NXP PCF 8575 T Datasheet

INTEGRATED CIRCUITS
DATA SH EET
PCF8575
Remote 16-bit I/O expander for
2
C-bus
Product specification Supersedes data of 1999 Feb 25 File under Integrated Circuits, IC12
1999 Apr 07
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus

CONTENTS

1 FEATURES 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING 6 CHARACTERISTICS OF THE I2C-BUS
6.1 Bit transfer
6.2 START and STOP conditions
6.3 System configuration
6.4 Acknowledge 7 FUNCTIONAL DESCRIPTION
7.1 Quasi-bidirectional I/Os
7.2 Addressing
7.3 Reading from a port (input mode)
7.4 Writing to the port (output mode)
7.5 Interrupt 8 LIMITING VALUES 9 HANDLING 10 CHARACTERISTICS 11 I2C-BUS TIMING CHARACTERISTICS 12 DEVICE PROTECTION 13 PACKAGE OUTLINE 14 SOLDERING
14.1 Introduction to soldering surface mount packages
14.2 Reflow soldering
14.3 Wave soldering
14.4 Manual soldering
14.5 Suitability of surface mount IC packages for wave and reflow soldering methods
15 DEFINITIONS 16 LIFE SUPPORT APPLICATIONS 17 PURCHASE OF PHILIPS I2C COMPONENTS
PCF8575
1999 Apr 07 2
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus

1 FEATURES

Operating supply voltage 2.5 to 5.5 V
Low standby current consumption of 10 µA maximum
I2C-bus to parallel port expander
400 kbits/s FAST I2C-bus
Open-drain interrupt output
16-bit remote I/O port for the I2C-bus
Compatible with most microcontrollers
Latched outputs with high current drive capability for
directly driving LEDs
Address by 3 hardware address pins for use of up to
8 devices
SSOP24 package.

2 GENERAL DESCRIPTION

The PCF8575 is a silicon CMOS circuit. It provides general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I
2
C-bus).
PCF8575
The device consists of a 16-bit quasi-bidirectional port and
2
an I
C-bus interface. The PCF8575 has a low current consumption and includes latched outputs with high current drive capability for directly driving LEDs. It also possesses an interrupt line (INT) which can be connected to the interrupt logic of the microcontroller. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C-bus. This means that the PCF8575 is an I2C-bus slave transmitter/receiver.
Every data transmission from the PCF8575 must consist of an even number of bytes, the first byte will be referred to as P07 to P00 and the second byte as P17 to P10. The third will be referred to as P07 to P00 and so on.

3 ORDERING INFORMATION

TYPE
NUMBER
PCF8575TS SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1
NAME DESCRIPTION VERSION
PACKAGE
1999 Apr 07 3
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus

4 BLOCK DIAGRAM

handbook, full pagewidth
INT
A0 A1 A2
SCL
SDA
1
INPUT
FILTER
INTERRUPT
LOGIC
I2C-BUS
CONTROL
PCF8575
SHIFT
REGISTER
LP FILTER
16 BITS
I/O
PORT
PCF8575
P00 to P07
4 to 11
P10 to P17
13 to 20
WRITE pulse
DD SS
POWER-ON
RESET
V V
READ pulse
MGL537
Fig.1 Block diagram.
1999 Apr 07 4
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus

