NXP Semiconductors NTAG I2C plus User Manual

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NTAG I²C plus Explorer Kit - Android Demo

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User manual

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Document information

Info

Content

Keywords

NTAG I2C plus, Explorer Kit, Android, NFC tag

Abstract

This User Manual describes the functionalities and how to use the

and have the same look and

Android and PC application of the NTAG I2C plus Explorer kit. Both applications provide the same functionality feel so this User Manual is valid for both.

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Contact information

For more information, please visit:

Revision history

Rev

Date

Description

2.1

20170309

Update - Bluetooth Pairing added

2.0

20170201

Updates

1.0

20160216

Initial Version

http://www.nxp.com

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1. Object

NTAG I2C plus Explorer kit is an all-in-one demonstr ation and development res ource to demonstrate the unique pr operties of the NTAG I full complement of hardware and s oftware tools, users can inv estigate the capabiliti es of the chip through the various demonstrations, develop and test their own applications (with additional LPC-Link2 debug probe

This User Manual ex plains how to use the NTAG I The Windows app is not detailed in this User Manual since it provides identical functionalities as the Android app, therefore the same User Manual is valid.

Technical aspects relat ed to the IC features are beyond the scope of this doc ument. To get further technical details please consult the dedicated Datasheet “NTAG I Forum Type 2 Tag compliant IC with I

1

).

2

C interface” (refer to [NTAGI2Cplus]).

2

C plus connected tag. By including a

2

C plus d emo application f or Android.

2

C plus, NFC

1

www.nxp.com/LPC-LINK2

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Fig 1. NTAG I2C plus

2. NT AG I2C plus introduction

The NTAG I2C plus part of NXP’s NTAG family offering both contactless and contact interfaces. In addit ion to the passive NFC F orum compliant RF interface, the NTAG I plus pro vides an I when the chip is powered by an external device, i.e. a NFC mobile phone.

The NTAG I supply external lo w power devices (e.g. microc ontrollers ) with the ener gy gener ated f rom the RF field of the external NFC device.

2

C interface that al lows the IC to c ommunicate with the mic rocontroller

2

C plus operating in energy harvesting mode provides the possibility to

2

C

The NTAG I

1. EEPROM memory compliant with the NFC Forum Type 2 Tag implementation.

2. 64-byte SRAM memory, which is mapped to the EEPROM memory and it is

The N TAG I of data from the RF interf ace to the I use of the SRAM memory that allows fas t data transfer between interfaces without the EEPROM performance limitations.

In addition to the I Detection pin for waking up the connected host devices or synchronizing the data transfer between the two interfaces.

The NTAG I done by authenticating the tag with a password. When the tag is protected, authentication is nee ded to access the memor y. The NTAG I speed when writing into the SRAM memory.

2

C plus product has two types of memories:

externally powered.

2

C plus feat ures a pass-through mode tha t allows fas t download an d upload

2

C interface func tionalit y, the NT AG I2C plus pr oduct f eatures an Event

2

C plus offers the pos sibil ity to pr otec t the memory access. This protection is

2

C interface and vi ce versa. T his f unctional it y m akes

2

C plus also impr oves the

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Fig 2. NTAG I2C plus Explorer Board (refer to [EXPLORER])

3. NT AG I2C plus Expl orer kit contents

The NTAG I2C plus Explorer kit (NEK) consists of hardware and software tools that developers can use to und erstand th e NXP NTAG I prototypes to demonstrate its potential for other application. The kit includes:

3.1 Hardware components

3.1.1 NT AG I2C plus Explorer Board

A hardware board bas ed on the NXP LPC 11U24 m icrocontroller (refer to [LPC11U24]), with on-board LCD d isplay, NXP LM75B tem perature sensor (refer to [LM75B]), vo ltage monitors, I2C serial bus connector, JT AG/SWD debug connector, RGD LED micro USB connector and five push buttons.

2

C plus functionalities and c reate firs t

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Fig 3. PCB and Flex antenna boards with NTAG I²C plus IC

Fig 4. Field detector board

3.1.2 Antenna board

The antenna board carries the NTAG I2C plus 2k version itself and provides two interfaces:

• The RF interface to an NFC device.

• The I

The design files for both th e PCB a nd Flex ante nna c an be f ound on the web pa ge (ref er to [PCB Antenna] and [Flex Antenna]

2

C interface to the host, e.g. the NTAG I2C plus Explorer board.

3.1.3 Field detector board

The position of the antenna of NFC devices vary from device to device. To use the Explorer Kit with an NFC Device, NFC radio needs to be enabled. To find the position of the antenna, it is convenient to use the included field detector board. The LED helps to find the antenna position.

Design files may be downloaded from the demo board homepage (refer to

Detector])

[Field

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Fig 5. Identiv uTrust CLOUD 3700F reader

3.1.4 USB reader

Instead of a NFC dev ice, the USB (PCSC) reader (Identiv uT r us t CLO UD 37 00F ) may be used in combination with the Windows app to develop applications.

To install the reader , do wnload latest driv er fr om the web page (r efer to [Identiv]), extract “Identiv uTrust Installer.zip” and install it with no reader connected.

In Windows 7 operativ e systems, when a sm artcard is placed over the reader there is frequently an issue regarding the smartcard mini-drivers. Although a solution to this problem is given in this section , more inf ormation can be found on the W indows Support Webpage Group Policy has to be changed to prim ary group policy settings for smart cards. The procedure is as follows:

2

. To s olve t his is sue t he Sm art Card P lug has to be disabled and Play in local

1. Click Start, type gpedit.msc in the Search programs and files box, and then press ENTER.

2. In the console tree under Computer Configuration, click Administrative Templates.

3. In the details pane, double-click Windows Components, and then doubleclick Smart Card.

4. Right-click Turn on Smart Card Plug and Play service, and then click Edit.

5. Click Disabled, and then click OK.

6. Click Start, type regedit.exe in the Search programs and files box, and then press ENTER.

7. Go through the tree key, on the left, up to the key

• HKEY_LOCAL_MACHINE \ Software \ Microsoft \ Cryptography \ Calais for 32-bit system or

• HKEY_LOCAL_MACHINE \ SOFTWARE \ Wow6432Node \ Microsoft \ Cryptography \ Calais for 64-bit system

8. Add a new DWORD value nam ed CardDisconnectPowerDo wnDelay and set its value to 0.

9. Click Start, type services.msc in the Search programs and files box, and then press ENTER.

10. Find the smart card service in the list, right-click and click Restart.

11. Now you may plug the reader

2

https://support.microsoft.com/en-us/kb/976832.

