NXP TEA1520P, TEA1520T, TEA1521P, TEA1521T, TEA1522P Schematic [ru]

...

TEA152x

SMPS ICs for low-power systems

Rev. 04 — 14 September 2010 Product data sheet

1. General description

The TEA152x family STARplug is a Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains. It is implemented in the high-voltage EZ-HV SOI process, combined with a low-voltage Bipolar Complementary Metal-Oxide Semiconductor (BiCMOS) process. The device includes a high-voltage power switch and a circuit for start-up directly from the rectified mains voltage.

A dedicated circuit for valley switching is built in, which makes a very efficient slim-line electronic power-plug concept possible.

In its most basic version of application, the TEA152x family acts as a voltage source. Here, no additional secondary electronics are required. A combined voltage and current source can be realized with minimum costs for external components. Implementation of the TEA152x family renders an efficient and low cost power supply system.

2. Features and benefits



Designed for general purpose supplies up to 30 W

 Integrated power switch:

Æ TEA1520x: 48 Ω; 650 V Æ TEA1521x: 24 Ω; 650 V Æ TEA1522x: 12 Ω; 650 V

Æ TEA1523P: 6.5 Ω; 650 V  Operates from universal AC mains supplies (80 V to 276 V)  Adjustable frequency for flexible design  RC oscillator for load insensitive regulation loop constant  Valley switching for minimum switch-on loss  Frequency reduction at low power output makes low standby power possible

(< 100 mW)

 Adjustable overcurrent protection  Undervoltage protection  Temperature protection  Short-circuit winding protectio n  Simple application with both primary and secondary (opto) feedback  Available in DIP8 and SO14 packages

NXP Semiconductors

3. Applications

Chargers



 Adapters  Set-Top Box (STB)  DVD  CD(R)  TV/monitor standby supplies  PC peripherals  Microcontroller supplies in home applications and small portable equipment, etc.

4. Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V R

V f

osc

drain

drain DSon

voltage on pin DRAIN Tj>0°C −0.4 - +650 V drain-source on-state

resistance

supply voltage continuous −0.4 - +40 V oscillator frequency 10 100 200 kHz current on pin DRAIN V

TEA1520x I

TEA1521x I

TEA1522x I

TEA1523P I

TEA152x

SMPS ICs for low-power systems

= −0.06 A

source

=25°C - 48 55.2 Ω

= 100 °C - 68 78.2 Ω

= −0.125 A

source

=25°C - 24 27.6 Ω

= 100 °C - 34 39.1 Ω

= −0.25 A

source

=25°C - 12 13.8 Ω

= 100 °C - 17 19.6 Ω

= −0.50 A

source

=25°C-6.57.5Ω

= 100 °C - 9.0 10.0 Ω

>60V;

drain

no auxiliary supply

-1.52mA

Product data sheet Rev. 04 — 14 September 2010 2 of 20

NXP Semiconductors

5. Ordering information

TEA152x

SMPS ICs for low-power systems

Table 2. Ordering information

Type number Package

Name Description Version

TEA1520P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TEA1521P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TEA1522P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TEA1523P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TEA1520T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 TEA1521T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 TEA1522T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

6. Block diagram

GND

1 (1)

2 (2, 3, 4, 5, 9, 10)

SUPPLY

VALLEY

TEA152x

LOGIC

100 mV

8 (14)

7 (12, 13)

DRAIN

n.c.

PWM

THERMAL

SHUTDOWN

POWER-UP

RESET

PROTECTION

LOGIC

overcurrent

short circuit winding

blank

0.5 V

0.75 V

6 (11)

5 (8)

SOURCE

AUX

mgt419

REG

3 (6)

4 (7)

stop

OSCILLATOR

low freq

1.8 U

2.5 V

10x

Pin numbers without parenthesis refer to DIP8 packages and within parenthesis refer to SO14 packages.

Fig 1. Block diagram

Product data sheet Rev. 04 — 14 September 2010 3 of 20

NXP Semiconductors

7. Pinning information

7.1 Pinning

TEA152x

SMPS ICs for low-power systems

GND

REG

TEA152xP

001aae137

DRAIN

n.c.

SOURCE

AUX

GND n.c.

