NXP PMV 32UP NXP Datasheet

Download

SOT23

PMV32UP

20 V, 4 A P-channel Trench MOSFET

Rev. 1 — 11 March 2011 Product data sheet

1. Product profile

1.1 General description

P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

1.2 Features and benefits

 1.8 V drain-source on-state resistance

rated

 Very fast switching  Trench MOSFET technology

1.3 Applications

 Relay driver  High-speed line driver

 High-side loadswitch  Switching circuits

1.4 Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

DSon

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for

drain 6 cm

drain-source voltage

gate-source voltage

drain current VGS=-4.5V; T

drain-source on-state resistance

Tj=25°C ---20V

-8 - 8 V

=25°C

amb

VGS=-4.5V; ID=-2.4A; T

=25°C

[1]

---4A

- 3236mΩ

NXP Semiconductors

017aaa094

2. Pinning information

PMV32UP

20 V, 4 A P-channel Trench MOSFET

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1 G gate 2Ssource 3 D drain

SOT23 (TO-236AB)

3. Ordering information

Table 3. Ordering information

Type number Package

PMV32UP TO-236AB plastic surface-mounted package; 3 leads SOT23

Name Description Version

4. Marking

Table 4. Marking codes

Type number Marking code

PMV32UP NF%

[1]

[1] % = placeholder for manufacturing site code

Product data sheet Rev. 1 — 11 March 2011 2 of 15

NXP Semiconductors

Tj (°C)

−75 17512525 75−25

017aaa123

120

der

(%)

Tj (°C)

−75 17512525 75−25

017aaa124

120

der

(%)

5. Limiting values

PMV32UP

20 V, 4 A P-channel Trench MOSFET

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

tot

amb

stg

Source-drain diode

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm2. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

drain-source voltage Tj=25°C - -20 V gate-source voltage -8 8 V drain current VGS=-4.5V; T

=-4.5V; T

peak drain current T total power dissipation T

= 25 °C; single pulse; tp≤ 10 µs - -16 A

amb

=25°C

amb

= 25 °C - 4150 mW

amb amb

=25°C =100°C

[1] [1]

[2] [1]

--4A

--2.5A

- 510 mW

- 930 mW

junction temperature -55 150 °C ambient temperature -55 150 °C storage temperature -65 150 °C

source current T

amb

=25°C

[1]

--1A

Fig 1. Normalized total power dissipation as a

function of junction temperature

Product data sheet Rev. 1 — 11 March 2011 3 of 15

Fig 2. Normalized continuous drain current as a

function of junction temperature

NXP Semiconductors

017aaa139

–1

–10

–1

–10

(A)

–10

–2

VDS (V)

–1

101

(1)

(2)

(3)

(4) (5)

Limit R

DSon

= VDS/I

(6)

PMV32UP

20 V, 4 A P-channel Trench MOSFET

IDM = single pulse (1) tp = 100 µs (2) t

= 1 ms

(3) t

= 10 ms

(4) DC; Tsp = 25 °C (5) t

= 100 ms

(6) DC; T

= 25 °C; drain mounting pad 6 cm

amb

Fig 3. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-source

voltage

6. Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

th(j-a)

thermal resistance from junction to ambient

th(j-sp)

thermal resistance from junction to solder point

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm

in free air

[1] [2]

- 207 245 K/W

- 117 135 K/W

- 2530K/W

Product data sheet Rev. 1 — 11 March 2011 4 of 15

NXP Semiconductors

017aaa140

tp (s)

–3

10110

–2

–1

th(j-a)

(K/W)

0.75

0.5

0.33

0.25

0.2

0.1

0.05

0.02

0.01

duty cycle = 1

017aaa141

tp (s)

–1

10110

–2

–1

th(j-a)

(K/W)

0.75

0.5

0.33

0.25

0.2

0.1

0.05

0.02

0.01

duty cycle = 1

PMV32UP

20 V, 4 A P-channel Trench MOSFET

FR4 PCB, standard footprint

Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

FR4 PCB, mounting pad for drain 6 cm

Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Product data sheet Rev. 1 — 11 March 2011 5 of 15