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3.1.4.1 USB Reader firmware update

In some cases, reader is not functioning properly with Windows “NTAG I²C plus Demo” application. This is due to newer Reader´s firmware. In this case, it needs to be updated, using patch tool

3

.

3.2 Software components

3.2.1 NT AG I2C plus Explorer board firmware

The firmware runs on the NTAG I2C plus Explor er boar d and is flashed dur ing produc tion at the MCU which supports the demonstration functionality of the hardware. The delivered NTAG I

• NTAG_I bootloader application. It is flashed at on-chip memory address starting at 0x0000 0000 and it is the f irst application to be executed after the MCU boots. This application has three functions:

2

C plus Explorer board firmware consists of three applications:

2

C_Explorer_Bootloader: This project implements the secondary

o Jump to the start memory of the user application. o Enter into flashing mode functionality. o Enter into USB mode (Peek and Poke).

• NTAG_I Android / Windows demonstration applications. It is flashed at on-chip flash memory starting at 0x0 000 4000 address and it is executed af ter the bootloader jumps to the application start address.

• NTAG_I the NTAG_I application is provided to il lustrate the NFC flashing functionality and its binary image is provided embedded by default into the Android app (see Section 4.5).

3.2.2 Android app

The demo applicat ion on an Andro id NFC phone ( “NFC m obile”) sho wcasing t he various features of the NT AG I from the public NXP website as well as at Google Play.

2

C_Explorer_Demo: This project implements the logic supporting the

2

C_Explorer_Blink: This is a sample proj ect that sets into blinking m ode

2

C Explorer board as soon as the RF field is detected. This

2

C plus. The NT AG I2C Demo application is available f o r download

3

http://www.nxp.com/demoboard/OM5569-NT322ER/documents/software/SW4044.zip

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Fig 6. Android app GUI

Note: The UM10989 (refer to [UM10989]) descr ibes in detail how to get started with the

development of Android Applications.

3.2.3 Windows app

Together with the US B reader, the W indows app can be utilized to substitute a m issing NFC mobile phone. The Windows app has similar functionaliti es as the An dr oi d a pp. This software component is available as a download from the public NXP website. The software will inclu de a setup file whic h will install the Windows App in the f o lder ‘Program files/NXP Semiconduc tors’, this instal latio n proc ess will c reat e a sh ortc ut to t he W indo ws App on your desktop. No further procedure is required to run this application.

1. Download the NTAG I

2. If not done, install the Identiv uTrust driver as described above and the NTAG I2C Demo App

3. Launch the NTAG I

There are some po ints to consider when using the Windows App, since it is conn ec ted to an external reader via USB. There are sometimes issues with the co nnection between the reader and the tag. On these cas es, it is recommended to restart t he a pp and re-plug the reader.

2

C Demo App (refer to [PC App])

2

C Demo App

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Fig 7. Windows application GUI

Note: The Windows application functionalities, GUI and look and feel are intentionally

made the sam e as the Android application . The Windows application is in ten ded t o run in a Windows environment together with the Identiv uTrust CLOUD 3700F reader as a substitute in case an NFC phon e is not available . Ther efore, this User Manual is valid f or both the Android app and Windows applicat ion. However, only Android app screensho ts are shown in this document.

3.2.4 Peek and Poke GUI

The Peek and Poke GUI is a Windows app that can be used to examine the detailed memory contents of the NT AG I of view only a USB cab le connec tion fr om the b oard t o th e PC is neede d (n o ne ed of t he USB NFC reader). This software component is available as a downlo ad from the public NXP website (refer to [Peek&Poke]

.

2

C plus EEPROM via I2C interface. From hardwar e poi nt

).

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Fig 8. Peek and Poke GUI

Note: The UM10967 (refer to [ UM10967]) descr ibes in detail how to get started with the

Peek and Poke tool and the different functionalities it offers.

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Fig 9. Application overview

4. NT AG I2C plus Explorer Demo app

The Android application is intended to operate on devices running Andr oid version 4.0 and above. The applicatio n has been optimized for a correct visioning of the graphical elements in smartphones featuring different resolutions.

As seen in Fig 9, the Andr oid application consists of two demos that can be launched from the main activity of the application and four configuration functionalities that are accessed from the configuration selection view in the main activity.

4.1 Demo tab

After the Splash wi ndo w c l os es, the Demo tab will a p pear. This screen allo ws th e us er to launch the Demo tab itself, the NDEF demo tab, the Speed demo tab and access the Configuration tab, with all configuration functionalities supported by the application.

Regarding the Demo tab, it allows demonstrating:

• The Energy harvesting functionality of the NTAG I powering up of the complete dem o kit board with the energy harvested f rom the RF interface without any battery.

• The RF to I related color button on the NFC device screen.

• The I the demo kit board reflected on the NFC device screen.

• The dynamic bidirectional communication between the two interfaces as the temperature value as well as the voltage on the energy-harvesting pin get dynamically updated on both the low power screen and the NFC device screen.

2

C com munication ena bling us to modify th e LED c olor b y pressing the

2

C to RF comm unication as the set of push buttons pres sed by the user o n

2

C plus that enables the

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Fig 10. Demo tab snapshot

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Fig 11. Green LED board configuration selection

4.1.1 Configuring NEK board to demonstrate RF to I2C communication

The board configuration p art of the demonstration s hows ho w the NTAG I2C plus passes a command from the RF input throug h the SRAM and I microprocessor, which acts upon the command and lights the appropriate LED.

1. Touch one of the colored board conf ig uration buttons on your mobile device. The NTAG icon then changes color, indicating the color selection.

2. Tap your mobile device on the antenna. When properly placed, the LED will illuminate in the chosen color. Optionally, the LCD display will display the harvested voltage, the t emperature sensed by the board, the d efault text or the stored NDEF message if the corresponding options are enabled in the board configuration menu.

2

C serial interface outp ut to the

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Fig 12. Reading board input

4.1.2 Reading board input to demonstrate I2C to RF communication

The three colored buttons on the NEK board demonstrate information from the board beings transferred f rom the microprocessor through t he I plus, which then sends it vi a the RF field t o the m obile devic e for dis pla y. W hen press ed, each colored button on t he NEK boar d wi ll caus e a cor r espond ing s h ade of f on t he board input NXP logo.

