Octek BISON III REV. 1.0 Bison III User Manual

BISON III
The material in this manual is for information only and is subject to change without notice.
REVISION: 1.0
IBM, IBM PC/XT/AT, PC-DOS, MS-DOS, OS/2, INTEL, AMI, Pentium ARE THE TRADEMARKS OR REGISTERED TRADEMARKS OF THEIR RESPECTIVE OWNERS.
This equipment generates and uses radio frequency energy and if not installed and used properly, that is, in strict accordance with the manufacturer's instructions, may cause interference with radio and television reception.
If this equipment does cause interference to radio or TV reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
* Reorient the receiving antenna. * Relocate the computer away from the receiver. * Move the computer away from the receiver. * Plug the computer into a different outlet so that computer and
receiver are on different branch circuits. * Ensure that card slot covers are in place when no card is installed. * Ensure that card mounting screws, attachment connector screws,
and ground wires are tightly secured. * If peripherals are used with this system, it is suggested to use
shielded, grounded cables, with in-line filters if necessary.
If necessary, the user should consult the dealer service representative for additional suggestions.
The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. It is the responsibility of the user to correct such interference.
Note
1. Electronic components are sensitive to dust and dirt. Do inspect
and clean the computer system regularly.
2. Turn off the power whenever you install or remove any connector,
memory module and add-on card. Before turning on the power,
make sure that all the connectors, memory modules and add-on
cards are secured.
3. After power is on, wait for a minute. The system BIOS are going
through a self-test during this period and nothing is shown on the
screen. After the self-test, the system BIOS will initialize the
display adaptor and show messages.
4. The SIMM sockets are fragile device. Do not force the SIMM
modules into the sockets. It may break the locking latches.
Table of Content
Chapter One INTRODUCTION
Chapter Two GENERAL FEATURES
Specifications ..........................................................................................2-1
The Central Processing Unit ...................................................................2-2
Cache Subsystem .....................................................................................2-3
DRAM Subsystem ....................................................................................2-3
DRAM Configuration ..............................................................................2-5
PCI Bus.....................................................................................................2-6
Chapter Three CONFIGURING THE SYSTEM
Installing The Processor .........................................................................3-1
Installing RAM Modules ..........................................................................3-2
Configuring The Cache Memory .............................................................3-2
Control of System Speed ..........................................................................3-3
Reset CMOS Setup Information ..............................................................3-3
VL-Bus Mastering Adapter Installation...................................................3-3
PCI-Bus Adapter Installation...................................................................3-4
Board Layout............................................................................................3-5
System Board Jumper and Connector Summary .....................................3-6
System Board Jumper Setting ..................................................................3-7
System Board Connectors .......................................................................3-8
Chapter Four TECHNICAL INFORMATION
Memory Mapping ....................................................................................4-1
I/O Address Map .....................................................................................4-2
System Interrupts .....................................................................................4-4
Direct Memory Access (DMA) ................................................................4-5
Real Time Clock and CMOS RAM ..........................................................4-6
System Expansion Bus .............................................................................4-6
Appendix A OPERATION AND MAINTENANCE
Static Electricity ......................................................................................A-1
Keeping The System Coo l.......................................................................A-1
Cleaning The "Golden Finger" ...............................................................A-2
Cleaning The Motherboard ....................................................................A-2
Appendix B TROUBLESHOOTING
Main Memory Error ................................................................................B-1
Chapter One Introduction
OCTEK BISON III is a workstation class platform that can meet the demand of most time critical applications nowadays. With the Intel Pentium processor and 64 bit interleaved memory system, it delivers higher performance among the PC/AT class machines that ever been.
VESA bus and ISA bus are incorporated to adapt the most popular add­on card standard. Latest local bus technology - Peripheral Component Interconnect (PCI) is also implemented, that makes BISON III tremendous adaptability.
Next-generation design remains 100% binary and PC/AT compatible that boosts up the existing applications without re-compile.
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INTRODUCTION
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Chapter Two General Features
Specifications
Processor: Pentium 60MHz or 66MHz CPU
Speed: Turbo/normal speed
I/O Slot: Four 16 bit ISA slots
Two VESA VL-bus slot (supporting one bus master)
Three PCI local bus slot (supporting three
bus masters)
Cache* :
Internal cache inside Pentium: 8K instruction cache
8K data cache
External cache: 64K external cache expandable to 512K
DRAM: Supports 4 banks of 32 bit wide SIMM
modules with 1MB, 2MB, 4MB, 8MB, 16MB and 32MB page-mode DRAMs Supports DRAM configurations from 2MB to 128MB
Two non-cacheable regions for bus mastering adapters DRAM post write buffer Supports pipeline DRAM burst cycles
Others: Fast Gate A20 and reset emulations.