NXP Semiconductors

7. Characteristics

PMV32UP

20 V, 4 A P-channel Trench MOSFET

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

(BR)DSS

drain-source

ID=-250µA; VGS=0V; Tj=25°C -20--V

breakdown voltage

GSth

gate-source threshold

ID=-250µA; VDS=VGS; Tj= 25 °C -0.45 -0.7 -0.95 V

voltage

DSS

GSS

DSon

drain leakage current VDS=-20V; VGS=0V; Tj=25°C ---1µA

=-20V; VGS=0V; Tj= 150 °C - - -10 µA

gate leakage current VGS=-8V; VDS=0V; Tj= 25 °C - - -100 nA drain-source on-state

resistance

forward

VGS=-4.5V; ID=-2.4A; Tj= 25 °C - 32 36 mΩ

=-4.5V; ID=-2.4A; Tj=150°C - 4653mΩ

=-2.5V; ID=-2.0A; Tj= 25 °C - 40 46 mΩ

=-1.8V; ID=-1.8A; Tj= 25 °C - 55 73 mΩ

VDS=-5V; ID=-2.4A; Tj=25°C - 13 - S

transconductance

Dynamic characteristi cs

Q Q Q C C C

G(tot) GS

GD iss oss rss

total gate charge ID=-1A; VDS=-10V; VGS=-4.5V; gate-source charge - 2.7 - nC

Tj=25°C

gate-drain charge - 2.2 - nC input capacitance VGS=0V; VDS= -10 V; f = 1MHz;

=25°C

output capacitance - 175 - pF

reverse transfer

- 15.5 - nC

- 1890 - pF

-112-pF

capacitance

d(on)

d(off)

turn-on delay time VDS=-10V; VGS=-5V; R

=25°C; ID=-1A

rise time - 21 - ns

G(ext)

=6Ω;

turn-off delay time - 95 - ns fall time - 33 - ns

-13-ns

Source-drain diode

source-drain voltage IS=-2.4A; VGS=0V; Tj=25°C - -0.75 -1 V

Product data sheet Rev. 1 — 11 March 2011 6 of 15

NXP Semiconductors

PMV32UP

20 V, 4 A P-channel Trench MOSFET

017aaa142

–1.8 V

VGS = –1.5 V

VDS (V)

(A)

–16

–12

–8

–4

0–5–4–2 –3–1

–2 V

–4.5 V

–2.5 V

Tj = 25 °C Tj = 25 °C; VDS = -3 V

Fig 6. Output characteristics: drain current as a

function of drain-source voltage; typical values

017aaa144

0.10

DSon

(Ω)

0.08

(1)

(2)

–3

–10

(A)

–4

–10

(1) (3)(2)

–5

–10

–6

–10

–0.2 –1.0–0.8–0.4 –0.6

017aaa143

VGS (V)

(1) minimum values (2) typical values (3) maximum values

Fig 7. Sub-threshold drain current as a function of

gate-source voltage

017aaa145

0.20

DSon

(Ω)

0.15

0.06

0.04

0.02

0.00 0 –16–12–4 –8

= 25 °C

(1) VGS = -1.5 V (2) V

= -1.8 V

(3) V

= -2.0 V

(3)

(4)

(5)

ID (A)

0.10

0.05

0.00

0.0 –5.0–4.0–2.0 –3.0–1.0

ID = -2.4 A (1) Tj = 150 °C (2) T

= 25 °C

(1)

(2)

VGS (V)

(4) VGS = -2.5 V (5) V

= -4.5 V

Fig 8. Drain-source on-state resistance as a function

of drain current; typical values

Product data sheet Rev. 1 — 11 March 2011 7 of 15

Fig 9. Drain-source on-state resistance as a function

of gate-source voltage; typical values

NXP Semiconductors

PMV32UP

20 V, 4 A P-channel Trench MOSFET

–16

(A)

–12

–8

–4

0.0 –2.0–1.5–0.5 –1.0

VDS > ID × R

DSon

(2)

017aaa146

(1) (2)

(1)

VGS (V)

(1) Tj = 25 °C (2) T

= 150 °C

Fig 10. Transfer characteristics: drain current as a

function of gate-source voltage; typical values

017aaa148

GS(th)

(V)

–1.2

(1)

–0.8

(2)

2.0

1.5

1.0

0.5

0.0 –60 180120060

017aaa147

Tj (°C)

Fig 11. Normalized drain-source on-state resistance as

a function of junction temperature; typical values

017aaa149

(pF)