2

C serial bus to the N TAG I2C

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Fig 13. Temperature sensor demonstrates SRAM pass through mode

4.1.3 Temperature sensor

The NEK board incorporates a temperature sensor for measuring the ambient temperature. This information can be shown in the Demo tab of the Android/PC application. Addit ion all y it can be shown in the LCD displa y if the opt io n is c heck ed in the menu.

This operation demonstrates the NTAG I which data passes through its SRAM. It is also an other demonstration of passing data from the microproc essor through the I read through the RF interface for display on the mobile device.

2

C plus operating in pass-through mode, in

2

C serial bus to the NT AG I2C plus, which can be

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Fig 14. Enabling NEK board LCD

4.1.4 Enabling LCD display

You can enable th e NEK board LCD b y touching the Enable LCD se lection bo x. When doing so, the LCD will show the predefined NTAG I energy harvested and , if enabled, the temperature s ensed by the board in Celsi us and Fahrenheit degrees.

Once again, this operation demonstrates the NTAG I through mode sends a command from the RF input through the I to the microprocessor, which in turn acts upon the command and turns on the LCD display.

2

C plus Explorer text message, the

2

C plus chip operating in pass-

2

C serial interface output

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Fig 15. Displaying NDEF text message on NEK board LCD

4.1.5 Displaying NDEF text message on the NEK board LCD

You can displa y the ND EF text m ess age on the NEK boar d LCD b y touch ing the Display NDEF message on LCD selection box.

Again, this operation dem onstrates the NT AG I First, the NDEF message is read from the NTAG I transferred to the MCU using the SRAM memory, which displays it in the display.

2

C plus operating in pass-through mode.

2

C plus EEPROM memory and is

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4.2 NDEF tab

The NDEF tab allows the user to r ead or write an NDEF m essage to the NT AG I2C plus EEPROM. Actually, it could be used to read or write an NDEF message to any NFC Forum Type 2 Tag, such as a MIFARE Ultralight, NTAG21x, ...

On the Read NDEF m ode, the ap pl ic ati on rea ds the NDEF message TLV from the NTAG

2

I

C plus and returns its content and the type of NDEF message.

On the Write NDEF m ode, the ap plicat ion allows th e user to write a T ext type, U RI type, Bluetooth pairing type or Smart Poster NDEF message.

• Text record type is used to store plain text data.

• URI record type allows NFC tags to trigg er actions on the NFC de vice (usua lly the

smartphone), such as opening a webpage or sending an SMS message.

• Bluetooth pairing NDEF messages contain information about a Bluetooth device that allows the smar tphone to pair with that Bluetooth device by just ta pping the tag. In the case of writing a Bluetooth pairing type message, it is important to remember that the MAC addr ess shall be 6 bytes, in hex adecimal (therefor e, 12 characters from 0 to F).

• Smart Poster record type defines a structure including a URI record type and a Text record type as building blocks.

The NDEF tab also co nt a ins a Writ e def ault NDEF message button. When this butto n is pressed, the application automatically writes a NDEF Smart Poster mes sage with the 2 records (optionally 3):

• Text record “NTAG I2C plus EXPLORER”

• URI content: www.nxp.com/demoboard/OM5569

.

• Optionally: AAR (Android Application Record)

More on Write default NDEF message is described below in section 4.2.2

.

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Fig 16. NDEF tab snapshot

When the NDEF message has been successfully written the “write tag successfully done” popup appears temporarily in the application informing the user that t he message has been correctly written. There is n o need to tap th e tag again if you want to write m ultiple NDEF messages and read them in between.

In order to learn mor e about the different t ypes of NDEF mess ages and what structure they have, please refer to the following NFC Forum specifications:

“NFC Data Exchange Format (NDEF) Technical Specifications” “NFC Record Type Definition (RTD) Technical Specification” “NFC Text RTD Technical Specification” “NFC URI RTD Technical Specificati on” “NFC Forum Connection Handover Technical Specification” “NFC Smart Poster RTD Technical Specification” “Bluetooth Secure Simple Pair ing Usin g NFC”

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Fig 17. Reading NDEF message stored in EEPROM of NTAG I2C plus

4.2.1 Reading NDEF data

To read a NDEF message out of NTAG I2C plus:

1. Select Read NDEF from the tab on the right of the mobile device screen.

2. Tap the mobile device onto the antenna.

3. A proper read will result in a m essage on the m obile device in dicating Read tag successfully done. If no NDEF message is found or NTAG I²C plus is not formatted as defined in NF C Forum Type 2 Tag s pec, it will result in a m essage

NTAG I2C plus product is not NDEF formatted. Additional ly, the Enable NDEF read loop selec tion box can be used to se t the application to perm anently read

the EEPROM memory, so any change will automatically appear in the window.

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Fig 18. Writing NDEF message to NTAG I2C plus EEPROM

4.2.2 Writing NDEF data

To write an NDEF message into the NTAG I2C plus:

1. Select Write NDEF from the tab on the right of the mobile device screen.

2. Type a message into the NDEF message area. Or alternatively, press Write Default NDEF message on your screen, which writes a NDEF Smart Poster message with the text content: “NTAG I2C plus EXPLORER” and the URI content: www.nxp.com/demoboard/OM5569 NDEF message an Android Applicatio n Record (AAR) , which adds the p ackage name of the NTAG I record. You can add an AAR to any NDEF record of your NDEF message because Android searches the entire NDEF message for AARs. If it finds an AAR, it starts the applicati on based on the pack age name inside the AAR. If the application is not pr esent on the device, Google Pla y is launched to do wnload the application.

. Additionally, you can add to your

2

C plus Demo application embedded inside the NDEF

3. Tap the mobile device onto the antenna.

4. A proper write will result in a mes sage on the mobile device indicating write tag successfully done.

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Fig 19. Data transfer speed measurement concept behind the SRAM selection

4.3 Speed tab

The speed Test Demo measures the transfer bit rate when communicating with the NTAG I

4.3.1 SRAM speed test

The SRAM speed Test measures the speed at which the data is transferred from the application to the microcontroller through the SRAM (with the NTAG I through mode), and vice versa. First, the application writes data to the SRAM several times, and the microcontroller reads from it. This way, the throughput of the communication in pass-through m ode from the application to the microcontroller can be obtained. Once this f irst test has finished, the m icrocontroller starts writing to the SRAM memory, while the application reads from it. This way, the throughput from the microcontroller to the application can be measured.

2

C plus Explorer board according to different configurations.

2

C plus in pass-

Since the s ize of the SR AM m emory is 64 bytes, the data to be transm itted and rec eived has to be a multiple of 64. Actually, what is transmitted is the number of 64-byte block s defined by the user in the Block multiplier field (10 by default).

