14.1Introduction to soldering surface mount
packages
14.2Reflow soldering
14.3Wave soldering
14.4Manual soldering
14.5Suitability of surface mount IC packages for
wave and reflow soldering methods
15DEFINITIONS
16LIFE SUPPORT APPLICATIONS
17PURCHASE OF PHILIPS I2C COMPONENTS
PCF8575
1999 Apr 072
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
1FEATURES
• Operating supply voltage 2.5 to 5.5 V
• Low standby current consumption of 10 µA maximum
• I2C-bus to parallel port expander
• 400 kbits/s FAST I2C-bus
• Open-drain interrupt output
• 16-bit remote I/O port for the I2C-bus
• Compatible with most microcontrollers
• Latched outputs with high current drive capability for
directly driving LEDs
• Address by 3 hardware address pins for use of up to
8 devices
• SSOP24 package.
2GENERAL DESCRIPTION
The PCF8575 is a silicon CMOS circuit. It provides general
purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I
2
C-bus).
PCF8575
The device consists of a 16-bit quasi-bidirectional port and
2
an I
C-bus interface. The PCF8575 has a low current
consumption and includes latched outputs with high
current drive capability for directly driving LEDs. It also
possesses an interrupt line (INT) which can be connected
to the interrupt logic of the microcontroller. By sending an
interrupt signal on this line, the remote I/O can inform the
microcontroller if there is incoming data on its ports without
having to communicate via the I2C-bus. This means that
the PCF8575 is an I2C-bus slave transmitter/receiver.
Every data transmission from the PCF8575 must consist
of an even number of bytes, the first byte will be referred
to as P07 to P00 and the second byte as P17 to P10.
The third will be referred to as P07 to P00 and so on.
3ORDERING INFORMATION
TYPE
NUMBER
PCF8575TSSSOP24plastic shrink small outline package; 24 leads; body width 5.3 mmSOT340-1
P1013quasi-bidirectional I/O 10
P1114quasi-bidirectional I/O 11
P1215quasi-bidirectional I/O 12
P1316quasi-bidirectional I/O 13
P1417quasi-bidirectional I/O 14
P1518quasi-bidirectional I/O 15
P1619quasi-bidirectional I/O 16
P1720quasi-bidirectional I/O 17
A021address input 0
SCL22serial clock line input
SDA23serial data line input/output
V
DD
12supply ground
24supply voltage
handbook, halfpage
INT
A1
A2
P00
P01
P02
1
2
3
4
5
6
24
23
22
21
20
19
PCF8575
P03
P04
P05
P06
P07
V
SS
7
8
9
10
11
12
18
17
16
15
14
13
MGL538
Fig.2 Pin configuration.
PCF8575
V
DD
SDA
SCL
A0
P17
P16
P15
P14
P13
P12
P11
P10
1999 Apr 075
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
6CHARACTERISTICS OF THE I2C-BUS
The I2C-bus is for bidirectional, 2-line communication
between different ICs or modules. The two lines are a
serial data line (SDA) and a serial clock line (SCL). Both
lines must be connected to a positive supply via a pull-up
resistor when connected to the output stages of a device.
Data transfer may be initiated only when the bus is not
busy.
6.1Bit transfer
One data bit is transferred during each clock pulse.
The data on the SDA line must remain stable during the
HIGH period of the clock pulse as changes in the data line
at this time will be interpreted as control signals
(see Fig.3).
6.2START and STOP conditions
Both data and clock lines remain HIGH when the bus is not
busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the START condition (S).
A LOW-to-HIGH transition of the data line while the clock
is HIGH is defined as the STOP condition P (see Fig.4).
PCF8575
6.4Acknowledge
The number of data bytes transferred between the START
and the STOP conditions from transmitter to receiver is not
limited. Each byte of eight bits is followed by one
acknowledge bit. The transmitter must release the SDA
line before the receiver can send an acknowledge bit.
A slave receiver which is addressed must generate an
acknowledge after the reception of each byte. Also a
master must generate an acknowledge after the reception
of each byte that has been clocked out of the slave
transmitter. The device that acknowledges has to pull
down the SDA line during the acknowledge clock pulse, so
that the SDA line is stable LOW during the HIGH period of
the acknowledge related clock pulse, set-up and hold
times must be taken into account.
A master receiver must signal an end of data to the
transmitter by not generating an acknowledge after the
last byte that has been clocked out of the slave. This is
done by the master receiver by holding the SDA line HIGH.