* Both caches are in write back.
26
GENERAL FEATURES
The Central Processing Unit
The Pentium processor is the next-generation member of 80486 family of microprocessors. It contains all of the features of the 80486 and provides significant enhancements and additions. It is 100% binary compatible with the X86 CPU.
The superscalar architecture of the Pentium processor contains two instruction pipelines and floating-point unit on the Pentium processor are capable of independent operation. Each pipeline issues hit instructions in a single clock. The dual pipes can issue two integer instructions in one clock, or one floating-point instruction in one clock.
The branch prediction unit includes two prefech buffers, one to prefetch code in a linear fashion, and one to prefetch code according to the Branch Target Buffer so that the needed code is almost always prefetched before it is needed for execution.
The floating point unit is redesigned and runs at least three times faster than 80486.
The Pentium processor includes separate 8K code cache and 8K write­back data cache. Each cache is 32 byte line size and is 2-way set associative. The data cache is configurable to be write-back or write­through on a line-by-line basis and follows the MESI protocol. The code cache is a write-protected cache.
The Pentium processor has widen the data bus to 64 bits to improve the data transfer rate. Burst read and burst writeback cycles are supported by the Pentium processor.
In summary, the Pentium processor provides an ultimate performance levels and retains compatibility with the existing applications.
21
GENERAL FEATURES
Cache Subsystem
The external cache of BISON III is write-back, direct-mapped with sizes of 64K, 128K, 256K or 512K. It is organized by single or dual bank mode. Dual bank mode is accessed in interleaved manner and it can support 3-2-2-2 burst read cycle.
DRAM Subsystem
The memory controller is 64 bit wide and has the following features:
Hidden refresh is used the increase the CPU bandwidth. The DRAM can be refreshed in the background while the CPU is accessing the internal or external cache.
Page Mode is used for faster data access from the DRAMs.
Posted-Write to the DRAM improves the write-cycle timing. One quad­word deep data buffer is used to hold the data from the CPU without waiting for the external DRAM cycle.
Shadow RAM is available as an option. System BIOS and video BIOS residing in slow EPROM can be copied to local DRAM to speed up accesses to BIOS code. Shadow RAM addresses range from C0000h to FFFFFh. 16K granularity is provided for address range C0000h to EFFFFh, while the area F0000h - FFFFFh can only be shadowed as a whole. Video BIOS at C0000h - C7FFFh can be cached in the external cache after shadowing.
25
GENERAL FEATURES
Two DRAM control regions can be selected to adapt the bus mastering add-on cards. For the memory region that bus master would write to, set it to non-cacheable or write-through would improve bus bandwidth owing to the elimination of the time-consuming cache invalidation cycle. For the card with its own memory mapped overlay to the system memory, holes can be enabled to allow accessing to the memory on the ISA or VESA bus.
21
GENERAL FEATURES
DRAM Configuration
Bank 0 (bits) Type Bank 1 (bits) Type Total
256K x 64 S ----- ----- 2M 256K x 64 S 256K x 64 S 4M 256K x 64 S 512K x 64 D 6M 256K x 64 S 1M x 64 S 10M 256K x 64 S 2M x 64 D 18M 256K x 64 S 4M x 64 S 34M 256K x 64 S 8M x 64 D 66M 512K x 64 D ----- ----- 4M 512K x 64 D 512K x 64 D 8M 512K x 64 D 1M x 64 S 12M 512K x 64 D 2M x 64 D 20M 512K x 64 D 4M x 64 S 36M 512K x 64 D 8M x 64 D 68M
1M x 64 S ----- ----- 8M 1M x 64 S 1M x 64 S 16M 1M x 64 S 2M x 64 D 24M 1M x 64 S 4M x 64 S 40M 1M x 64 S 8M x 64 D 72M 2M x 64 D ----- ----- 16M 2M x 64 D 2M x 64 D 32M 2M x 64 D 4M x 64 S 48M 2M x 64 D 8M x 64 D 80M 4M x 64 S ----- ----- 32M 4M x 64 S 4M x 64 S 64M 4M x 64 S 8M x 64 D 96M 8M x 64 D ----- ----- 64M 8M x 64 D 8M x 64 D 128M
Type S stands for single density DRAM module, type D stands for double density. 70nS 32-bit wide SIMM modules can be used.