The integrity of the d ata trans fer red in both dir ections is c heck ed b y appending a C RC32 value in the last b lock. The CRC32 is calculated f or the whole message that h as been transferred (for all the blocks). If the CRC32 from the message received by the application is right, it will show an “Integrity of the data: OK” message. On the other hand, if the CRC32 from the m essage received by the board is right, it will turn on the green LED at the end of the Speed Test.

Once the test has been finished, both the application and the microcontroller indicate whether the integrit y check was succ essful ( through a green LED at th e m icrocontrol ler), and the application shows the time, mean speed and data transferred for both directions.

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Fig 20. SRAM Speed test snapshot

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Fig 21. EEPROM Speed test snapshot

4.3.2 EEPROM speed test

The EEPROM Speed Test measur es the speed at which the applicat ion is able to write and read the EEPROM memory of the NTAG I message is written to t he EEPROM, and then, the same NDEF m essage is read. The written NDEF mess age is a tex t t ype message that contains th e da ta i n the textbox of the application repeated as many times as indicated in the Block multiplier field.

First, the applicatio n creates the NDEF mess age to be written by creating a string that contains the content from the textbox as many times as indicated, and adding the appropriate header. T hen, it writes it to the EEPROM m emory by sendin g as man y NFC Forum T ype 2 Tag Write comm ands as neces sar y, and m easuring t he tim e it ta k es to do so. Once it has finished writing, it reads the NDEF message from the NTAG I EEPROM memory.

Once the test is f inished, the application s hows the number of b ytes, mean speed and time for both the readi ng and writin g proces s. T he user c an also check the cont ent of the memory to ensure that the NDEF message has been written appropriately.

2

C plus. In order to do this, an NDEF

2

C plus

Comparison between EEPROM read/write Fig 21 and SRAM read/write Fig 20 is represented. Performing operations on SRAM memory with FAST_READ and FAST_WRITE commands, highly improve overall communication speed.

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Fig 22. CONFIG tab menu

4.4 Configuration tab

This tab shows a selection menu that provides access to the different configuration activities of the NT AG I may select Read Tag Memory, Reset Tag Memory, Read Session Registers or Read/Write Configuration registers.

2

C plus supported by the application. Fr om this screen, the user

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Fig 23. Read tag memory snapshot

4.4.1 Reading tag memory

This option reads and displays on the screen the content of the whole memory of the NTAG I tag memory:

For security reasons, the pages from 0xE2 to 0xFF in the sector 0 are hidden when reading all the memory. These bytes define the PWD, PACK, AUTH0, PT_I2C and ACCESS bytes.

2

C plus product. T h e c omplete content can be sc r olled on t he s c r een. T o read the

1. Select Read Tag Memory from the Configuration tab.

2. Tap the mobile device to the antenna (it might take 2-3 seconds to read the memory content.

3. The screen will display the entire memory contents.

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Fig 24. Reset tag snapshot

4.4.2 Resetting tag memory

This configuration functionality is about resetting the whole user memory of the NTAG I2C plus product to the original content that was programmed during production.

1. Select Reset Tag memory from the Config tab screen.

2. Tap the mobile device to the antenna tag. The user should tap the NTAG I plus device for 2-3 seconds to reset the memory content.

3. Upon successful reset, a banner indicating completion will be displayed along the bottom of the screen.

In addition, when the user runs the reset mem ory on the NTAG I write the PWD to 0xF FF FF FF F, AU T H0 to 0x F F, P AC K to 0x 000 0, A CC E SS to 0x00 and PT_I2C to 0x00. These are the default values for the access configuration.

2

C PLU S version, it will

2

C

Alternatively, we can a lso reset the tag contents if we k eep the second button pressed and tap the p hone with the NF C communication e nabled. W hen the LED is set to green, the tag memory has been reset to the default NDEF SmartPoster.

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Fig 25. Alternative way to reset tag

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Fig 26. Read Session registers snapshot

4.4.3 Reading session registers

This option displa ys the content of the session registers in the NTAG I2C plus. Session registers are used to configure or monitor the registers values of the current communication session. Session registers values can be modified within a particular communication sess ion ( on l y v ia t he I them). However, after Power-On-Reset, these values go back to their default configuration values, which are obtained from the configuration registers.

2

C interface, so the a ppl ication is not able to modify

Session registers values c a n be r ea d on pages F8h to F 9h (s ec tor 3) vi a the RF int erf ac e or at block FEh via the I

2

C interface.

To read the tag session registers:

1. Select Read Session Registers from the Config tab screen.

2. Tap the mobile device to the tag antenna.

3. Upon successful read, the session registers values will be shown. Tapping o n any of the right-f acing arrows will bring up more details. A blue mark indicates ON or selected.

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Session register values are displayed on the screen divided into different groups:

• General Chip Information: General information about the discovered NTAG I plus product. It shows the following information:

o IC product: NTAG I o User Memory: Size of the user memory of the NTAG I

• NTAG Configuration: General NTAG configuration:

2

o I

C RST on start is: Shows the content of the I2C_RST_ON_OFF bit,

which is responsible for enabling a soft reset through an I start.

• Field Detection: Information related to the field detection functionality, which is used for the smart pairing with devices, as it triggers a signal to the connec ted host when the NTAG I

o FD_OFF: Shows the co ntent of the FD_OFF bits, which define th e event

upon which the signal output on the field detection pin is brought up.

2

C plus chip version.

2

C plus chip.

2

C repeated

2

C plus product is powered by an external NFC device.

2

C

o FD_ON: Shows the content of the FD_ON bits, which define the event

upon which the signal output on the field detection pin is brought down.

o Last NDEF Page is: Shows the content of the LA ST _N DEF_ BLO C K byte,

this is the address of the last block (I NDEF message.

o NDEF Data Read is: Shows the content of the NDEF_DATA_READ bit. o RF Field present is: S hows the co ntent of the RF_FIELD_PR ESENT bit,

which indicates if an RF field is detected.

• Pass through: Information related to the pas s-through functionality, which allo ws the fast transfer of data between the R F and the I SRAM memory.

o Pass Through is: Shows the content of the PT HRU_ON_OFF bit, which

is responsible for enabling the data transfer via the SRAM memory.

2

o I

C locked is: Shows th e content of the I2C_LOCKED bit, which can lock

the access to memory to the I

o RF locked is: Sho ws the content of the RF_LOCKED bit, which can lock

the access to memory to the RF interface.

o SRAM I

which indicates if the data in the SRAM memor y is ready to be read by the I

o From RF to I

defines the data flow direction for the data transfer.

