NXP HUQFN92U User Manual
NXP Semiconductors
HUQFN92U: plastic thermal enhanced ultra thin quad flat package; no leads;
92 terminals; UTLP based; body 7 x 7 x 0.55 mm
Package outline
SOT1066-1
L
D
terminal 1
index area
e
M
B
AC
v
M
Cw
L
1
D2 D3
D6
A12
e
R
B9
A13
e
B10
2
e
1
1/2 e
B18
B A
E
A
A
1
detail X
M
B
AC
b
A24
v
M
Cw
D7
e
A25
B19
y
C
1
C
y
E
h
B1
A1
terminal 1
index area
D5
D1 D4
B36 B28
A48
D
DIMENSIONS (mm are the original dimensions)
mm
UNIT
max
nom
min
A1b D DhE Ehe
A
0.60
0.10
0.35
7.1
0.55
0.50
0.07
0.05
0.30
0.25
7.0
6.9
4.50
4.45
4.40
OUTLINE
VERSION
SOT1066-1
IEC JEDEC JEITA
- - -
h
7.1
4.50
7.0
4.45
6.9
4.40
REFERENCES
- - -
A37
k
0.5
1/2 e
B27
A36
D8
LC
0
e1e2e
5.5
4
- - -
e3e
LC
3
4
4
2.5
scale
5.5
e4e
5 mm
L LC L1kv
R
0.35
0.5
0.35
0.30
0.25
0.30
0.25
0.125
0.075
0.025
EUROPEAN
PROJECTION
X
0.45
0.07w0.05y0.08
0.40
0.35
ISSUE DATE
08-02-13
08-02-25
y
0.1
1
SOT1066-1 © NXP B.V. 2008 . All rights reserved.
PDF 26 February 2008 1 of 1
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