NXP TDA8552T, TDA8552TS DATA SHEET

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INTEGRATED CIRCUITS

DATA SH EET

TDA8552T; TDA8552TS

2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing

Product speciﬁcation Supersedes data of 1998 Jun 02 File under Integrated Circuits, IC01

2002 Jan 04

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

FEATURES

• One pin digital volume control (for each channel)

• Volume setting with up/down pulses

• Auto repeat function on volume setting

• Headphone sensing

• Maximum gain set by selection pin

• Low sensitivity for EMC radiation

• Internal feedback resistors

• Flexibility in use

• Few external components

• Low saturation voltage of output stage

• Standby mode controlled by CMOS compatible levels

• Low standby current

• No switch-on/switch-off plops

• High supply voltage ripple rejection

• Protected against electrostatic discharge

• Outputs short-circuitsafe to ground, VDDand across the

load

• Thermally protected.

APPLICATIONS

GENERAL DESCRIPTION

TheTDA8552T isatwo channelaudiopower amplifierthat provides an output power of 2 × 1.4 W into an 8 Ω load using a 5 V power supply. The circuit contains two BTL power amplifiers, two digital volume controls and standby/mute logic. Volume and balance of the amplifiers are controlled using two digital input pins which can be driven by simple push-buttons or by a microcontroller.

Using the selection pin(GAINSEL) the maximum gain can be set at 20 or 30 dB. The headphone sense input (HPS) can be used to detect if a headphone is plugged into the jack connector. If a headphone is plugged into the jack connector the amplifier switches from the BTL to the SE mode and the BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption.

The TDA8552T is contained in a 20-pin small outline package. For the TDA8552TS, which is contained in a 20-pin very small outline package, the maximum output power is limited by the maximum allowed ambient temperature. More information can be found in Section “Thermal design considerations”. The SO20 package has the four corner leads connected to the die pad so that the thermal behaviour can be improved by the PCB layout.

TDA8552T; TDA8552TS

• Portable consumer products

• Notebook computers

• Communication equipment.

ORDERING INFORMATION

TYPE

NUMBER

TDA8552T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 TDA8552TS SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1

NAME DESCRIPTION VERSION

PACKAGE

2002 Jan 04 2

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

stb

step

THD total harmonic distortion P SVRR supply voltage ripple

supply voltage 2.7 5 5.5 V quiescent supply current BTL mode; VDD=5V − 14 20 mA

BTL mode; V SE mode; V SE mode; V

= 3.3 V − 10 15 mA

=5V − 8.5 12 mA

= 3.3 V − 58mA

standby current − 110µA output power THD = 10%; RL=8Ω; VDD=5V 1 1.4 − W voltage gain low gain; maximum volume − 20 − dB

low gain; minimum volume −−60 − dB high gain; maximum volume − 30 − dB high gain; minimum volume −−50 − dB

number of volume steps − 64 −

= 0.5 W − 0.1 − %

50 −−dB

rejection

2002 Jan 04 3

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

BLOCK DIAGRAM

andbook, full pagewidth

IN1

UP/DOWN1

SVR

IN2

VOLUME CONTROL

20 kΩ

0.5V

UP/DOWN COUNTER

up down

INTERFACE

VOLUME CONTROL

20 kΩ

20 dB

30 dB

0.5V

15 kΩ

0.5V

15 kΩ

0.5V

DD1VDD2VDD3VDD4

381318

MASTER

15 kΩ

3.4 kΩ

1.6 kΩ

20 kΩ 20 kΩ

SLAVE

TDA8552T

MASTER

OUT1+

OUT1−

OUT2+

UP/DOWN2

MODE

HPS

0.5V

UP/DOWN COUNTER

INTERFACE

STANDBY/MUTE

AND OPERATING

up down

20 dB

0.5V

SELECTION

3.4 kΩ

1.6 kΩ

0.5V

GAIN

30 dB

15 kΩ

0.5V

15 kΩ

Fig.1 Block diagram.