25
GENERAL FEATURES
PCI Bus
Introduction
The Peripheral Component Interconnect (PCI) local bus was specified to establish a high performance local bus standard for several generations of product. It is a 32 bit wide, burst transfer mode bus that is designed to allow glue-less interconnect of component. The following is the features of the PCI :
High performance -
Synchronous bus with operation up to 33MHz 120Mbytes/sec substantial transfer rate
Ease of use -
Enables full auto configuration support of PCI local bus add-in boards and components. PCI devices contain registers with the device information required for configuration.
Features of the PCI bus in OCTEK BISON III
* The PCI local bus is fully compliant to PCI V2.0 specification.
* Up to three PCI masters. * Burst mode PCI accesses to local memory support.
* Combine host CPU sequential writes into PCI burst write cycles.
21
Chapter Three Configuring The System
Important Note: Turn off the power before installing or replacing any component.
Installing The Processor
Pentium is a 273 pin PGA device. Make sure the pin 1 of Pentium (with a notch at the corner) is line up with the pin 1 of the socket.
Before installing the processor, make sure that all the pins are straight. The pins are very fragile. Once these pins are bent, the processor may be damaged.
34
CONFIGURING THE SYSTEM
Installing RAM Modules
BISON III has four banks on board for SIMM modules. Bank 0 and bank 1 must be installed first. Make sure pin 1 of the SIMM module inserted near the power connector. Lock it firmly with the latches on the socket.
Extra SIMM module should be inserted at bank 2 and bank 3.
Configuring The Cache Memory
Note: If you have any question about the configuration of the cache memory, consult your local dealer. Improper configuration will cause the system malfunction.
The external cache is organized by single bank or dual banks with sizes of 64KB to 512KB. Follow the tables below to configure the system.
Cache size JP7 JP16 JP17 JP11 JP10 JP9
64K 2-1 2-1 2-1 OPEN OPEN OPEN 128K 2-3 2-3 2-3 OPEN OPEN CLOSE 256K 2-1 2-1 2-1 OPEN CLOSE CLOSE 512K 2-3 2-3 2-3 CLOSE CLOSE CLOSE
Cache size U13 U14 BANK 0 BANK 1
64K OPEN 8K x 8 8K x 8 OPEN 128K OPEN 8K x 8 8K x 8 8K x 8 256K OPEN 8K x 8 32K x 8 OPEN 512K 8K x 8 8K x 8 32K x 8 32K x 8
31
CONFIGURING THE SYSTEM
Control Of System Speed
System speed can be controlled by keyboard and turbo switch. To change the speed by keyboard, use ‘-’ and ‘+’ of the numeric keypad.
Press ‘Ctrl’ ‘Alt’ and `-' for slow speed and press ‘Ctrl’ ‘Alt’ and ‘+’ for fast speed.
Reset CMOS Setup Information
Sometimes, the improper setting of system setup may make the system malfunction. In this case, turn off the power and set JP28 to 1-2 for a while. The internal CMOS status register is reset. Then set the jumper to 2-3 of JP28 and turn on the power. The BIOS finds the CMOS status register is reset and regards the setup information is invalid. So it will prompt you to correct the information.
VL-Bus Mastering Adapter Installation
VL-Bus mastering adapters can be installed either at J2 or J3. Maximum one VL-Bus mastering adapters is supported by Bison III.
35
CONFIGURING THE SYSTEM
PCI-Bus Adapter Installation
PCI-Bus adapters can be installed either at JA1, JA2 or JA3. The corresponding PCI slot number of each physical slot is listed in the following table :
JA1 JA2 JA3
PCI Slot # 3 1 2
31
CONFIGURING THE SYSTEM
Board Layout
35
CONFIGURING THE SYSTEM
System Board Jumper and Connector Summary
Description J15 Keyboard Connector JP28 Reset CMOS J13, J14 Power Supply Connector J12 External Battery Connector JP27 Display Selection JP7, JP9-JP11, JP16-JP17
Cache Size Selection
J1 Power LED 6 Ext-Lock Connector JP1 Speaker Connector JP29 Power-Good Selection JP13 Cooling Fan Power Selection JP12 Cooling Fan Connector JP3 Hardware Reset Connector JP15 High Speed Write Enable JP2 Turbo Switch JP4 CPU Clock Speed Selection
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CONFIGURING THE SYSTEM
System Board Jumper Setting
There are several options which allows user to select by hardware switches.
