NXP TDA 1308 T-N2 Datasheet

TDA1308

Class-AB stereo headphone driver

Rev. 5 — 14 March 2011 Product data sheet

1. General description

The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or
a TSSOP8 plastic package. The device is fabricated in a 1 μm Complementary Metal
Oxide Semiconductor (CMOS) process and has been primarily developed for portable
digital audio applications.

2. Features and benefits

 Wide temperature range
 No switch ON/OFF clicks
 Excellent power supply ripple rejection
 Low power consumption
 Short-circuit resistant
 High performance

 High signal-to-noise ratio
 High slew rate
 Low distortion

 Large output voltage swing

3. Quick reference data

Table 1. Quick reference data

=5V; VSS=0V; T

V

DD

Symbol Parameter Conditions Min Typ Max Unit

V

DD

V

SS

I

DD

P

tot

P

o

THD+N total harmonic

S/N signal-to-noise ratio 100 110 - dB

supply voltage single supply 3.0 5.0 7.0 V

negative supply
voltage

supply current no load - 3 5 mA
total power

dissipation
output power maximum; THD+N < 0.1 %

distortion-plus-noise

=25°C; fi= 1 kHz; RL=32Ω; unless otherwise specified.

amb

dual supply 1.5 2.5 3.5 V
dual supply −1.5 −2.5 −3.5 V

no load - 15 25 mW

[1]

-4080mW

[1]

-0.030.06%

[1]

- −70 −65 dB

=5kΩ - −101 - dB

R

L

NXP Semiconductors

Table 1. Quick reference data …continued

VDD=5V; VSS=0V; T

Symbol Parameter Conditions Min Typ Max Unit

α

cs

PSRR power supply ripple

T

amb

TDA1308

Class-AB stereo headphone driver

=25°C; fi= 1 kHz; RL=32Ω; unless otherwise specified.

amb

channel separation - 70 - dB

=5kΩ

R

L

=100Hz;

f

i

rejection

V

ripple(p-p)

= 100 mV

ambient temperature −40 - +85 °C

[1]

- 105 - dB

-90-dB

[1] VDD=5V; V

4. Ordering information

Table 2. Ordering information

Type number Package

TDA1308T SO8 plastic small outline package; 8 leads; body width

TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads;

5. Block diagram

= 3.5 V (at 0 dB).

o(p-p)

Name Description Version

SOT96-1

3.9 mm
SOT505-1

body width 3 mm

TDA1308

OUTA

INA-

INA+

V

SS

1

2

3

4

8

V

DD

7

OUTB

6

INB-

5

INB+

mka779

Fig 1. Block diagram

TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 5 — 14 March 2011 2 of 17

NXP Semiconductors

6. Pinning information

6.1 Pinning

TDA1308

Class-AB stereo headphone driver

TDA1308

Fig 2. Pin configuration

6.2 Pin description

Table 3. Pin description

Symbol Pin Description

OUTA 1 output A
INA− 2 inverting input A
INA+ 3 non-inverting input A
V

SS

INB+ 5 non-inverting input B
INB− 6 inverting input B
OUTB 7 output B
V

DD

4 negative supply

8 positive supply

OUTA

INA-

INA+

V

SS

1

2

3

4

001aaf782

8

V

DD

7

OUTB

6

INB-

5

INB+

7. Internal circuitry

V

DD

I

1

INA/B+

INA/B-

OUTA/B

V

SS

M1

D3D2D1

M4

D4

M2 M3

M5

Fig 3. Equivalent schematic diagram

TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 5 — 14 March 2011 3 of 17

A1

C

m

A2

M6

mka781

NXP Semiconductors

8. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

DD

t

sc

T

stg

T

amb

V

ESD

supply voltage 0 8.0 V
short-circuit duration time output; T

storage temperature −65 +150 °C
ambient temperature −40 +85 °C
electrostatic discharge

voltage

[1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.
[2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative.

9. Thermal characteristics

P

tot

HBM
MM

=1W

amb

TDA1308

Class-AB stereo headphone driver

=25°C;

20 - s

[1]

−2+2kV

[2]

−200 +200 V

Table 5. Thermal characteristics

Symbol Parameter Conditions Typ Unit

R

th(j-a)

thermal resistance from junction
to ambient

SO8 210 K/W
TSSOP8 220 K/W

TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 5 — 14 March 2011 4 of 17

NXP Semiconductors

10. Characteristics

TDA1308

Class-AB stereo headphone driver

Table 6. Characteristics

VDD=5V; VSS=0V; T

=25°C; fi= 1 kHz; RL=32Ω; unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

Supplies

V

DD

supply voltage single supply 3.0 5.0 7.0 V

dual supply 1.5 2.5 3.5 V

V

SS

I

DD

P

tot

negative supply voltage dual supply −1.5 −2.5 −3.5 V
supply current no load - 3 5 mA
total power dissipation no load - 15 25 mW

Static characteristics

|V
I
V
G
I
R

ΔV

α

PSRR power supply ripple rejection f
C

| input offset voltage - 10 - mV

I(offset)

IB

cm

v(ol)

O

o

O

cs

L

input bias current - 10 - pA
common-mode voltage 0 - 3.5 pA
open-loop voltage gain RL=5kΩ -70-dB
output current maximum - 60 - mA
output resistance THD+N < 0.1 % - 0.25 - Ω
output voltage variation

R
R

=16Ω

L

=5kΩ

L

[1]

0.75 - 4.25 V

[1]

1.5- 3.5V

[1]

0.1- 4.9V

channel separation - 70 - dB

=5kΩ

R

L

=100Hz; V

i

ripple(p-p)

= 100 mV - 90 - dB

[1]

-105-dB

load capacitance - - 200 pF

Dynamic characteristi cs

[2]

THD+N total harmonic

distortion-plus-noise

R
R

=5kΩ

L

=5kΩ

L

- 0.03 0.06 %

[2]

- −70 −65 dB

[2]

- −101 - dB

[2]

-0.0009-%
S/N signal-to-noise ratio 100 110 - dB
f

1

P

o

C

i

unity gain frequency open-loop; RL=5kΩ -5.5-MHz
output power maximum; THD+N < 0.1 % - 40 80 mW

input capacitance - 3 - pF
SR slew rate unity gain inverting - 5 - V/μs
B bandwidth unity gain inverting - 20 - kHz

[1] Values are proportional to VDD; THD+N < 0.1 %.
[2] V

TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 5 — 14 March 2011 5 of 17

=5V; V

DD

= 3.5 V (at 0 dB).

o(p-p)

NXP Semiconductors

11. Application information

TDA1308

Class-AB stereo headphone driver

Fig 4. Typical application

12. Test information

C1
22 μF
6 V

V

DD

R1
10 kΩ

R2
10 kΩ

1

7

100 μF/6 V

8

4

100 μF/6 V

100 μF

C4

C3

C5

0.1 μF

C2
100 μF
10 V

R

L

V

R

L

V

R

L

001aan758

V

OUTA

OUTA

OUTB

R6

3.9 kΩ

C7

1 μF

C6

1 μF

R5

3.9 kΩ

R3

3.9 kΩ

V

INA

V

INB

3.9 kΩ

2

3

5

6

TDA1308

R4

3.9 kΩ

8

1

TDA1308

7

C6
100 μF

4

100 μF

V

OUTB

R

L

mka782

V

INA

V

ref

(typ. 2.5 V)

V

INB

3.9 kΩ

3.9 kΩ

2

3

5

6

3.9 kΩ

Fig 5. Measurement circuit for inverting ap plication

TDA1308 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 5 — 14 March 2011 6 of 17