15 kΩ

20 kΩ 20 kΩ

SLAVE

1, 10, 11, 2014

GAINSEL GND1 to GND4

OUT2−

MGM608

2002 Jan 04 4

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

PINNING

SYMBOL PIN

GND1 1 ground 1, substrate/leadframe OUT2+ 2 positive loudspeaker terminal

DD1

HPS 4 digital input for headphone

MODE 5 digital trinary input for mode

UP/DOWN1 6 digital trinary input for volume

UP/DOWN2 7 digital trinary input for volume

DD2

OUT2− 9 negative loudspeaker terminal

GND2 10 ground 2, substrate/leadframe GND3 11 ground 3, substrate/leadframe OUT1+ 12 positive loudspeaker terminal

DD3

GAINSEL 14 digital input for gain selection IN2 15 audio input channel 2 SVR 16 halfsupplyvoltage, decoupling

IN1 17 audio input channel 1 V

DD4

OUT1− 19 negative loudspeaker terminal

GND4 20 ground 4, substrate/leadframe

(1)

DESCRIPTION

output channel 2

3 supply voltage 1

sensing

selection (standby, mute and operating)

control channel 1

control channel 2

8 supply voltage 2

output channel 2

output channel 1

13 supply voltage 3

ripple rejection

18 supply voltage 4

output channel 1

handbook, halfpage

UP/DOWN1 UP/DOWN2

TDA8552T; TDA8552TS

GND1

OUT2+

DD1 HPS

MODE

TDA8552T

6 7

DD2

OUT2−

GND2

MGM610

Fig.2 Pin configuration.

20 19 18 17 16 15 14 13 12 11

GND4 OUT1− V

DD4

IN1 SVR IN2 GAINSEL V

DD3

OUT1+ GND3

Note

1. For the SO20 (SOT163-1) package only: the ground pins 1, 10, 11 and 20 are mechanically connected to the leadframe and electrically to the substrate of the die. On the PCB the ground pins can be connected to a copper area to decrease the thermal resistance.

2002 Jan 04 5

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

FUNCTIONAL DESCRIPTION

The TDA8552T is a 2 × 1.4 W BTL audio power amplifier capable of delivering 2 × 1.4 W output power into an 8 Ω load at THD = 10%using a 5 V power supply. The gain of the amplifier can be set by the digital volume control. The gain in the maximum volume setting is 20 dB (low gain) or 30 dB (high gain). This maximum gain can be selected by the gain selection pin. The headphone sense input (HPS) can be used to detect if a headphone is pluggedinto thejack connector.If a headphoneis plugged intothe jackconnector theamplifier switchesfrom the BTL to the SE mode and the BTL loudspeakers are switched off. This also results in a reduction of quiescent current consumption. Using the MODE pin the device can be switched to the standby condition, the mute condition or the normal operating condition.The device is protected by an internal thermal shutdown protection mechanism.

Power ampliﬁer

The power amplifier is a Bridge-Tied Load (BTL) amplifier with a complementary CMOS output stage. The total voltage loss for both output power MOS transistors is within 1 V and with a 5 V supply and an 8 Ω loudspeaker an output power of 1.4 W can be delivered. The total gain of this power amplifier can be set at 20 or 30 dB by the gain selection pin.

Gain selection

The gain selection can be used for a fixed gain setting, depending on the application. The gainselection pin must be hard wired to ground (20 dB) or to VDD (30 dB). Gain selecting during the operation is not advised, switching is not guaranteed plop free.

Input attenuator

The volume control operates as adigitally controlled input attenuator between the audio input pin and the power amplifier. In the maximum volume control setting the attenuation is 0 dB and in the minimum volume control setting the typical attenuation is 80 dB. The attenuation can be set in 64 steps by the UP/DOWN pin. Both attenuators forchannels 1 and 2 are separated from each other and are controlled by there own UP/DOWN pin. Balance control can be arranged by applying UP/DOWN pulses only on pins 6 and 7, see Fig.5.

TDA8552T; TDA8552TS

Volume control

Each attenuator is controlled with its own UP/DOWN pin (trinary input):

• Floating UP/DOWN pin: volume remains unchanged

• Negative pulses: decreasing volume

• Positive pulses: increasing volume.

Each pulse on the UP/DOWN pin results in a change in

gain of (typical value).

In the basic application the UP/DOWN pin is switched to ground or VDDby a double push-button. When the supply voltage is initially connected, after a complete removal of the supply, the initial state of the volume control is an attenuation of 40 dB (low volume), so the gain of the total amplifier is −20 dB in the low gain setting or −10 dB in the high gainsetting. After powering-up, some positive pulses have to be applied to the UP/DOWN pin for turning up to listening volume.

Auto repeat

If the UP/DOWN pin is LOW or HIGH for the wait time (t in seconds) (one of the keys is pressed) then the device starts making up or down pulses by itself with a frequency

given by (repeat function).

The wait time and the repeat frequency are set using an internal RC oscillator with an accuracy of ±10%.

