadow RAM .....................................................................................................15
2.14 Power Management ............................................................................................15
2.15 Software Compatibility ......................................................................................15
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Chapter 3: Setup and Installation
3.1 Setup ..................................................................................................................16
3.2 Installation Precautions .....................................................................................16
3.3 Operation and Maintenance ..............................................................................16
3.4 CPU Jumper Settings ........................................................................................17
3.5 CPU Installation ................................................................................................18
3.6 DynamiCache / DRAM Installation ..................................................................19
3.7 Compatible 72-pin SIMM Types ......................................................................20
3.8 Control of System Speeds .................................................................................21
3.9 Fan Voltage. ......................................................................................................21
3.10 Fan connector ....................................................................................................21
3.11 Reset CMOS buffer ...........................................................................................21
3.12 Color / Mono display select. .............................................................................21
3.13 Connectors.........................................................................................................22
3.14 Reset Switch Connector ....................................................................................22
3.15 Turbo Switch Connector ...................................................................................22
3.16 Turbo Led Connector ........................................................................................23
3.17 Speaker Connector. ...........................................................................................23
3.18 Keyboard Lock Connector ................................................................................24
3.19 Keyboard Connector .........................................................................................24
3.20 External Battery Connector. ..............................................................................25
3.21 Power Supply Connector...................................................................................25
Chapter 4: BIOS Setup
4.1 BIOS Power-On Self-Test (POST) ...................................................................27
4.2 AMI BIOS Beep Codes.....................................................................................27
4.3 Microid Research BIOS Beep Codes ................................................................28
Appendix: Advanced Technical Information
A.1 Memory Address Map......................................................................................29
A.2 I/O Address Map ..............................................................................................30
A.3 I/O Extension Pinout ........................................................................................31
A.3.i 18-Bit ISA Pinout................................................................................31
A.3.ii 16-Bit ISA Extension Pinout...............................................................31
A.4 VL-BUS Extension Pinout ...............................................................................32
A.5 Direct Memory Access Channels .....................................................................33
A.6 DMA Controller Registers ...............................................................................33
A.7 Page Register Address......................................................................................34
A.8 System Interrupts..............................................................................................34
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Chapter 1 System Overview
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CHAPTER 1
SYSTEM OVERVIEW
Listed below are answers to some questions you may have about DCA2 and its phenomenal performance.
1.1 What is DCA2 ?
DCA2 (DynamiCache Architecture - 2nd generation) is a high performance cache memory system that alleviates the traditional bottleneck of mainboards. This evolutionary system operates up to four times faster than standard DRAM or external cache based boards. With DCA2 users at last have a means of enhancing their systems without the necessity of processor or external cache upgrades.
1.2 What makes DCA2 so powerful ?
Unlike external cache, which was implemented as a low-cost enhancement to standard DRAM, DCA2 was designed for pure performance. DCA2 transforms the entire memory bank into DynamiCache, a high speed memory that operates at 15ns rather than 70ns.
1.3 What is DynamiCache ?
DynamiCache is a high speed memory module that boosts the entire memory bank so that it operates at the same speed as the CPU clocking rate. The entire memory bank appears as cache to the CPU.
1.4 Why is DCA2 a better choice ?
DCA2 has a far greater impact and offers more benefits dollar for dollar than the best external cache based boards. Programs such as Windows 3.11, OS/2 and Windows NT place extreme stress on external cache based systems, often causing bottlenecks between the CPU and the memory bank. When the cache bank becomes full, the CPU must wait for new instructions to be loaded up from the slower DRAM memory. With DCA2, the
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memory operates at the same speed as the CPU, allowing the CPU to retrieve instructions from any location within the main memory at zero wait states.
1.5 Users advantages of DCA2
The entire memory bank acts as if its a cache subsytem. 15ns memory (standard DRAM only operates at 70ns). Zero wait states between the CPU and memory. Up to 200% memory performance increase with applications running in a DOS
environment or other 16-bit operating systems.
Up to 400% memory performance increase with applications run in an OS2 and NT
environment or other 32-bit operating systems.
DCA2 memory operates at CPU speed, making it four times faster than any other
DRAM memory currently on the market.
1.6 Technical advantages of DCA2
15ns Access Time during Hit Cycle 15ns Posted Random Writes 35ns Random Read Access Page Miss Transparent Refresh during Cache Reads Hidden DRAM precharge during Page Reads Consumes 1/3 the power of SRAM plus DRAM solutions On-board cache Hit/Miss Comparator Write Posting Register with Direct Path to Memory Array
1.7 DynamiCache Description
The benefits of DynamiCache are easy to understand. New operating systems such as Windows 3.11, Windows NT, OS/2, UNIX and their associated applications generate a new level of high stresses on conventional external caches, preventing the power of these Oss from being fully exploited. Although these operating systems do offer the ability to multitask applications, these features are rarely used in practice as it causes even the best designed L2 cache motherboard to perform at unacceptably low levels. DynamiCache, being able to access any instruction or data string from any physical address in memory at full cache speed, enables the CPU to handle multitasked operations as smoothly as it handles single applications.
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1.8 DynamiCache Architecture
The DynamiCache chips are physically similar to a standard 4MB page mode or static column DRAM with the addition of an integrated Row Register Register and an internal controller that allows it to operate much like page mode or static column DRAM. DynamiCache’s Row Register register is tightly coupled with the Memory Array. Memory Reads always occur from the Row Register Registers. When the internal comparitor detects a page hit, only the Row Register register is accessed and data is made available in 15ns from the column address. When a page read miss is detected, the new Memory Array row is loaded into the cache and data is available at the output all within a single 35ns access. Subsequent reads within the page (burst read, local instructions or data) can continue at a 15ns cycle time.
