NXP PCF 8575 T Datasheet

INTEGRATED CIRCUITS

DATA SH EET

PCF8575

Remote 16-bit I/O expander for

2

I

C-bus

Product specification
Supersedes data of 1999 Feb 25
File under Integrated Circuits, IC12

1999 Apr 07

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

CONTENTS

1 FEATURES
2 GENERAL DESCRIPTION
3 ORDERING INFORMATION
4 BLOCK DIAGRAM
5 PINNING
6 CHARACTERISTICS OF THE I2C-BUS

6.1 Bit transfer

6.2 START and STOP conditions

6.3 System configuration

6.4 Acknowledge
7 FUNCTIONAL DESCRIPTION

7.1 Quasi-bidirectional I/Os

7.2 Addressing

7.3 Reading from a port (input mode)

7.4 Writing to the port (output mode)

7.5 Interrupt
8 LIMITING VALUES
9 HANDLING
10 CHARACTERISTICS
11 I2C-BUS TIMING CHARACTERISTICS
12 DEVICE PROTECTION
13 PACKAGE OUTLINE
14 SOLDERING

14.1 Introduction to soldering surface mount
packages

14.2 Reflow soldering

14.3 Wave soldering

14.4 Manual soldering

14.5 Suitability of surface mount IC packages for
wave and reflow soldering methods

15 DEFINITIONS
16 LIFE SUPPORT APPLICATIONS
17 PURCHASE OF PHILIPS I2C COMPONENTS

PCF8575

1999 Apr 07 2

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

1 FEATURES

• Operating supply voltage 2.5 to 5.5 V

• Low standby current consumption of 10 µA maximum

• I2C-bus to parallel port expander

• 400 kbits/s FAST I2C-bus

• Open-drain interrupt output

• 16-bit remote I/O port for the I2C-bus

• Compatible with most microcontrollers

• Latched outputs with high current drive capability for

directly driving LEDs

• Address by 3 hardware address pins for use of up to

8 devices

• SSOP24 package.

2 GENERAL DESCRIPTION

The PCF8575 is a silicon CMOS circuit. It provides general
purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I

2

C-bus).

PCF8575

The device consists of a 16-bit quasi-bidirectional port and

2

an I

C-bus interface. The PCF8575 has a low current
consumption and includes latched outputs with high
current drive capability for directly driving LEDs. It also
possesses an interrupt line (INT) which can be connected
to the interrupt logic of the microcontroller. By sending an
interrupt signal on this line, the remote I/O can inform the
microcontroller if there is incoming data on its ports without
having to communicate via the I2C-bus. This means that
the PCF8575 is an I2C-bus slave transmitter/receiver.

Every data transmission from the PCF8575 must consist
of an even number of bytes, the first byte will be referred
to as P07 to P00 and the second byte as P17 to P10.
The third will be referred to as P07 to P00 and so on.

3 ORDERING INFORMATION

TYPE

NUMBER

PCF8575TS SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1

NAME DESCRIPTION VERSION

PACKAGE

1999 Apr 07 3

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

4 BLOCK DIAGRAM

handbook, full pagewidth

INT

A0
A1
A2

SCL

SDA

1

21
2
3

22
23

INPUT

FILTER

INTERRUPT

LOGIC

I2C-BUS

CONTROL

PCF8575

SHIFT

REGISTER

LP FILTER

16 BITS

I/O

PORT

PCF8575

P00 to P07

4 to 11

P10 to P17

13 to 20

WRITE pulse

DD
SS

24
12

POWER-ON

RESET

V
V

READ pulse

MGL537

Fig.1 Block diagram.

1999 Apr 07 4

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

5 PINNING

SYMBOL PIN DESCRIPTION

INT 1 interrupt output (active LOW)
A1 2 address input 1
A2 3 address input 2
P00 4 quasi-bidirectional I/O 00
P01 5 quasi-bidirectional I/O 01
P02 6 quasi-bidirectional I/O 02
P03 7 quasi-bidirectional I/O 03
P04 8 quasi-bidirectional I/O 04
P05 9 quasi-bidirectional I/O 05
P06 10 quasi-bidirectional I/O 06
P07 11 quasi-bidirectional I/O 07
V

SS

P10 13 quasi-bidirectional I/O 10
P11 14 quasi-bidirectional I/O 11
P12 15 quasi-bidirectional I/O 12
P13 16 quasi-bidirectional I/O 13
P14 17 quasi-bidirectional I/O 14
P15 18 quasi-bidirectional I/O 15
P16 19 quasi-bidirectional I/O 16
P17 20 quasi-bidirectional I/O 17
A0 21 address input 0
SCL 22 serial clock line input
SDA 23 serial data line input/output
V

DD

12 supply ground

24 supply voltage

handbook, halfpage

INT

A1

A2
P00
P01
P02

1
2
3
4
5
6

24
23
22
21
20
19

PCF8575

P03
P04
P05
P06
P07

V

SS

7
8

9
10
11
12

18
17
16
15
14
13

MGL538

Fig.2 Pin configuration.