5 PINNING

SYMBOL PIN DESCRIPTION
INT 1 interrupt output (active LOW) A1 2 address input 1 A2 3 address input 2 P00 4 quasi-bidirectional I/O 00 P01 5 quasi-bidirectional I/O 01 P02 6 quasi-bidirectional I/O 02 P03 7 quasi-bidirectional I/O 03 P04 8 quasi-bidirectional I/O 04 P05 9 quasi-bidirectional I/O 05 P06 10 quasi-bidirectional I/O 06 P07 11 quasi-bidirectional I/O 07 V
SS
P10 13 quasi-bidirectional I/O 10 P11 14 quasi-bidirectional I/O 11 P12 15 quasi-bidirectional I/O 12 P13 16 quasi-bidirectional I/O 13 P14 17 quasi-bidirectional I/O 14 P15 18 quasi-bidirectional I/O 15 P16 19 quasi-bidirectional I/O 16 P17 20 quasi-bidirectional I/O 17 A0 21 address input 0 SCL 22 serial clock line input SDA 23 serial data line input/output V
DD
12 supply ground
24 supply voltage
handbook, halfpage
INT
A1
A2 P00 P01 P02
1 2 3 4 5 6
PCF8575
P03 P04 P05 P06 P07
V
SS
7 8
9 10 11 12
MGL538
Fig.2 Pin configuration.
PCF8575
V
DD
SDA SCL A0 P17 P16 P15 P14 P13 P12 P11 P10
1999 Apr 07 5
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus

6 CHARACTERISTICS OF THE I2C-BUS

The I2C-bus is for bidirectional, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy.

6.1 Bit transfer

One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Fig.3).

6.2 START and STOP conditions

Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the START condition (S).
A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition P (see Fig.4).
PCF8575

6.4 Acknowledge

The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The transmitter must release the SDA line before the receiver can send an acknowledge bit.
A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse, set-up and hold times must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an acknowledge after the last byte that has been clocked out of the slave. This is done by the master receiver by holding the SDA line HIGH. In this event the transmitter must release the data line to enable the master to generate a STOP condition.
6.3 System configuration
A device generating a message is a ‘transmitter’, a device receiving the message is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’ (see Fig.5).
handbook, full pagewidth
SDA
SCL
data line
stable;
data valid
Fig.3 Bit transfer.
change of data allowed
MBC621
1999 Apr 07 6
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus
handbook, full pagewidth
SDA
SCL
S
START condition
Fig.4 Definition of START and STOP conditions.
SDA SCL
P
STOP condition
PCF8575
SDA
SCL
MBC622
handbook, full pagewidth
MASTER
TRANSMITTER /
RECEIVER
DATA OUTPUT
BY TRANSMITTER
DATA OUTPUT
BY RECEIVER
SCL FROM
MASTER
RECEIVER
S
START
condition
SLAVE
SLAVE
TRANSMITTER /
RECEIVER
Fig.5 System configuration.
MASTER
TRANSMITTER
not acknowledge
acknowledge
MASTER
TRANSMITTER /
RECEIVER
9821
clock pulse for
acknowledgement
MGL539
MBA605
Fig.6 Acknowledgment on the I2C-bus.
1999 Apr 07 7
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus
PCF8575

7 FUNCTIONAL DESCRIPTION

7.1 Quasi-bidirectional I/Os

The PCF8575’s 16 ports (see Fig.7) are entirely independent and can be used either as input or output ports. Input data is transferred from the ports to the microcontroller in the READ mode (see Fig.10). Output data is transmitted to the ports in the WRITE mode (see Fig.9).
This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction. At power-on the I/Os are HIGH. In this mode only a current source (I VDD (I
) allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH,
OHt
) to VDD is active. An additional strong pull-up to
OH
and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs. After power-on as all the I/Os are set HIGH all of them can be used as input. Any change in setting of the I/Os as either inputs or outputs can be done with the write mode. Warning: If a HIGH is applied to an I/O which has been written earlier to LOW, a large current (IOL) will flow to VSS. (see Characteristics note 3).
MGL540
V
DD
P00 to P07 P10 to 17
V
SS
to interrupt logic
book, full pagewidth
write pulse
data from shift register
power-on reset
read pulse
data to shift register
DQ
FF
C
I
S
D
FF
C
I
I
OH
100
I
OHt
Q
S
µA
I
OL
Fig.7 Simplified schematic diagram of each I/O.