Figure 1
Since reads occur from the Row Register register, the Memory Array Precharge can occur simultaneously without degrading performance. The on chip refresh counter with an independent refresh bus allows the DynamiCache to be refreshed during cache reads. Memory Writes are internally posted in 15 nSecs and are directed to the DRAM array.During a write hit, the on chip comparator activates a parallel write path to the Row Register register to maintain coherency. The DynamiCache delivers 15nSec page mode memory writes. This high level of performance is achieved with a single non-interleaved memory consisting of as few as eight 1M x 4 components or a single 72-pin 4Mbyte DynamiCache module.
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1.9 Distributed Cache
DynamiCache uses what is referred to as distributed cache rather than lumped cache. The 15 ns access time is available throughout the entire range of installed DynamiCache, not just in a small external cache. External cache only provides benefit to the system while the instructions are housed in the cache. The penalties that are usually associated with external cache, such as write back latencies, cache thrashings and cache saturation are not present in DynamiCache. This architecture provides all of the cache benefits for the entire range of installed memory with none of the cache penalties.
1.10 DynamiCache Applications
DynamiCache was designed with the new emerging 32-bit protected mode operating systems in mind. External cache, prior to 1994 was an acceptable cost based solution for enhancing DOS applications that typically occupied a memory space that was less than the size of the installed external cache. If the CPU requested an instruction or a string of data, this information was made available to the CPU at cache speed (zero wait state). With the advent of Windows, however, the typical application became larger and much more complex supporting virtual disks, DLLs and GUI interfaces.
1.11 Application Overhead and its effect on External Cache
These new applications subsequently brought with them tremendous overhead for the operating systems. OS/2 and Windows NT were created to handle the demands of the new applications with the hopes that a pre-emptive multitasking, multithreading 32 bit OS would break the bottleneck to productivity. It was quickly found that these operating systems were only effective on high end systems, such as DX2, Pentium or RISC platforms. Even with top end CPUs, a large main DRAM bank was needed, typically 16Mbytes or more and a very expensive L2 cache was often employed, usually 256K to 512K.
1.12 External Cache Saturation Problem
Cache saturation is an easy concept to understand. If the executing program is smaller than the external cache I have installed, then no saturation occurs. There will always be memory address space available for the execution of this program. If the program is slightly larger than my L2 cache, saturation may still not occur, provided that the cache is well designed. There is a point, however, when the L2 cache will remain constantly saturated with instructions. Some of these may be in the process of being read from the main memory and some will be waiting to be written back to memory. The net effect is that if the program
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is large enough, the L2 cache is kept filled with data on a continuous basis. It is the maintenance of this traffic flow that dramatically reduces the amount of time the CPU would otherwise have for executing software instructions.
1.13 Dynamicache Excels and External Cache Suffers Under Heavy Processing
Loads
Heavy processing loads can easily reduce a 66Mhz CPU and L2 cache combination to
effective processing speeds as little as 20% of the CPU’s capabilities. A CPU under these
circumstances spends as much as 80% of its time squeezing large amounts of data to and from memory through a very small SRAM cache. External cache, under these high stress conditions is kept in a continuous state of flux. This is the point at which a cache mechanism ceases to be effective in providing any benefit to system performance.
This is the state in which the cache has become saturated. If the processing demands from the CPU increase any further, the external cache actually creates a penalty in performance by virtue of it’s memory management overhead. DynamiCache does not suffer from these penalties.
1.14 Targeted Operating Environments
DCA2 is designed with the following target operating systems, and application environments:
Multitasking Mutlithreding ( Windows 3.11, Windows NT, OS/2 2.11, etc.) Large Applications ( Desktop publishers, graphic designers, databases/spreadsheets ) I/O Intensive computing ( Graphics applications, multimedia, disk and data transfers ) CPU Bound Computing ( CAD/CAM, MATHCad and other scientific number crunchers ) Software Compilers Application Servers ( Networked applications accessed from a central server ) File Servers ( Novel, Lantastic, LANManager, Vines ) DynamiCache is fully compatible with all the major operating systems and
application.
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1.15 L2/ DCA2 Cache Efficiency Versus Application Size
.
Where do the software applications fit on this curve ?
Typical Benchmarks usually utilize less than 5% memory load. DOS applications typically generate less than 25% memory load. Windows 3.11 applications typically generate approximately 50% memory load. OS/2 2.11, UNIX and Windows NT easily generate 50% to 100% memory load Windows NT Advanced Server and Novell Application Servers routinely use 90% to 100% load.
* Memory Loads do not include virtual disk accesses.
