NXP PCA 82C251 T Datasheet

PCA82C251

CAN transceiver for 24 V systems

Rev. 04 — 25 August 2011 Product data sheet

1. General description

The PCA82C251 is the interface between a CAN protocol controller and the physical b us. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller.

2. Features and benefits

 Fully compatible with the “ISO 11898-24 V” standard  Slope control to reduce Radio Frequency Interference (RFI)  Thermally protected  Short-circuit proof to battery and ground in 24 V powered systems  Low-current Standby mode  An unpowered node does not disturb the bus lines  At least 110 nodes can be connected  High speed (up to 1 MBd)  High immunity against electromagnetic interference.

3. Applications

 High-speed applications (up to 1 MBd) in trucks and busses.

4. Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Max Unit

1/t

bit

CAN

diff

amb

supply voltage 4.5 5.5 V supply current Standby mode - 275 A maximum transmission speed non-return-to-zero 1 - MBd CANH, CANL input/output voltage 36 +36 V differential bus voltage 1.5 3.0 V propagation delay High-speed mode - 50 ns ambient temperature 40 +125 C

NXP Semiconductors

mbg613

SLOPE/

STANDBY

RECEIVER

REFERENCE

VOLT AGE

DRIVER

PROTECTION

CANH CANL

GND

ref

RXD

TXD

PCA82C251

TXD

GND

CANH

CANL

RXD V

ref

mbg612

1 2 3 4

6 5

8 7

5. Ordering information

PCA82C251

CAN transceiver for 24 V systems

Table 2. Ordering information

Type number Package

Name Description Version

PCA82C251T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

6. Block diagram

7. Pinning information

Product data sheet Rev. 04 — 25 August 2011 2 of 17

7.1 Pinning

Fig 1. Block diagram

Fig 2. Pin configuration

NXP Semiconductors

7.2 Pin description

Table 3. Pin description

Symbol Pin Description

TXD 1 transmit data input GND 2 ground V

RXD 4 receive data output V

ref

CANL 6 LOW-level CAN voltage input/output CANH 7 HIGH-level CAN voltage input/output Rs 8 slope resistor input

8. Functional description

The PCA82C251 is the interface between a CAN protocol controller and the physical b us. It is primarily intended for applications up to 1 MBd in trucks and buses. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. It is fully compatible with the “ISO 11898-24 V” standard.

PCA82C251

CAN transceiver for 24 V systems

3 supply voltage

5 reference voltage output

A current-limiting circuit protects the transmitter output stage against short-circuits to positive and negative battery voltage. Although power dissipation will increase as a result of a short circuit fault condition, this feature will prevent destruction of the transmitter output stage.

If the junction temperature exceeds approximately 160 C, the limiting current of both transmitter outputs is decreased. Because the transmitter is responsible for most of the power dissipated, this will result in reduced power dissipation and hence a lower chip temperature. All other parts of the IC will remain operational. The thermal protection is needed, in particular, when a bus line is short-circuited.

The CANH and CANL lines are also protected against electrical transients which may occur in an automotive environment.

Pin 8 (Rs) allows three different modes of operation to be selected: High-speed, Slope control and Standby.

For high-speed operation, the transmitter output transistors are simply switched on and off as fast as possible. In this mode, no measures are taken to limit the rise and fall slopes. A shielded cable is recommended to avoid RFI problems. High-speed mode is selected by connecting pin 8 to ground.

Slope control mode allows the use of an unshielded twisted pair or a p arallel pair of wires as bus lines. To reduce RFI, the rise and fall slopes should be limited. The rise and fall slopes can be programmed with a resistor connected from pin 8 to ground. The slope is proportional to the current output at pin 8.

If a HIGH level is applied to pin 8, the circuit enters a low-current Standby mode. In this mode, the transmitter is switched off and the recei ver is switched to a low current. If dominant bits are detected (differential bus voltage >0.9 V), RXD will be switched to a

Product data sheet Rev. 04 — 25 August 2011 3 of 17

NXP Semiconductors

LOW level. The microcontroller should react to this condition by switching the transceiver back to normal operation (via pin 8). Because the receiver is slo wer in Standby mode, the first message will be lost at higher bit rates.

Table 4. Truth table of the CAN transceiver

Supply TXD CANH CANL Bus state RXD

4.5 V to 5.5 V 0 HIGH LOW dominant 0

4.5 V to 5.5 V 1 (or floating) floating floating recessive 1

4.5 V < VCC<5.5V X

0V<VCC< 4.5 V floating floating floating floating X

[1] If another bus node is transmitting a dominant bit, then RXD is logic 0. [2] X = don’t care.