7.2 Addressing

Figures 8, 9 and 10 show the address and timing diagrams. Before any data is transmitted or received the master must send the address of the receiver via the SDA line. The first byte transmitted after the START condition carries the address of the slave device and the read/write bit. The address of the slave device must not be changed between the START and the STOP conditions. The PCF8575 acts as a slave receiver or a slave transmitter.
handbook, halfpage
S 0 1 0 0 A2 A1 A0 R/W A
slave address
MGL541
Fig.8 Byte containing the slave address and the R/W bits.
1999 Apr 07 8
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1999 Apr 07 9
SCL
12345678
handbook, full pagewidth
Integral multiples of two bytes
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I
WRITE TO
PORT
DATA OUTPUT
FROM PORT
P05 OUTPUT
VOLTAGE
P05 PULL-UP
OUTPUT CURRENT
INT
slave address (PCF8575)
S 0 1 0 0 A2 A1 A0 0 A P07 P06 P00 P17 P101
start condition
R/W
acknowledge from slave
data to port 0 data to port 1
A ASDA
P05
acknowledge from slave
I
OHt
t
pv
t
ir
acknowledge from slave
Data A0 and
B0 valid
I
OH
MGL542
2
C-bus
PCF8575
Fig.9 WRITE mode (output).
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1999 Apr 07 10
SCL
SDA
S 0 1 0 0 A2 A1 A0 1 A P07 P06 P05 P04
P03 P02 P01 P00 P17 P10
A A P07 P00 A P17 P10 1P
book, full pagewidth
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I
READ FROM PORT
DATA INTO PORT
INT
t
iv
R/W acknowledge
from slave
t
h
t
ir
t
su
acknowledge from receiver
t
ir
acknowledge from receiver
P07 to P00 P17 to P10P07 to P00 P17 to P10 P07 to P00 P17 to P10
acknowledge from receiver
MGL543
non acknowledge from receiver
A LOW-to-HIGH transition of SDA, while SCL is HIGH is defined as the STOP condition (P). Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). Input data is lost.
Fig.10 READ mode (input).
2
C-bus
PCF8575
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus

7.3 Reading from a port (input mode)

All ports programmed as input should be set to logic 1. To read, the master (microcontroller) first addresses the slave device after it receives the interrupt. By setting the last bit of the byte containing the slave address to logic 1 the read mode is entered. The data bytes that follow on the SDA are the values on the ports.
If the data on the input port changes faster than the master can read, this data may be lost.

7.4 Writing to the port (output mode)

To write, the master (microcontroller) first addresses the slave device. By setting the last bit of the byte containing the slave address to logic 0 the write mode is entered. The PCF8575 acknowledges and the master sends the first data byte for P07 to P00. After the first data byte is acknowledged by the PCF8575, the second data byte P17 to P10 is sent by the master. Once again the PCF8575 acknowledges the receipt of the data after which this 16-bit data is presented on the port lines.
The number of data bytes that can be sent successively is not limited. After every two bytes the previous data is overwritten.
PCF8575

7.5 Interrupt

The PCF8575 provides an open-drain interrupt (INT) which can be fed to a corresponding input of the microcontroller (see Figs 9, 10 and 12). This gives these chips a kind of a master function which can initiate an action elsewhere in the system.
An interrupt is generated by any rising or falling edge of the port inputs. After time tiv the signal INT is valid.
The interrupt disappears when data on the port is changed to the original setting or data is read from or written to the device which has generated the interrupt.
In the write mode the interrupt may become deactivated (HIGH) on the rising edge of the write to port pulse. On the falling edge of the write to port pulse the interrupt is definitely deactivated (HIGH).
The interrupt is reset in the read mode on the rising edge of the read from port pulse.
During the resetting of the interrupt itself any changes on the I/Os may not generate an interrupt. After the interrupt is reset any change in I/Os will be detected and transmitted
INT.
as an
The first data byte in every pair refers to Port 0 (P07 to P00), whereas the second data byte in every pair refers to Port 1 (P17 to P10), see Fig.11.
handbook, full pagewidth
07 06 05 04 03 02 01 00
P07 P06 P05 P04 P03 P02 P01 P00
First Byte
Second Byte
A
16 15 14 13 12 11 10
P17 P16 P15 P14 P13 P12 P11 P10
A
MGL545
Fig.11 Correlation between bits and ports.
1999 Apr 07 11
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus
handbook, full pagewidth
MICROCOMPUTER
INT
V
DD
PCF8575
(1)
INT INT
PCF8575
(2)
PCF8575
PCF8575
(8)
INT
MGL544
Fig.12 Application of multiple PCF8575s with interrupt.
1999 Apr 07 12
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus
PCF8575