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1.16 General Specifications Overview
Processor:
Processor Type Intel 486SX-25/33, 486DX-25/33, 486DX2-50/66 Intel 486DX4-75/100, Intel P24T AMD 486DX-40, 486DX2-50/66 Cyrix 486DX-33, 486DX2-50/66
Speed 25 / 33 / DX2-50 / DX2-66 / DX4-100
CPU voltage detection Automatic voltage conversion circuitry
Cache Architecture:
Internal Cache 8KB 4-way set associative cache (SX/DX/DX2) 16KB 4-way set associative cache (DX4)
External Cache DynamiCache Architecture II (DCA2) running at CPU speed DynamiCache running at 15ns
Memory Subsystem:
DynamiCache Simm sockets 2 x 72 pin 4MB / 8MB / 16MB DynamiCache modules
DRAM Simm sockets 2 x 72 pin 4MB / 8MB / 16MB / 32MB DRAM modules
Max. Memory Size 96MB
Mixed Memory Type Support mixed DynamiCache / DRAM modules
Memory Width 32-bit DynamiCache & DRAM
Enhancement Fast Page Mode and Hidden Refresh supported
BIOS Subsystem
BIOS Type AMI / Microid Research
BIOS Shadowing Shadow RAM for System and Video BIOS
BIOS Features Built-in setup, Power-on self test, Drive table optimization, User­ definable drive types, Password protection, Shadowing options
Input/Output Subsystem
VESA bus slots 3 x 32-bit VL-Bus slots (2 slave, 1 master/slave)
ISA bus slots 6 x 16-bit ISA slots 2 x 8-bit ISA slots
I/O bus speed Up to 33MHz (VESA bus)
Power Management
Green functions Support Green Functions (Hardware controlled) Voltage regulation for DX4 CPUs
System Support Functions
System functions 7 DMA channels, 16 level interrupts, Programmable timers
Support functions Fast A20 gate and Fast Reset
Clock Enhanced real time clock/calendar with battery back-up
Other Features
Power good On board power good signal generation
Switches Hardware Turbo, Reset, Keylock switches
Size 8.5" (W) x 11" (L)
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CHAPTER 2
GENERAL FEATURES
2.1 Layout of Hippo DCA2 Board
Figure 2
Inspect and clean your computer system regularly. Electronic components are sensitive to dust and dirt.
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2.2 System Component Map
Memor y / S y s t e m C o mp o n e nts
1
Keyboard BIOS
2
Keyboard connector
3
Power connector
4
8-Bit ISA slots
5
16-Bit ISA Extension slots
6
32-Bit VESA Extension slots
7
DynamiCache slot-1 and slot-2
8
DRAM slot-1 and slot-2
9
System BIOS
10
Mach 210 programmable logic
11
Mach 110 programmable logic
12
82C802G chipset
13
Transistor Logics
14
CPU socket
15
NPD605A voltage regulator
Ju m p e r C o n n ec t o rs
P1
Reset
P2
Turbo SW
P3
Turbo Led
P4
Speaker
P5
Keylock
P6
Power Connector
P7
Power Connector
P8
External Battery Connector
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2.3 Jumper Description Table
Jumper
Description
Setting Option
JP1
Fan voltage select (+12/+5V)
1-2 2-3
*
+5V
+12V
JP2
Fan connector
-- <RFU>
JP3
CPU clock speed select
1-2 2-3
*
25 Mhz
33 MHz
JP4
CPU clock speed select
1-2 2-3
*
25 Mhz
33 MHz
JP5
CPU reset signal source
1-2 * <RFU>
JP6
CPU initialization signal source
open * Cyrix, SL
JP7
Cyrix CPU type select
1-2 2-3
open
*
2 x CLK 1 x CLK
JP8
Floating point error pin select
1-2 2-3
open
*
486DX,DX2
487
486SX
JP9
VL-Bus operation
2-3
open
*
nonsynch.
synch.
JP10
Non-maskable interrupt select
1-2, 3-4
2-3
*
486DX,DX2,487
486SX
JP11
CPU bus speed type selection
1-2 2-3
* CPU > 33Mz
CPU <= 33Mz
JP12
VL-Bus wait state selection
1-2 2-3
*
1 wait state 0 wait state
JP13
SL-CPU select
2-3 * <RFU>
JP14
SL-CPU select
2-3 * SL
JP15
Cyrix CPU support
2-3 * <RFU>
JP16
CPU clock multiplier - 2.5x
open * <RFU>
JP17
Clock multiplier - 2x
open * <RFU>
JP18
EPMI
open * <RFU>
JP19
CMOS discharge
1-2 2-3
*
discharge
preserve
JP20 Power Good Generation
1-2 2-3
*
off-board
on-board
JP21 Color / Mono display select
1-2 2-3
*
color
mono
JP22
Cyrix CPU Voltage Select (+3.3V)
open * <RFU> !
JP23
Cyrix CPU Voltage Select (+3.6V)
open * <RFU> !
JP24
Cyrix CPU Voltage Select (+3.8V)
open * <RFU> !
JP25
Cyrix CPU Voltage Select (+4.0V)
open * <RFU> !
JP26
Intel / AMD CLKMUL Select
1-2 2-3
*
<RFU>
JP27
CPU Voltage Auto-detect for Intel / AMD
CPU (+5.0V or +3.45V)
1-2
open
*
<RFU> !
JP28
Force CPU Voltage to +5.0V
open * <RFU> !
JW1
VL-Bus operation
1-2 2-3
*
nonsynch
synch
* Factory Default Settings <RFU> reserved for future use
Caution, consult your dealer before making changes to voltage select jumpers. Improper settings could cause permanent damages to the CPU.
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2.4 DynamiCache
The DynamiCache memory subsystem consists of two 72-pin DynamiCache SIMM sockets. These sockets support up to 32MB of DynamiCache configured in 4MB, 8MB, and 16MB modules. (16MB to be released Q2 1995). The DynamiCache sockets are located on the top right corner of the motherboard.
The DynamiCache memory has already been preinstalled on the Hippo DCA2 motherboard. Additional DynamiCache can be ordered through Ocean Information Systems, Inc. or from one of over two hundred authorized distributors worldwide. DynamiCache is as easy to handle and install as standard 72-pin DRAM. It requires no special handling or skill other than taking normal anti-static precautions.
