Figure 1 provides a cross-reference to match the revision code to the revision level marked on the device.
Temperature (Tj)
+
Consumer: 0 to + 95 °CD
Industrial: -40 to +105 °CC
Core Frequency $
400 MHz4
500 MHz5
600 MHz6
Package TypeVV
196MAPBGA, 12 x 12 mm, 0.8 mm pitchVJ
196MAPBGA, 10 x 10 mm, 0.65 mm pitchVL
144LQFP, 20 x 20 mm, 0.5 mm pitchAG
100LQFP, 14 x 14 mm, 0.5 mm pitchAF
80LQFP, 12 x 12 mm, 0.5 mm pitch AE
Qualification LevelM
Prototype SamplesP
Mass Production M
SpecialS
Part # seriesXX
i.MX RTRT
Tie%
Standard Feature1
Full Feature2
4MB Flash SIP4
Enhanced Feature5
Far Field AFE (e.g. for Alexa Voice Service)A
Facial RecognitionF
Local Voice ControlL
MIMXX X@%+VV$A
Family
@
First Generation RT family1
Reserved2-8
##
Sub-Family##
RT101x01
RT102x02
RT105x05
RT106x06
Silicon RevA
A0A
A1B
For details on the Arm® configuration used on this chip (including Arm module revisions), please see the
“Platform configuration” section of the “Arm Cortex®-M7 Platform” chapter of the i.MX RT1015 Crossover Processor Reference Manual (IMXRT1015RM).
2NXP Semiconductors
Figure 1. Revision Level to Part Marking Cross-Reference
Chip Errata for the i.MX RT1015, Rev. 2, 01/2021
Table 2 summarizes errata on the i.MX RT1015.
Table 2. Summary of Silicon Errata
ErrataName
ADC
ERR011164
ERR006223
ERR050143
ERR011572
ERR011207
ERR011377
ERR050130 PIT: Temporary incorrect value reported in LMTR64H register in lifetimer modeNo fix scheduled10
ADC: ADC_ETC fails to clear the ADC_ETC request signals automatically after
receiving DMA ack
CCM
CCM: Failure to resume from Wait/Stop mode with power gatingNo fix scheduled
CCM: SoC will enter low power mode before the Arm CPU executes WFI when
improper low power sequence is used
Cortex-M7
Cortex-M7: Write-Trough stores and loads may return incorrect dataNo fix scheduled
FlexSPI
FlexSPI: When FLEXSPI_AHBCR[PREFETCHEN] is set, incorrect data can be
returned in rare conditions
FlexSPI: FlexSPI DLL lock status bit not accurate due to timing issueNo fix scheduled
PIT
Solution
No fix scheduled
No fix scheduled
No fix scheduled
Page
4
5
6
7
8
9
QTMR
ERR050194 QTMR: Overflow flag and related interrupt cannot be generated when the timer
is configured as upward count mode
SAI
ERR011096
ERR011150
ERR050144 SAI: Setting FCONT = 1 when TMR > 0 may not function correctlyNo fix scheduled14
ERR011165
ERR006281
ERR050101
SAI: The internal bit clock cannot be generated when BCI = 1No fix scheduled
SAI: Internally generated receive or transmit BCLK cannot be re-enabled if it is
first disabled when RCR2[DIV] or TCR2[DIV] > 0
SNVS
SNVS: Invalid ECC check failureNo fix scheduled
USB
USB: Incorrect DP/DN state when only VBUS is appliedNo fix scheduled
USB: Endpoint conflict issue in device modeFix in next revision
No fix scheduled11
12
No fix scheduled
13
15
16
17
Chip Errata for the i.MX RT1015, Rev. 2, 01/2021
NXP Semiconductors3
ERR011164
ERR011164ADC: ADC_ETC fails to clear the ADC_ETC request signals
automatically after receiving DMA ack
Description:
If enable ADC_ETC to trigger DMA transfer, the DMA transfer data send ack out. It does not clear
the request signals automatically and continue to trigger DMA.
Projected Impact:
This issue can lead to DMA failure when working with ADC_ETC.
Workarounds:
Configuring two DMA channels for ADC_ETC data transfer. The first DMA channel with low
priority triggered by ADC_ETC request is to transfer ADC_ETC data. The second DMA channel
with high priority links to the first channel is to clear request of ADC_ETC by writing
DMA_CTRL register. Both channel’s priority need to be higher than any channel used by other
peripherals. This solution is result in DMA to transfer ADC_ETC data twice for one request signal
and application need handle the redundant data properly.
Proposed Solution:
No fix scheduled
Software Status:
Software workaround is not in SDK.
Chip Errata for the i.MX RT1015, Rev. 2, 01/2021
4NXP Semiconductors
ERR006223CCM: Failure to resume from Wait/Stop mode with power gating
Description:
When entering Wait/Stop mode with power gating of the Arm core(s), if an interrupt arrives during
the power-down sequence, the system could enter an unexpected state and fail to resume.
Projected Impact:
Device might fail to resume from low-power state.
Workarounds:
Use REG_BYPASS_COUNTER (RBC) to hold off interrupts when the PGC unit is in the middle
of the power-down sequence. The counter needs to be set/cleared only when there are no interrupts
pending. The counter needs to be enabled as close to the WFI (Wait For Interrupt) state as possible.
The following equation can be used to aid determination of the RBC counter value:
The PREG_BYPASS_COUNT value is equal or greater than 2.
Proposed Solution:
ERR006223
No fix scheduled
Software Status:
Software workaround is in SDK.
Chip Errata for the i.MX RT1015, Rev. 2, 01/2021
NXP Semiconductors5
ERR050143
ERR050143CCM: SoC will enter low power mode before the Arm CPU
executes WFI when improper low power sequence is used
Description:
When software tries to enter the low power mode with the following sequence, SoC enters the low
power mode before the Arm CPU executes the WFI instructions.
•Set CCM_CLPCR[1:0] to 2’b00
•Arm CPU enters WFI
•Arm CPU wakes up from an interrupt event, which is masked by GPC or not visible to GPC,
such as an interrupt from local timer.
•Set CCM_CLPCR[1:0] to 2’b01 or 2’b10
•Arm CPU executes WFI
Before the last step, SoC enters the WAIT mode if CCM_CLPCR[1:0] is set to 2’b01, or enters
the STOP mode if CCM_CLPCR[1:0] is set to 2’b10.
Workarounds:
Software workaround:
1. Trigger IRQ #41 (IOMUX), which is always pending by setting IOMUXC_GPR_GPR1[12] bit
2. Unmask IRQ #41 in GPC before setting the CCM low power mode
3. Mask IRQ #41 right after the CCM low power mode is set (set CCM_CLPCR[1:0])
Proposed Solution:
No fix scheduled
Software Status:
Software workaround is in SDK
Chip Errata for the i.MX RT1015, Rev. 2, 01/2021
6NXP Semiconductors
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