PCF8575

V

DD

SDA
SCL
A0
P17
P16
P15
P14
P13
P12
P11
P10

1999 Apr 07 5

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

6 CHARACTERISTICS OF THE I2C-BUS

The I2C-bus is for bidirectional, 2-line communication
between different ICs or modules. The two lines are a
serial data line (SDA) and a serial clock line (SCL). Both
lines must be connected to a positive supply via a pull-up
resistor when connected to the output stages of a device.
Data transfer may be initiated only when the bus is not
busy.

6.1 Bit transfer

One data bit is transferred during each clock pulse.
The data on the SDA line must remain stable during the
HIGH period of the clock pulse as changes in the data line
at this time will be interpreted as control signals
(see Fig.3).

6.2 START and STOP conditions

Both data and clock lines remain HIGH when the bus is not
busy. A HIGH-to-LOW transition of the data line, while the
clock is HIGH is defined as the START condition (S).

A LOW-to-HIGH transition of the data line while the clock
is HIGH is defined as the STOP condition P (see Fig.4).

PCF8575

6.4 Acknowledge

The number of data bytes transferred between the START
and the STOP conditions from transmitter to receiver is not
limited. Each byte of eight bits is followed by one
acknowledge bit. The transmitter must release the SDA
line before the receiver can send an acknowledge bit.

A slave receiver which is addressed must generate an
acknowledge after the reception of each byte. Also a
master must generate an acknowledge after the reception
of each byte that has been clocked out of the slave
transmitter. The device that acknowledges has to pull
down the SDA line during the acknowledge clock pulse, so
that the SDA line is stable LOW during the HIGH period of
the acknowledge related clock pulse, set-up and hold
times must be taken into account.

A master receiver must signal an end of data to the
transmitter by not generating an acknowledge after the
last byte that has been clocked out of the slave. This is
done by the master receiver by holding the SDA line HIGH.
In this event the transmitter must release the data line to
enable the master to generate a STOP condition.

6.3 System configuration

A device generating a message is a ‘transmitter’, a device
receiving the message is the ‘receiver’. The device that
controls the message is the ‘master’ and the devices which
are controlled by the master are the ‘slaves’ (see Fig.5).

handbook, full pagewidth

SDA

SCL

data line

stable;

data valid

Fig.3 Bit transfer.

change
of data
allowed

MBC621

1999 Apr 07 6

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

handbook, full pagewidth

SDA

SCL

S

START condition

Fig.4 Definition of START and STOP conditions.

SDA
SCL

P

STOP condition

PCF8575

SDA

SCL

MBC622

handbook, full pagewidth

MASTER

TRANSMITTER /

RECEIVER

DATA OUTPUT

BY TRANSMITTER

DATA OUTPUT

BY RECEIVER

SCL FROM

MASTER

RECEIVER

S

START

condition

SLAVE

SLAVE

TRANSMITTER /

RECEIVER

Fig.5 System configuration.

MASTER

TRANSMITTER

not acknowledge

acknowledge

MASTER

TRANSMITTER /

RECEIVER

9821

clock pulse for

acknowledgement

MGL539

MBA605

Fig.6 Acknowledgment on the I2C-bus.

1999 Apr 07 7

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

PCF8575

7 FUNCTIONAL DESCRIPTION

7.1 Quasi-bidirectional I/Os

The PCF8575’s 16 ports (see Fig.7) are entirely independent and can be used either as input or output ports. Input data
is transferred from the ports to the microcontroller in the READ mode (see Fig.10). Output data is transmitted to the ports
in the WRITE mode (see Fig.9).

This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction.
At power-on the I/Os are HIGH. In this mode only a current source (I
VDD (I

) allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH,

OHt

) to VDD is active. An additional strong pull-up to

OH

and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs. After power-on
as all the I/Os are set HIGH all of them can be used as input. Any change in setting of the I/Os as either inputs or outputs
can be done with the write mode. Warning: If a HIGH is applied to an I/O which has been written earlier to LOW, a large
current (IOL) will flow to VSS. (see Characteristics note 3).