2

C ready is: Shows the content of the SRAM_I2C_READY bit,

2

C interface.

2

C is: Shows the content of the PTHRU_DIR bit, which

2

C interface.

2

C interface addressing) of the

2

C interface by usin g a 64 byte

• SRAM Memory settings: Information about the SRAM mirroring feature. The SRAM memory can be mirrored in the User Memor y for RF access b y enabling the SRAM mirroring feature.

o SRAM Mirror: Shows the content of the SRAM_MIRROR_ON_OFF bit. o SRAM M irror block: Shows the conten t of the SRAM_MIRROR_BLOC K

byte, which indicates the address of the first block (I addressing) of the mirror of SRAM memory.

2

C interface

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Fig 27. Read / Write configuration registers snapshot

• I2C Settings: Information about the I2C management configuration.

o WD_LS Ti mer is: Sho ws the conte nt of the W DT_LS byte: the LS B of the

watchdog time control register.

o WD_MS T imer: Shows the content of the W DT_MS byte: the MSB of the

watchdog time control register.

2

o I

C Clock stretch: Shows the content of the I2C_CLOCK_STR bit, which

is responsible for enabling the I

For further inform ation about the session registers b ytes, please refer to the NTAG I plus product data sheet (refer to [NTAGI2Cplus

4.4.4 Reading / Writing configuration registers

Configuration register s define the def ault functi onalities of the NTAG I2C plus to be use d for the communication after a Power-On-Reset.

2

C clock stretching.

]).

2

C

Configuration register s values can be read and written in Pages E8h and E9h ( sector 0 for NTAG I selected by pressing the Read/Write config buttons on top of the window.

For further informat ion about the co nfiguration reg isters bytes, p lease consult t he NTAG

2

I

C plus product datasheet (refer to [NTAGI2Cplus]).

2

C plus 1k). The operation to be performed, read or write, in each tap is

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To read configuration registers:

1. Select Read/Write Config registers from the Config tab screen.

2. Tap the mobile device to the antenna tag.

3. Upon successful read, the configuration registers values will be shown.

4. To write the configurati on registers, s witch to W rite config. Register contents are controlled either via dr opdown menus, direc t input or by slider contr ollers where grey indicates OFF and blue indicates ON.

Configuration register values are displayed on the screen divided into different groups:

• General Chip Information: General information about the discovered NTAG I plus product. It shows the following information

o IC product: NTAG I o User Memory: Size of the user memory of the NTAG I

2

C plus chip version

2

C plus chip

2

C

• Field Detection: Information related to the field detection functionality, which is used for the smart pairing with devices, as it triggers a signal to the connec ted host when the NTAG I

o FD_OFF: Shows the co ntent of the FD_OFF bits, which define th e event

upon which the signal output on the field detection pin is brought up

o FD_ON: Shows the content of the FD_ON bits, which define the event

upon which the signal output on the field detection pin is brought down

• Pass through: Information related to the pas s-through functionalit y, which allows the fast transfer of data between t he RF and the I SRAM memory.

o Functionality: Shows the content of the PTHRU_ON_OFF bit, which is

responsible for enabling the data transfer via the SRAM memory.

o Direction: Shows the c ontent of the TRANSFER_DI R bit, which defines

the data flow direction for the data transfer.

o Write from RF: Shows the c ontent of the TRANSFER_D IR bit (same as

direction), which defines the data flow direction for the data transfer

• SRAM Memory settings: Information about the SRAM mirroring feature. The SRAM memory can be mirrored in the User Memor y for RF access b y enabling the SRAM mirroring feature.

o Last NDEF Page: Sh ows the content of the LAST_NDEF_ BLOCK byte,

this is the address of the last block (I NDEF message.

2

C plus product is powered by an external NFC device.

2

C interface by using a 64 byte

2

C interface addressing) of the

o SRAM Mirror: Shows the content of the SRAM_MIRROR_ON_OFF bit. o SRAM M irror block: Shows the conten t of the SRAM_MIRROR_BLOC K

• I2C Settings: Information about the I2C management configuration.

o WD_LS Timer: Sho ws the content of the W DT_LS byte: the LSB of the

byte, which indicates the address of the first block (I addressing) of the mirror of SRAM memory.

watchdog time control register

2

C interface

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o WD_MS T imer: Shows the content of the W DT_MS byte: the MSB of the

watchdog time control register

2

o I

C Clock stretch: Shows the content of the I2C_CLOCK_STR bit, which

is responsible for enabling the I

2

C RST on start: Shows the c ontent of the I2C_RST_ON_OFF bit , which

o I

is responsible for enabling a soft reset through an I

• Access Configuration: Information about the I

o AUTH0: This is the first page of the Sec tor 0 where the authentication is

needed in order to acces s the user memory from NFC perspective. By default the AUTH0 value is 0xFF, this means that the password protection is effectively disabled. When the user introduces a new password this AUTH0 will be automatically set to 0x03.

o NFC Prot: Sho ws t he memory protection b it. If s et to O FF onl y the wr ite t o

the protected area is protec ted by the password. If set to ON, read and write into the protected area is protected by password.

2

C clock stretching.

2

C repeated start.

2

C management configuration.

o NFC DIS SEC 1: Shows the NFC access protection t o Sector 1. If set to

OFF the Sector 1 will be a ccessible in 2K vers ion. If set to ON, Sector 1 is not accessible and will return NACK0.

o AUTHLIM: Shows limitation of negative password authentication attempts.

If the limit is reached then the protected area will no longer be accessible. Set to 0 means that limitation is disabled.

o 2K Prot: Shows the pass word protec tion for Sec tor 1 f or 2k version. If set

to OFF, t he pass word auth entication f or Sec tor 1 is disable d. Other wise, if set to ON the password is needed to access to Sector 1.

o SRAM Prot: Shows the p assword protection for pass-through and mirr or

mode. If set to OFF th e password aut hentication f or pass-through m ode is disabled. If set to ON then the password authentication to access SRAM in pass-through is required.

o I2C Prot: Shows the acc ess to protected area from I

then the whole user m emory is accessible from I the protected area is read only. Other value will disable the access to protected area.

For further informat ion about the configurat ion register s bytes, please ref er to the NTAG

2

I

C plus product datasheet (refer to [NTAGI2Cplus]).

