NXP PXTA92 Schematic [ru]

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SOT89

PXTA92

300 V, 100 mA PNP high-voltage transistor

Rev. 6 — 27 September 2011 Product data sheet

1. Product profile

1.1 General description

PNP high-voltage transistor in a medium power and flat lead SOT89 (SC-62) Surface-Mounted Device (SMD) plastic package.

NPN complement: PXTA42.

1.2 Features and benefits

 High breakdown voltage  AEC-Q101 qualified  Medium power and flat lead SMD plastic package

1.3 Applications

 Electronic ballast for fluorescent lighting  LED driver for LED chain module  High Intensity Discharge (HID) front lighting  Automotive motor management  Hook switch for wired telecom  Switch Mode Power Supply (SMPS)

1.4 Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V I I h

CEO C CM

collector-emitter voltage open base - - 300 V collector current - - 100 mA peak collector current - - 200 mA DC current gain VCE= 10 V;

= 10 mA

40 - -

NXP Semiconductors

321

sym079

2. Pinning information

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1emitter 2 collector 3base

3. Ordering information

Table 3. Ordering information

Type number Package

PXT A92 SC-62 plastic surface-mounted package; exposed die pad

PXTA92

300 V, 100 mA PNP high-voltage transistor

Name Description Version

SOT89

for good heat transfer; 3 leads

4. Marking

Table 4. Marking codes

Type number Marking code

PXTA92 *2D

[1] * = placeholder for manufacturing site code

5. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

CBO

CEO

EBO

tot

amb

stg

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for

collector 6 cm

[1]

collector-base voltage open emitter - 300 V collector-emitter voltage open base - 300 V emitter-base voltage open collector - 5V collector current - 100 mA peak collector current - 200 mA peak base current - 100 mA total power dissipation T

amb

 25 C

[1]

- 1300 mW junction temperature - 1 50 C ambient temperature 65 +150 C storage temperature 65 +150 C

Product data sheet Rev. 6 — 27 September 2011 2 of 9

NXP Semiconductors

6. Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

th(j-a)

thermal resistance from junction to ambient

th(j-sp)

thermal resistance from junction to solder point

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.

7. Characteristics

Table 7. Characteristics

=25C unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

CBO

EBO

CEsat

BEsat

collector-base cut-off current

emitter-base cut-off current

DC current gain VCE= 10 V; IC= 1mA 25 - -

collector-emitter saturation voltage

base-emitter saturation voltage

transition frequency VCE= 20 V;

collector capacitance VCB= 20 V;

PXTA92

300 V, 100 mA PNP high-voltage transistor

in free air

VCB= 200 V; IE=0A - - 250 nA

VEB= 3V; IC=0A - - 100 nA

= 10 V;

IC= 10 mA

= 10 V;

= 30 mA

IC= 20 mA; IB= 2mA - - 500 mV

IC= 20 mA; IB= 2mA - - 900 mV

= 10 mA;

f = 100 MHz

IE=ie=0A; f=1MHz

[1]

--96K/W

--16K/W

40 - -

25 - -

50 - - MHz

--6pF

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.

Product data sheet Rev. 6 — 27 September 2011 3 of 9

NXP Semiconductors

06-08-29Dimensions in mm

4.6

4.4

1.8

1.4

1.6

1.4

1.2

0.8

1.5

0.48

0.35

0.44

0.23

0.53

0.40

2.6

2.4

4.25

3.75

123

9. Package outline

Fig 1. Package outline PXTA92 (SOT89/SC-62)

PXTA92

300 V, 100 mA PNP high-voltage transistor

10. Packing information

Table 8. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

PXTA92 SOT89 8 mm pitch, 12 mm tape and reel; T1

[1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T3: 90 taping

8 mm pitch, 12 mm tape and reel; T3

[1]

1000 4000

[2]

-115 -135

[3]

-120 -

Product data sheet Rev. 6 — 27 September 2011 4 of 9

NXP Semiconductors

solder lands

solder resist

occupied area

solder paste

sot089_fr

1.2

1.9

2.25

4.75

(3×)

0.7

(3×)

0.6

(3×)

1.1

(2×)

1.2

0.85

0.2

0.5

1.7

4.85

3.95

4.6

1.51.5

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot089_fw

0.7

5.3

6.6

2.4

3.5

0.5

1.8

(2×)

1.5

(2×)

7.6

1.9 1.9

Dimensions in mm

11. Soldering

PXTA92

300 V, 100 mA PNP high-voltage transistor

Fig 2. Reflow soldering footprint PXTA92 (SOT89/SC-62)

Product data sheet Rev. 6 — 27 September 2011 5 of 9

Fig 3. Wave soldering footprint PXTA92 (SOT89/SC-62)

NXP Semiconductors

PXTA92

300 V, 100 mA PNP high-voltage transistor

12. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PXTA92 v.6 20110927 Product data sheet - PXTA92 v.5 Modifications: PXTA92 v.5 20110711 Product data sheet - PXTA92 v.4 PXTA92 v.4 20041209 Product specification - PXTA92 v.3 PXTA92 v.3 19990429 Product specification - PXTA92_93_CNV v.2 PXTA92_93_CNV v.2 19970620 Product specification - -

• Descriptive title corrected

Product data sheet Rev. 6 — 27 September 2011 6 of 9

NXP Semiconductors

PXTA92

300 V, 100 mA PNP high-voltage transistor

13. Legal information

13.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this docu ment may have change d since this d ocument was p ublished and may dif fe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is open for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

, unless otherwise

Product data sheet Rev. 6 — 27 September 2011 7 of 9

NXP Semiconductors

PXTA92

300 V, 100 mA PNP high-voltage transistor

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trademarks are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 6 — 27 September 2011 8 of 9

NXP Semiconductors

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 3

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 3

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4

10 Packing information . . . . . . . . . . . . . . . . . . . . . 4

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 6

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

14 Contact information. . . . . . . . . . . . . . . . . . . . . . 8

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

PXTA92

300 V, 100 mA PNP high-voltage transistor

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 27 September 2011

Document identifier: PXTA92

NXP PXTA92 Schematic [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Product profile

1.1 General description

1.2 Features and benefits

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Test information

8.1 Quality information

9. Package outline

10. Packing information

11. Soldering

12. Revision history

13. Legal information

13.1 Data sheet status

13.2 Definitions

13.3 Disclaimers

13.4 Trademarks

14. Contact information

15. Contents