In this event the transmitter must release the data line to
enable the master to generate a STOP condition.
6.3System configuration
A device generating a message is a ‘transmitter’, a device
receiving the message is the ‘receiver’. The device that
controls the message is the ‘master’ and the devices which
are controlled by the master are the ‘slaves’ (see Fig.5).
handbook, full pagewidth
SDA
SCL
data line
stable;
data valid
Fig.3 Bit transfer.
change
of data
allowed
MBC621
1999 Apr 076
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
handbook, full pagewidth
SDA
SCL
S
START condition
Fig.4 Definition of START and STOP conditions.
SDA
SCL
P
STOP condition
PCF8575
SDA
SCL
MBC622
handbook, full pagewidth
MASTER
TRANSMITTER /
RECEIVER
DATA OUTPUT
BY TRANSMITTER
DATA OUTPUT
BY RECEIVER
SCL FROM
MASTER
RECEIVER
S
START
condition
SLAVE
SLAVE
TRANSMITTER /
RECEIVER
Fig.5 System configuration.
MASTER
TRANSMITTER
not acknowledge
acknowledge
MASTER
TRANSMITTER /
RECEIVER
9821
clock pulse for
acknowledgement
MGL539
MBA605
Fig.6 Acknowledgment on the I2C-bus.
1999 Apr 077
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
PCF8575
7FUNCTIONAL DESCRIPTION
7.1Quasi-bidirectional I/Os
The PCF8575’s 16 ports (see Fig.7) are entirely independent and can be used either as input or output ports. Input data
is transferred from the ports to the microcontroller in the READ mode (see Fig.10). Output data is transmitted to the ports
in the WRITE mode (see Fig.9).
This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction.
At power-on the I/Os are HIGH. In this mode only a current source (I
VDD (I
) allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH,
OHt
) to VDD is active. An additional strong pull-up to
OH
and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs. After power-on
as all the I/Os are set HIGH all of them can be used as input. Any change in setting of the I/Os as either inputs or outputs
can be done with the write mode. Warning: If a HIGH is applied to an I/O which has been written earlier to LOW, a large
current (IOL) will flow to VSS. (see Characteristics note 3).
MGL540
V
DD
P00 to P07
P10 to 17
V
SS
to interrupt
logic
book, full pagewidth
write pulse
data from
shift register
power-on
reset
read pulse
data to
shift register
DQ
FF
C
I
S
D
FF
C
I
I
OH
100
I
OHt
Q
S
µA
I
OL
Fig.7 Simplified schematic diagram of each I/O.
7.2Addressing
Figures 8, 9 and 10 show the address and timing diagrams. Before any data is transmitted or received the master must
send the address of the receiver via the SDA line. The first byte transmitted after the START condition carries the address
of the slave device and the read/write bit. The address of the slave device must not be changed between the START and
the STOP conditions. The PCF8575 acts as a slave receiver or a slave transmitter.
handbook, halfpage
S0100A2 A1 A0 R/W A
slave address
MGL541
Fig.8 Byte containing the slave address and the R/W bits.
1999 Apr 078
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1999 Apr 079
SCL
12345678
handbook, full pagewidth
Integral multiples of two bytes
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I
WRITE TO
PORT
DATA OUTPUT
FROM PORT
P05 OUTPUT
VOLTAGE
P05 PULL-UP
OUTPUT CURRENT
INT
slave address (PCF8575)
S0100A2 A1 A00A P07 P06P00P17P101
start condition
R/W
acknowledge
from slave
data to port 0data to port 1
AASDA
P05
acknowledge
from slave
I
OHt
t
pv
t
ir
acknowledge
from slave
Data A0 and
B0 valid
I
OH
MGL542
2
C-bus
PCF8575
Fig.9 WRITE mode (output).
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1999 Apr 0710
SCL
SDA
S 0 1 0 0 A2 A1 A0 1 A P07 P06 P05 P04
P03 P02 P01 P00P17P10
AA P07P00 A P17P10 1P
book, full pagewidth
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I
READ FROM PORT
DATA INTO PORT
INT
t
iv
R/W acknowledge
from slave
t
h
t
ir
t
su
acknowledge
from receiver
t
ir
acknowledge
from receiver
P07 to P00P17 to P10P07 to P00P17 to P10P07 to P00P17 to P10
acknowledge
from receiver
MGL543
non acknowledge
from receiver
A LOW-to-HIGH transition of SDA, while SCL is HIGH is defined as the STOP condition (P). Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present
at the latest acknowledge phase is valid (output mode). Input data is lost.