MGL540

V

DD

P00 to P07
P10 to 17

V

SS

to interrupt
logic

book, full pagewidth

write pulse

data from
shift register

power-on
reset

read pulse

data to
shift register

DQ

FF

C

I

S

D

FF

C

I

I

OH

100

I

OHt

Q

S

µA

I

OL

Fig.7 Simplified schematic diagram of each I/O.

7.2 Addressing

Figures 8, 9 and 10 show the address and timing diagrams. Before any data is transmitted or received the master must
send the address of the receiver via the SDA line. The first byte transmitted after the START condition carries the address
of the slave device and the read/write bit. The address of the slave device must not be changed between the START and
the STOP conditions. The PCF8575 acts as a slave receiver or a slave transmitter.

handbook, halfpage

S 0 1 0 0 A2 A1 A0 R/W A

slave address

MGL541

Fig.8 Byte containing the slave address and the R/W bits.

1999 Apr 07 8

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in

white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...

1999 Apr 07 9

SCL

12345678

handbook, full pagewidth

Integral multiples of two bytes

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I

WRITE TO

PORT

DATA OUTPUT

FROM PORT

P05 OUTPUT

VOLTAGE

P05 PULL-UP

OUTPUT CURRENT

INT

slave address (PCF8575)

S 0 1 0 0 A2 A1 A0 0 A P07 P06 P00 P17 P101

start condition

R/W

acknowledge
from slave

data to port 0 data to port 1

A ASDA

P05

acknowledge
from slave

I

OHt

t

pv

t

ir

acknowledge
from slave

Data A0 and

B0 valid

I

OH

MGL542

2

C-bus

PCF8575

Fig.9 WRITE mode (output).

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

d

_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in

white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...

1999 Apr 07 10

SCL

SDA

S 0 1 0 0 A2 A1 A0 1 A P07 P06 P05 P04

P03 P02 P01 P00 P17 P10

A A P07 P00 A P17 P10 1P

book, full pagewidth

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I

READ FROM PORT

DATA INTO PORT

INT

t

iv

R/W acknowledge

from slave

t

h

t

ir

t

su

acknowledge
from receiver

t

ir

acknowledge
from receiver

P07 to P00 P17 to P10P07 to P00 P17 to P10 P07 to P00 P17 to P10

acknowledge
from receiver

MGL543

non acknowledge
from receiver

A LOW-to-HIGH transition of SDA, while SCL is HIGH is defined as the STOP condition (P). Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present
at the latest acknowledge phase is valid (output mode). Input data is lost.

Fig.10 READ mode (input).

2

C-bus

PCF8575

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

7.3 Reading from a port (input mode)

All ports programmed as input should be set to logic 1.
To read, the master (microcontroller) first addresses the
slave device after it receives the interrupt. By setting the
last bit of the byte containing the slave address to logic 1
the read mode is entered. The data bytes that follow on the
SDA are the values on the ports.

If the data on the input port changes faster than the master
can read, this data may be lost.

7.4 Writing to the port (output mode)

To write, the master (microcontroller) first addresses the
slave device. By setting the last bit of the byte containing
the slave address to logic 0 the write mode is entered.
The PCF8575 acknowledges and the master sends the
first data byte for P07 to P00. After the first data byte is
acknowledged by the PCF8575, the second data byte
P17 to P10 is sent by the master. Once again the
PCF8575 acknowledges the receipt of the data after which
this 16-bit data is presented on the port lines.

The number of data bytes that can be sent successively is
not limited. After every two bytes the previous data is
overwritten.

PCF8575

7.5 Interrupt

The PCF8575 provides an open-drain interrupt (INT)
which can be fed to a corresponding input of the
microcontroller (see Figs 9, 10 and 12). This gives these
chips a kind of a master function which can initiate an
action elsewhere in the system.

An interrupt is generated by any rising or falling edge of the
port inputs. After time tiv the signal INT is valid.

The interrupt disappears when data on the port is changed
to the original setting or data is read from or written to the
device which has generated the interrupt.

In the write mode the interrupt may become deactivated
(HIGH) on the rising edge of the write to port pulse. On the
falling edge of the write to port pulse the interrupt is
definitely deactivated (HIGH).

The interrupt is reset in the read mode on the rising edge
of the read from port pulse.