GND SOURCE

GND GND

RC GND

REG AUX

TEA152xT

7 8

001aae138

Fig 2. Pin configuration DIP8 Fig 3. Pin configuration SO14

7.2 Pin description

Table 3. Pin description

Symbol Pin Description

DIP8 SO14

GND 2 2, 3, 4,

RC 36frequency setting REG 4 7 regul ation input AUX 5 8 input for voltage from the auxiliary winding for timing

SOURCE 6 11 source of the internal MOS switch n.c. 7 12, 13 not connected DRAIN 8 14 drain of the internal MOS switch; input for the start-up current

1 1 supply voltage

ground

5, 9, 10

(demagnetization)

and valley sensing

DRAIN

8. Functional description

The TEA152x family is the heart of a compact flyback converter, with the IC placed at the primary side. The auxiliary winding of the transformer can be used for indirect feedback to control the isolated output. This additional winding also powers the IC. A more accurate control of the output voltage and/or current can be implemented with an additional secondary sensing circuit and optocoupler feedback.

The TEA152x family uses voltage mode control. The frequency is determined by the maximum transformer demagnetizing time and the time of the oscillator. In the first case, the converter operates in the Self-Oscillating Power Supply (SOPS) mode. In the latter case, it operates at a constant frequency, which can be adjusted with external

Product data sheet Rev. 04 — 14 September 2010 4 of 20

NXP Semiconductors

components RRC and CRC. This mode is called Pulse Width Modulation (PWM). Furthermore, a primary stroke is started only in a valley of the secondary ringing. This valley switching principle minimizes capacitive switch-on losses.

8.1 Start-up and Underoltage lockout

Initially , the IC is self supplying from the rectified main s volt age. The IC st art s switching as soon as the voltage on pin VCC passes the V the auxiliary winding of the transformer as soon as V from the line is stopped for high efficiency operation.

When for some reason the auxiliary supply is not sufficient, the high-voltage supply also supplies the IC. As soon as the voltage on pin V stops switching and restarts from the rectified mains voltage.

8.2 Oscillator

The frequency of the oscillator is set by the external resistor and capacitor on pin RC. The external capacitor is charged rapidly to the V stroke, it discharges to the V relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost equal to the sensitivity at high duty factors. This results in a more constant gain over the duty factor range compared to PWM systems with a linear sawtooth oscillator. Stable operation at low duty factors is easily realized. For high efficiency, the frequency is reduced as soon as the duty factor drops below a certain value. This is accomplished by increasing the oscillator charge time.

SMPS ICs for low-power systems

CC(startup)

RC(max)

level. Because the discharge is exponential, the

RC(min)

level. The supply is taken over by

is high enough and the supply

drops below the V

CC(stop)

level and, starting from a new primar y

TEA152x

level, the IC

To ensure that the capacitor can be charged within the cha rge time, the value of the oscillator capacitor should be limited to approximately 1 nF.

8.3 Duty factor control

The duty factor is controlled by the internal regulation voltage and the oscillator signal on pin RC. The internal regulation volt age is eq ual to the extern al reg ulation voltage (−2.5 V) multiplied by the gain of the error amplifier (typically 20 dB which is 10×).

8.4 Valley switching

A new cycle is started when the primary switch is switched on (see Figure 4). After a certain time (determined by the oscillator voltage RC and the internal regulation level), the switch is turned off and the secondary stroke starts. The internal regulation level is determined by the voltage on pin REG.

After the secondary stroke, the drain voltage shows an oscillation with a frequency of approximately:

----------------------------------------------

2 π× LpC

where:

×()×

= primary self-inductance

= parasitic capacitance on drain node

(1)

Product data sheet Rev. 04 — 14 September 2010 5 of 20

NXP Semiconductors

As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for a low drain voltage before starting a new primary stroke.

TEA152x

SMPS ICs for low-power systems

Figure 4

shows the drain voltage together with the valley signal, the signal indicating the

secondary stroke and the RC voltage. The primary stroke starts some time before the actu al valley at low ringing frequencies,

and some time after the actual valley at high ringing frequencies.

secondary

ringing

drain

valley

secondary

stroke

oscillator

primary

stroke

secondary

stroke

regulation level

mgt42

A: Start of new cycle with valley switching B: Start of new cycle in a classical PWM system

Fig 4. Signals for valley switching

Figure 5 shows a typical curve for a reflected output voltage N × Vo of 80 V. This voltage is

the output voltage Vo (see the factor N (determined by the turns ratio of the transformer).