Figure 3
Figure 4 Side View of DynamiCache SIMM Module
2.5 DRAM Memory
For maximum versatility the Hippo DCA2 also has a traditional DRAM memory subsystem located next to the DynamiCache slots.
These two 72-pin DRAM SIMM sockets that support a maximum installation of 64MB DRAM. (It should be noted, however, that DRAM may drag down the overall system performance because of inherent design deficiencies in DRAM.) Each of the DRAM slots can be configured in 4MB, 8MB, 16MB, or 32MB up to a maximum of 64MB of DRAM.
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2.6 Memory Configuration Table
Bank 0
DynamiCache
Slot 1
Bank 1
DynamiCache
Slot 2
Bank 2
DRAM
Slot 1
Bank 3
DRAM
Slot 2
Total Memory
Size
4 X X X 4
4 X 2 X 6 4 X 2 2
8
4 X 8 X 12
4 X 8 8 20
4 4 X X 8 4 4 4 X 12
4 4 4 4 16
4 4 8 X 16 4 4 8 8
24 4 4
16 X 24
4 4 16 4 28
4 4 16
16
40 4 4
32 X 40
4 4 32
32
72
4 8 X X 12 4 8 8 X
20
8 X X X 8 8 X 4 X
12 8 X 4 4
16
8 X 8 X 16
8 X 8 8 24
8 X 16 X 24 8 X
16 4 28
8 X 16
16
40
8 X 32 X 40 8 X
32
32
72
8 8 X X 16
8 8 8 X 24 8 8 8 8
32
8 8 16 X 32
8 8 16
16
48
8 8 32 X 48
8 8 32
32
80
16 * X X X 16
16 X 8 X 24
16 X 8 8 32
16 X 16 X 32
16 X 16
16
48
16 X 32 X 48
16 X 32
32
80
16
16 X X
32
16
16
16 X 48
16
16
16
16
64
16
16
32 X 64
16
16
32
32
96
* 16MB DynamiCache Module scheduled to be released Q2, 1995
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2.7 Total System Memory
The entire main memory is composed of the total DynamiCache plus DRAM subsystem. Refer to the chart below for possible memory configurations, from 4MB to 32MB. The system auto detects the memory size.
For maximum efficiency in system performance, OISI strongly recommends a minimum of 8MB DynamiCache. Most of the advanced operating system application software (Chicago, Daytona, Windows NT, Windows for Workgroups, OS/2 2.11, et al) require a
minimum of 8MB system memory to run efficiently. It would be to the user’s benefit to
install 8MB DynamiCache to allow the entire program set and data set to run within DCA2.
2.8 ISA Slots
ISA is the abbreviation for Industry Standard Architecture. It refers to the bus architecture originally created for the IBM XT and AT computers. The XT had an 8-bit data path and the AT a 16-bit data path. The AT has become the industry standard because of the large number of peripherals designed to connect to it. The Hippo DCA2 has six 16-bit ISA slots and two 8-bit ISA slot.
Figure 5
2.9 VESA Local Bus
VESA refers to the Video Electronics Standards Association, an organization of major PC graphics vendors devoted to improving graphics standards. The Hippo DCA2 has three 32-bit VESA Local Bus (VL) extensions and is one hundred percent compatible with the specification set forth by the Video Electronics Standards Association.
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The 32-bit data path VESA Local Bus provide a direct link between the CPU and the system memory, allowing data to be processed at the speed of the CPU, up to 33MHz, rather than the slower running 16-bit at 8-12 Mhz data path ISA BUS rate.
Figure 6
2.10 CPU
The Central Processing Unit (CPU) is the part of the computer that interprets and executes instructions. It is also referred to as the processor.
The Hippo DCA2 supports a wide range of processor types, including write back and low­powered CPUs as well as various processing speeds. With DynamiCache the onboard memory is brought up to the speed of the CPU, making it possible to run a fast processor without the problem of bottlenecks.
2.11 Processor Types Supported:
Intel 486SX-25 Intel 486SX-33 Intel 486DX-33 Intel 486DX2-50 Intel 486DX2-66 Intel 486DX4-100 Intel P24T AMD 486DX-33 AMD 486DX2-50 AMD 486DX2-66 Cyrix 486DX-33 Cyrix 486DX2-50 Cyrix DX2-66
2.12 BIOS
BIOS is an acronym for Basic Input/Output System. It is a setup program that stores system configurations used by the motherboard. This information is vital in order for the system to boot and work properly. There are various BIOS programs available. The Hippo DCA2 comes with the option of AMI BIOS or Microid Research BIOS.
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2.13 Shadow RAM
Shadow RAM improves computer performance by taking data that is stored in ROM (read­only memory) and copying the information into the much faster RAM (random-access memory). The control setup for the Shadow RAM is located in the configuration registers.
2.14 Power Management
The Hippo DCA2 supports Green Functions, which make the system fully compliant with
the Environmental Protection Agency’s Energy Star program. In order to meet the EPA’s
Energy Star standards a system must consume fewer than 30 watts when in sleep mode. The Hippo DCA2 accomplishes this with two energy saving modes:
1) Spindown: Shuts down the hard drive when it isn’t in use
2) Powerdown : Blanks the monitor and slows down the speed for Intel-compatible
CPU.
2.15 Software Compatibility
100% IBM PC/AT compatible File servers, application servers, communication servers DOS, OS/2, UNIX, XENIX, Novell, Windows, and Windows NT. Computer-aided Design (CAD), Computer-aided Manufacturing (CAM) Graphic applications, Desktop Publishing
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CHAPTER 3
SETUP AND INSTALLATION
3.1 Setup
Before installing the Hippo DCA2 motherboard in your system, you must attach the peripheral connectors. Follow the instructions outlined in this chapter for proper installation.