Volume settings in standby mode

When the device is switched with the MODE select pin to the mute or the standby condition, the volume control attenuation setting keeps its value, under the assumption that the voltage on the V minimum supply voltage. After switching the device back to the operation mode, the previous volume setting is maintained. In the standby mode the volume setting is maintained as long as the minimum supply voltage is available. The current consumption is very low, approximately 1 µA (typ.). In battery fed applications the volumesetting can bemaintained during batteryexchange if there is a supply capacitor available.

-----64

-------t

rep

1.25 dB=

wait

pin does not fall below the

2002 Jan 04 6

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

Mode select pin

The deviceis in thestandby mode (with a very low current consumption) if the voltage at the MODE pin is between VDDandVDD− 0.5 V.At a modeselectvoltage levelofless than 0.5 V the amplifier is fully operational. In the range between 1 V and VDD− 1 V the amplifier is in the mute condition.The muteconditionis usefulforusing itasa ‘fast mute’, in this mode the output signal is suppressed, while the volume setting remains at its value. It is advised to keep the device in the mute condition while the input capacitor is being charged. This can be achieved by holding the MODE pin at a level of 0.5VDD, or by waiting approximately 100 ms before giving the first volume-UP pulses.

Headphone sense pin (HPS)

A headphone can beconnected tothe amplifier by using a coupling capacitorfor each channel. The common ground pin of the headphone is connected to the ground of the amplifier, see Fig.4. By using the HPS pin as illustrated in Fig.4, the TDA8552T detects if a headphone jack plug is inserted into the connector.

TDA8552T; TDA8552TS

When noheadphone is plugged in, thevoltage level at the HPSpin willremain LOW.A voltage lessthan VDD− 1Vat the HPS pin will keep the device in theBTL mode,thus the loudspeakers can be operational. If the HPS pin is not connected then the device will remain in the BTL mode.

When a headphone is plugged into the connector, the voltage at the HPS pin will be set to VDD. The device then switches to the Single-Ended (SE) mode, this means that the slave power amplifiers at the outputs OUT1− and OUT2− will be switched to the standby mode. This results in floating outputs OUT1− and OUT2−, the loudspeaker signal isthus attenuated byapproximately 80 dB and only the headphone can operate.

One of the benefits of this system is that the loudspeaker current does not flow through the jack connector switch, which could give some output power loss. The other benefit is that the quiescent current is reduced when the headphone jack is inserted.

2002 Jan 04 7

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

ORM

stg

amb

tot

THERMAL CHARACTERISTICS

See Section “Thermal design considerations” in Chapter “Test and application information”.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

th(j-a)

supply voltage operating −0.3 +5.5 V input voltage −0.3 VDD+ 0.3 V repetitive peak output current − 1A storage temperature −55 +150 °C operating ambient temperature −40 +85 °C AC and DC short-circuit safe voltage − 5.5 V maximum power dissipation SO20 − 2.2 W

SSOP20 − 1.1 W

thermal resistance from junction to ambient

for the TDA8552T (SO20) in free air 60 K/W

extra copper 55 K/W

for the TDA8552TS (SSOP20) in free air 110 K/W

extra copper 80 K/W

Table 1 Power rating; note 1

MUSIC POWER

(V) RL (Ω)

o (w)

THD = 10%

OPERATION

(W)

max

amb(max)

SO20 SSOP20

3.3 4 0.9 BTL 0.55 120 106

3.3 8 0.6 BTL 0.28 134 127

3.3 16 0.3 BTL 0.14 142 139

3.3 32SE 0.035 headphone 0.03 150 150

5.0 4 2.0 BTL 1.25 81 50

5.0 8 1.4 BTL 0.65 114 98

5.0 16 0.8 BTL 0.32 132 124

5.0 32SE 0.09 headphone 0.07 146 144 continuous sine wave

3.3 4 0.9 BTL 1.1 89 62

5 8 1.4 BTL 1.25 81 50

Note

1. The power rating is based on R

with recommended copperpattern of at least 4 × 1cm2to the cornerleads and

th(j-a)

copper under the IC package.