Figure 6) transferred to the primary side of the transformer with

Figure 5 shows that the

system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on losses to a minimum. At 200 kHz, the next primary stroke is started at 33° before the valley. The switch-on losses are still reduced significantly.

Product data sheet Rev. 04 — 14 September 2010 6 of 20

NXP Semiconductors

mgt424

Fig 5. Typical phase of drain ringing at switch-on (at N × Vo=80V)

phase

(deg)

−20

−40

0 200 400 800

TEA152x

SMPS ICs for low-power systems

600

f (kHz)

8.5 Demagnetization

The system operates in discontinuous conduction mode all the time. As long as the secondary stroke has not ended, the oscillator will not start a new primary stroke. During the first t

seconds, demagnetization recognition is suppressed. This suppressio n may

suppr

be necessary in applications where the transformer has a large leakage induct ance and at low output voltages.

8.6 Minimum and maximum duty factor

The minimum duty factor of the switched mode power supply is 0 %. The maximum duty factor is set to 75 % (typical value at 100 kHz oscillation frequency).

8.7 OverCurrent Protection (OCP)

The cycle-by-cycle peak drain current limit circuit uses the external source resistor RI to measure the current. The circuit is activated after the leading edge bla nking time t protection circuit limits the source voltage to V

source(max)

, and thus limits the primary peak

current.

8.8 Short-circuit winding protection

The short-circuit winding protection circuit is also activated af ter the leading edge bla nking time. If the source voltage exceeds the short-circuit winding protection voltage V stops switching. Only a power-on reset will restart normal operation. The short-circuit winding protection also protects in case of a secondary diode short circuit.

leb

swp

. The

, the IC

8.9 OverTemperature Protection (OTP)

An accurate temperature protection is provided in the device. When the junction temperature exceeds the thermal shutdown temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. The IC continues normal operation as soon as the overtemperature situation has disapp eared.

Product data sheet Rev. 04 — 14 September 2010 7 of 20

NXP Semiconductors

8.10 OverVoltage Protection (OVP)

Overvoltage protection can be achieved in the application by pulling pin REG above its normal operation level. The current primary stroke is terminated immediately, and no new primary stroke is started until the voltage on pin REG drops to its normal operation level. Pin REG has an internal clamp. The current feed into this pin must be limited.

8.1 1 Output characteristics of complete power-plug

Typical characteristics:

• Output power: A wide range of output power levels can be handled by choosing the

• Accuracy: The accuracy of the complete conv er te r, functioning as a voltage source

• Efficiency: An efficiency of 75 % at maximum output power can be achieved for a

• Ripple: A minimum ripple is obtained in a system designed for a maximum duty factor

TEA152x

SMPS ICs for low-power systems

with primary sensing, is approximately 8 % (mainly dependent on the transformer coupling). The accuracy with secondary sensing is defined by the accuracy of the external components. For safety requirements in case of optocoupler feedback loss, the primary sensing remains active when an over vo ltage circuit is conn ec te d.

complete converter designed for universal mains.

of 50 % under normal operating conditions, and a minimized dead time. The magnitude of the ripple in the output voltage is determined by the frequency and duty factor of the converter, the output cur rent level and the value and ESR of the output capacitor.

and package of the TEA152x family. Power levels up to 30 W can be realized.

DS(on)

8.12 Input characteristics of complete power-plug

Typical characteristics:

• The input voltage range comprises the universal AC mains (80 V to 276 V)

Product data sheet Rev. 04 — 14 September 2010 8 of 20

NXP Semiconductors

9. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground; positive currents flow into the device; pins V current driven and pins REG and AUX are not allowed to be voltage driven.

Symbol Parameter Conditions Min Max Unit

Voltages

source

drain

Currents

REG

AUX

source

drain

General

tot

stg

esd

TEA152x

SMPS ICs for low-power systems

and RC are not allowed to be

supply voltage continuous −0.4 +40 V voltage on pin RC −0.4 +3 V voltage on pin SOURCE DMOS power

transistor

voltage on pin DRAIN Tj>0°C −0.4 +650 V

current on pin REG - 6 mA current on pin AUX −10 +5 mA source current

TEA1520x −0.25 +0.25 A TEA1521x −0.5 +0.5 A TEA1522x −1+1A TEA1523P −2+2A

drain current

TEA1520x −0.25 +0.25 A TEA1521x −0.5 +0.5 A TEA1522x −1+1A TEA1523P −2+2A

total power dissipation

DIP8 package T SO14 package T

<45°C-1.0W

amb

<50°C-1.0W

amb

storage temperature −55 +150 °C junction temperature −40 +145 °C electrostatic discharge voltage human body model

machine model

−0.4 +5 V

[1]

- ±2500 V

[2]

- ±200 V

[1] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. All pins

are 2500 V maximum, except pin DRAIN, which is 1000 V maximum.