3.2 Installation Precautions
Turn off the power whenever installing or removing any connectors, memory module or add-
on cards.
Before turning on the power, make sure that all the connectors, memory modules and add-on
cards are secured.
Eliminate any static electricity when handling the motherboard or any peripherals to prevent
damage to electrical components. To eliminate electricity touch a grounded metal object before removing the board from the anti-static bag and wear a grounded wrist or ankle strap when handling the components.
Put the board and perhipherals back into the anti-static bags when you are not using them.
Always handle the board by its edges, taking care not to touch any of its components.
3.3 Operation and Maintenance
Keep the system cool. The motherboard contains many high-speed components and they will
generate heat during operation. Other add-on cards and the hard disk can also produce a lot of heat. The temperature inside the computer system may be very high. In order to keep the system running stable, the temperature must be kept at a low level. An easy way to do this is to keep the cool air circulating inside the case. If the temperature is still very high, install another fan inside the case. Using a larger case is recommended if there a number of add-on cards and disk drives in the system.
Clean the “Gold Finger.” Whenever inserting an add-on card to the motherboard make sure
that there is no dirt on the “gold finger” of the add-on card. If dirt is present the contact between the “golden finger” and the slot may be poor, causing the add-on card to work improperly. Use a pencil eraser to clean the “gold finger” if dirt is found.
Clean the motherboard. The computer system should be kept clean. Dust and dirt are harmful
to electronic devices. To prevent dust from accumulating on the motherboard install all mounting plates on the rear of the case. Regularly examine your system and, if necessary, vacuum the interior of the system with a miniature vacuum.
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Chapter 3 Setup and Installation
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17
3.4 CPU Jumper Settings
Brand
Type
JP3
JP4
JP5
JP6
JP7
JP8
JP10
JP11
JP13
JP14
JP15
Intel
SX-25
1-2
1-2
1-2
open
open
open
2-3
2-3
2-3
2-3
2-3
Intel
SX-33
2-3
2-3
1-2
open
open
open
2-3
2-3
2-3
2-3
2-3
Intel
DX-25
1-2
1-2
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Intel
DX-33
2-3
2-3
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Intel
DX2-50
1-2
1-2
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Intel *
DX2-66
2-3
2-3
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Intel
DX4-75
1-2
1-2
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Intel
DX4-100
2-3
2-3
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Intel
P24T
2-3
2-3
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Intel
487-25
1-2
1-2
1-2
open
open
2-3
1-2, 3-4
2-3
2-3
2-3
2-3
Intel
487-33
2-3
2-3
1-2
open
open
2-3
1-2, 3-4
2-3
2-3
2-3
2-3
Intel SL
SX-33
2-3
2-3
1-2
open
open
open
2-3
2-3
2-3
2-3
2-3
Intel SL
DX-33
2-3
2-3
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Intel SL
DX2-66
2-3
2-3
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3 AMD
DX2-50
1-2
1-2
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
AMD
DX2-66
2-3
2-3
1-2
open
open
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Cyrix
DX-33
2-3
2-3
1-2
open
2-3
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Cyrix
DX2-50
1-2
1-2
1-2
open
1-2
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
Cyrix
DX2-66
2-3
2-3
1-2
open
1-2
1-2
1-2, 3-4
2-3
2-3
2-3
2-3
* Manufacturer default jumper settings
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3.5 CPU Installation
The CPU is composed of several pins that can easily be bent during installation, causing permanent damage to the processor. It is therefore very important that you make sure the pins are straight before installing the CPU onto the PGA socket located on your motherboard (refer to layout for exact location). To properly align the CPU with the socket align pin 1 of the CPU with pin 1 of the CPU PGA socket as demonstrated below.
486 CPU
Figure 7 Top view of CPU
Figure 8 Top view of PGA Socket
Turn off the power whenever installing or removing any CPU, connector, memory module or add-on cards. Before turning on the power, make sure that all of these parts are secured.
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3.6 DynamiCache/DRAM Installation
There are four memory banks located on the Hippo motherboard, marked DynamiCache Bank 1, DynamiCache Bank 2, DRAM Bank 1, DRAM Bank 2. The DynamiCache modules must be inserted into theDynamiCache banks and the DRAM modules into the DRAM banks.
Figure 9 Memory Modules Sockets
Never force the SIMM modules into the SIMM sockets. The sockets are fragile and the locking latches may break.
Depending on how your memory is configured, you may not need to use all of the memory banks. It is important that you insert the modules in consecutive order, beginning with memory bank one. Before inserting the modules, position the motherboard so that the memory banks are facing the direction demonstrated.
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To insert the modules into the banks follow these steps:
1. Locate the notch on the corner of the module.
2. Hold the module so that the notch is at the bottom left corner.
3. Insert the bottom edge of the module into the bank at an angle, then push the
module forward so that it is locked into place by the latches located on the sides of the bank. The latches should be locked tightly and the holes in the module should be aligned with the tabs on the bank.
Figure 10 Proper Memory Module Installation
3.7 Compatible 72-pin SIMM TYPES
Slots
Memory Size
Speed
DynamiCache Slot 1
4M, 8M, 16M
15ns
DynamiCache Slot 2
4M, 8M, 16M
15ns
DRAM Slot 1
4M, 8M, 16M, 32M
60ns / 70ns
DRAM Slot 2
4M, 8M, 16M, 32M
60ns / 70ns
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3.8 Control of System Speed
System speed can be controlled by keyboard and turbo switch. To change the speed by keyboard, use the minus sign (-) and the plus sign (+). Press <control> + <alt> + <“-”> for slow speed and <control> + <alt> + <“+”> for fast speed.