JP27 - Display Selection
JP27 CLOSE CGA, EGA, VGA (default) OPEN Monochrome display
JP29 - Power-good Selection
PIN 1-2 Power-good signal from
power supply (default)
2-3 On board power-good signal
JP13 - Cooling Fan Power Selection
PIN 1-2 12Vdc (default) 2-3 +5Vdc
JP15 - High Speed Write Enable (VL-Bus)
JP15 CLOSE 1 Wait State (default) OPEN 0 Wait State
35
CONFIGURING THE SYSTEM
JP4 - CPU Clock Speed Select
PIN 1-2 60 MHz 2-3 66 MHz
System Board Connectors
Under typical conditions, these connectors should be connected to the indicators and switches of the system unit. The functions and the pin assignment of the connectors on the motherboard are listed below.
JP1 - Speaker Connector
Pin Assignment
1 Data out 2 +5 Vdc 3 Ground 4 +5 Vdc
JP3 - Hardware Reset Connector
Pin Assignment
1 Selection Pin 2 Ground
31
CONFIGURING THE SYSTEM
J1 - Power LED & Ext-Lock Connector
Pin Assignment
1 +5 Vdc 2 Key 3 Ground 4 Keyboard inhibit 5 Ground
J13, J14 - Power Supply Connector
Pin Assignment
1 POWERGOOD 2 +5 Vdc 3 +12 Vdc 4 -12 Vdc 5 Ground 6 Ground
Pin Assignment
1 Ground 2 Ground 3 -5 Vdc 4 +5 Vdc 5 +5 Vdc 6 +5 Vdc
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CONFIGURING THE SYSTEM
J12 - External Battery Connector
Pin Assignment
1 + Vdc 2 not used 3 Ground 4 Ground
JP12 - Cooling Fan Connector
Pin Assignment
1 + 5Vdc
or + 12Vdc
2 Ground
J15 - Keyboard Connector
Pin Assignment
1 Keyboard clock 2 Keyboard data 3 Spare 4 Ground 5 +5 Vdc
JP2 - Turbo Switch Connector
Pin Assignment
1 Selection Pin 2 Ground
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Chapter 4 Technical Information
This section provides technical information about BISON III and is intended for advanced users interested in the basic design and operation of BISON III.
Memory Mapping
Address Range Function 000000­7FFFFF
000K-512K System Board Memory
(512K) 080000­09FFFF
512K-640K System Board Memory
(128K) 0A0000­0BFFFF
640K-768K Display Buffer (128K)
0C0000­0DFFFF
768K-896K Adaptor ROM / Shadow
RAM (128K) 0E0000­0EFFFF
896K-960K System ROM /
Shadow RAM (64K) 0F0000­0FFFFF
960K-1024K System BIOS ROM /
Shadow RAM (64K) 100000­7FFFFF
1024K-8192K System Memory
800000­FFFFFF
8192K-16318K System Memory
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TECHNICAL INFORMATION
I/O Address Map
I/O Address Map on System Board
I/O address hex 000 to 0FF are reserved for the system board I/O.
ADDRESS (HEX) DEVICE 000-01F DMA Controller 1, 8237 020-03F Interrupt Controller 1, 8259, Master 040-05F Timer, 8254 060-06F Keyboard Controller 070-07F Real Time Clock, NMI
(non-maskable interrupt) mask 080-09F DMA Page Register, 74LS612 0A0-0BF Interrupt Controller 2, 8259 0C0-0DF DMA Controller 2, 8237 0F0 Clear Math Coprocessor Busy 0F1 Reset Math Coprocessor 0F8-0FF Math Coprocessor Port
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TECHNICAL INFORMATION
I/O address hex 100 to 3FF are available on the I/O channel.
