NXP BZX 384-C5V1 NXP Datasheet

DATA SH EET
DISCRETE SEMICONDUCTORS
BZX384 series
Voltage regulator diodes
Product data sheet Supersedes data of 2003 Apr 01
2004 Mar 22
NXP Semiconductors Product data sheet
Top view
Voltage regulator diodes BZX384 series

FEATURES

Total power dissipation: max. 300 mW
Two tolerance series: ±2% and approx. ±5%
Working voltage range: nominal 2.4 to 75 V (E24 range)
Non-repetitive peak reverse power dissipation:
40 W.
max.

APPLICATIONS

General regulation functions.

DESCRIPTION

Low-power voltage regulator diodes encapsulated in a very small SOD323 (SC-76) plastic SMD package.
The diodes are available in the normalized E24 ±2% (BZX384-B) and approx. ±5% (BZX384-C) tolerance range. The series consists of 37 working voltages from 2.4
types with nominal
to 75 V.

PINNING

PIN DESCRIPTION
1 cathode 2 anode
handbook, halfpage
The marking bar indicates the cathode.
12
MAM387
Fig.1 Simplified outline (SOD323; SC-76) and
symbol.
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX384 series

MARKING

TYPE
NUMBER
Marking codes for BZX384-B2V4 to BZX384-B75
BZX384-B2V4 K1 BZX384-B6V2 L2 BZX384-B16 M3 BZX384-B43 N3 BZX384-B2V7 K2 BZX384-B6V8 L3 BZX384-B18 M4 BZX384-B47 N4 BZX384-B3V0 K3 BZX384-B7V5 L4 BZX384-B20 M5 BZX384-B51 N5 BZX384-B3V3 K4 BZX384-B8V2 L5 BZX384-B22 M6 BZX384-B56 N6 BZX384-B3V6 K5 BZX384-B9V1 L6 BZX384-B24 M7 BZX384-B62 N7 BZX384-B3V9 K6 BZX384-B10 L7 BZX384-B27 M8 BZX384-B68 N8 BZX384-B4V3 K7 BZX384-B11 L8 BZX384-B30 M9 BZX384-B75 N9 BZX384-B4V7 K8 BZX384-B12 L9 BZX384-B33 N0 BZX384-B5V1 K9 BZX384-B13 M1 BZX384-B36 N1 BZX384-B5V6 L1 BZX384-B15 M2 BZX384-B39 N2
Marking codes for BZX384-C2V4 to BZX384-C75
BZX384-C2V4 T3 BZX384-C6V2 T1 BZX384-C16 DE BZX384-C43 DR BZX384-C2V7 T4 BZX384-C6V8 D7 BZX384-C18 DF BZX384-C47 DS BZX384-C3V0 T5 BZX384-C7V5 D8 BZX384-C20 DG BZX384-C51 DT BZX384-C3V3 T6 BZX384-C8V2 D9 BZX384-C22 DH BZX384-C56 DU BZX384-C3V6 T7 BZX384-C9V1 D0 BZX384-C24 DJ BZX384-C62 DV BZX384-C3V9 T8 BZX384-C10 T2 BZX384-C27 DK BZX384-C68 DW BZX384-C4V3 T9 BZX384-C11 DA BZX384-C30 DL BZX384-C75 DX BZX384-C4V7 T0 BZX384-C12 DB BZX384-C33 DM BZX384-C5V1 D5 BZX384-C13 DC BZX384-C36 DN BZX384-C5V6 D6 BZX384-C15 DD BZX384-C39 DP
MARKING
CODE
TYPE
NUMBER
MARKING
CODE
TYPE
NUMBER
MARKING
CODE
TYPE
NUMBER
MARKING
CODE

ORDERING INFORMATION

TYPE
NUMBER
BZX384-B2V4 to BZX384-B75
BZX384-C2V4 to BZX384-C75
NAME DESCRIPTION VERSION
plastic surface mounted pack ag e; 2 leads SOD323
PACKAGE
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX384 series

LIMITING VALUES

In accordance with the Absolu te Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
F
I
ZSM
P
ZSM
P
tot
T
stg
T
j
Note
1. Refer to SOD323 standard mounting conditions .