(1)

(2)

–0.4

–60 180120060

= -0.25 mA; VDS = V

(3)

Tj (°C)

(1) maximum values (2) typical values (3) minimum values

Fig 12. Gate-source threshold voltage as a function of

junction temperature

–1

–10

f = 1 MHz; V (1) C

iss

(2) C

oss

(3) C

rss

Fig 13. Input, output and reverse transfer capacitances

as a function of drain-source voltage; typical

(3)

= 0 V

–10–1

VDS (V)

–10

values

Product data sheet Rev. 1 — 11 March 2011 8 of 15

NXP Semiconductors

017aaa137

GS(th)

GS1QGS2

G(tot)

GS(pl)

VSD (V)

–0.2 –1.2–1.0–0.6 –0.8–0.4

017aaa151

–8

–4

–12

–16

(A)

–0

(1)

(2)

PMV32UP

20 V, 4 A P-channel Trench MOSFET

amb

017aaa150

QG (nC)

= 25 °C

–4.5

(V)

–3.0

–1.5

0.0 0161248

ID = -2.4 A; VDS = -10 V; T

Fig 14. Gate-so urce voltage as a function of gate

charge; typical values

Fig 15. Gate charge waveform definitions

= 0 V

(1) T

= 150 °C

(2) T

= 25 °C

Fig 16. Sourc e current as a function of source-drain voltage; typical values

Product data sheet Rev. 1 — 11 March 2011 9 of 15

NXP Semiconductors

UNIT

max.

Qwv

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

04-11-04 06-03-16

IEC JEDEC JEITA

0.1

0.48

0.38

0.15

0.09

3.0

2.8

1.4

1.2

0.95

1.9

2.5

2.1

0.55

0.45

0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT23 TO-236AB

detail X

w M

v M

0 1 2 mm

scale

1.1

0.9

Plastic surface-mounted package; 3 leads SOT23

PMV32UP

20 V, 4 A P-channel Trench MOSFET

8. Package outline

Fig 17. Package outline SOT23 (TO-236AB)

Product data sheet Rev. 1 — 11 March 2011 10 of 15

NXP Semiconductors

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3×)

0.6

(3×)

0.6

(3×)

0.7

(3×)

3.3

2.9

1.7

1.9

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2×)

1.2

(2×)

2.2

2.6

Dimensions in mm

9. Soldering

PMV32UP

20 V, 4 A P-channel Trench MOSFET

Fig 18. Reflow soldering footprint for SOT23 (TO-236AB)

Fig 19. Wave soldering footprint for SOT23 (TO-236AB)

Product data sheet Rev. 1 — 11 March 2011 11 of 15

NXP Semiconductors

10. Revision history

PMV32UP

20 V, 4 A P-channel Trench MOSFET

Table 8. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PMV32UP v.1 20110311 Product data sheet - -

Product data sheet Rev. 1 — 11 March 2011 12 of 15

NXP Semiconductors

PMV32UP

20 V, 4 A P-channel Trench MOSFET

11. Legal information

11.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URL http://www.nxp.com.

[1] [2]

Product status

[3]

Definition

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specificatio n — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

11.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteri stics sections of this document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective

, unless otherwise

Product data sheet Rev. 1 — 11 March 2011 13 of 15

NXP Semiconductors

PMV32UP

20 V, 4 A P-channel Trench MOSFET

agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpret ed or construed as an offer to sell products that is open f or accept ance or the grant , conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It i s neit her qua lif ied nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, custome r (a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, da mages or failed produ ct claims result ing from custome r design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

11.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trademarks are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

12. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 1 — 11 March 2011 14 of 15

NXP Semiconductors

13. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . .4

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10

9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .12

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .13

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .13

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .13

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .14

12 Contact information. . . . . . . . . . . . . . . . . . . . . .14

PMV32UP

20 V, 4 A P-channel Trench MOSFET

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 11 March 2011 Document identifier: PMV32UP

NXP PMV 32UP NXP Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Product profile

1.1 General description

1.2 Features and benefits

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Package outline

9. Soldering

10. Revision history

11. Legal information

11.1 Data sheet status

11.2 Definitions

11.3 Disclaimers

11.4 Trademarks

12. Contact information

13. Contents