8 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
SYMBOL PARAMETER MIN. MAX. UNIT
V
DD
I
DD
I
SS
V
I
I
I
I
O
P
P
O
T
stg
T
amb
supply voltage 0.5 +6.5 V supply current −±100 mA supply current −±100 mA input voltage VSS− 0.5 VDD+ 0.5 V DC input current −±20 mA DC output current −±25 mA total power dissipation 400 mW power dissipation per output 100 mW storage temperature 65 +150 °C operating ambient temperature 40 +85 °C
Note
1. Stress above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. This is a stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

9 HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under
“Handling MOS Devices”
.

10 CHARACTERISTICS

= 2.5 to 5.5 V; VSS=0V; T
V
DD
= 40 to +85 °C; unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
DD
I
DD
supply voltage 2.5 5.5 V supply current operating mode; no load;
100 200 µA VI=VDD or VSS; f
= 400 kHz
SCL
I
DD(stb)
V
POR
V
IL1
standby current standby mode; no load;
VI=VDD or V
SS
power-on reset voltage note 1 1.2 1.8 V LOW-level input voltage pins A0,
2.5 10 µA
0.0 0.2V
DD
V
A1 and A2
V
IL2
LOW-level input voltage on all other
0.0 0.3V
DD
V
signal pins
V
IH
I
HIGH-level input voltage 0.7V leakage current at pins A0,
VI=VDD or V
SS
1 +1 µA
DD
V
DD
V
A1 and A2
1999 Apr 07 13
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus
PCF8575
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
leakage current on all other signal
VI=VDD or V
SS
10 +10 µA
pins
Input SCL; input/output SDA
I
OL
C
I
LOW-level output current VOL= 0.4 V; note 3 3 −−mA input capacitance VI=VSS; note 2 −−7pF
I/Os; P00 to P07 and P10 to P17
I
OL
I
OH
I
OHt
C
I
C
O
Port timing; C
t
pv
t
su
t
h
Interrupt
I
OL
LOW-level output current VOL= 1 V; note 3 10 25 mA HIGH-level output current VOH=V
SS
30 −−300 µA
transient pull-up current VOH=VSS; see Fig.9 0.5 1.0 mA input capacitance note 2 −−10 pF output capacitance note 2 −−10 pF
100 pF (see Figs 9 and 10)
L
output data valid −−4µs input data set-up time 0 −−µs input data hold time 4 −−µs
INT (see Fig.13)
LOW-level output current VOL= 0.4 V 1.6 −−mA TIMING;CL≤100 pF (see Figs 9 and 10) t
iv
t
ir
input data valid time −−4µs
reset delay time −−4µs
Notes
1. The power-on reset circuit resets the I2C-bus logic with VDD<V
and sets all I/Os to logic 1 (with current source
POR
to VDD).
2. The value is not tested, but verified on sampling basis.
3. A single LOW-level output current (IOL) must not exceed 20 mA for an extended time. The sum of all I
at any point
OLs
in time must not exceed 100 mA.
1999 Apr 07 14
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus
PCF8575