2

C perspective. If 0

2

C. If this value is 1 then

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Fig 28. Figure title here

Fig 29. LPC11U1x/2x flash sectors

4.5 Action bar

4.5.1 NFC Flashing via NTAG I2C plus Explorer demo

NTAG I2C plus enabl es data download cap ability. The on-chip SRAM permits tem porary storage of data during the transfer, enabling the tag to act as a modem.

4.5.1.1 Design implementation choice

The NEK board em beds a LPC11U24. The following table shows th e correspondence between sector numbers and memory addresses for LPC11U2x/1x devices.

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The on-chip flash mem ory of the LPC11U24 is grouped in s ectors. The flash mem ory is divided into 8 sectors of 4 Kb each. Therefore, for LPC11 U24 we have 32Kb of Flash memory available.

NXP’s LPC11U24 microcontroller provides two methods to update the flash contents:

• In-system-programming (ISP): We use this method when we flash new contents using the USB port and a computer (drag-and-drop a binary file).

• In application programming (IAP): Programming is performed by erase and write operation on the on-chip flash m emory, as directed by the end-user application code  this is the method we use for NFC flashing.

A secondary bootloader has been implemented in order to enable firmware flashing through NFC inter face. A secondar y bootloader is a piece of code, which allows a user application code to be downloaded via alternative channels to the USB (i.e.: NFC flashing).

The primary bootloader is the firmware that resides in a microcontroller’s boot ROM block and is executed on power -up and resets. After the b oot ROM’s executio n, the sec ondary bootloader is executed. T he secondary bootlo ader in turn will then execut e the end-user application.

Both the secondary boot loader and the us er appl icati on res ide in flas h. T herefor e, for the secondary bo otloader to fla sh the user app licat ion w ithout m odif ying an y of its own c ode, the user application should be flashed starting the next available sector.

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Fig 30. On-chip flash memory organization for NFC flashing functionality

The NEK secondary bootloader implements the IAP functionality that allows to erase/write flash m emor y sectors dir ected b y the appl ic ation and t he HID dr ivers for USB communication. In our case, the NEK secondary bootloader occupies 4 flash sectors. This means that th is four f irst m emor y sectors are never er ased since they belong to the secondary bootloader (they must always be there in order to have the NFC flashing functionality available).

Therefore, we hav e 4 extra flash sectors available for end-user application (16 K b). In this memory area, we store the NEK Demo (LED, Speed Tests, etc.), the blink application or an y other us er appl ication. NFC f lashin g func tiona lity ac tuall y re-writes this 16 Kb with the user application send b y the Android or PC app via NFC interface. For

this reason, the maximum size of the binary file that can be upgraded through the RF interface is 16 KB.

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Fig 31. NFC Flashing option selection within the Android app

4.5.1.2 How to flash new firmware through NFC

As an illustr ative exam ple, we are going to f lash the provided Blink application via NFC flashing (green LED bl inks when detec ts th e pres e nc e of the R F f iel d) . Af ter this p r oces s , the default NTAG Explorer Demo will be replaced by the Blink application

Pre-condition:

(1) Install NTAG I (2) Verity that NEK board firmware version is v3.4

Main flow:

(1) Tap on the Context menu button on your phone or in the app (depending on

which phone you are using)

(2) Select the NFC Flashing option in the Android app

2

C plus Demo Android application v1.7.4

(3) Once in the NF C Flashing m enu, we need to select the binar y file to be flashed

into the NEK board MCU. We have two options:

- Select the Blink application or Demo application embedded by default in the

Android app by clicking on “Select from Appl” button.

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Fig 32. Selection of binary file to be flashed into MCU memory

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Fig 33. Selection of binary file to be flashed into MCU memory (II)

Fig 34. Entering NFC Flashing mode

- Alternat ively, we can s elect fr om the phone mem ory a binary fi le by clicking on

the “Select from Storage” button.

(4) NFC Flash ing m ode is e nable d in th e N EK boar d b y pressing the third colored

button (right button) before power up. While keeping the button pressed, we tap the NEK board into the phone NFC sweet spot.

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Fig 35. NFC Flashing progress bar

As soon as we tap the NEK board, the NFC flashing will start. O nce the NFC Flashing process has started, we can release the right button. This process may take some seconds, it is important to keep the phone steady until the NFC flashing process has finished (as indicated by the progress bar and green blinking LED).

In this example, we flash the Blink application binary file into the MCU memory. For doing so, we need to click on Select from Appl button and click on LED Blinker.

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Fig 36. NFC Flashing successful execution

(5) When the NFC Flashing process has finished, both the Android app and the NEK

board notifies it to the user. In the Android app, a message appears on the bottom part of the scr een. The NEK board blink s the green LED thre e times and displays “Flashing OK”.

(6) If the process has finished successfully, we can now check if the Blink

application is installed and has replaced the previous Demo app.

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Fig 37. LED Blinker NFC Flashing upgrade verification

(7) If the proc ess has not fin ished suc cess fully, (e.g. due to an RF f ield lost), we can

retry as many times as required. For that, we need to go back to Step 1 and repeat the entire process. Note that, if the flashing process has not finished successfully, the pre vious installed firmware ma y be not usable, and therefore, we need to retry flashing a new firmware.

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Fig 38. About tab snapshot

4.5.2 About

The about functiona lity can be used to get the vers ion being used for th e board design, firmware of the boar d and the Android app by tapping the board wit h the NFC enabled device.

4.5.3 Feedback

This option allows you to report feed back on the Android app direc tly to the NXP suppor t team.

4.5.4 Learn more

This option will bring you to a set of links w ith further information ab out NXP NTAG I2C plus tag, application notes, and design files and to the Android app source code.

All these functions can be found in the context menu

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Fig 39. Learn more snapshot

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4.6 Authentication

The NTAG I2C Plus offers authenticati on to protect memor y operations. The device can be locked or not. If it is not lock ed, the user is able to perf orm any mem ory operation. If the device is lock ed, the user must introduce t he correct password to authent icate and access the memory.

The application provides the feature to lock and unloc k the device. In t he up per right side of the screen there is a locker icon. In case the device is a NTAG I authentication feature, the locker will be white and open. This means, the user can interact will all m emor y. Nonetheless , if th e dev ice is a NT G I are possible: the de vice can be loc ked or unl ocked, and th e device ca n be aut henticated or not. In the case, the device is unlocked, there is no need of authentication. This is shown with an open green loc ker. On the other side, if the device is locked, for a nonauthenticated stat e, the icon shown is a r e d cl os ed locker, while if it is auth enticated then is a green closed locker. The different states are shown in Fig. 40.