(°C)

2002 Jan 04 8

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

QUALITY SPECIFICATION

Quality specification in accordance with

DC CHARACTERISTICS

VDD=5V; T

=25°C; RL=8Ω; V

amb

speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

stb

V

OUT+

− V

OUT−

supply voltage 2.7 5 5.5 V supply current BTL mode; VDD=5V;

standby current V DC output voltage note 2 − 2.5 − V

 differential output offset

voltage

Mode select pin

MODE

mute

input voltage standby VDD− 0.5 − V

input current 0 < V mute attenuation note 3 80 tbf − dB

Gain select pin

GAINSEL

input voltage low gain (20 dB) 0 − 0.6 V

input current −−1µA

Headphone sense pin

HPS

input voltage SE mode; headphone

input current −−1µA

“SNW-FQ-611 part E”

= 0 V; total gain setting at 7 dB; according to Fig.4.; unless otherwise

MODE

, if this type is used as an audio amplifier.

− 14 20 mA

RL=∞; note 1 SE mode; V BTL mode; V

=5V − 8.5 12 mA

= 3.3 V;

− 10 15 mA

RL= ∞; note 1 SE mode; V

MODE=VDD

= 3.3 V − 58mA

− 110µA

GAINSEL=0V −−50 mV GAINSEL = V

−−150 mV

mute 1 − V operating 0 − 0.5 V

MODE<VDD

−−1µA

high gain (30 dB) 4.1 − V

VDD− 1 − V

detected

− 1.4 V

2002 Jan 04 9

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Volume control

rep

th(up)

ﬂoat(max)

ﬂoat(min)

th(down)

I(up/down)

wait

rep

Volume attenuator

v(l)

v(h)

step

∆G

i(max)(rms)

pulse width 50 −−ns pulse repetition time 100 −−ns UP/DOWN pin UP threshold

4.1 − V

level UP/DOWN pin ﬂoating high

−−3.4 V

level UP/DOWN pin ﬂoating low

1.0 −−V

level UP/DOWN pin DOWN

0 − 0.6 V

threshold level input current UP/DOWN pin 0 < V

UP/DOWN<VDD

−−200 µA auto repeat wait time − 500 − ms repeat time key pressed − 130 − ms

low gain; maximum volume

19 20 21 dB

(including power ampliﬁer) low gain; minimum volume

tbf −60 tbf dB

(including power ampliﬁer) high gain; maximum volume

29 30 31 dB

(including power ampliﬁer) high gain; minimum volume

tbf −50 tbf dB

(including power ampliﬁer) number of gain steps − 64 − variation of gain per step − 1.25 − dB input impedance 14 20 − kΩ maximum input voltage

−−1.75 V (RMS value)

Notes

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal DC output offset voltage



----------------------------------------------------------------



2. The DC output voltage with respect to ground is approximately 0.5VDD.

3. Output voltage inmute position ismeasured with an input of1 V (RMS) in a bandwidthof 20 kHz, so including noise,

gain select pin is LOW (0 V).

2002 Jan 04 10

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

AC CHARACTERISTICS (VDD= 3.3 V)

=25°C; RL=8Ω; f = 1 kHz; total gain setting at 7 dB; V

amb

(maximum gain = 20 dB); according to Fig.4.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

output power THD = 10%; RL=4Ω− 0.9 − W

THD = 10%; R THD = 10%; R THD = 0.5%; R THD = 0.5%; R

THD = 0.5%; R THD total harmonic distortion P V

o(n)

noise output voltage note 2 − 60 −µV

SVRR supply voltage ripple

= 0.1 W; note 1 − 0.1 − %

note 3 tbf 55 − dB

rejection

i(max)

maximum input voltage THD = 1%;

Gv= −50 to 0 dB

sup

channel suppression V

HPS=VDD

channel separation − 55 − dB

; note 4 − 80 − dB

= 0 V; gain select pin is at 0 V

MODE

=8Ω− 0.6 − W

=16Ω− 0.3 − W

=4Ω− 0.6 − W

=8Ω− 0.4 − W

=16Ω− 0.2 − W

−−1.1 V

Notes

1. Volume setting at maximum.

2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), R

3. Supply voltage ripple rejection is measured at the output, with a source impedance of R

=0Ω, gain select pin is LOW (0 V).

source

=0Ω at the input.

source

The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V).

4. Channel suppression is measured at the output with a source impedance of R

=0Ω at the input and a

source

frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 2 V (RMS).

