NXP BZX 79-C3V3 NXP Datasheet

Page 1
DATA SH EET
DISCRETE SEMICONDUCTORS
6
BZX79 series
Voltage regulator diodes
Product data sheet Supersedes data of 1999 May 25
2002 Feb 27
Page 2
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX79 series

FEATURES

Total power dissipation: max. 500 mW
Two tolerance series: ±2%, and approx. ±5%
Working voltage range: nom. 2.4 to 75 V (E24 range)
Non-repetitive peak reverse power dissipation:
40 W.
max.
handbook, halfpage

APPLICATIONS

Low voltage stabilizers or voltage references.

DESCRIPTION

ka
MAM239
Low-power voltage regulator diodes in hermetically sealed leaded glass SOD27 (DO-35) packages. The diodes are available in the normalized E24 ±2% (BZX79-B) and approx.
±5% (BZX79-C) tolerance range. The series
consists of 37 types with nominal working voltages from
to 75 V.
2.4
The diodes are type branded.
Fig.1 Simplified outline (SOD27; DO-35) and
symbol.

LIMITING VALUES

In accordance with the Absolu te Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
F
I
ZSM
P
P
T T
tot
ZSM
stg j
continuous forward current 250 mA non-repetitive peak reverse current tp = 100 μs; square wave;
= 25 °C prior to surge
T
j
total power dissipation T
non-repetitive peak reverse power dissipation
= 50 °C; note 1 400 mW
amb
T
= 50 °C; note 2 500 mW
amb
tp = 100 μs; square wave;
= 25 °C prior to surge; see Fig.3
T
j
see Tables 1 and 2 A
40 W
storage temperature −65 +200 °C junction temperature −65 +200 °C
Notes
1. Device mounted on a printed circuit-board withou t metallization pad; lead length max.
2. Tie-point temperature ≤ 50 °C; max. lead length 8 mm.
ELECTRICAL CHARACTERISTICS Total BZX79-B and BZX79-C series
Tj = 25 °C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MAX. UNIT
V
F
forward voltage IF = 10 mA; see Fig.4 0.9 V
2002 Feb 27 2
Page 3
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX79 series
SYMBOL PARAMETER CONDITIONS MAX. UNIT
I
R
reverse current
BZX79-B/C2V4 VR = 1 V 50 μA BZX79-B/C2V7 VR = 1 V 20 μA BZX79-B/C3V0 VR = 1 V 10 μA BZX79-B/C3V3 VR = 1 V 5 μA BZX79-B/C3V6 VR = 1 V 5 μA BZX79-B/C3V9 VR = 1 V 3 μA BZX79-B/C4V3 VR = 1 V 3 μA BZX79-B/C4V7 VR = 2 V 3 μA BZX79-B/C5V1 VR = 2 V 2 μA BZX79-B/C5V6 VR = 2 V 1 μA BZX79-B/C6V2 VR = 4 V 3 μA BZX79-B/C6V8 VR = 4 V 2 μA BZX79-B/C7V5 VR = 5 V 1 μA BZX79-B/C8V2 VR = 5 V 700 nA BZX79-B/C9V1 VR = 6 V 500 nA BZX79-B/C10 VR = 7 V 200 nA BZX79-B/C11 VR = 8 V 100 nA BZX79-B/C12 VR = 8 V 100 nA BZX79-B/C13 VR = 8 V 100 nA BZX79-B/C15 to BZX79-B/C75 VR = 0.7V
Znom
50 nA
2002 Feb 27 3
Page 4
2002 Feb 27 4
Table 1 Per type, BZX79-B/C2V4 to BZX79-B/C24 Tj = 25 °C unless otherwise specified.
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX79 series
BZX79-
Bxxx Cxxx
WORKING VOLTAGE
V
(V)
Z
I
Ztest
= 5 mA
Tol. approx.
at
Tol. ±2% (B)
±5%
(C)
DIFFERENTIAL RESISTANCE
r
(Ω)
dif
at I
= 1 mA at I
Ztest
Ztest
= 5 mA
TEMP. COEFF.
S
(mV/K)
Z
I
Ztest
= 5 mA
at
(see Figs 5 and 6)
DIODE CAP.
C
(pF)
d
f = 1 MHz;
