NXP TDA 1308 T-N2 Datasheet

TDA1308

Class-AB stereo headphone driver

Rev. 5 — 14 March 2011 Product data sheet

1. General description

The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or a TSSOP8 plastic package. The device is fabricated in a 1 μm Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily developed for portable digital audio applications.

2. Features and benefits

 Wide temperature range  No switch ON/OFF clicks  Excellent power supply ripple rejection  Low power consumption  Short-circuit resistant  High performance

 High signal-to-noise ratio  High slew rate  Low distortion

 Large output voltage swing

3. Quick reference data

Table 1. Quick reference data

=5V; VSS=0V; T

Symbol Parameter Conditions Min Typ Max Unit

tot

THD+N total harmonic

S/N signal-to-noise ratio 100 110 - dB

supply voltage single supply 3.0 5.0 7.0 V

negative supply voltage

supply current no load - 3 5 mA total power

dissipation output power maximum; THD+N < 0.1 %

distortion-plus-noise

=25°C; fi= 1 kHz; RL=32Ω; unless otherwise specified.

amb

dual supply 1.5 2.5 3.5 V dual supply −1.5 −2.5 −3.5 V

no load - 15 25 mW

[1]

-4080mW

[1]

-0.030.06%

[1]

- −70 −65 dB

=5kΩ - −101 - dB

NXP Semiconductors

Table 1. Quick reference data …continued

VDD=5V; VSS=0V; T

Symbol Parameter Conditions Min Typ Max Unit

PSRR power supply ripple

amb

TDA1308

Class-AB stereo headphone driver

=25°C; fi= 1 kHz; RL=32Ω; unless otherwise specified.

amb

channel separation - 70 - dB

=5kΩ

=100Hz;

rejection

ripple(p-p)

= 100 mV

ambient temperature −40 - +85 °C

[1]

- 105 - dB

-90-dB

[1] VDD=5V; V

4. Ordering information

Table 2. Ordering information

Type number Package

TDA1308T SO8 plastic small outline package; 8 leads; body width

TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads;

5. Block diagram

= 3.5 V (at 0 dB).

o(p-p)

Name Description Version

SOT96-1

3.9 mm SOT505-1

body width 3 mm

TDA1308

OUTA

INA-

INA+

OUTB

INB-

INB+

mka779

Fig 1. Block diagram

Product data sheet Rev. 5 — 14 March 2011 2 of 17

NXP Semiconductors

6. Pinning information

6.1 Pinning

TDA1308

Class-AB stereo headphone driver

TDA1308

Fig 2. Pin configuration

6.2 Pin description

Table 3. Pin description

Symbol Pin Description

OUTA 1 output A INA− 2 inverting input A INA+ 3 non-inverting input A V

INB+ 5 non-inverting input B INB− 6 inverting input B OUTB 7 output B V

4 negative supply

8 positive supply

OUTA

INA-

INA+

001aaf782

OUTB

INB-

INB+

7. Internal circuitry

INA/B+

INA/B-

OUTA/B

D3D2D1

M2 M3

Fig 3. Equivalent schematic diagram

Product data sheet Rev. 5 — 14 March 2011 3 of 17

mka781

NXP Semiconductors

8. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

stg

amb

ESD

supply voltage 0 8.0 V short-circuit duration time output; T

storage temperature −65 +150 °C ambient temperature −40 +85 °C electrostatic discharge

voltage

[1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative. [2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative.

9. Thermal characteristics

tot

HBM MM

=1W

amb

TDA1308

Class-AB stereo headphone driver

=25°C;

20 - s

[1]

−2+2kV

[2]

−200 +200 V

Table 5. Thermal characteristics

Symbol Parameter Conditions Typ Unit

th(j-a)

thermal resistance from junction to ambient

SO8 210 K/W TSSOP8 220 K/W

Product data sheet Rev. 5 — 14 March 2011 4 of 17

NXP Semiconductors

10. Characteristics

TDA1308

Class-AB stereo headphone driver

Table 6. Characteristics

VDD=5V; VSS=0V; T

=25°C; fi= 1 kHz; RL=32Ω; unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

Supplies

supply voltage single supply 3.0 5.0 7.0 V

dual supply 1.5 2.5 3.5 V

tot

negative supply voltage dual supply −1.5 −2.5 −3.5 V supply current no load - 3 5 mA total power dissipation no load - 15 25 mW

Static characteristics

|V I V G I R

ΔV

PSRR power supply ripple rejection f C

| input offset voltage - 10 - mV

I(offset)

v(ol)

input bias current - 10 - pA common-mode voltage 0 - 3.5 pA open-loop voltage gain RL=5kΩ -70-dB output current maximum - 60 - mA output resistance THD+N < 0.1 % - 0.25 - Ω output voltage variation