ADDRESS (HEX) DEVICE 1F0-1F8 Fixed Disk 200-207 Game I/O 278-27F Parallel Printer Port 2 2F8-2FF Serial Port 2 300-31F Prototype Card 360-36F Reserved 378-37F Parallel Printer Port 1 380-38F SDLC, bisynchronous 2 3A0-3AF Bisynchronous 1 3B0-3BF Monochrome Display and Printer
Adapter 3C0-3CF Reserved 3D0-3DF Color Graphics Monitor Adapter 3F0-3F7 Diskette Controller 3F8-3FF Serial Port 1 CF8 PCI Config-address Register
+
CFC PCI Config-data Register
+
+ Double word I/O locations
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TECHNICAL INFORMATION
System Interrupts
Sixteen levels of system interrupts are provided on BISON III. The following shows the interrupt-level assignments in decreasing priority.
Level Function
Microprocessor NMI Parity or I/O Channel
Check
Interrupt Controllers
CTLR 1 CTLR 2
IRQ0 Timer Output 0 IRQ1 Keyboard
(Output Buffer Full)
IRQ2 Interrupt from CTLR 2
IRQ8 Real-time Clock Interrupt IRQ9 Software Redirected to
INT 0AH (IRQ2) IRQ10 Reserved IRQ11 Reserved IRQ12 Reserved IRQ13 Coprocessor IRQ14 Fixed Disk Controller IRQ15 Reserved
IRQ3 Serial Port 2 IRQ4 Serial Port 1 IRQ5 Parallel Port 2 IRQ6 Diskette Controller
IRQ7 Parallel Port 1
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TECHNICAL INFORMATION
Direct Memory Access (DMA)
BISON III supports seven DMA channels.
Channel Function
0 Spare (8 bit transfer) 1 SDLC (8 bit transfer) 2 Floppy Disk (8 bit transfer) 3 Spare (8 bit transfer) 4 Cascade for DMA Controller 1 5 Spare (16 bit transfer) 6 Spare (16 bit transfer) 7 Spare (16 bit transfer)
The following shows the addresses for the page register.
Page Register I/O Address (HEX) DMA Channel 0 0087 DMA Channel 1 0083 DMA Channel 2 0081 DMA Channel 3 0082 DMA Channel 5 008B DMA Channel 6 0089 DMA Channel 7 008A Refresh 008F
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TECHNICAL INFORMATION
Real Time Clock and CMOS RAM
Real time clock and CMOS RAM are contained on board. Real time clock provides the system date and time. CMOS RAM stores system information. Both are backed up by battery and will not lose information after power off. The following page shows the CMOS RAM Address Map.
System Expansion Bus
BISON III provides four 16-bit ISA slots; two VL-bus slots.
The I/O channel supports:
* I/O address space from hex 100 to hex 3FF * Selection of data access (either 8 or 16 bit) * 24 bit memory addresses (16MB) * Interrupts * DMA channels * Memory refresh signal
41
TECHNICAL INFORMATION
The following figure shows the pin numbering for I/O channel connectors (A-side and B-side).
47
TECHNICAL INFORMATION
The following figure shows the pin numbering for I/O channel connectors (C-side and D-side).
41
TECHNICAL INFORMATION
The following tables summarize pin assignments for the I/O channel connectors.
I/O Channel (A-Side)
I/O Pin Signal Name I/O