2

C plus, the follo wing s tates

2

C, which has no

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Fig 40. Authentication States snapshot. (a) NTAG I2C Tag without authentication feature.

: (b) unlocked, (c) locked and authenticated, and (d)

locked and not authenticated.

(a) (b)

( c) (d)

The rest are NTAG I2C plus

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Fig 41. Password snapshot

Fig 42. Authentication state diagram

In order to lock or unlock the device, the user can press on the locker icon. A password selection menu wi ll be shown, as shown in Fig. 41. If the device is unlock ed, then the menu is to set a password. After setting it, the device is locked and authenticated. In case the device is locked, the menu is to authentic ate the us er with the cor rec t pa s s word. If the user introduces the correct password, the device is unlocked. Fig 42. depicts a state diagram about the authentication procedure.

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Fig 43. Bluetooth pairing pop-up message

4.7 Bluetooth pairing functionality

This new feature is included in version 1.1 of the Android App. When working with a Kinetis KW41Z board, a Bluetooth pairing NDEF message can be automatically written in the NTAG I²C plus when pressing button ‘SW3’ on the board.

This Bluetooth pairing NDEF message is detected by the Android App when tapping the NTAG I²C plus board to the phone. Once the NDEF message has been read by the Android App, the NTAG I²C plus will delete it and write the default NDEF message.

A pop-up message is displayed on the phone to let the user decide, whether to proceed to the Bluetooth pairing or ignore it. Fig 43 s ho ws the pop-up message displayed. If the user decides to proceed with the Bluetooth pairing, the Andro id S ystem will pair both devices and launch ‘Kinetis BLE Toolbox’ application from Play Store.

When using this functionality, this functionality is not restricted to NTAG I²C plus, it works also with the previous NTAG I²C IC version.

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5. Federal Communication Com mi s s ion Interference Statement

5.1 FCC Grant

The NTAG I²C plus Explorer Kit with FCC ID OWROM5569-NT322E has been tested to fulfil the approval requirements ANSI C63.4-2009; FCC Part 15, Subpart C and has passed the tests.

5.2 Integration condition

NTAG I²C plus Explorer Kit is not intended to be reused as a module for integration into end devices. If used, FCC certification needs to be repeated.

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6. References

[NTAGI2Cplus] NT3H2111/NT3H2211, NTAG I²C plus, NFC Forum Type 2 Tag

compliant IC with I²C interface

http://www.nxp.com/documents/data_sheet/NT3H2111_2211.pdf

[DEMOBOARD] Demo board home page with all resources

www.nxp.com/demoboard/OM5569

[EXPLORER] Schematics of the Explorer main board http://www.nxp.com/documents/software/SW3638.zip

[Flex Antenna] Schematics of the Flex antenna http://www.nxp.com/documents/software/SW3641.zip

[PCB Antenna] Schematics of the PCB antenna board http://www.nxp.com/documents/software/SW3639.zip

[Field Detector] Schematics of the Field detector board http://www.nxp.com/documents/software/SW3640.zip

[Identiv] Identiv Reader Driver http://www.nxp.com/documents/software/SW3750.zip

[PC App] PC Applicatio n http://www.nxp.com/documents/software/SW3651.zip

[Peek&Poke] Peek and Poke http://www.nxp.com/documents/software/SW3652.zip

[LPC11U24] LPC11U24, 32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash;

up to 10 kB SRAM and 4 kB EEPROM; USB device; USART

http://www.nxp.com/documents/data_sheet/LPC11U2X.pdf

[LM75B] LM75B, Digital temperature sensor and thermal watchdog http://www.nxp.com/documents/data_sheet/LM75B.pdf

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[UM10989] NTAG I²C Demo Android app Developer start-up guide www.nxp.com/documents/user_manual/UM10989.pdf [UM10967] NTAG I²C plus Explorer Kit and Peek & Poke www.nxp.com/documents/user_manual/UM10967.pdf

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Purchase of NXP ICs with NFC technology

Purchase of an NXP Semiconductors IC that complies with one of the Near

whether hardware or software.

7. Legal information

7.1 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or war ra nti e s as to th e accu racy or completeness of information included herein and shall have no liability for the consequences of use of such information.

7.2 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including n egl ig ence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifica ti on s and pr od uct de scri pti ons, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof .

Suitability fo r use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors acc ept s no liabi li t y for any assistance with applicati ons or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem whic h is bas ed on an y weak n ess or def ault in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the ap pli cations and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Export control — This document as well as the item ( s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.

Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

Evaluation pro du ct s — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of noninfringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer.

In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or info rm ati o n, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theor y, even if advised of the possibilit y of suc h damages.

Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.

7.3 Licenses

Field Communicatio n (NFC ) st an da rds ISO / IEC 18092 and ISO/IEC 21481 does not convey an implied license under any patent right infringed by implementation of any of those standards. Purchase of NXP Semiconductors IC does not include a license to any NXP patent (or other IP right) covering combinations of those products with other products,

7.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are property of their respective owners.

MIFARE — is a trademark of NXP Semiconductors N.V. I²C-bus — logo is a trademark of NXP Semiconductors N.V