Table 5. Pin Rs su mmary

Condition forced at pin Rs Mode Resulting voltage or current at pin Rs

10 A<I VRs<0.3V

>0.75V

CAN transceiver for 24 V systems

[2]

<200A Slope control 0.4VCC<VRs<0.6V

floating if

>0.75V

floating if

> 0.75V

Standby IRs<10A

High-speed IRs< 500 A

PCA82C251

[1]

floating X

[1]

[2]

9. Limiting values

amb

0V<V 0V<V

. The rating for Tvj limits the allowable combinations of power dissipation (Pd) and ambient

< 5.5 V; no time limit

[1]

36 +36 V

[2]

36 +36 V

[3]

40 +150 C

[4]

2500 +2500 V

[5]

250 +250 V

vj=Tamb+Pd

 R

th(vj-a)

, where R

th(j-a)

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to pin 2; positive input current.

Symbol Parameter Conditions Min Max Unit

trt

stg

amb

ESD

[1] TXD is LOW. Short-circuit protection provided for slew rates up to 5 V/s for voltages above +30 V. [2] Short-circuit applied when TXD is HIGH, followed by TXD switched to LOW. [3] In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is: T

[4] Classification A: human body model; C = 100 pF; R = 1500 ; V = 2000 V. [5] Classification B: machine model; C = 200 pF; R = 25 ; V = 200 V.

supply voltage 0.3 +7.0 V DC voltage at pins 1, 4, 5 and 8 0.3 VCC+0.3 V DC voltage at pin 6 (CANL) 0 V < VCC< 5.5 V; TXD HIGH or floating 36 +36 V

DC voltage at pins 7 (CANH) 0V < VCC< 5.5 V; no time limit 36 +36 V transient voltage at pins 6 and 7 see Figure 8 200 +200 V storage temperature 55 +150 C ambient temperature 40 +125 C virtual junction temperature electrostatic discharge voltage

fixed value to be used for the calculation of T temperature (T

is a

Product data sheet Rev. 04 — 25 August 2011 4 of 17

NXP Semiconductors

10. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Typ Unit

th(j-a)

thermal resistance from junction to ambient in free air 160 K/W

11. Characteristics

PCA82C251

CAN transceiver for 24 V systems

Table 8. Characteristics

VCC= 4.5 V to 5.5 V; T

=40C to +125C; RL=60; I8>10A; unless otherwise specified; all voltages referenced to

amb

ground (pin 2) ; positive input current; all parameters are guaranteed over the ambient temperature range by design, but onl y



100 % tested at +25

Symbol Parameter Conditions Min Typ Max Unit

Supply

supply current dominant; V1=1V; VCC=5.1V - - 78 mA

dominant; V dominant; V recessive; V Standby

=1V; VCC=5.25V - - 80 mA

=1V; VCC=5.5V - - 85 mA

=4V; R8=47k --10mA

[1]

- - 275 A

DC bus transmitter

V V I

V I

V V

IH IL

6,7

HIGH-level input voltage output recessive 0.7V LOW-level input voltage output dominant 0.3 - 0.3V HIGH-level input current V1=4V 200 - +30 A LOW-level input current V1=1V  - 600 A recessive bus voltage V1= 4 V; no load 2.0 - 3.0 V off-state output leakage current 2V<(V6, V7)<7V 2-+2 mA

CANH output voltage V1=1V; VCC=4.75V to 5.5V 3.0 - 4.5 V

CANL output voltage V1= 1 V 0.5 - 2.0 V difference between output

6, 7

voltage at pins 6 and 7

sc7

sc6

short-circuit CANH current V7= 5V - - 200 mA

short-circuit CANL current V6= 36 V - - 200 mA

DC bus receiver: V

diff(r)

differential input voltage (recessive)

diff(d)

differential input voltage (dominant)

5V<(V

, V7)<36V 10 - +10 mA

=1V; VCC= 4.5 V to 4.75 V 2.75 4.5

V1= 1 V 1.5 - 3.0 V

=1V; RL=45 1.5 - - V

= 4 V; no load 500 - +50 mV

= 36 V - 100 - mA

= 4 V; pins 6 and 7 externally driven; 2V<(V6,V7) < 7 V; unless otherwise specified

[2]

1.0 - +0.5 V

7V<(V

6,V7

)<12V

[2]

1.0 - +0.4 V

0.9 - 5.0 V

7V<(V

) < 12 V; not Standby

6,V7

1.0 - 5.0 V

-VCC+0.3 V

mode Standby mode 0.97 - 5.0 V Standby mode; VCC= 4.5 V to 5.10 V 0.91 - 5.0 V

Product data sheet Rev. 04 — 25 August 2011 5 of 17

NXP Semiconductors

PCA82C251

CAN transceiver for 24 V systems

Table 8. Characteristics …continued

VCC= 4.5 V to 5.5 V; T ground (pin 2) ; positive input current; all parameters are guaranteed over the ambient temperature range by design, but onl y 100 % tested at +25C.