R R

=16Ω

=5kΩ

[1]

0.75 - 4.25 V

[1]

1.5- 3.5V

[1]

0.1- 4.9V

channel separation - 70 - dB

=5kΩ

=100Hz; V

ripple(p-p)

= 100 mV - 90 - dB

[1]

-105-dB

load capacitance - - 200 pF

Dynamic characteristi cs

[2]

THD+N total harmonic

distortion-plus-noise

R R

=5kΩ

- 0.03 0.06 %

[2]

- −70 −65 dB

[2]

- −101 - dB

[2]

-0.0009-% S/N signal-to-noise ratio 100 110 - dB f

unity gain frequency open-loop; RL=5kΩ -5.5-MHz output power maximum; THD+N < 0.1 % - 40 80 mW

input capacitance - 3 - pF SR slew rate unity gain inverting - 5 - V/μs B bandwidth unity gain inverting - 20 - kHz

[1] Values are proportional to VDD; THD+N < 0.1 %. [2] V

Product data sheet Rev. 5 — 14 March 2011 5 of 17

=5V; V

= 3.5 V (at 0 dB).

o(p-p)

NXP Semiconductors

11. Application information

TDA1308

Class-AB stereo headphone driver

Fig 4. Typical application

12. Test information

C1 22 μF 6 V

R1 10 kΩ

R2 10 kΩ

100 μF/6 V

100 μF

0.1 μF

C2 100 μF 10 V

001aan758

OUTA

OUTB

3.9 kΩ

1 μF

3.9 kΩ

INA

INB

3.9 kΩ

TDA1308

3.9 kΩ

TDA1308

C6 100 μF

100 μF

OUTB

mka782

INA

ref

(typ. 2.5 V)

INB

3.9 kΩ

Fig 5. Measurement circuit for inverting ap plication

Product data sheet Rev. 5 — 14 March 2011 6 of 17

NXP Semiconductors

TDA1308

Class-AB stereo headphone driver

(dB)

10−210

RL = 32 Ω

−3

no load

−4

10−510−610−710

mka784

fi (Hz)

-70

Xtalk

(dB)

-90

RL = 16 Ω

-110 32 Ω

5 kΩ

-130

−8

-1

-2

-3

mka785

-4

fi (Hz)

-5

Fig 6. Open-loop gain as a function of input frequenc y Fig 7. Crosstalk as a function of input frequenc y

100

(mW)

mka786

RL = 16 Ω

32 Ω

-50

THD+N

(dB)

= 16 Ω; Po = 50 mW

-70

8 Ω

RL = 32 Ω; Po = 50 mW

mka787

(V)

-90

-110

RL = 5 kΩ; V

-1

-2

= 3.5 V

o(p-p)

-3

-4

fi (Hz)

-5

Fig 8. Output power as a function of supply voltage Fig 9. Total harmonic distortion plus noise ratio as a

function of input frequency

Product data sheet Rev. 5 — 14 March 2011 7 of 17

NXP Semiconductors

TDA1308

Class-AB stereo headphone driver

o(p-p)

mka788

(V)

THD+N

(dB)

-100

-40

-60

-80

RL = 8 Ω

16 Ω

32 Ω

5 kΩ

= 1 kHz

-2

-1

110

Fig 10. Total harmonic distortion plus noise ratio as a function of output vol tage level

Product data sheet Rev. 5 — 14 March 2011 8 of 17

NXP Semiconductors

-1

13. Package outline

TDA1308

Class-AB stereo headphone driver

O8: plastic small outline package; 8 leads; body width 3.9 mm

pin 1 index

w M

detail X

v M

(A )

SOT96

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

OUTLINE VERSION

SOT96-1

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

IEC JEDEC JEITA

076E03 MS-012

0.25

0.01

0.49

0.36

0.019

0.0100

0.014

0.0075

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

0.25

5.0

0.19

4.8

0.20

0.19

REFERENCES

(1)E(2)

4.0

3.8

0.16

0.15

eHELLpQZywv θ

6.2

1.27

5.8

0.244

0.05

0.228

1.05

1.0

0.4

0.039

0.016

0.7

0.6

0.028

0.024

0.25 0.10.25

0.010.010.041 0.004

EUROPEAN

PROJECTION

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

99-12-27 03-02-18

Fig 11. Package outline SOT96-1 (SO8)

Product data sheet Rev. 5 — 14 March 2011 9 of 17

NXP Semiconductors

-1

TDA1308

Class-AB stereo headphone driver

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm

pin 1 index

w M

detail X

SOT505

(A3)

v M

2.5 5 mm0

scale

DIMENSIONS (mm are the original dimensions)

UNIT

max.