[2] Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω series

resistor.

Product data sheet Rev. 04 — 14 September 2010 9 of 20

NXP Semiconductors

10. Thermal characteristics

Table 5. Thermal characteristics

Symbol Parameter Conditions Typ Unit

th(j-a)

thermal resistance from junction to ambient in free air

DIP8 package 100 K/W SO14 package 91 K/W

TEA152x

SMPS ICs for low-power systems

[1]

[1] Thermal resistance R

printed-circuit board. See the TEA152x application note for details.

11. Characteristics

Table 6. Characteristics

amb

positive when flowing into the IC; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Supply

CC(oper)

CC(startup)

CC(ch)

CC(startup)

CC(stop)

drain

Pulse-width modulator

min

max

SOPS

det(demag)

sup(xfmr_ring)

RC oscillator

RC(min)

RC(max)

ch(RC)

osc

Duty factor regulator: pin REG

REG

clamp(REG)

can be lower when the GND pins are connected to sufficient copper area on the

th(j-a)

=25°C; no overtemperature; all voltages are measured with respect to ground; currents are

operating supply current normal operation - 1.3 1.9 mA start-up supply current start-up - 180 400 μA charge supply current V

>60V −6 −4 −3mA

drain

start-up supply voltage 9 9.5 10 V stop supply voltage undervoltage lockout 7.0 7.5 8.0 V current on pin DRAIN V

drain

>60V no auxiliary supply - 1.5 2 mA with auxiliary

- 30 125 μA

supply

minimum duty factor - 0 - % maximum duty cycle f = 100 kHz - 75 - %

demagnetization detection

50 100 150 mV

voltage transformer ringing

start of 2nd stroke 1.0 1.5 2.0 μs

suppression time

minimum voltage on pin RC 60 75 90 mV maximum voltage on pin RC 2.4 2.5 2.6 V charge time on pin RC - 1 - μs oscillator frequency 10 100 200 kHz

voltage on pin REG 2.4 2.5 2.6 V voltage gain error amplifier - 20 - dB clamp voltage on pin REG I

=6mA --7.5V

REG

Product data sheet Rev. 04 — 14 September 2010 10 of 20

NXP Semiconductors

Table 6. Characteristics …continued

amb

positive when flowing into the IC; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Valley switching

(ΔV/Δt)

valley

d(vrec-swon)

Current and short-circuit winding protection

source(max)

d(prop)

swp

leb

FET output stage

L(drain)

BR(DRAIN)

DSon

f(DRAIN)

Temperature protection

prot(max)

prot(hys)

TEA152x

SMPS ICs for low-power systems

=25°C; no overtemperature; all voltages are measured with respect to ground; currents are

vrec

valley recognition voltage change with time

ringing frequency for valley

N × Vo= 100 V 200 550 800 kHz

switching valley recognition to

switch-on delay time

maximum voltage on pin

ΔV/Δt=0.1V/μs 0.470.500.53V

SOURCE delay from detecting

source(max)

to switch-off

short-winding protection

ΔV/Δt=0.5V/μs - 160 185 ns

ΔV/Δt=0.5V/μs 0.7 0.75 0.8 V

voltage leading edge blanking time 250 350 450 ns

leakage current on pin

= 650 V - - 125 μA

drain

DRAIN breakdown voltage on pin

Tj>0°C 650 - - V

DRAIN drain-source on-state

resistance

TEA1520x I

TEA1521x I

TEA1522x I

TEA1523P I

= −0.06 A

source

=25°C - 48 55.2 Ω

=100°C - 68 78.2 Ω

= −0.125 A

source

=25°C - 24 27.6 Ω

=100°C - 34 39.1 Ω

= −0.25 A

source

=25°C - 12 13.8 Ω

=100°C - 17 19.6 Ω

= −0.50 A

source

=25°C-6.57.5Ω

=100°C - 9.0 10.0 Ω

fall time on pin DRAIN Vi=300V;

no external capacitor at drain

maximum threshold temperature

hysteresis of protection temperature

−102 - +102 V/μs

-150-ns

-75-ns

150 160 170 °C

-2-°C

Product data sheet Rev. 04 — 14 September 2010 11 of 20

NXP Semiconductors

12. Application information

TEA152x

SMPS ICs for low-power systems

VCC

CF2

GND

REG

TEA152xP

DRAIN

n.c.