A1 -I/O CH CK I A2 SD7 I/O A3 SD6 I/O A4 SD5 I/O A5 SD4 I/O A6 SD3 I/O A7 SD2 I/O A8 SD1 I/O
A9 SD0 I/O A10 -I/O CH RDY I A11 AEN O A12 SA19 I/O A13 SA18 I/O A14 SA17 I/O A15 SA16 I/O A16 SA15 I/O A17 SA14 I/O A18 SA13 I/O A19 SA12 I/O A20 SA11 I/O A21 SA10 I/O A22 SA9 I/O A23 SA8 I/O A24 SA7 I/O A25 SA6 I/O A26 SA5 I/O A27 SA4 I/O A28 SA3 I/O A29 SA2 I/O A30 SA1 I/O A31 SA0 I/O
47
TECHNICAL INFORMATION
I/O Channel (B-Side)
I/O Pin Signal Name I/O
B1 GND Ground
B2 RESET DRV I
B3 +5 Vdc Power
B4 IRQ9 I
B5 -5 Vdc Power
B6 DRQ2 I
B7 -12 Vdc Power
B8 0WS I
B9 +12 Vdc Power B10 GND Ground B11 -SMEMW O B12 -SMEMR O B13 -IOW I/O B14 -IOR I/O B15 -DACK3 I B16 DRQ3 O B17 -DACK1 I B18 DRQ1 O B19 -Refresh I/O B20 CLK O B21 IRQ7 I B22 IRQ6 I B23 IRQ5 I B24 IRQ4 I B25 IRQ3 I B26 -DACK2 O B27 T/C O B28 BALE O B29 +5 Vdc Power B30 OSC O B31 GND Ground
41
TECHNICAL INFORMATION
I/O Channel (C-Side)
I/O Pin Signal Name I/O
C1 SBHE I/O
C2 LA23 I/O
C3 LA22 I/O
C4 LA21 I/O
C5 LA20 I/O
C6 LA19 I/O
C7 LA18 I/O
C8 LA17 I/O
C9 -MEMR I/O C10 -MEMW I/O C11 SD8 I/O C12 SD9 I/O C13 SD10 I/O C14 SD11 I/O C15 SD12 I/O C16 SD13 I/O C17 SD14 I/O C18 SD15 I/O
47
TECHNICAL INFORMATION
I/O Channel (D-Side)
I/O Pin Signal Name I/O
D1 -MEM CS16 I
D2 -I/O CS16 I
D3 IRQ10 I
D4 IRQ11 I
D5 IRQ12 I
D6 IRQ15 I
D7 IRQ14 I
D8 -DACK0 O
D9 DRQ0 I D10 -DACK5 O D11 DRQ5 I D12 -DACK6 O D13 DRQ6 I D14 -DACK7 O D15 DRQ7 I D16 +5 Vdc Power D17 -MASTER I D18 GND Ground
41
TECHNICAL INFORMATION
The following table summarizes the pin assignments for VESA VL­bus connector.
VL-bus (side A)
I/O Pin Signal Name
A1 CD1 A2 CD3 A3 GROUND A4 CD5 A5 CD7 A6 CD9 A7 CD11 A8 CD13
A9 CD15 A10 GROUND A11 CD17 A12 POWER A13 CD19 A14 CD21 A15 CD23 A16 CD25 A17 GROUND A18 CD27 A19 CD29 A20 CD31 A21 CA30 A22 CA28 A23 CD26 A24 GROUND A25 CA24 A26 CA22 A27 POWER A28 CA20
47
TECHNICAL INFORMATION
VL-bus (side A)
I/O Pin Signal Name
A29 CA18 A30 CA16 A31 CA14 A32 CA12 A33 CA10 A34 CA8 A35 GROUND A36 CA6 A37 CA4 A38 WBACK­A39 BEO­A40 POWER A41 BE1­A42 BE2­A43 GROUND A44 BE3­A45 ADS­A46 LRDY­A47 LDEV­A48 LREQ­A49 GROUND A50 LGNT­A51 POWER A52 ID2 A53 ID3 A54 ID4 A55 LKEN­A56 LEADS-
41
TECHNICAL INFORMATION
VL-bus (side B)
I/O Pin Signal Name
B1 CD0
B2 CD2
B3 CD4
B4 CD6
B5 CD8
B6 GROUND
B7 CD10
B8 CD12
B9 POWER B10 CD14 B11 CD16 B12 CD18 B13 CD20 B14 GROUND B15 CD22 B16 CD24 B17 CD26 B18 CD28 B19 CD30 B20 POWER B21 CA31 B22 GROUND B23 CA29 B24 CA27 B25 CA25 B26 CA23 B27 CA21 B28 CA19
47
TECHNICAL INFORMATION
VL-bus (side B)
I/O Pin Signal Name
B29 GROUND B30 CA17 B31 CA15 B32 POWER B33 CA13 B34 CA11 B35 CA9 B36 CA7 B37 CA5 B38 GROUND B39 CA3 B40 CA2 B41 n/c B42 RESET­B43 D/C­B44 M/IO­B45 W/R­B46 RDY­B47 GROUND B48 IRQ9 B49 BRDY­B50 BLAST­B51 ID0 B52 ID1 B53 GROUND B54 VLCLK B55 POWER B56 LBS16-
41
TECHNICAL INFORMATION
The following table summarizes pin assignments for PCI local bus connector.