3.9 Fan voltage
There are two different voltages available for CPU fans; +5 volts and + 12 volts.Select a proper setting for jumper JP1 before you turn on the computer.
3.10 Fan Connector
This connector allows the CPU fan to draw current directly from the motherboard, without having to rely on a separate power connector.
A CPU fan is highly recommended for today’s high speed CPUs. Extreme
high CPU temperature are generated during system operations , and may cause abnormal hardware behaviour if system is not cool down.
3.11 Reset CMOS
If the setting of the system setup is done improperly it may make the system malfunction. If this happens, turn off the power and set jumper JP19 to 1-2 to reset the internal CMOS status register. Next, set the jumper JP19 back to 2-3 and turn on the power. The BIOS will find the CMOS status register is reset and will regard the setup information invalid, so it will prompt you to correct the information.
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3.12 Color / Mono Display Select
Depending on the type of monitor you are using. Set jumper JP21 to 1-2 for a color display monitor ( which includes all types of VGA monitors ), and set jumper JP21 to 2-3 for a monochrome display monitor.
3.13 Connectors
The motherboard contains jumpers and dip switches that must be properly set before installing the board into the computer. These switches are necessary to configure various functions on the motherboard.
3.14 Reset Switch Connector
The reset switch connector is a two-pin single in-line berg that is attached to an externally mounted reset switch by cable. The reset button is used to warm reboot the system. his
switch is open when it’s ready for normal operation and is closed or shorted to reset the
sytem.
1 2 Figure 11
Pin
Assignment
1
Reset strobe
2
Ground
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3.15 Turbo Switch Connector
The turbo switch connector is a two-pin single in-line berg that is attached by cable to an externally mounted turbo switch on the chasis. The turbo button is used to toggle between standard AT-Bus speed and maximum speed of the processor. This switch is open when it’s ready for normal operation and is closed or shorted to obtain high speed of the sytem.
1 2 Figure 12
3.16 Turbo Led Connector
The turbo Led is a two-pin single in-line berg that is connected to a LED display. The display lights up when the CPU is operating at full speed.
1 2 Figure 13
Pin
Assignment
1
Ground
2
Turbo strobe
Pin
Description
1
Cathode
2
Anode
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3.17 Speaker Connector
The speaker connector is a four-pin berg that is attached via a cable to the system
speaker.
This is a nonpolarized connector and can be installed in keyed position.
3.18 Keyboard Lock Connector
The keyboard lock enables the user to lock the keyboard, preventing unauthorized use of the system. J??? is a five-pin single in-line berg that is attached to the keyboard lock connector by a cable.
Figure 15
Figure 14
Pin
Description
1
Data Out
2
Key
3
Ground
4
VCC
Pin
Assignment
1
LED power
2
Key
3
Ground
4
Keyboard lock
5
Ground
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3.19 Keyboard Connector
The keyboard connector is a five-pin DIN socket. Attach a standard AT-compatible keyboard cable. The pin assignments are listed below.
Figure 16
Turn off the power whenever installing or removing any connector, memory module or add-on cards. Before turning on the power, make sure that all of these parts are secured.
3.20 External Battery Connector
The Hippo DCA2 comes with an onboard rechargeable battery so an external battery is not necessary. As an added feature, however, the board does support an external battery of 3.6 volts. Install the battery according to the pin assignments listed in diagram below.
Figure 17
Pin
Assignment
1
Keyboard clock
2
Keyboard data
3
Not used
4
Ground
5
VCC
Pin
Assignment
1
3.6 Volt DC
2
Not used
3
Not used
4
Ground
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3.21 Power Supply Connector
The power supply is the electrical device that converts the alternating current used by standard A C outlets to the lower-voltage direct current required by computers. A stable power source is essential for proper and reliable operation. It is therefore a good idea to use a high quality power supply. It is essential that the power supply provide +5 VDC with a voltage range between +4.95 VDC and +5.25 VDC.
There are two power supplies connectors on the motherboard. Power supplies can run on a wide range of voltages and must be set to the proper range. Each connector has six wires, all of which must be aligned with the proper pin number.
Figure 18 Front View of Power Connectors
Figure 19 Top View of Power Connectors
Pin
Assignment
1
Power Good (orange wire)
2
VCC (red wire)
3
+12 Volts (yellow wire)
4
-12 Volts (blue wire)
5
Ground (black wire)
6
Ground (black wire)
7
Ground (black wire)
8
Ground (black wire)
9
-5 Volts (white wire)
10
VCC (red wire)
11
VCC (red wire)
12
VCC (red wire)
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CHAPTER 4
BIOS SET UP
4.1 BIOS Power-On Self-Test (POST)
During the self-test, errors may occur. These errors are communicated through a series of beeps. The method of beeps used depends on the BIOS program. For example, Microid Research BIOS uses a combination of low and high tones. AMI BIOS uses a series of beeps with different error messages that correspond to the number of beeps heard.