CHARACTERISTICS

continuous forward current 250 mA non-repetitive peak reverse current tp = 100 μs; square wave;
T
= 25 °C; prior to surge
amb
non-repetitive peak reverse power dissipation
total power dissipation T
tp = 100 μs; square wave;
= 25 °C; prior to surge
T
amb
= 25 °C; note 1 300 mW
amb
see Tables 1 and 2 A
40 W
storage temperature −65 +150 °C junction temperature −65 +150 °C
Total BZX384-B and C series
Tj = 25 °C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MAX. UNIT
V
F
forward voltage IF = 10 mA; see Fig.3 0.9 V
IF = 100 mA; see Fig.3 1.1 V
I
R
reverse current;
BZX384-B/C2V4 VR = 1 V 50 μA BZX384-B/C2V7 VR = 1 V 20 μA BZX384-B/C3V0 VR = 1 V 10 μA BZX384-B/C3V3 VR = 1 V 5 μA BZX384-B/C3V6 VR = 1 V 5 μA BZX384-B/C3V9 VR = 1 V 3 μA BZX384-B/C4V3 VR = 1 V 3 μA BZX384-B/C4V7 VR = 2 V 3 μA BZX384-B/C5V1 VR = 2 V 2 μA BZX384-B/C5V6 VR = 2 V 1 μA BZX384-B/C6V2 VR = 4 V 3 μA BZX384-B/C6V8 VR = 4 V 2 μA BZX384-B/C7V5 VR = 5 V 1 μA BZX384-B/C8V2 VR = 5 V 700 nA BZX384-B/C9V1 VR = 6 V 500 nA BZX384-B/C10 VR = 7 V 200 nA BZX384-B/C11 VR = 8 V 100 nA BZX384-B/C12 VR = 8 V 100 nA BZX384-B/C13 VR = 8 V 100 nA BZX384-B/C15 to 75 VR = 0.7V
Znom
50 nA
2004 Mar 22 5
Table 1 Per type BZX384-B/C2V4 to B/C24 Tj = 25 °C unless otherwise specified.
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX384 series
BZX­Bxxx Cxxx
WORKING VOLTAGE VZ (V)
at I
Ztest
= 5 mA
Tol. ±2% (B) Tol. ±5% (C) at I
DIFFERENTIAL RESISTANCE
r
(Ω)
dif
= 1 mA at I
Ztest
Ztest
= 5 mA
TEMPERATURE
COEFFICIENT S
at I
Ztest
= 5 mA
(see Figs 4 and 5)
(mV/K)
Z
DIODE CAP.
(pF)
C
d
at f
= 1 MHz;
= 0 V
V
R
NON-REPETITIVE
PEAK REVERSE
CURRENT I
MIN. MAX. MIN. MAX. TYP. MAX. TYP. MAX. MIN. TYP. MAX. MAX. MAX.
2V4 2.35 2.45 2.2 2.6 275 600 70 100 3.5 1.6 0 450 6.0 2V7 2.65 2.75 2.5 2.9 300 600 75 100 3.5 2.0 0 450 6.0 3V0 2.94 3.06 2.8 3.2 325 600 80 95 3.5 2.1 0 450 6.0 3V3 3.23 3.37 3.1 3.5 350 600 85 95 3.5 2.4 0 450 6.0 3V6 3.53 3.67 3.4 3.8 375 600 85 90 3.5 2.4 0 450 6.0 3V9 3.82 3.98 3.7 4.1 400 600 85 90 3.5 2.5 0 450 6.0 4V3 4.21 4.39 4.0 4.6 410 600 80 90 3.5 2.5 0 450 6.0 4V7 4.61 4.79 4.4 5.0 425 500 50 80 3.5 1.4 0.2 300 6.0 5V1 5.00 5.20 4.8 5.4 400 480 40 60 2.7 0.8 1.2 300 6.0 5V6 5.49 5.71 5.2 