2002 Jan 04 11

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

AC CHARACTERISTICS (VDD=5V)

=25°C; RL=8Ω; f = 1 kHz; total gain setting at 7 dB; V

amb

(maximum gain = 20 dB); according to Fig.4; package is SO20.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

output power THD = 10%; RL=8Ω 1.0 1.4 − W

THD = 10%; R THD = 0.5%; R THD = 0.5%; R

THD total harmonic distortion P

o(n)

noise output voltage GAINSEL. = 0 V; note 2 − 60 100 µV

= 0.1 W; note 1 − 0.15 0.4 %

= 0.5 W; note 1 − 0.1 0.3 %

GAINSEL. = V

SVRR supply voltage ripple

note 3 50 55 − dB

rejection

i(max)

a maximum input voltage THD = 1%;

Gv= −50 to 0 dB

sup

channel suppression V

HPS=VDD

channel separation 50 −−dB

; note 4 70 80 − dB

= 0 V; Gain select pin is at 0 V

MODE

=16Ω− 0.8 − W

=8Ω 0.6 1.0 − W

=16Ω− 0.6 − W

; note 2 − 100 −µV

−−1.75 V

Notes

1. Volume setting at maximum.

2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted),

source

=0Ω.

=0Ω at the input.

source

3. Supply voltage ripple rejection is measured at the output, with a source impedance of R The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V).

4. Channel suppression is measured at the output with a source impedance of R

=0Ω at the input and a

source

frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 1 V (RMS).

2002 Jan 04 12

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

AC CHARACTERISTICS (FOR HEADPHONE; RL=32Ω; CONNECTED SE)

=5V; T

(maximum gain = 20 dB); according to Fig.4.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

THD total harmonic distortion P V

o(n)

SVRR supply voltage ripple

i(max)

Notes

1. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), R

source

2. Supply voltage ripple rejection is measured at the output, with a source impedance of R The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive supply rail, gain select pin is LOW (0 V).

=25°C; f = 1 kHz; total gain setting at 20 dB; V

amb

output power THD = 10%; VDD= 3.3 V − 35 − mW

THD = 10%; V THD = 0.5%; V THD = 0.5%; V

=60mW − 0.04 − %

noise output voltage note 1 − 60 100 µV

note 2 50 55 − dB

rejection maximum input voltage THD = 1%;

Gv= −50 to 0 dB

channel separation 50 −−dB

=0Ω, gain select pin is LOW (0 V).

= 0 V; gain select pin is 0 V

MODE

= 5.0 V − 90 − mW

= 3.3 V − 25 − mW

= 5.0 V − 60 − mW

−−1.75 V

=0Ω at the input.

source

handbook, full pagewidth

th(UP)

float(max)

UP/DOWN

float(min)

th(DOWN)

The rise time (tr) of the pulse may have any value.

rep

decreasing volume

Fig.3 Timing UP/DOWN pin.

2002 Jan 04 13

increasing volume

floating

rep

MGM611

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

volume control

IN1

330 nF

IN1

2.2 kΩ

down

2.2 kΩ

mute

100

330 nF

IN2

C8 100 nF

standby

operating

UP/DOWN1

220 µF

UP/DOWN2

MODE

SVR

IN2

HPS

5 4

VOLUME CONTROL

kΩ

0.5V

UP/DOWN COUNTER

up down

INTERFACE

VOLUME CONTROL

kΩ

0.5V

UP/DOWN COUNTER

up down

INTERFACE

STANDBY/MUTE

AND OPERATING

20 dB

30 dB

15 kΩ

0.5V

15 kΩ

20 dB

30 dB

15 kΩ

0.5V

15 kΩ

0.5V

DD1, 2

3, 8 13, 18

MASTER

15 kΩ

3.4 kΩ

1.6 kΩ

0.5V

20 kΩ 20 kΩ

SLAVE

TDA8552T

MASTER

15 kΩ

3.4 kΩ

1.6 kΩ

0.5V

GAIN

SELECTION

20 kΩ 20 kΩ

SLAVE

GAINSEL GND1 to GND4

TDA8552T; TDA8552TS

VDD = 5 V

DD3, 4

1, 10, 11, 2014

100 kΩ

C3 C4

OUT1+

220 µF

8 Ω

OUT1−

OUT2+

8 Ω

OUT2−

R2 820 kΩ

100

220 µF

R1 1 kΩ

headphone jack

tip

ring sleeve

R4 1 kΩ

ground

MGM609

Fig.4 Test and application diagram.