at
= 0 V
V
R
NON-REPETITIVE PEAK
tp = 100 μs; T
at
MIN. MAX. MIN. MAX. TYP. MAX. TYP. MAX. MIN. TYP. MAX. MAX. MAX.
2V4 2.35 2.45 2.2 2.6 275 600 70 100 3.5 1.6 0 450 6.0 2V7 2.65 2.75 2.5 2.9 300 600 75 100 3.5 2.0 0 450 6.0 3V0 2.94 3.06 2.8 3.2 325 600 80 95 3.5 2.1 0 450 6.0 3V3 3.23 3.37 3.1 3.5 350 600 85 95 3.5 2.4 0 450 6.0 3V6 3.53 3.67 3.4 3.8 375 600 85 90 3.5 2.4 0 450 6.0 3V9 3.82 3.98 3.7 4.1 400 600 85 90 3.5 2.5 0 450 6.0 4V3 4.21 4.39 4.0 4.6 410 600 80 90 3.5 2.5 0 450 6.0 4V7 4.61 4.79 4.4 5.0 425 500 50 80 3.5 1.4 0.2 300 6.0 5V1 5.00 5.20 4.8 5.4 400 480 40 60 2.7 0.8 1.2 300 6.0 5V6 5.49 5.71 5.2 6.0 80 400 15 40 2.0 1.2 2.5 300 6.0 6V2 6.08 6.32 5.8 6.6 40 150 6 10 0.4 2.3 3.7 200 6.0 6V8 6.66 6.94 6.4 7.2 30 80 6 15 1.2 3.0 4.5 200 6.0 7V5 7.35 7.65 7.0 7.9 30 80 6 15 2.5 4.0 5.3 150 4.0 8V2 8.04 8.36 7.7 8.7 40 80 6 15 3.2 4.6 6.2 150 4.0 9V1 8.92 9.28 8.5 9.6 40 100 6 15 3.8 5.5 7.0 150 3.0 10 9.80 10.20 9.4 10.6 50 150 8 20 4.5 6.4 8.0 90 3.0 11 10.80 11.20 10.4 11.6 50 150 10 20 5.4 7.4 9.0 85 2.5 12 11.80 12.20 11.4 12.7 50 150 10 25 6.0 8.4 10.0 85 2.5 13 12.70 13.30 12.4 14.1 50 170 10 30 7.0 9.4 11.0 80 2.5 15 14.70 15.30 13.8 15.6 50 200 10 30 9.2 11.4 13.0 75 2.0 16 15.70 16.30 15.3 17.1 50 200 10 40 10.4 12.4 14.0 75 1.5 18 17.60 18.40 16.8 19.1 50 225 10 45 12.4 14.4 16.0 70 1.5 20 19.60 20.40 18.8 21.2 60 225 15 55 12.3 15.6 18.0 60 1.5 22 21.60 22.40 20.8 23.3 60 250 20 55 14.1 17.6 20.0 60 1.25 24 23.50 24.50 22.8 25.6 60 250 25 70 15.9 19.6 22.0 55 1.25
REVERSE CURRENT
(A)
I
ZSM
= 25 °C
amb
Page 5
2002 Feb 27 5
Table 2 Per type, BZX79-B/C27 to BZX79-B/C75 Tj = 25 °C unless otherwise specified.
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX79 series
BZX79-
Bxxx Cxxx
WORKING VOLTAGE
V
(V)
Z
I
Ztest
= 2 mA
Tol. approx.
at
Tol. ±2% (B)
±5%
(C)
DIFFERENTIAL RESISTANCE
r
(Ω)
dif
at I
= 0.5 mA at I
Ztest
Ztest
= 2 mA
TEMP. COEFF.
S
(mV/K)
Z
I
Ztest
= 2 mA
at
(see Figs 5 and 6)
DIODE CAP.
C
(pF)
d
f = 1 MHz;
at
= 0 V
V
R
NON-REPETITIVE PEAK
tp = 100 μs; T
at
MIN. MAX. MIN. MAX. TYP. MAX. TYP. MAX. MIN. TYP. MAX. MAX. MAX.
27 26.50 27.50 25.1 28.9 65 300 25 80 18.0 22.7 25.3 50 1.0 30 29.40 30.60 28.0 32.0 70 300 30 80 20.6 25.7 29.4 50 1.0 33 32.30 33.70 31.0 35.0 75 325 35 80 23.3 28.7 33.4 45 0.9 36 35.30 36.70 34.0 38.0 80 350 35 90 26.0 31.8 37.4 45 0.8 39 38.20 39.80 37.0 41.0 80 350 40 130 28.7 34.8 41.2 45 0.7 43 42.10 43.90 40.0 46.0 85 375 45 150 31.4 38.8 46.6 40 0.6 47 46.10 47.90 44.0 50.0 85 375 50 170 35.0 42.9 51.8 40 0.5 51 50.00 52.00 48.0 54.0 90 400 60 180 38.6 46.9 57.2 40 0.4 56 54.90 57.10 52.0 60.0 100 425 70 200 42.2 52.0 63.8 40 0.3 62 60.80 63.20 58.0 66.0 120 450 80 215 58.8 64.4 71.6 35 0.3 68 66.60 69.40 64.0 72.0 150 475 90 240 65.6 71.7 79.8 35 0.25 75 73.50 76.50 70.0 79.0 170 500 95 255 73.4 80.2 88.6 35 0.2
REVERSE CURRENT
(A)
I
ZSM
= 25 °C
amb
Page 6
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX79 series

