ook, halfpage
DISCRETE SEMICONDUCTORS
M3D088
MMBT3904
NPN switching transistor
Product data sheet
Supersedes data of 2002 Oct 04
2004 Feb 03
NXP Semiconductors Product data sheet
NPN switching transistor MMBT3904
FEATURES
• Collector current capability IC = 200 mA
• Collector-emitter voltage V
CEO
= 40 V.
APPLICATIONS
• General switching and amplification.
DESCRIPTION
NPN switching transistor in a SOT23 plastic pack age.
complement: MMBT3906.
PNP
MARKING
T YPE NUMBER MARKING CODE
(1)
MMBT3904 7A∗
Note
1. ∗ = p: Made in Hong Kong.
∗ = t: Made in Malaysia.
∗ = W: Made in China.
QUICK REFERENCE DATA
SYMBOL PARAMETER MAX. UNIT
V
I
CEO
C
collector-emitter voltage 40 V
collector current (DC) 200 mA
PINNING
PIN DESCRIPTION
1 base
2 emitter
3 collector
handbook, halfpage
3
1
21
3
2
Top view
MAM255
Fig.1 Simplified outline (SOT23) and symbol.
ORDERING INFORMATION
PACKAGE
T YPE NUMBER
NAME DESCRIPTION VERSION
MMBT3904 − plastic surface mounted package; 3 leads SOT23
2004 Feb 03 2
NXP Semiconductors Product data sheet
NPN switching transistor MMBT3904
LIMITING VALUES
In accordance with the Absolu te Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
Note
1. Transistor mounted on an FR4 printed-circuit board.
collector-base voltage open emitter − 60 V
collector-emitter voltage open base − 40 V
emitter-base voltage open collector − 6 V
collector current (DC) − 200 mA
peak collector current − 200 mA
peak base current − 100 mA
total power dissipation T
≤ 25 °C; note 1 − 250 mW
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient note 1 500 K/W
Note
1. Transistor mounted on an FR4 printed-circuit board.
2004 Feb 03 3