NXP PDTA124EE, PDTA124EM, PDTA124ET, PDTA124EU Schematic [ru]
PDTA124E series
PNP resistor-equipped transistors;
R1 = 22 k
Rev. 8 — 25 November 2011 Product data sheet
1. Product profile
1.1 General description
PNP Resistor-Equipped Transistor (RET) family in Surface-Mounted Device (SMD) plastic
packages.
Table 1. Product overview
Type number Package NPN
PDTA124EE SOT416 SC-75 - PDTC124EE ultra small
PDTA124EM SOT883 SC-101 - PDTC124EM leadless ultra small
PDTA124ET SOT23 - TO-236AB PDTC124ET small
PDTA124EU SOT323 SC-70 - PDTC124EU very small
, R2 = 22 k
NXP JEITA JEDEC
complement
Package
configuration
1.2 Features and benefits
100 mA output current capability Reduces component count
Built-in bias resistors Reduces pick and place costs
Simplifies circuit design AEC-Q101 qualified
1.3 Applications
Digital applications in automotive and
industrial segments
Cost-saving alternative for BC847/857
series in digital applications
Control of IC inputs Switching loads
1.4 Quick reference data
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
CEO
I
O
R1 bias resistor 1 (input) 15.4 22 28.6 k
R2/R1 bias resistor ratio 0.8 1 1.2
collector-emitter voltage open base - - 50 V
output current - - 100 mA
NXP Semiconductors
006aaa144
12
3
sym003
3
2
1
R1
R2
3
1
2
Transparent
top view
sym003
3
2
1
R1
R2
PDTA124E series
2. Pinning information
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
SOT23; SOT323; SOT416
1 input (base)
2 GND (emitter)
3 output (collector)
SOT883
1 input (base)
2 GND (emitter)
3 output (collector)
PNP resistor-equipped transistors; R1 = 22 k
, R2 = 22 k
3. Ordering information
Table 4. Ordering information
Type number Package
PDTA124EE SC-75 plastic surface-mounted package; 3 leads SOT416
PDTA124EM SC-101 leadless ultra small plastic package; 3 solder lands;
PDTA124ET - plastic surface-mounted package; 3 leads SOT23
PDTA124EU SC-70 plastic surface-mounted package; 3 leads SOT323
4. Marking
Table 5. Marking codes
Type number Marking code
PDTA124EE 05
PDTA124EM DH
PDTA124ET *05
PDTA124EU *05
[1] * = placeholder for manufacturing site code
Name Description Version
SOT883
body 1.0 0.6 0.5 mm
[1]
PDTA124E_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 25 November 2011 2 of 17
NXP Semiconductors
PDTA124E series
5. Limiting values
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
V
CEO
V
EBO
V
I
I
O
I
CM
P
tot
T
j
T
amb
T
stg
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 70 m copper strip line, standard footprint.
PNP resistor-equipped transistors; R1 = 22 k
, R2 = 22 k
collector-base voltage open emitter - 50 V
collector-emitter voltage open base - 50 V
emitter-base voltage open collector - 10 V
input voltage
positive - +10 V
negative - 40 V
output current - 100 mA
peak collector current single pulse;
1ms
t
p
total power dissipation T
amb
25 C
PDTA124EE (SOT416)
PDTA124EM (SOT883)
PDTA124ET (SOT23)
PDT A124EU (SOT323)
- 100 mA
[1][2]
-150mW
[2][3]
-250mW
[1]
-250mW
[1]
-200mW
junction temperature - 150 C
ambient temperature 65 +150 C
storage temperature 65 +150 C
PDTA124E_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 25 November 2011 3 of 17
NXP Semiconductors
PDTA124E series
300
P
tot
(mW)
200
100
0
-75 17512525 75-25
(1) SOT23; FR4 PCB, standard footprint
SOT883; FR4 PCB with 70 m copper strip line, standard footprint
(2) SOT323; FR4 PCB, standard footprint
(3) SOT416; FR4 PCB, standard footprint
Fig 1. Power derating curves
PNP resistor-equipped transistors; R1 = 22 k
006aac778
(1)
(2)
(3)
T
(°C)
amb
, R2 = 22 k
6. Thermal characteristics
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 70 m copper strip line, standard footprint.
thermal resistance from junction
to ambient
PDTA124EE (SOT416)
PDTA124EM (SOT883)
PDTA124ET (SOT23)
PDT A124EU (SOT323)
in free air
[1][2]
--830K/W
[2][3]
--500K/W
[1]
--500K/W
[1]
--625K/W
PDTA124E_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 25 November 2011 4 of 17
NXP Semiconductors
006aac782
10
-5
1010
-2
10
-4
10
2
10
-1
tp (s)
10
-3
10
3
1
10
2
10
10
3
Z
th(j-a)
(K/W)
1
duty cycle = 1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
PDTA124E series
PNP resistor-equipped transistors; R1 = 22 k
3
10
duty cycle = 1
Z
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for
0.75
th(j-a)
(K/W)
10
2
10
1
-5
10
0.33
0.1
0.02
0
0.5
0.2
0.05
0.01
-4
10
10
FR4 PCB, standard footprint
PDTA124EE (SOT416); typical values
-3
-2
-1
10
1
1010
2
10
, R2 = 22 k
006aac781
3
10
tp (s)
FR4 PCB, 70m copper strip line
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for
PDTA124EM (SOT883); typical values
PDTA124E_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 25 November 2011 5 of 17
NXP Semiconductors
PDTA124E series
PNP resistor-equipped transistors; R1 = 22 k
3
10
duty cycle = 1
Z
th(j-a)
0.75
(K/W)
2
10
10
1
-5
10
FR4 PCB, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for
PDTA124ET (SOT23); typical values
0.33
0.1
0.02
0
0.5
0.2
0.05
0.01
-4
10
-3
10
-2
-1
10
1
1010
2
10
, R2 = 22 k
006aac779
3
10
tp (s)
3
10
duty cycle = 1
Zth(j-a)
(K/W)
10
0.75
0.5
0.33
2
10
1
-5
10
0.1
0.02
0
0.2
0.05
0.01
-4
10
-3
10
-2
-1
10
1
1010
2
10
FR4 PCB, standard footprint
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for
PDTA124EU (SOT323); typical values
006aac780
tp (s)
3
10
PDTA124E_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 25 November 2011 6 of 17
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