4.2 AMI BIOS Error Beep Codes
# of Beeps
Error Message
Explanation
1
DRAM Refresh Failure
The memory refresh circuitry is faulty
2
Parity Error
A parity error occured in the first 64KB block of memory
3
Base 64K RAM Failure
A memory failure occurred in the first 64KB of memory
4
System Timer Failure
Timer 1 is not functioning
5
Processor Failure
An error occurred in the CPU
6
Gate A20 Failure
The BIOS is unable to switch the CPU into protected mode
7
Processor Exception Error
An exception interrupt occured in the CPU
8
Display Memory Read/Write Error
The system video adapter is missing or its memory is faulty
9
ROM Checksum Error
The ROM checksum value does not match the BIOS code
10
Read/Write Error
The CMOS shutdown register memory has failed
4.3 Microid Research BIOS Error Beep Codes
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Beep Tones
Error Message
L H L H H
Real time clock is not updating
L H-L L L
ROM BIOS checksum test
L H-H L L
Page register test
L H-L H L
Keyboard controller self-test
L H-H H L
Memory refresh circuit test
L H-L L H
Master DMA controller failure
L H-H L H
Slave DMA controller failure
L H-L L L L
Memory bank 0 pattern test failure
L H-H L L L
Memory bank 0 parity circuitry failure
L H-L H L L
Memory bank 0 parity error
L H-H H L L
Memory bank 0 data bus failure
L H-L L H L
Memory bank 0 address failure
L H-H L H L
Memory bank 0 block access read failure
L H-L H H L
Memory bank 0 block access read/wrfitge failure
L H-H H H L
Master 8259 failure
L H-L L L H
Slave 8259 failure
L H-H L L H
Master 8259 interrupt address error
L H-L H L H
Slave 8259 interrupt address error
L H-H H L L
8259 interrupt address error
L H-L L H H
Master 8259 stock interrupt error
L H-H L H
Slave 8259 stock interrupt error
L H-L H H H
System timer 8254 interrupt failure
L H-H H H H
8254 channel 0 test and initialization
L H-L L L L H
8254 channel 2 speaker failure
After the power is on, wait for a minute before proceeding. The system BIOS are going through a self-test and nothing is displayed on screen. After the self-test, the system BIOS initialize the display adaptor and show messages.
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APPENDIX
ADVANCED TECHNICAL INFORMATION
A.1 Memory Address Map
Address
Size
Function
0000000-009FFFF
640 KB
System board memory
00A0000-00BFFFF
128 KB
Video RAM display buffer
00C0000-00DFFFF
128 KB
Reserved for add-on cards ROM BIOS
00E0000-00EFFFF
64 KB
System ROM BIOS expansion
00F0000-00FFFFF
64 KB
System ROM BIOS
0100000-0FDFFFF
15232 KB
Extended memory
0FE0000-0FEFFFF
64 KB
Duplicates of system ROM BIOS at 0F0000-0FFFFFF
1000000-5FFFFFF
80 MB
Extended memory
0000000-5FFFFFF
96 MB
Total memory space addressable by Hippo DCA2 VESA System Board
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A.2 I/O Address Map
I/O Address Hex 000 to 0FF are reserved for the system board and Hex 100 to 3FF are for I/O channels.
Address (Hex)
Device
000-01F
DMA Controller 1, 8237A-5
020-021
Interrupt Controller 1, 8237A-5
022-023
Chip set Address
040-04F
Timer 1, 8254
050-05F
Timer 2, 8254
060-06F
8042 Keyboard/Controller
070-07F
Real Time Clock, Non-Maskable Interrupt Mask
080-09F
DMA Page Registers
0A0-0BF
Interrupt Controller 2,8259A
0C0-0DF
DMA Controller 2, 8237A-5
0F0
Clear Math Coprocessor Busy
0F1
Reset Math Coprocessor
0F8-0FF
Math Coprocessor
1F0-1F8
Fixed Disk
200-207
Game Ports
278-27F
Parallel Printer Port 2 (PIO-2)
2F8-2FF
Serial Port 2 (SIO-2)
300-31F
Prototype Card/Streaming Tape Adapter
360-363
PC Network, Low Address
368-36B
PC Network, High Address
378-37F
Parallel Printer Port 1 (PIO-1)
380-38F
SDLC, Bisynchronous 2
3A0-3AF
Bisynchronous 1
3B0-3BF
Monochrome Display and Primer Adapter
3C0-3CF
EGA Adapter
3D0-3DF
Color/Graphics Monitor Adapter
3F0-3F7
Diskette Controller
3F8-3FF
Serial Port 1 (SIO-1)
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A.3 I/O Extension Pinout
A.3i 8-Bit ISA Pinout
Ground
GND
B1
A1
-I/O CHCK
I O
RSTDRV
B2