Fig.10 READ mode (input).
2
C-bus
PCF8575
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
7.3Reading from a port (input mode)
All ports programmed as input should be set to logic 1.
To read, the master (microcontroller) first addresses the
slave device after it receives the interrupt. By setting the
last bit of the byte containing the slave address to logic 1
the read mode is entered. The data bytes that follow on the
SDA are the values on the ports.
If the data on the input port changes faster than the master
can read, this data may be lost.
7.4Writing to the port (output mode)
To write, the master (microcontroller) first addresses the
slave device. By setting the last bit of the byte containing
the slave address to logic 0 the write mode is entered.
The PCF8575 acknowledges and the master sends the
first data byte for P07 to P00. After the first data byte is
acknowledged by the PCF8575, the second data byte
P17 to P10 is sent by the master. Once again the
PCF8575 acknowledges the receipt of the data after which
this 16-bit data is presented on the port lines.
The number of data bytes that can be sent successively is
not limited. After every two bytes the previous data is
overwritten.
PCF8575
7.5Interrupt
The PCF8575 provides an open-drain interrupt (INT)
which can be fed to a corresponding input of the
microcontroller (see Figs 9, 10 and 12). This gives these
chips a kind of a master function which can initiate an
action elsewhere in the system.
An interrupt is generated by any rising or falling edge of the
port inputs. After time tiv the signal INT is valid.
The interrupt disappears when data on the port is changed
to the original setting or data is read from or written to the
device which has generated the interrupt.
In the write mode the interrupt may become deactivated
(HIGH) on the rising edge of the write to port pulse. On the
falling edge of the write to port pulse the interrupt is
definitely deactivated (HIGH).
The interrupt is reset in the read mode on the rising edge
of the read from port pulse.
During the resetting of the interrupt itself any changes on
the I/Os may not generate an interrupt. After the interrupt
is reset any change in I/Os will be detected and transmitted
INT.
as an
The first data byte in every pair refers to Port 0
(P07 to P00), whereas the second data byte in every pair
refers to Port 1 (P17 to P10), see Fig.11.
handbook, full pagewidth
07 06 05 04 03 02 01 00
P07 P06 P05 P04 P03 P02 P01 P00
First Byte
Second Byte
17
A
16 15 14 13 12 11 10
P17 P16 P15 P14 P13 P12 P11 P10
A
MGL545
Fig.11 Correlation between bits and ports.
1999 Apr 0711
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
handbook, full pagewidth
MICROCOMPUTER
INT
V
DD
PCF8575
(1)
INTINT
PCF8575
(2)
PCF8575
PCF8575
(8)
INT
MGL544
Fig.12 Application of multiple PCF8575s with interrupt.
1999 Apr 0712
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
PCF8575
8LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
SYMBOLPARAMETERMIN.MAX.UNIT
V
DD
I
DD
I
SS
V
I
I
I
I
O
P
tot
P
O
T
stg
T
amb
supply voltage−0.5+6.5V
supply current−±100mA
supply current−±100mA
input voltageVSS− 0.5VDD+ 0.5V
DC input current−±20mA
DC output current−±25mA
total power dissipation−400mW
power dissipation per output−100mW
storage temperature−65+150°C
operating ambient temperature−40+85°C
Note
1. Stress above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. This is
a stress ratings only and functional operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
9HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under
“Handling MOS Devices”
.
10 CHARACTERISTICS
= 2.5 to 5.5 V; VSS=0V; T
V
DD
= −40 to +85 °C; unless otherwise specified.
amb
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supplies
V
DD
I
DD
supply voltage2.5−5.5V
supply currentoperating mode; no load;
−100200µA
VI=VDD or VSS;
f
= 400 kHz
SCL
I
DD(stb)
V
POR
V
IL1
standby currentstandby mode; no load;
VI=VDD or V
SS
power-on reset voltagenote 1−1.21.8V
LOW-level input voltage pins A0,
−2.510µA
0.0−0.2V
DD
V
A1 and A2
V
IL2
LOW-level input voltage on all other
0.0−0.3V
DD
V
signal pins
V
IH
I
L1
HIGH-level input voltage0.7V
leakage current at pins A0,
output data valid−−4µs
input data set-up time0−−µs
input data hold time4−−µs
INT (see Fig.13)
LOW-level output currentVOL= 0.4 V1.6−−mA
TIMING;CL≤100 pF (see Figs 9 and 10)
t
iv
t
ir
input data valid time−−4µs
reset delay time−−4µs
Notes
1. The power-on reset circuit resets the I2C-bus logic with VDD<V
and sets all I/Os to logic 1 (with current source
POR
to VDD).