Symbol Parameter Conditions Min Typ Max Unit

diff(hys)

diff

differential input hysteresis see Figure 5 - 150 - mV HIGH-level output voltage pin 4; I4= 100 A0.8V LOW-level output voltage pin 4; I4= 1 mA 0 - 0.2V

input resistance CANH, CANL 5 - 25 k differential input resistance 20 - 100 k

Reference output

ref

Timing (C

bit

onTXD

offTXD

onRXD

offRXD

onRXD

reference output voltage V8=1V;I5 <50A0.45V

= 100 pF; see Figure 3, Figure 4, Figure 6 and Figure 7)

minimum bit time R delay TXD to bus active R delay TXD to bus inactive R delay TXD to receiver active R delay TXD to receiver inactive R

delay TXD to receiver active R SR CANH, CANL slew rate R t

WAKE

wake-up time from Standby

(via pin 8) t

dRXDL

bus dominant to RXD LOW V8= 4 V; see Figure 7 --3 s

Standby/Slope control (pin 8)

stb

slope

input voltage for Standby mode 0.75VCC-- V

Slope control mode current 10 - 200 A

Slope control mode voltage 0.4V

=40C to +125C; RL=60; I8>10A; unless otherwise specified; all voltages referenced to

amb

-VCCV

=10mA 0 - 1.5 V

- 0.55V

=4V; I5 <5A0.4V

=0 --1 s

ext

=0 - - 50 ns

ext

=0 -4080ns

ext

=0 - 55 120 ns

ext

=0; T

ext

= 4.5 V to 5.1 V

=0; VCC= 4.5 V to 5.1 V - 80 170 ns

ext

=0; T

ext

=0k - 90 190 ns

ext

=47k - 290 400 ns

ext

=47k - 440 550 ns

ext

=47k -7- V/s

ext

<+85C

amb

<+85C - 90 170 ns

amb

- 80 150 ns

-0.6VCCV

see Figure 6 --20s

-0.6VCCV

[1] I1=I4=I5=0mA; 0V<V6<VCC; 0 V < V7<VCC; V8=VCC; T [2] This is valid for the receiver in all modes: High-speed, Slope control and Standby.

Product data sheet Rev. 04 — 25 August 2011 6 of 17

amb

< 90 C.

NXP Semiconductors

015aaa243

30 pF

100 pF60 Ω

100 nF

+5 V

PCA82C251

RXD

ref

TXD

CANH

CANL

GND

ext

mbg615

onTXD

onRXD

offTXD

offRXD

TXD

diff

RXD

0.9 V

0.3V

0.7V

0.5 V

0 V

mbg616

HIGH

LOW

hysteresis

0.5 0.9

diff

(V)

RXD

Fig 3. Test circuit for dynamic characteristics.

PCA82C251

CAN transceiver for 24 V systems

Fig 4. Timing diagram for dynamic characteristics.

Product data sheet Rev. 04 — 25 August 2011 7 of 17

Fig 5. Hysteresi s.

NXP Semiconductors

mbg617

0 V

WAKE

RXD

mbg618

0 V

1.5 V

dRXDL

diff

RXD

mbg619

ref

RXD

PCA82C251 60 Ω

47 kΩ

500 pF

CANH

CANL

GND Rs

TXD

100 nF

+5 V

500 pF

SCHAFFNER

GENERATOR

Fig 6. Timing diagram for wake-up from Standby.

PCA82C251

CAN transceiver for 24 V systems

=1V.

TXD

VRs=4V; V

TXD

=4V.

Fig 7. Timing diagram for bus domina nt to RXD LO W.

The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b.

Fig 8. Test circuit for automotive transients.

Product data sheet Rev. 04 — 25 August 2011 8 of 17

NXP Semiconductors

mbg620

ref

RXD

CANH CANL

TXD

+5 V

CRX1CRX0 PX,YCTX0

P8xC592

CAN-CONTROLLER

ext

GND

120 Ω 120 Ω

CAN BUS

LINE

100 nF

PCA82C251

CAN-TRANSCEIVER

12. Application information

PCA82C251

CAN transceiver for 24 V systems

(1) The output control register of the P8xC592 should be programmed to 1AH (push-pull operation,

dominant = LOW).