1.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT505-1

0.15

0.05

A2A3b

0.95

0.25

0.80

IEC JEDEC JEITA

0.45

0.25

ceD

0.28

0.15

REFERENCES

(1)E(2)

3.1

2.9

3.1

2.9

0.65

5.1

4.7

0.7

0.4

wyv

0.1 0.10.10.94

EUROPEAN

PROJECTION

(1)

0.70

0.35

ISSUE DATE

6° 0°

99-04-09 03-02-18

Fig 12. Package outline SOT505-1 (TSSOP8)

Product data sheet Rev. 5 — 14 March 2011 10 of 17

NXP Semiconductors

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology . A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when thro ugh-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.

14.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by so lder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:

TDA1308

Class-AB stereo headphone driver

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, in cluding the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are exposed to the wave

• Solder bath specifications, including temperature and impurities

Product data sheet Rev. 5 — 14 March 2011 11 of 17

NXP Semiconductors

14.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

• Solder paste printing issues including smearing, release, and adjusting the process

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

Table 7. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

< 2.5 235 220 ≥ 2.5 220 220

TDA1308

Class-AB stereo headphone driver

higher minimum peak temperatures (see Figure 13 reducing the process window

window for a mix of large and small components on one board

heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joint s (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with

Table 7

and 8

Volume (mm3) < 350 ≥ 350

) than a SnPb process, thus

Table 8. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3) < 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245 > 2.5 250 245 245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.

Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 13

Product data sheet Rev. 5 — 14 March 2011 12 of 17

NXP Semiconductors

Fig 13. Temperature profiles for large and small components

maximum peak temperature

temperature

MSL: Moisture Sensitivity Level

= MSL limit, damage level

minimum peak temperature

= minimum soldering temperature

TDA1308

Class-AB stereo headphone driver

peak

temperature

time

001aac84

For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”.

Product data sheet Rev. 5 — 14 March 2011 13 of 17

NXP Semiconductors

Class-AB stereo headphone driver

TDA1308

15. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TDA1308 v.5 20110314 Product data sheet - TDA1308_A_4 Modifications:

TDA1308_A_4 20070125 Product data sheet - TDA1308_A_3 TDA1308_A_3 20020719 Product specification - TDA1308_A_2 TDA1308_A_2 20020227 Product specification - TDA1308_1 TDA1308_1 19940905 Product specification - -

• Remove d all references to type numbers TDA1308, TDA1308A, TDA1308AUK

• Changed pin names INA(neg), INA(pos), INB(pos), INB(neg) to INA−, INA+, INB+ and INB−

• Updated parameter symbols in Tables 4 and 6, and Figures 7, 9 and 10

• Replaced Figure 4

Product data sheet Rev. 5 — 14 March 2011 14 of 17

NXP Semiconductors

TDA1308

Class-AB stereo headphone driver

16. Legal information

16.1 Data sheet status

Document status

Objective [short] data sheet Development This document contain s data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) d escribed i n this docume nt may have changed since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied u pon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

16.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be lia ble for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonabl y be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is ope n for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

, unless otherwise

Product data sheet Rev. 5 — 14 March 2011 15 of 17

NXP Semiconductors

TDA1308

Class-AB stereo headphone driver

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It i s neither qua lif ied nor test ed in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equ ipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, da mages or failed produ ct cl aims resulting from custome r design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

16.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trad emarks are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 5 — 14 March 2011 16 of 17

NXP Semiconductors

18. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

9 Thermal characteristics . . . . . . . . . . . . . . . . . . 4

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

11 Application information. . . . . . . . . . . . . . . . . . . 6

12 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

14 Soldering of SMD packages . . . . . . . . . . . . . . 11

14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 11

14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 11

14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 11

14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 12

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

17 Contact information. . . . . . . . . . . . . . . . . . . . . 16

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

TDA1308

Class-AB stereo headphone driver

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 March 2011

Document identifier: TDA1308

NXP TDA 1308 T-N2 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features and benefits

3. Quick reference data

4. Ordering information

5. Block diagram

6. Pinning information

6.1 Pinning

6.2 Pin description

7. Internal circuitry

8. Limiting values

9. Thermal characteristics

10. Characteristics

11. Application information

12. Test information

13. Package outline

14. Soldering of SMD packages

14.1 Introduction to soldering

14.2 Wave and reflow soldering

14.3 Wave soldering

14.4 Reflow soldering

15. Revision history

16. Legal information

16.1 Data sheet status

16.2 Definitions

16.3 Disclaimers

16.4 Trademarks

17. Contact information

18. Contents