11 I2C-BUS TIMING CHARACTERISTICS

See Fig.13 and note 1.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
f
SCL
t
SW
t
BUF
SCL clock frequency 400 kHz tolerable spike width on bus note 2 50 ns BUS free time between a STOP
1.3 −µs
and START condition
t
SU;STA
t
HD;STA
t
LOW
t
HIGH
t
r
t
f
t
SU;DAT
t
HD;DAT
t
SU;STO
C
b
START condition set-up time 0.6 −µs START condition hold time 0.6 −µs SCL LOW time 1.3 −µs SCL HIGH time 0.6 −µs SCL and SDA rise time note 3 20 + 0.1C SCL and SDA fall time note 3 20 + 0.1C
300 ns
b
300 ns
b
data set-up time 100 ns data hold time 0 ns STOP condition set-up time 0.6 −µs capacitive load represented by
400 pF
each bus line
Notes
1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to V
IL
and VIH with an input voltage swing of VSS to VDD.
2. The device inputs SDA and SCL are filtered and will reject spikes on the bus lines of widths less than t
SW(max)
.
3. The rise and fall times specified here refer to the driver device (PCF8575) and are part of the general fast I2C-bus specification when PCF8575 asserts an acknowledge on SDA, the minimum fall time is 20 ns + 0.1Cb.
handbook, full pagewidth
PROTOCOL
SCL
SDA
CONDITION
t
SU;STA
t
BUF
START
(S)
BIT 7
MSB
(A7)
t
LOWtHIGH
t
r
BIT 6
(A6)
SCL
t
f
BIT 0
LSB
(R/W)
ACKNOWLEDGE
(A)
STOP
CONDITION
(P)
t
HD;STA
t
SU;DAT
Fig.13 I2C-bus timing diagram.
1999 Apr 07 15
t
HD;DAT
t
SU;STO
MGL546
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus

12 DEVICE PROTECTION

handbook, full pagewidth
V
INT
A1
A2 P00 P01 P02 P03 P04 P05 P06 P07
SS
1 2 3 4 5 6 7 8 9 10 11 12
PCF8575
V
DD
V
DD
SDA
SCL
A0
P17
P16
P15
P14
P13
P12
P11
P10
substrate V
SS
MGR789
Fig.14 Device protection diagram.
1999 Apr 07 16
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus

13 PACKAGE OUTLINE

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
D
c
y
Z
24 13
PCF8575

SOT340-1

E
H
E
A
X
v M
A
pin 1 index
112
w M
b
e
DIMENSIONS (mm are the original dimensions)
mm
A
max.
2.0
0.21
0.05
1.80
1.65
0.25
b
3
p
0.38
0.25
UNIT A1A2A
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
p
cD
0.20
8.4
0.09
8.0
0 2.5 5 mm
scale
(1)E(1) (1)
eHELLpQZywv θ
5.4
0.65 1.25
5.2
7.9
7.6
Q
A
2
A
1
detail X
1.03
0.9
0.63
0.7
(A )
L
p
L
A
3
θ
0.13 0.10.2
0.8
0.4
o
8
o
0
OUTLINE VERSION
SOT340-1 MO-150AG
IEC JEDEC EIAJ
REFERENCES
1999 Apr 07 17
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08 95-02-04
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus

14 SOLDERING

14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in
“Data Handbook IC26; Integrated Circuit Packages”
our (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
PCF8575
Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
If wave soldering is used the following conditions must be observed for optimal results:
1999 Apr 07 18
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus
PCF8575
14.5 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD
PACKAGE
WAVE REFLOW
HLQFP, HSQFP, HSOP, SMS not suitable
(3)
PLCC
, SO suitable suitable
(2)
LQFP, QFP, TQFP not recommended
(3)(4)
suitable
suitable
(1)
SQFP not suitable suitable SSOP, TSSOP, VSO not recommended
(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Apr 07 19
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus

15 DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

16 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
PCF8575
17 PURCHASE OF PHILIPS I
Purchase of Philips I components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C components conveys a license under the Philips’ I2C patent to use the
1999 Apr 07 20
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus
NOTES
PCF8575
1999 Apr 07 21
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus
NOTES
PCF8575
1999 Apr 07 22
Philips Semiconductors Product specification
Remote 16-bit I/O expander for I2C-bus
NOTES
PCF8575
1999 Apr 07 23
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© Philips Electronics N.V. 1999 SCA63 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Printed in The Netherlands 465006/00/03/pp24 Date of release: 1999 Apr 07 Document order number: 9397 750 05528
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