2002 Jan 04 14

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

Test conditions

=25°C if not specially mentioned; VDD=5V;

amb

f = 1 kHz, R 22 Hz to 22 kHz.Thethermal resistance (instandardprint, without extra copper) = 110 K/W for the SSOP20; the maximum sine wave power dissipation is:

150 25–

---------------------110

For T

amb

150 60–

---------------------110

Thermal design considerations

The ‘measured’ thermal resistance of the IC package is highly dependent on the configuration and size of the application board. All surface mount packages rely on the traces of the PCB to conductheat awayfrom thepackage. To improve the heat flow, a significant area on the PCB must be attached to the (ground) pins. Data may not be comparable between different semiconductor manufacturers because the application boards and test methods are not (yet) standardized. Also, the thermal performance of packagesfor aspecific applicationmay be differentthan presented here,because theconfigurationof the application boards (copper area) may be different. PhilipsSemiconductors uses FR-4typeapplication boards with 1 oz copper traces with solder coating Solder Resist Mask (SRM).

The SSOP20 package has improved thermal conductivity which reduces the thermal resistance. Using a practical PCB layout (see Fig.18) with wider copper tracks to the corner pins and just under the IC, the thermal resistance from junction to ambient can be reduced to approximately 80 K/W. For T

dissipation for this PCB layout is:

The thermal resistance for the SO20 is approximately 55 K/W if applied to a PCBwith wider copper tracks to the corner pins and just under the body of the IC. The maximum total power dissipation for this practical application is:

150 60–

----------------------

=8Ω, Gv= 20 dB, audio band-pass

1.14 W=

=60°C the maximum total power dissipation is:

0.82 W=

=60°C the maximum total power

amb

150 60–

---------------------80

1.63 W=

1.12 W=

TDA8552T; TDA8552TS

BTL application

The BTL application diagram is illustrated in Fig.4. The quiescent current has been measured without any

load impedance. The total harmonic distortion as a function of frequency was measured with a low-pass filter of 80 kHz. The value of capacitor C3 influences the behaviour of the SVRR at low frequencies, increasing the value of C3 increases the performance of the SVRR.

Headphone application

=25°C if not specially mentioned, VDD=5V,

amb

f = 1 kHz, RL=32Ω, Gv= 14 dB, audio band-pass 22 Hz to 22 kHz.

For headphone application diagram see: Fig.4 If a headphone is plugged into the headphone jack, the

HPS pin will switch-off the outputs of the SLAVE output stage, this results in a mute attenuation >80 dB for the loudspeakers. In this condition the quiescent current will be reduced.

General remarks

Reduction of the value of capacitor C3 results in a decrease of the SVRR performance at low frequencies.

The capacitor value of C5 and C6 in combination with the load impedance of the headphone determines the low frequency behaviour.

To prevent against high output currents during inserting the headphone into theheadphone jack,resistors of5.1 Ω have to be connected in series with the SE output lines.

The UP/DOWNpin can be driven by a 3-statelogic output stage (microprocessor) without extra external components. If the UP/DOWN pin is driven by push-buttons, then it is advised to have an RC-filter between the buttons and the UP/DOWN pin. Advised valuesfor the RC-filterare2.2 kΩ and100 nF. Resistor R4 is not necessary for basic operation, but is advised to keep C6 charged to a voltage of 0.5VDD This has the advantage that the plop noise when inserting the headphone plug is minimal. If the headphone sense function (HPS) is not used then the HPS-pin 4 should be hard-wired to ground. This pin should never be left unconnected.

Using double push buttons, the volume step for both channels can be controlled. When for the balance control only a single contact is used, the balance steps are

1.25 dB. If double contacts are used for the balance buttons and the dashed connection is made, then the balance steps are 2.5 dB.

2002 Jan 04 15

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

Application without volume control

If pins 6, 7 and 8 are hardwired together the device operates with the volume control setting at maximum. When the supply voltage is connectedand thedevice isswitched fromstandby tomute or operating for the first time then

the gain is ramped up from −20 dB to +20 dB. This takes approximately 5 s. This maximum gain setting is maintained until the supply voltage drops below the minimum value.

balance left

volume

down

2.2 kΩ

UP/DOWN1

100 nF

TDA8552T

2.2 kΩ

UP/DOWN2

100 nF

MGM612

handbook, full pagewidth

balance right

Fig.5 Volume and balance control using buttons.

2002 Jan 04 16

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

MGR005

VDD (V)

handbook, halfpage

(mA)

234 6

RL= ∞.

handbook, halfpage

(dB)

−20

−40

−60

02040 80

VDD= 5 V; RL=8Ω. (1) Gv= 30 dB (max.). (2) Gv= 20 dB (max.).