2. The value is not tested, but verified on sampling basis.
3. A single LOW-level output current (IOL) must not exceed 20 mA for an extended time. The sum of all I
at any point
OLs
in time must not exceed 100 mA.
1999 Apr 0714
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
PCF8575
11 I2C-BUS TIMING CHARACTERISTICS
See Fig.13 and note 1.
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
f
SCL
t
SW
t
BUF
SCL clock frequency−400kHz
tolerable spike width on busnote 2−50ns
BUS free time between a STOP
1.3−µs
and START condition
t
SU;STA
t
HD;STA
t
LOW
t
HIGH
t
r
t
f
t
SU;DAT
t
HD;DAT
t
SU;STO
C
b
START condition set-up time0.6−µs
START condition hold time0.6−µs
SCL LOW time1.3−µs
SCL HIGH time0.6−µs
SCL and SDA rise timenote 320 + 0.1C
SCL and SDA fall timenote 320 + 0.1C
300ns
b
300ns
b
data set-up time100−ns
data hold time0−ns
STOP condition set-up time0.6−µs
capacitive load represented by
−400pF
each bus line
Notes
1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to V
IL
and VIH with an input voltage swing of VSS to VDD.
2. The device inputs SDA and SCL are filtered and will reject spikes on the bus lines of widths less than t
SW(max)
.
3. The rise and fall times specified here refer to the driver device (PCF8575) and are part of the general fast I2C-bus
specification when PCF8575 asserts an acknowledge on SDA, the minimum fall time is 20 ns + 0.1Cb.
handbook, full pagewidth
PROTOCOL
SCL
SDA
CONDITION
t
SU;STA
t
BUF
START
(S)
BIT 7
MSB
(A7)
t
LOWtHIGH
t
r
BIT 6
(A6)
1/f
SCL
t
f
BIT 0
LSB
(R/W)
ACKNOWLEDGE
(A)
STOP
CONDITION
(P)
t
HD;STA
t
SU;DAT
Fig.13 I2C-bus timing diagram.
1999 Apr 0715
t
HD;DAT
t
SU;STO
MGL546
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
12 DEVICE PROTECTION
handbook, full pagewidth
V
INT
A1
A2
P00
P01
P02
P03
P04
P05
P06
P07
SS
1
2
3
4
5
6
7
8
9
10
11
12
PCF8575
V
DD
24
V
DD
23
SDA
22
SCL
21
A0
20
P17
19
P16
18
P15
17
P14
16
P13
15
P12
14
P11
13
P10
substrate V
SS
MGR789
Fig.14 Device protection diagram.
1999 Apr 0716
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
13 PACKAGE OUTLINE
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
D
c
y
Z
2413
PCF8575
SOT340-1
E
H
E
A
X
v M
A
pin 1 index
112
w M
b
e
DIMENSIONS (mm are the original dimensions)
mm
A
max.
2.0
0.21
0.05
1.80
1.65
0.25
b
3
p
0.38
0.25
UNITA1A2A
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
p
cD
0.20
8.4
0.09
8.0
02.55 mm
scale
(1)E(1)(1)
eHELLpQZywv θ
5.4
0.651.25
5.2
7.9
7.6
Q
A
2
A
1
detail X
1.03
0.9
0.63
0.7
(A )
L
p
L
A
3
θ
0.130.10.2
0.8
0.4
o
8
o
0
OUTLINE
VERSION
SOT340-1 MO-150AG
IEC JEDEC EIAJ
REFERENCES
1999 Apr 0717
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08
95-02-04
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
14 SOLDERING
14.1Introduction to soldering surface mount
packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“Data Handbook IC26; Integrated Circuit Packages”
our
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
14.2Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
14.3Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
PCF8575
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
14.4Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Apr 0718
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
PCF8575
14.5Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Apr 0719
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
15 DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
16 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PCF8575
17 PURCHASE OF PHILIPS I
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C components conveys a license under the Philips’ I2C patent to use the
1999 Apr 0720
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
NOTES
PCF8575
1999 Apr 0721
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
NOTES
PCF8575
1999 Apr 0722
Philips SemiconductorsProduct specification
Remote 16-bit I/O expander for I2C-bus
NOTES
PCF8575
1999 Apr 0723
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands465006/00/03/pp24 Date of release: 1999 Apr 07Document order number: 9397 750 05528
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