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8. List of figures

Fig 1. NTAG I2C plus .................................................. 4

Fig 2. NTAG I2C plus Explorer Board (refer to

[EXPLORER]) ................................................... 5

Fig 3. PCB and Flex antenna boards with NTAG I²C

plus IC ............................................................... 6

Fig 4. Field detector board .......................................... 6

Fig 5. Identiv uTrust CLOUD 3700F reader ................ 7

Fig 6. Android app GUI ............................................... 9

Fig 7. Windows application GUI ................................ 10

Fig 8. Peek and Poke GUI ........................................ 11

Fig 9. Application overview ....................................... 12

Fig 10. Demo tab snapshot ......................................... 13

Fig 11. Green LED board configuration selection ....... 14

Fig 12. Reading board input ........................................ 15

Fig 13. Temperature sensor demonstrates SRAM pass

through mode .................................................. 16

Fig 14. Enabling NEK board LCD ............................... 17

Fig 15. Displaying NDEF text message on NEK board

LCD ................................................................. 18

Fig 16. NDEF tab snapshot ......................................... 20

Fig 17. Reading NDEF message stored in EEPROM of

Fig 18. Writing NDEF message to NTAG I2C plus

Fig 19. Data transfer speed mea sur ement concept

Fig 20. SRAM Speed test snapshot ............................ 24

Fig 21. EEPROM Speed test snapshot ....................... 25

Fig 22. CONFIG tab menu .......................................... 26

Fig 23. Read tag memory snapshot ............................ 27

Fig 24. Reset tag snapsh ot ......................................... 28

Fig 25. Alternative way to reset tag ............................. 29

Fig 26. Read Session registers snapshot ................... 30

Fig 27. Read / Write configuration registers snapshot 32

Fig 28. Figure title here ............................................... 35

Fig 29. LPC11U1x/2x flash sectors ............................. 35

Fig 30. On-chip flash memory organization for NFC

Fig 31. NFC Flashing option selection within the

Fig 32. Selection of binary file to be flashed into MCU

Fig 33. Selection of binary file to be flashed into MCU

Fig 34. Entering NFC Flashing mode .......................... 40

Fig 35. NFC Flashing progress bar ............................. 41

Fig 36. NFC Flashing successful execution ................ 42

2

NTAG I

EEPROM ........................................................ 22

behind the SRAM selection ............................. 23

flashing functionality ........................................ 37

Android app..................................................... 38

memory ........................................................... 39

memory (II) ...................................................... 40

C plus ................................................ 21

Fig 37. LED Blinker NFC Flashing upgrade verification

........................................................................ 43

Fig 38. About tab snapsho t ......................................... 44

Fig 39. Learn more snapshot ...................................... 45

Fig 40. Authentication States snapshot. (a) NTAG I2C

Tag without authentication feature. The rest are

NTAG I2C plus: (b) unlocked, (c) locked and

authenticated, and (d) locked and not

authenticated. .................................................. 47

Fig 41. Password snapshot ......................................... 48

Fig 42. Authentic at io n state dia gram ........................... 48

Fig 43. Bluetooth pair i ng pop-up message .................. 49

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Please be aware that important notices concerning this document and the product(s) described herein, have been included in the section 'Legal information'.

©

For more information, please visit: http://www.nxp.com

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9. Contents

1. Object ................................................................... 3

2. NTAG I2C plus introduction ................................ 4

3. NTAG I2C plus Explorer kit contents ................. 5

3.1 Hardware components ....................................... 5

3.1.1 NTAG I2C plus Explorer Board ........................... 5

3.1.2 Antenna board .................................................... 6

3.1.3 Field detector board ........................................... 6

3.1.4 USB reader ........................................................ 7

3.1.4.1 USB Reader firmware update ............................ 8

3.2 Software components ........................................ 8

3.2.1 NTAG I2C plus Explorer board firmware ............. 8

3.2.2 Android app ........................................................ 8

3.2.3 Windows app ...................................................... 9

3.2.4 Peek and Poke GUI ......................................... 10

4. NTAG I2C plus Explorer Demo app .................. 12

4.1 Demo tab.......................................................... 12

4.1.1 Configuring NEK board to demonstrate RF to I2C

communication ................................................. 14

4.1.2 Reading board input to demonstrate I2C to RF

communication ................................................. 15

4.1.3 Temperature sensor ......................................... 16

4.1.4 Enabling LCD display ....................................... 17

4.1.5 Displaying NDEF text message on the NEK

board LCD ........................................................ 18

4.2 NDEF ta b ......................................................... 19

4.2.1 Reading NDEF data ......................................... 21

4.2.2 Writing NDEF d ata ........................................... 22

4.3 Speed tab ......................................................... 23

4.3.1 SRAM speed test ............................................. 23

4.3.2 EEPROM speed test ........................................ 25

4.4 Configuration tab .............................................. 26

4.4.1 Reading tag memory ........................................ 27

4.4.2 Resetting tag me mory ...................................... 28

4.4.3 Reading session registers ................................ 30

4.4.4 Reading / Writing configuration registers ......... 32

4.5 Action bar ......................................................... 35

4.5.1 NFC Flashing via NTAG I2C plus Explorer demo

......................................................................... 35

4.5.1.1 Design implementation choice ......................... 35

4.5.1.2 How to flash new firmware through NFC .......... 38

4.5.2 About ................................................................ 44

4.5.3 Feedback ......................................................... 44

4.5.4 Learn more ....................................................... 44

4.6 Authentication .................................................. 46

4.7 Bluetooth pairing functionality .......................... 49

5. Federal Communication Commission

Interference Statement ...................................... 50

5.1 FCC Gran t ........................................................ 50

5.2 Integration condition ......................................... 50

6. References ......................................................... 51

7. Legal information .............................................. 53

7.1 Definitions ......................................................... 53

7.2 Disclaimers ....................................................... 53

7.3 Licenses ........................................................... 53

7.4 Trademarks ...................................................... 53

8. List of figures ..................................................... 54

9. Contents ............................................................. 55

Date of release:

Document identifier:

Mouser Electronics

Authorized Distributor

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NXP: OM23221ARD

NXP Semiconductors NTAG I2C plus User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Object

2. NT AG I2C plus introduction

3. NT AG I2C plus Expl orer kit contents

3.1 Hardware components

3.1.1 NT AG I2C plus Explorer Board

3.1.2 Antenna board

3.1.3 Field detector board

3.1.4 USB reader

3.1.4.1 USB Reader firmware update

3.2 Software components

3.2.1 NT AG I2C plus Explorer board firmware

3.2.2 Android app

3.2.3 Windows app

3.2.4 Peek and Poke GUI

4. NT AG I2C plus Explorer Demo app

4.1 Demo tab

4.1.1 Configuring NEK board to demonstrate RF to I2C communication

4.1.2 Reading board input to demonstrate I2C to RF communication

4.1.3 Temperature sensor

4.1.4 Enabling LCD display

4.1.5 Displaying NDEF text message on the NEK board LCD

4.2 NDEF tab

4.2.1 Reading NDEF data

4.2.2 Writing NDEF data

4.3 Speed tab

4.3.1 SRAM speed test

4.3.2 EEPROM speed test

4.4 Configuration tab

4.4.1 Reading tag memory

4.4.2 Resetting tag memory

4.4.3 Reading session registers

4.4.4 Reading / Writing configuration registers

4.5 Action bar

4.5.1 NFC Flashing via NTAG I2C plus Explorer demo

4.5.1.1 Design implementation choice

4.5.1.2 How to flash new firmware through NFC

4.5.2 About

4.5.3 Feedback

4.5.4 Learn more

4.6 Authentication

4.7 Bluetooth pairing functionality

5. Federal Communication Com mi s s ion Interference Statement

5.1 FCC Grant

5.2 Integration condition

6. References

7. Legal information

7.1 Definitions

7.2 Disclaimers

7.3 Licenses

7.4 Trademarks

8. List of figures

9. Contents