TDA8552T; TDA8552TS

MGR006

(1)

(2)

volume steps

Fig.6 IDD as a function of VDD.

handbook, halfpage

THD

(%)

(1)

(2)

−1

−2

VDD= 5 V; RL=8Ω; f = 1 kHz; Gv= 20 dB (max.). (1) Gv= 0 dB. (2) Gv= 7 dB. (3) Gv= 20 dB.

(3)

−1

MGR007

110

Po (W)

Fig.7 Gain as a function of volume steps.

handbook, halfpage

THD

(%)

(1) (2)

(3)

−1

−2

VDD= 5 V; RL=8Ω; f = 1 kHz; Gv= 30 dB (max.). (1) Gv= 0 dB. (2) Gv= 7 dB. (3) Gv=20dB. (4) Gv=30dB.

−1

(4)

MGR008

110

Po (W)

Fig.8 THD as a function of Po.

2002 Jan 04 17

Fig.9 THD as a function of Po.

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

handbook, halfpage

THD

(%)

−1

−2

(1)

(2)

(3)

−1

VDD= 5 V; RL=8Ω; Gv= 20 dB (max.). (1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz.

110

MGR009

Po (W)

TDA8552T; TDA8552TS

handbook, halfpage

THD

(%)

−1

−2

VDD= 5 V; RL=8Ω; Gv= 30 dB (max.). (1) f = 10 kHz. (2) f = 1 kHz. (3) f = 100 Hz.

(1)

(2)

(3)

−1

MGR010

110

Po (W)

Fig.10 THD as a function of Po.

handbook, halfpage

THD

(%)

(1)

−1

−2

10 10

VDD= 5 V; RL=8Ω; Po= 0.1 W; Gv= 20 dB (max.). (1) Gv= 0 dB. (2) Gv= 7 dB. (3) Gv= 20 dB.

(2)

(3)

Fig.11 THD as a function of Po.

MGR011

handbook, halfpage

THD

(%)

(1)

(2)

−1

−2

f (Hz)

10 10

(3)

VDD= 5 V; RL=8Ω; Po= 0.1 W; Gv= 30 dB (max.). (1) Gv= 0 dB. (2) Gv= 7 dB. (3) Gv=30dB.

MGR012

f (Hz)

Fig.12 THD as a function of frequency.

2002 Jan 04 18

Fig.13 THD as a function of frequency.

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

MGR013

f (Hz)

SVRR

(1)

handbook, halfpage

(dB)

(2)

−20

(3)

(4)

−40

(5)

(6)

−60

−80

10 10

VDD= 5 V; RL=8Ω; V (1) C3 = 10 µF; Gv=20dB. (2) C3 = 10 µF; Gv= 7 dB. (3) C3 = 100 µF; Gv= 20 dB. (4) C3 = 10 µF; Gv=10dB. (5) C3 = 100 µF; Gv= 7 dB. (6) C3 = 100 µF; Gv= 10 dB.

= 100 mV.

ref

TDA8552T; TDA8552TS

2.4

handbook, halfpage

(V)

1.6

1.2

0.8

0.4

−50 −30 −10

VDD= 5 V; RL=8Ω; f = 1 kHz; THD = 1%. (1) Gv= 20 dB (max.). (2) Gv= 30 dB (max.).

MGR014

(1) (2)

G (dB)

100

Fig.14 SVRR as a function of frequency.

handbook, halfpage

sup

(dB)

−20

−40

−60

−80

−100

VP= 5 V; Vo= 1 V; V (1) Channel 1. (2) Channel 2.

HPS=VP

Fig.15 Input voltage as a function of gain.

MGL436

handbook, halfpage

(dB)

−20

−40

−60

(1) (2)

f (Hz)

−80

−100

VP= 5 V; Vo=1V.

(1) (2)

(1) Gv=30dB. (2) Gv=20dB.

MGL435

f (Hz)

Fig.16 Channel suppression as a function of

frequency.

2002 Jan 04 19

Fig.17 Channel separation as a function of

frequency.

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

handbook, full pagewidth

TDA8552T; TDA8552TS

top view

IN1

330 nF

IN2

20 dB 30 dB

TDA

8552/53TS

Analog Audio

CIC – Nijmegen

220 µF

100 nF

MODE

20 1

150 nF

220 µF

TDA8552/53TS

1 kΩ

− OUT1 +− OUT2 +

+VddGND

100 kΩ

220 µF

820

kΩ

1.5 kΩ

5 Ω

bottom view

1.5 kΩ

DOWN

5 Ω

1 kΩ

MGR015

Fig.18 Printed-circuit board layout.