A2
SD7
I/O
Power
+5 VDC
B3
A3
SD6
I/O
I IRQ9
B4
A4
SD5
I/O
Power
-5 VDC
B5
A5
SD4
I/O I
DRQ2
B6
A6
SD3
I/O
Power
-12 VDC
B7
A7
SD2
I/O
I OWS
B8
A8
SD1
I/O
Power
+12 VDC
B9
A9
SD0
I/O
Ground
GND
B10
A10
-I/O CHRDY
I
O -SMEMW
B11
A11
AEN
O
O -SMEMR
B12
A12
SA19
I/O I/O
-IOW
B13
A13
SA18
I/O I/O
-IOR
B14
A14
SA17
I/O
O -DACK3
B15
A15
SA16
I/O
I DRQ3
B16
A16
SA15
I/O
O -DACK1
B17
A17
SA14
I/O
I DRQ1
B18
A18
SA13
I/O
I/O
-Ref
B19
A19
SA12
I/O
O CLK
B20
A20
SA11
I/O I
IRQ7
B21
A21
SA10
I/O I
IRQ6
B22
A22
SA9
I/O
I IRQ5
B23
A23
SA8
I/O
I IRQ4
B24
A24
SA7
I/O I
IRQ3
B25
A25
SA6
I/O
O -DACK2
B26
A26
SA5
I/O
O T/C
B27
A27
SA4
I/O O
BALE
B28
A28
SA3
I/O Power
+5 VDC
B29
A29
SA2
I/O
O OSC
B30
A30
SA1
I/O
Ground
GND
B31
A31
SA0
I/O
A.3ii 16-Bit ISA Extension Pinout
I -MEMCS16
D1
C1
-BHE
I/O
I -I/OCS16
D2
C2
LA23
I/O
I IRQ10
D3
C3
LA22
I/O I
IRQ11
D4
C4
LA21
I/O
I IRQ12
D5
C5
LA20
I/O
I IRQ15
D6
C6
LA19
I/O I
IRQ14
D7
C7
LA18
I/O 0
-DACK0
D8
C8
LA17
I/O
I DRQ0
D9
C9
-MEMR
I/O
0 -DACK5
D10
C10
-MEMW
I/O I
DRQ5
D11
C11
SD08
I/O
0 -DACK6
D12
C12
SD09
I/O
I DRQ6
D13
C13
SD10
I/O
0 -DACK7
D14
C14
SD11
I/O
I DRQ7
D15
C15
SD12
I/O
Power
+5 VDC
D16
C16
SD13
I/O I
-MASTER
D17
C17
SD14
I/O Ground
GND
D18
C18
SD15
I/O
A.4 VL-BUS Extension Pinout
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CD1
B1
A1
CD0
CD3
B2
A2
CD2
Ground
B3
A3
CD4
CD5
B4
A4
CD6
CD7
B5
A5
CD8
CD9
B6
A6
Ground
CD11
B7
A7
CD10
CD13
B8
A8
CD12
CD15
B9
A9
Power
Ground
B10
A10
CD14
CD17
B11
A11
CD16
Power
B12
A12
CD18
CD19
B13
A13
CD20
CD21
B14
A14
Ground
CD23
B15
A15
CD22
CD25
B16
A16
CD24
Ground
B17
A17
CD26
CD27
B18
A18
CD28
CD29
B19
A19
CD30
CD31
B20
A20
Power
CA30
B21
A21
CA31
CA28
B22
A22
Ground
CD26
B23
A23
CA29
Ground
B24
A24
CA27
CA24
B25
A25
CA25
CA22
B26
A26
CA23
Power
B27
A27
CA21
CA20
B28
A28
CA19
CA18
B29
A29
Ground
CA16
B30
A30
CA17
CA14
B31
A31
CA15
CA12
B32
A32
Power
CA10
B33
A33
CA13
CA8
B34
A34
CA11
Ground
B35
A35
CA9
CA6
B36
A36
CA7
CA4
B37
A37
CA5
WBack
B38
A38
Ground
BEO
B39
A39
CA3
Power
B40
A40
CA2
BE1
B41
A41
n/c
BE2
B42
A42
Reset
Ground
B43
A43
D/C
BE3
B44
A44
M/IO
ADS
B45
A45
W/R
LRDY
B46
A46
RDY
LDEV
B47
A47
Ground
LREQ
B48
A48
IRQ9
Ground
B49
A49
BRDY
LGNT
B50
A50
Blast
Power
B51
A51
ID0
ID2
B52
A52
ID1
ID3
B53
A53
Ground
ID4
B54
A54
VLCLK
LKEN
B55
A55
Power
Leads
B56
A56
LBS16
A.5 Direct Memory Access Channels
Channel
Function
8-Bit
16-Bit
Transfer
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Block Size
0
Spare
8-bit
64
1
SDLC
8-bit
64
2
Floppy Disk
8-bit
64
3
Spare
8-bit
64
4
Cascade for DMA controller 1
5
Spare
16-bit
128
6
Spare
16-bit
128
7
Spare
16-bit
128
A.6 DMA Controller Registers
Address (Hex)
Command Code
C0
CH-0 base and current address
C2
CH-0 base and current word count
C4
CH-1 base and current address
C6
CH-1 base and current word count
C8
CH-2 base and current address
CA
CH-2 base and current word count
CC
CH-3 base and current address
CE
CH-3 base and current word count
D0
Read Status Register/Write Command Register
D2
Write Request Register
D4
Write Single Mask Register Bit
D6
Write Mode Register
D8
Clear Byte Pointer Flip-Flop
DA
Read Temporary Register/Write Master Clear
DC
Clear Master Register
DE
Write All Mask Register Bits
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A.7 Page Register Address
Page Register
I/O Address (Hex)
DMA Channel 0
0087
DMA Channel 1
0083
DMA Channel 2
0081
DMA Channel 3
0082
DMA Channel 5
008B
DMA Channel 6
0089
DMA Channel 7
008A
Refresh 008F
A.8 System Interrupts
Interrupt Controllers ( NMI level )
Parity or I/O Channel Check
CTLR 1
CTLR 2
IRQ0
Timer Output 0
IRQ1
Keyboard
(Output Buffer Full)
IRQ2
Interrupt from CTLR 2
IRQ8
Real-time Clock Interrupt
IRQ9
Software Redirected to INT 0AH (IRQ2)
IRQ10
Reserved
IRQ11
Reserved
IRQ12
Reserved
IRQ13
Coprocessor
IRQ14
Fixed Disk Controller
IRQ15
Reserved
IRQ3
Serial Port 2
IRQ4
Serial Port 1
IRQ5
Parallel Port 2
IRQ6
Diskette Controller
IRQ7
Parallel Port 1
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