• Working voltage range: nom. 2.4 to 75 V (E24 range)
• Non-repetitive peak reverse power dissipation:
40 W.
max.
handbook, halfpage
APPLICATIONS
• Low voltage stabilizers or voltage references.
DESCRIPTION
ka
MAM239
Low-power voltage regulator diodes in hermetically sealed
leaded glass SOD27 (DO-35) packages. The diodes are
available in the normalized E24 ±2% (BZX79-B) and
approx.
±5% (BZX79-C) tolerance range. The series
consists of 37 types with nominal working voltages from
to 75 V.
2.4
The diodes are type branded.
Fig.1Simplified outline (SOD27; DO-35) and
symbol.
LIMITING VALUES
In accordance with the Absolu te Maximum Rating System (IEC 60134).
1. Device mounted on a printed circuit-board without metallization pad.
GRAPHICAL DATA
thermal resistance from junction to tie-point lead length 8 mm.300K/W
thermal resistance from junction to ambient lead length max.; see Fig.2 and note 1380K/W
3
10
handbook, full pagewidth
R
th j-a
(K/W)
2
10
10
1
−1
10
δ = 1
0.75
0.50
0.33
0.20
0.10
0.05
0.02
0.01
≤0.001
t
p
T
11010210
3
4
10
Fig.2 Thermal resistance from junction to ambient as a function of puls e duration.
δ
=
tp (ms)
MBG930
t
p
T
5
10
2002 Feb 276
Page 7
NXP SemiconductorsProduct data sheet
Voltage regulator diodesBZX79 series
3
10
handbook, halfpage
P
ZSM
(W)
2
10
10
1
−1
10
(1) Tj = 25 °C (prior to surge).
(2) Tj = 150 °C (prior to surge).
Objective data sheetDevelopmentThis document contains data from the objective specification for product
Preliminary data sheetQualificationThis document contains data from the preliminary specification.
Product data sheetProductionThis document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
http://www.nxp.com.
URL
DISCLAIMERS
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Right to make changes⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be su itable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modificati on .
(1)
PRODUCT
STATUS
(2)
DEFINITION
development.
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
Terms and conditions of sale⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
No offer to sell or license⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveya nce or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Limiting values⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC
the device. Limiting values are stress ratings only an d
operation of the device at these or any other conditions
2002 Feb 279
60134) may cause permanent damage to
Page 10
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors . No changes were
made to the content, except for the legal definitions and disclaimers.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
The information presented in this documen t d oes not form part of any quotation or contract, is believe d t o b e a ccur ate a nd re li a ble and may be chan ged
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industri al or intellectual property righ ts.
Printed in The Netherlands 613514/03/pp10 Date of release: 2002 Feb 27 Document order number: 9397 750 09387
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