2002 Jan 04 20

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

PACKAGE OUTLINES

SO20: plastic small outline package; 20 leads; body width 7.5 mm

TDA8552T; TDA8552TS

SOT163-1

v M

pin 1 index

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

max.

2.65

0.10

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

0.49

0.36

0.32

0.23

0.013

0.009

0.019

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

w M

scale

(1)E(1) (1)

13.0

12.6

0.51

0.49

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

detail X

1.1

1.0

0.043

0.039

(A )

0.25

0.01

0.25 0.1

0.01

ywv θ

0.9

0.4

0.004

0.035

0.016

o o

OUTLINE VERSION

SOT163-1

IEC JEDEC EIAJ

075E04 MS-013

REFERENCES

2002 Jan 04 21

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22 99-12-27

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm

TDA8552T; TDA8552TS

SOT266-1

v M

pin 1 index

110

w M

DIMENSIONS (mm are the original dimensions)

max.

1.5

0.1501.4

1.2

A3b

0.25

0.32

0.20

UNIT A1A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

0 2.5 5 mm

0.20

6.6

0.13

6.4

(1)E(1)

4.5

4.3

scale

eHELLpQZywv θ

0.65 1.0 0.2

6.6

6.2

detail X

0.75

0.65

0.45

(A )

0.13 0.1

0.48

0.18

(1)

OUTLINE

VERSION

SOT266-1 MO-152

IEC JEDEC EIAJ

REFERENCES

2002 Jan 04 22

EUROPEAN

PROJECTION

ISSUE DATE

95-02-22 99-12-27

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

SOLDERING Introduction to soldering surface mount packages

Thistext givesa verybrief insight toa complex technology. A more in-depth account of soldering ICs can be found in our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011). There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for certainsurface mount ICs,but it isnotsuitable forfine pitch SMDs. In these situations reflow soldering is recommended.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied tothe printed-circuitboard by screenprinting, stencillingor pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages.

Wave soldering

Conventional single wave soldering is not recommended forsurface mount devices(SMDs) or printed-circuitboards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

TDA8552T; TDA8552TS

• Use a double-wave soldering method comprising a turbulent wavewith high upwardpressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• Forpackages with leadson four sides,thefootprint must be placedat a 45° angle to the transportdirection of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement and before soldering, thepackage must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a lowvoltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

If wave soldering is used the following conditions must be observed for optimal results:

2002 Jan 04 23

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

Suitability of surface mount IC packages for wave and reﬂow soldering methods

PACKAGE

BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not suitable

(3)

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering isonly suitable forSSOP and TSSOP packages witha pitch (e) equal toor larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface.

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

SOLDERING METHOD

WAVE REFLOW

(2)

(3)(4) (5)

suitable

suitable suitable

(1)

2002 Jan 04 24

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital

TDA8552T; TDA8552TS

volume control and headphone sensing

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

Objective data Development This data sheet contains data from the objective specification for product

Preliminary data Qualiﬁcation This data sheet contains data from the preliminary specification.

Product data Production This data sheet contains data from the product specification. Philips

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

(1)

STATUS

(2)

development. Philips Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notiﬁcation (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

DEFINITIONS Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device atthese oratany otherconditionsabove thosegivenin the Characteristics sectionsof the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentation or warrantythatsuch applicationswill be suitable for the specified use without further testing or modification.

DISCLAIMERS Life support applications  These products are not

designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expectedto resultin personalinjury. Philips Semiconductorscustomers using orsellingthese products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for theuse of anyof these products,conveysno licenceor title under any patent, copyright, or mask work right to these products,and makesnorepresentations orwarranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

2002 Jan 04 25

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

NOTES

TDA8552T; TDA8552TS

2002 Jan 04 26

Philips Semiconductors Product speciﬁcation

2 x 1.4 W BTL audio ampliﬁers with digital volume control and headphone sensing

NOTES

TDA8552T; TDA8552TS

2002 Jan 04 27

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

The information presented in this document does not form part of any quotation orcontract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 753503/03/pp28 Date of release: 2002 Jan 04 Document order number: 9397 750 09236

SCA74

NXP TDA8552T, TDA8552TS DATA SHEET

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

ORDERING INFORMATION

QUICK REFERENCE DATA

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

LIMITING VALUES

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

DC CHARACTERISTICS

AC CHARACTERISTICS (VDD= 3.3 V)

AC CHARACTERISTICS (VDD=5V)

PACKAGE OUTLINES

SOT163-1

SOT266-1

DATA SHEET STATUS

DEFINITIONS