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-tp
R
th j-a
Note
1. Device mounted on a printed circuit-board without metallization pad.

GRAPHICAL DATA

thermal resistance from junction to tie-point lead length 8 mm. 300 K/W thermal resistance from junction to ambient lead length max.; see Fig.2 and note 1 380 K/W
3
10
handbook, full pagewidth
R
th j-a
(K/W)
2
10
10
1
1
10
δ = 1
0.75
0.50
0.33
0.20
0.10
0.05
0.02
0.01 0.001
t
p
T
11010210
3
4
10
Fig.2 Thermal resistance from junction to ambient as a function of puls e duration.
δ
=
tp (ms)
MBG930
t
p
T
5
10
2002 Feb 27 6
Page 7
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX79 series
3
10
handbook, halfpage
P
ZSM (W)
2
10
10
1
1
10
(1) Tj = 25 °C (prior to surge). (2) Tj = 150 °C (prior to surge).
(1)
(2)
1 duration (ms)
MBG801
Fig.3 Maximum permissible non-repetitive peak
reverse power dissipation versus duration.
300
handbook, halfpage
I
F
(mA)
200
100
0
10
0.6 1
Tj = 25 °C.
0.8
MBG781
VF (V)
Fig.4 Typical forward current as a function of
forward voltage.
handbook, halfpage
0
S
Z
(mV/K)
1
2
3
060
BZX79-B/C2V4 to BZX79-B/C4V3.
Tj = 25 to 150 °C.
20 40
4V3
MBG783
3V9
3V6
3V3
3V0
2V4 2V7
IZ (mA)
Fig.5 Temperature coefficient as a function of
working current; typical values.
10
handbook, halfpage
S
Z
(mV/K)
5
0
5 02016
BZX79-B/C4V7 to BZX79-B/C12.
T
= 25 to 150 °C.
j
4812
12 11
10 9V1 8V2
7V5 6V8
6V2 5V6 5V1
4V7
MBG782
IZ (mA)
Fig.6 Temperature coefficient as a function of
working current; typical values.
2002 Feb 27 7
Page 8
NXP Semiconductors Product data sheet
Hermetically sealed glass package; axial leaded; 2 leads
SOD27
Voltage regulator diodes BZX79 series

PACKAGE OUTLINE

(1)
b
LD L
DIMENSIONS (mm are the original dimensions)
G
UNIT
mm
Note
1. The marking band indicates the cathode.
b
max.
0.56
OUTLINE VERSION
SOD27 DO-35A24 SC-40
D
max.
max.
IEC JEDEC EIAJ
L
1
min.
25.44.251.85
REFERENCES
G
1
0 1 2 mm
scale
EUROPEAN
PROJECTION
ISSUE DATE
97-06-09
2002 Feb 27 8
Page 9
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX79 series

DATA SHEET STATUS

DOCUMENT
STATUS
Objective data sheet Development This document contains data from the objective specification for product
Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at
http://www.nxp.com.
URL
DISCLAIMERS General Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be su itable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modificati on .
(1)
PRODUCT STATUS
(2)
DEFINITION
development.
above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.
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Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC the device. Limiting values are stress ratings only an d operation of the device at these or any other conditions
2002 Feb 27 9
60134) may cause permanent damage to
Page 10
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors . No changes were made to the content, except for the legal definitions and disclaimers.
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Printed in The Netherlands 613514/03/pp10 Date of release: 2002 Feb 27 Document order number: 9397 750 09387
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