PCI Bus Pinout (side A)
I/O Pin Signal Name
A1 TRST#
A2 +12V
A3 Reserved
A4 Reserved
A5 +5V
A6 INTA#
A7 INTC#
A8 +5V
A9 Reserved A10 +5V A11 Reserved A12 Ground A13 Ground A14 Reserved A15 RST# A16 +5V A17 GNT# A18 Ground A19 Reserved A20 AD[30] A21 Reserved A22 AD[28] A23 AD[26] A24 Ground A25 AD[24] A26 IDSEL A27 Reserved A28 AD[22] A29 AD[20] A30 Ground
47
TECHNICAL INFORMATION
PCI Bus Pinout (side A)
I/O Pin Signal Name
A31 AD[18] A32 AD[16] A33 Reserved A34 FRAME# A35 Ground A36 TRDY# A37 Ground A38 STOP# A39 Reserved A40 SDONE A41 SBO# A42 Ground A43 PAR A44 AD[15] A45 Reserved A46 AD[13] A47 AD[11] A48 Ground A49 AD[09] A50 C/BE[0]# A51 Reserved A52 AD[06] A53 AD[04] A54 Ground A55 AD[02] A56 AD[00] A57 +5V A58 REQ64# A59 +5V A60 +5V
41
TECHNICAL INFORMATION
PCI Bus Pinout (side B)
I/O Pin Signal Name
B1 -12V
B2 TCK
B3 Ground
B4 Reserved
B5 +5V
B6 +5V
B7 INTB#
B8 INTD#
B9 PRSNT1# B10 Reserved B11 PRSNT2# B12 Ground B13 Ground B14 Reserved B15 Ground B16 CLK B17 Ground B18 REQ# B19 +5V B20 AD[31] B21 AD[29] B22 Ground B23 AD[27] B24 AD[25] B25 Reserved B26 C/BE[3]# B27 AD[23] B28 Ground B29 AD[21] B30 AD[19]
47
TECHNICAL INFORMATION
PCI Bus Pinout (side B)
I/O Pin Signal Name
B31 Reserved B32 AD[17] B33 C/BE[2]# B34 Ground B35 IRDY# B36 Reserved B37 DEVSEL# B38 Ground B39 LOCK# B40 PERR# B41 Reserved B42 SERR# B43 Reserved B44 C/BE[1]# B45 AD[14] B46 Ground B47 AD[12] B48 AD[10] B49 Ground B50 AD[08] B51 AD[07] B52 Reserved B53 AD[05] B54 AD[03] B55 Ground B56 AD[01] B57 Reserved B58 ACK64# B59 +5V B60 +5V
41
Appendix A Operation and Maintenance
Static Electricity
When installing or removing any add-on card, DRAM module or processor, you should discharge the static electricity on your body. Static electricity is dangerous to electronic device and can build-up on your body. When you touch the add-on card or motherboard, it is likely to damage the device. To discharge the static electricity, touch the metal of your computer. When handling the add-on card, don't contact the components on the cards or their "golden finger". Hold the cards by their edges.
Keeping The System Cool
The motherboard contains many high-speed components and they will generate heat during operation. Other add-on cards and hard disk drive can also produce a lot of heat. The temperature inside the computer system may be very high. In order to keep the system running stably, the temperature must be kept at a low level. A easy way to do this is to keep the cool air circulating inside the case. The power supply contains a fan to blow air out of the case. If you find that the temperature is still very high, it would be better to install another fan inside the case. Using a larger case is recommended if there are a number of add-on cards and disk drives in the system.
A2
OPERATION AND MAINTENANCE
Cleaning The "Golden Finger"
Whenever inserting an add-on card to the motherboard, make sure that there is no dirt on the "golden finger" of the add-on card. If not, the contact between the "golden finger" and the slot may be poor and thus the add-on card may not work properly. Use a pencil eraser to clean the "golden finger" if dirt is found.
Cleaning The Motherboard
The computer system should be kept clean. Dust and dirt is harmful to electronic devices. To prevent dust from accumulating on the mother­board, installing all mounting plates on the rear of the case. Regularly examine your system, and if necessary, vacuum the interior of the system with a miniature vacuum.
A1
Appendix B Troubleshooting
Main Memory Error
After power up, the monitor remains blank, and there are beep sounds indicating a main memory failure. In this case, turn off the power and remove all SIMM modules. Carefully place the modules back to the sockets and make sure that all the modules are locked by the locking latches firmly.
In some other cases, the total memory found by the BIOS is different from the actual amount of memory on board. ( Note that 128K bytes memory is reserved for the shadow RAM function and will not be counted by the BIOS). It is also a memory failure and you can follow the instruction above.
B24
TROUBLESHOOTING
THIS PAGE IS INTENTIONALLY LEFT BLANK
B2
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