SOURCE

AUX

CF1

mains

Fig 6. Primary sensed application; configuration for TEA152xP (DIP8)

Further application information can be found in the TEA152x application note.

mgt425

AUX

C6 - Ycap

Product data sheet Rev. 04 — 14 September 2010 12 of 20

NXP Semiconductors

-1

13. Package outline

TEA152x

SMPS ICs for low-power systems

IP8: plastic dual in-line package; 8 leads (300 mil)

w M

(e )

seating plane

pin 1 index

SOT97

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min.

max.

050G01 MO-001 SC-504-8

1.73

1.14

0.068

0.021

0.045

0.015

IEC JEDEC JEITA

OUTLINE VERSION

SOT97-1

max.

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

0.53

0.38

0 5 10 mm

scale

1.07

0.36

0.89

0.23

0.014

0.042

0.009

0.035

REFERENCES

(1) (1)

cD E e M

9.8

6.48

9.2

6.20

0.39

0.26

0.36

0.24

3.60

3.05

0.14

0.12

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

10.0

0.39

0.33

8.3

max.

0.2542.54 7.62

1.154.2 0.51 3.2

0.010.1 0.3

0.0450.17 0.02 0.13

ISSUE DATE

99-12-27 03-02-13

(1)

Fig 7. Package outline SOT97-1 (DIP8)

Product data sheet Rev. 04 — 14 September 2010 13 of 20

NXP Semiconductors

-1

TEA152x

SMPS ICs for low-power systems

O14: plastic small outline package; 14 leads; body width 3.9 mm

pin 1 index

w M

detail X

v M

(A )

SOT108

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

OUTLINE VERSION

SOT108-1

A1A2A3b

max.

0.25

1.75

0.10

0.010

0.069

0.004

1.45

1.25

0.057

0.049

IEC JEDEC JEITA

076E06 MS-012

0.25

0.01

0.49

0.36

0.019

0.014

0.25

0.19

0.0100

0.0075

(1)E(1)

8.75

8.55

0.35

0.34

REFERENCES

eHELLpQZywv θ

1.27

0.05

6.2

5.8

0.244

0.228

4.0

3.8

0.16

0.15

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.25

0.6

0.028

0.01 0.004

0.024

EUROPEAN

PROJECTION

0.25 0.1

0.01

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

99-12-27 03-02-19

Fig 8. Package outline SOT108-1 (SO14)

Product data sheet Rev. 04 — 14 September 2010 14 of 20

NXP Semiconductors

TEA152x

SMPS ICs for low-power systems

14. Abbreviations

Table 7. Abbreviations

Acronym Description

BiCMOS Bipolar Complementary Metal-Oxide Semiconductor DMOS Diffusion Metal-Oxide Semiconductor ESR Equivalent Series Resistance EZ-HV SOI Easy High Voltage Silicon-On-Insulator FET Field-Effect Transistor PWM Pulse Width Modulation SMPS Switched Mode Power Supply SOPS Self-Oscillating Power Supply

15. Revision history

Table 8. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TEA152X v4.0 20100914 Product data sheet - TEA152X_3 Modifications:

TEA152X_3 20090323 Product data sheet - TEA152X_FAM_2 Modifications: • The format of this data sheet has been redesigned to comply with the new identity

TEA152X_FAM_2 20060125 Product data sheet - TEA152X_FAMILY_1 TEA152X_FAMILY_1 20000908 Product specification - -

•

Table 1 “Quick reference data” updated Table 4 “Limiting values” updated

•

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• The minimum value of T

has changed in Table 1 and Table 4

amb

has changed in Table 4

Product data sheet Rev. 04 — 14 September 2010 15 of 20

NXP Semiconductors

TEA152x

SMPS ICs for low-power systems

16. Legal information

16.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) d escribed i n this docume nt may have changed since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

http://www.nxp.com.