During the resetting of the interrupt itself any changes on
the I/Os may not generate an interrupt. After the interrupt
is reset any change in I/Os will be detected and transmitted

INT.

as an

The first data byte in every pair refers to Port 0
(P07 to P00), whereas the second data byte in every pair
refers to Port 1 (P17 to P10), see Fig.11.

handbook, full pagewidth

07 06 05 04 03 02 01 00

P07 P06 P05 P04 P03 P02 P01 P00

First Byte

Second Byte

17

A

16 15 14 13 12 11 10

P17 P16 P15 P14 P13 P12 P11 P10

A

MGL545

Fig.11 Correlation between bits and ports.

1999 Apr 07 11

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

handbook, full pagewidth

MICROCOMPUTER

INT

V

DD

PCF8575

(1)

INT INT

PCF8575

(2)

PCF8575

PCF8575

(8)

INT

MGL544

Fig.12 Application of multiple PCF8575s with interrupt.

1999 Apr 07 12

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

PCF8575

8 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); note 1.

SYMBOL PARAMETER MIN. MAX. UNIT

V

DD

I

DD

I

SS

V

I

I

I

I

O

P

tot

P

O

T

stg

T

amb

supply voltage −0.5 +6.5 V
supply current −±100 mA
supply current −±100 mA
input voltage VSS− 0.5 VDD+ 0.5 V
DC input current −±20 mA
DC output current −±25 mA
total power dissipation − 400 mW
power dissipation per output − 100 mW
storage temperature −65 +150 °C
operating ambient temperature −40 +85 °C

Note

1. Stress above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. This is
a stress ratings only and functional operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.

9 HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under

“Handling MOS Devices”

.

10 CHARACTERISTICS

= 2.5 to 5.5 V; VSS=0V; T

V

DD

= −40 to +85 °C; unless otherwise specified.

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

DD

I

DD

supply voltage 2.5 − 5.5 V
supply current operating mode; no load;

− 100 200 µA
VI=VDD or VSS;
f

= 400 kHz

SCL

I

DD(stb)

V

POR

V

IL1

standby current standby mode; no load;

VI=VDD or V

SS

power-on reset voltage note 1 − 1.2 1.8 V
LOW-level input voltage pins A0,

− 2.5 10 µA

0.0 − 0.2V

DD

V

A1 and A2

V

IL2

LOW-level input voltage on all other

0.0 − 0.3V

DD

V

signal pins

V

IH

I

L1

HIGH-level input voltage 0.7V
leakage current at pins A0,

VI=VDD or V

SS

−1 − +1 µA

DD

− V

DD

V

A1 and A2

1999 Apr 07 13

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

PCF8575

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

L2

leakage current on all other signal

VI=VDD or V

SS

−10 − +10 µA

pins

Input SCL; input/output SDA

I

OL

C

I

LOW-level output current VOL= 0.4 V; note 3 3 −−mA
input capacitance VI=VSS; note 2 −−7pF

I/Os; P00 to P07 and P10 to P17

I

OL

I

OH

I

OHt

C

I

C

O

Port timing; C

t

pv

t

su

t

h

Interrupt

I

OL

LOW-level output current VOL= 1 V; note 3 10 25 − mA
HIGH-level output current VOH=V

SS

−30 −−300 µA

transient pull-up current VOH=VSS; see Fig.9 −0.5 −1.0 − mA
input capacitance note 2 −−10 pF
output capacitance note 2 −−10 pF

≤ 100 pF (see Figs 9 and 10)

L

output data valid −−4µs
input data set-up time 0 −−µs
input data hold time 4 −−µs

INT (see Fig.13)

LOW-level output current VOL= 0.4 V 1.6 −−mA
TIMING;CL≤100 pF (see Figs 9 and 10)
t

iv

t

ir

input data valid time −−4µs

reset delay time −−4µs

Notes

1. The power-on reset circuit resets the I2C-bus logic with VDD<V

and sets all I/Os to logic 1 (with current source

POR

to VDD).

2. The value is not tested, but verified on sampling basis.

3. A single LOW-level output current (IOL) must not exceed 20 mA for an extended time. The sum of all I

at any point

OLs

in time must not exceed 100 mA.