(2) If no slope control is desired: R

ext

=0.

Fig 9. PCA82C251 CAN transceiver application diagram

Product data sheet Rev. 04 — 25 August 2011 9 of 17

NXP Semiconductors

UNIT

max.

A1A2A3b

(1)E(2)

(1)

eHELLpQZywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

1.27

6.2

5.8

1.05

0.7

0.6

0.7

0.3

8 0

o o

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

w M

detail X

v M

(A )

pin 1 index

076E03 MS-012

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15

0.05

0.244

0.228

0.028

0.024

0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

99-12-27 03-02-18

13. Package outline

PCA82C251

CAN transceiver for 24 V systems

Fig 10. Package outline SOT96-1 (SO8)

Product data sheet Rev. 04 — 25 August 2011 10 of 17

NXP Semiconductors

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology . A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.

14.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:

PCA82C251

CAN transceiver for 24 V systems

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are exposed to the wave

• Solder bath specifications, including temperature and impurities

Product data sheet Rev. 04 — 25 August 2011 11 of 17

NXP Semiconductors

14.4 Reflow soldering

Key characteristics in reflow soldering are:

• L ead-free versus SnPb sold ering; note that a lead-fr ee reflow process usually leads to

• Solder paste printing issues including smearing, release, and adjusting the process

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

Table 9. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

< 2.5 235 220  2.5 220 220

PCA82C251

CAN transceiver for 24 V systems

higher minimum peak temperatures (see Figure 11 reducing the process window

window for a mix of large and small components on one board

heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joint s (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with

Table 9

and 10

Volume (mm3) < 350  350

) than a SnPb process, thus

Table 10. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (C)

Volume (mm3) < 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245 > 2.5 250 245 245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.

Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 11

Product data sheet Rev. 04 — 25 August 2011 12 of 17

NXP Semiconductors

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Fig 11. Temperature profiles for large and small components

PCA82C251

CAN transceiver for 24 V systems

MSL: Moisture Sensitivity Level

For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”.

Product data sheet Rev. 04 — 25 August 2011 13 of 17

NXP Semiconductors

PCA82C251

CAN transceiver for 24 V systems

15. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Ch ange notice Supersedes

PCA82C251_4 20110825 Product data sheet - PCA82C251_3 Modifications:

PCA82C251_3 20000113 Product data sheet - PCA82C251_2 PCA82C251_2 19970314 Product data sheet - PCA82C251_1 PCA82C251_1 - Product data sheet - -

• The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• DIP8 package discontinued; bare die no longer available.

• Section 4 “Quick reference data” t

propagation delay added.

• Typing errors corrected in Table 8 and Figure 3.

Product data sheet Rev. 04 — 25 August 2011 14 of 17

NXP Semiconductors

PCA82C251

CAN transceiver for 24 V systems

16. Legal information

16.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) d escribed i n this docu ment may have changed si nce this d ocument was p ublished and may dif fer in case of multiple devices. The latest product statu s

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

16.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be

suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is open for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

, unless otherwise

Product data sheet Rev. 04 — 25 August 2011 15 of 17

NXP Semiconductors

PCA82C251

CAN transceiver for 24 V systems

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

16.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trademarks are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 04 — 25 August 2011 16 of 17

NXP Semiconductors

18. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Functional description . . . . . . . . . . . . . . . . . . . 3

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

10 Thermal characteristics . . . . . . . . . . . . . . . . . . 5

11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

12 Application information. . . . . . . . . . . . . . . . . . . 9

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

14 Soldering of SMD packages . . . . . . . . . . . . . . 11

14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 11

14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 11

14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 11

14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 12

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

17 Contact information. . . . . . . . . . . . . . . . . . . . . 16

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

PCA82C251

CAN transceiver for 24 V systems

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 August 2011

Document identifier: PCA82C251

NXP PCA 82C251 T Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features and benefits

3. Applications

4. Quick reference data

5. Ordering information

6. Block diagram

7. Pinning information

7.1 Pinning

7.2 Pin description

8. Functional description

9. Limiting values

10. Thermal characteristics

11. Characteristics

12. Application information

13. Package outline

14. Soldering of SMD packages

14.1 Introduction to soldering

14.2 Wave and reflow soldering

14.3 Wave soldering

14.4 Reflow soldering

15. Revision history

16. Legal information

16.1 Data sheet status

16.2 Definitions

16.3 Disclaimers

16.4 Trademarks

17. Contact information

18. Contents