[3]

Definition

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied u pon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

16.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be lia ble for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonabl y be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is ope n for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

http://www.nxp.com/profile/terms

, unless otherwise

Product data sheet Rev. 04 — 14 September 2010 16 of 20

NXP Semiconductors

TEA152x

SMPS ICs for low-power systems

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It i s neither qua lif ied nor test ed in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equ ipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, da mages or failed produ ct cl aims resulting from custome r design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

16.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trad emarks are the property of their respective owners.

STARplug — is a trademark of NXP B.V. EZ-HV — is a trademark of NXP B.V.

17. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 04 — 14 September 2010 17 of 20

NXP Semiconductors

18. Tables

Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .2

Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3

Table 3. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4

Table 4. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .9

Table 5. Thermal characteristics . . . . . . . . . . . . . . . . . .10

Table 6. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .10

Table 7. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .15

Table 8. Revision history . . . . . . . . . . . . . . . . . . . . . . . .15

TEA152x

SMPS ICs for low-power systems

continued >>

Product data sheet Rev. 04 — 14 September 2010 18 of 20

NXP Semiconductors

19. Figures

Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

Fig 2. Pin configuration DIP8. . . . . . . . . . . . . . . . . . . . . .4

Fig 3. Pin configuration SO14 . . . . . . . . . . . . . . . . . . . . .4

Fig 4. Signals for valley switching . . . . . . . . . . . . . . . . . .6

Fig 5. Typical phase of drain ringing at switch-on

(at N × Vo= 80 V). . . . . . . . . . . . . . . . . . . . . . . . . .7

Fig 6. Primary sensed application; configuration

for TEA152xP (DIP8). . . . . . . . . . . . . . . . . . . . . .12

Fig 7. Package outline SOT97-1 (DIP8) . . . . . . . . . . . .13

Fig 8. Package outline SOT108-1 (SO14) . . . . . . . . . . .14

TEA152x

SMPS ICs for low-power systems

continued >>

Product data sheet Rev. 04 — 14 September 2010 19 of 20

NXP Semiconductors

20. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 4

8.1 Start-up and Underoltage lockout . . . . . . . . . . . 5

8.2 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3 Duty factor control . . . . . . . . . . . . . . . . . . . . . . 5

8.4 Valley switching . . . . . . . . . . . . . . . . . . . . . . . . 5

8.5 Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 7

8.6 Minimum and maximum duty factor . . . . . . . . . 7

8.7 OverCurrent Protection (OCP) . . . . . . . . . . . . . 7

8.8 Short-circuit winding protection. . . . . . . . . . . . . 7

8.9 OverTemperature Protection (OTP) . . . . . . . . . 7

8.10 OverVoltage Protection (OVP) . . . . . . . . . . . . . 8

8.1 1 Output characteristics of complete power-plug. 8

8.12 Input characteristics of complete power-plug . . 8

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9

10 Thermal characteristics . . . . . . . . . . . . . . . . . 10

11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 10

12 Application information. . . . . . . . . . . . . . . . . . 12

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13

14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17

17 Contact information. . . . . . . . . . . . . . . . . . . . . 17

18 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

19 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

TEA152x

SMPS ICs for low-power systems

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 September 2010

Document identifier: TEA152X

NXP TEA1520P, TEA1520T, TEA1521P, TEA1521T, TEA1522P Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features and benefits

3. Applications

4. Quick reference data

5. Ordering information

6. Block diagram

7. Pinning information

7.1 Pinning

7.2 Pin description

8. Functional description

8.1 Start-up and Underoltage lockout

8.2 Oscillator

8.3 Duty factor control

8.4 Valley switching

8.5 Demagnetization

8.6 Minimum and maximum duty factor

8.7 OverCurrent Protection (OCP)

8.8 Short-circuit winding protection

8.9 OverTemperature Protection (OTP)

8.10 OverVoltage Protection (OVP)

8.1 1 Output characteristics of complete power-plug

8.12 Input characteristics of complete power-plug

9. Limiting values

10. Thermal characteristics

11. Characteristics

12. Application information

13. Package outline

14. Abbreviations

15. Revision history

16. Legal information

16.1 Data sheet status

16.2 Definitions

16.3 Disclaimers

16.4 Trademarks

17. Contact information

18. Tables

19. Figures

20. Contents