1999 Apr 07 14

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

PCF8575

11 I2C-BUS TIMING CHARACTERISTICS

See Fig.13 and note 1.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

f

SCL

t

SW

t

BUF

SCL clock frequency − 400 kHz
tolerable spike width on bus note 2 − 50 ns
BUS free time between a STOP

1.3 −µs

and START condition

t

SU;STA

t

HD;STA

t

LOW

t

HIGH

t

r

t

f

t

SU;DAT

t

HD;DAT

t

SU;STO

C

b

START condition set-up time 0.6 −µs
START condition hold time 0.6 −µs
SCL LOW time 1.3 −µs
SCL HIGH time 0.6 −µs
SCL and SDA rise time note 3 20 + 0.1C
SCL and SDA fall time note 3 20 + 0.1C

300 ns

b

300 ns

b

data set-up time 100 − ns
data hold time 0 − ns
STOP condition set-up time 0.6 −µs
capacitive load represented by

− 400 pF

each bus line

Notes

1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to V

IL

and VIH with an input voltage swing of VSS to VDD.

2. The device inputs SDA and SCL are filtered and will reject spikes on the bus lines of widths less than t

SW(max)

.

3. The rise and fall times specified here refer to the driver device (PCF8575) and are part of the general fast I2C-bus
specification when PCF8575 asserts an acknowledge on SDA, the minimum fall time is 20 ns + 0.1Cb.

handbook, full pagewidth

PROTOCOL

SCL

SDA

CONDITION

t

SU;STA

t

BUF

START

(S)

BIT 7

MSB

(A7)

t

LOWtHIGH

t

r

BIT 6

(A6)

1/f

SCL

t

f

BIT 0

LSB

(R/W)

ACKNOWLEDGE

(A)

STOP

CONDITION

(P)

t

HD;STA

t

SU;DAT

Fig.13 I2C-bus timing diagram.

1999 Apr 07 15

t

HD;DAT

t

SU;STO

MGL546

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

12 DEVICE PROTECTION

handbook, full pagewidth

V

INT

A1

A2
P00
P01
P02
P03
P04
P05
P06
P07

SS

1
2
3
4
5
6
7
8
9
10
11
12

PCF8575

V

DD

24

V

DD

23

SDA

22

SCL

21

A0

20

P17

19

P16

18

P15

17

P14

16

P13

15

P12

14

P11

13

P10

substrate V

SS

MGR789

Fig.14 Device protection diagram.

1999 Apr 07 16

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

13 PACKAGE OUTLINE

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

D

c

y

Z

24 13

PCF8575

SOT340-1

E

H

E

A

X

v M

A

pin 1 index

112

w M

b

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

2.0

0.21

0.05

1.80

1.65

0.25

b

3

p

0.38

0.25

UNIT A1A2A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

p

cD

0.20

8.4

0.09

8.0

0 2.5 5 mm

scale

(1)E(1) (1)

eHELLpQZywv θ

5.4

0.65 1.25

5.2

7.9

7.6

Q

A

2

A

1

detail X

1.03

0.9

0.63

0.7

(A )

L

p

L

A

3

θ

0.13 0.10.2

0.8

0.4

o

8

o

0

OUTLINE
VERSION

SOT340-1 MO-150AG

IEC JEDEC EIAJ

REFERENCES

1999 Apr 07 17

EUROPEAN

PROJECTION

ISSUE DATE

93-09-08
95-02-04

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

14 SOLDERING

14.1 Introduction to soldering surface mount
packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“Data Handbook IC26; Integrated Circuit Packages”

our
(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

14.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

14.3 Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

PCF8575

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

14.4 Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

If wave soldering is used the following conditions must be
observed for optimal results:

1999 Apr 07 18

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

PCF8575

14.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD

PACKAGE

WAVE REFLOW

HLQFP, HSQFP, HSOP, SMS not suitable

(3)

PLCC

, SO suitable suitable

(2)

LQFP, QFP, TQFP not recommended

(3)(4)

suitable

suitable

(1)

SQFP not suitable suitable
SSOP, TSSOP, VSO not recommended

(5)

suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

1999 Apr 07 19

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

15 DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

16 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PCF8575

17 PURCHASE OF PHILIPS I

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C COMPONENTS

2

C components conveys a license under the Philips’ I2C patent to use the

1999 Apr 07 20

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

NOTES

PCF8575

1999 Apr 07 21

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

NOTES

PCF8575

1999 Apr 07 22

Philips Semiconductors Product specification

Remote 16-bit I/O expander for I2C-bus

NOTES

PCF8575

1999 Apr 07 23

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1999 SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 465006/00/03/pp24 Date of release: 1999 Apr 07 Document order number: 9397 750 05528