6.0 80 400 15 40 2.0 1.2 2.5 300 6.0 6V2 6.08 6.32 5.8 6.6 40 150 6 10 0.4 2.3 3.7 200 6.0 6V8 6.66 6.94 6.4 7.2 30 80 6 15 1.2 3.0 4.5 200 6.0 7V5 7.35 7.65 7.0 7.9 30 80 6 15 2.5 4.0 5.3 150 4.0 8V2 8.04 8.36 7.7 8.7 40 80 6 15 3.2 4.6 6.2 150 4.0 9V1 8.92 9.28 8.5 9.6 40 100 6 15 3.8 5.5 7.0 150 3.0 10 9.80 10.20 9.4 10.6 50 150 8 20 4.5 6.4 8.0 90 3.0 11 10.80 11.20 10.4 11.6 50 150 10 20 5.4 7.4 9.0 85 2.5 12 11.80 12.20 11.4 12.7 50 150 10 25 6.0 8.4 10.0 85 2.5 13 12.70 13.30 12.4 14.1 50 170 10 30 7.0 9.4 11.0 80 2.5 15 14.70 15.30 13.8 15.6 50 200 10 30 9.2 11.4 13.0 75 2.0 16 15.70 16.30 15.3 17.1 50 200 10 40 10.4 12.4 14.0 75 1.5 18 17.60 18.40 16.8 19.1 50 225 10 45 12.4 14.4 16.0 70 1.5 20 19.60 20.40 18.8 21.2 60 225 15 55 14.4 16.4 18.0 60 1.5 22 21.60 22.40 20.8 23.3 60 250 20 55 16.4 18.4 20.0 60 1.25 24 23.50 24.50 22.8 25.6 60 250 25 70 18.4 20.4 22.0 55 1.25
tp = 100 μs;
at
T
= 25 °C
amb
ZSM
(A)
2004 Mar 22 6
Table 2 Per type BZX384-B/C27 to B/C75 Tj = 25 °C unless otherwise specified.
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX384 series
BZX­Bxxx Cxxx
WORKING VOLTAGE VZ (V)
at I
Ztest
= 2 mA
Tol. ±2% (B) Tol. ±5% (C) at I
DIFFERENTIAL RESISTANCE
r
(Ω)
dif
= 0.5 mA at I
Ztest
Ztest
= 2 mA
TEMPERATURE
COEFFICIENT S
at I
Ztest
= 2 mA
(see Figs 4 and 5)
(mV/K)
Z
DIODE CAP.
(pF)
C
d
at f
= 1 MHz;
= 0 V
V
R
NON-REPETITIVE
PEAK REVERSE
CURRENT I
MIN. MAX. MIN. MAX. TYP. MAX. TYP. MAX. MIN. TYP. MAX. MAX. MAX.
27 26.50 27.50 25.1 28.9 65 300 25 80 21.4 23.4 25.3 50 1.0 30 29.40 30.60 28.0 32.0 70 300 30 80 24.4 26.6 29.4 50 1.0 33 32.30 33.70 31.0 35.0 75 325 35 80 27.4 29.7 33.4 45 0.9 36 35.30 36.70 34.0 38.0 80 350 35 90 30.4 33.0 37.4 45 0.8 39 38.20 39.80 37.0 41.0 80 350 40 130 33.4 36.4 41.2 45 0.7 43 42.10 43.90 40.0 46.0 85 375 45 150 37.6 41.2 46.6 40 0.6 47 46.10 47.90 44.0 50.0 85 375 50 170 42.0 46.1 51.8 40 0.5 51 50.00 52.00 48.0 54.0 90 400 60 180 46.6 51.0 57.2 40 0.4 56 54.90 57.10 52.0 60.0 100 425 70 200 52.2 57.0 63.8 40 0.3 62 60.80 63.20 58.0 66.0 120 450 80 215 58.8 64.4 71.6 35 0.3 68 66.60 69.40 64.0 72.0 150 475 90 240 65.6 71.7 79.8 35 0.25 75 73.50 76.50 70.0 79.0 170 500 95 255 73.4 80.2 88.6 35 0.2
tp = 100 μs;
at
T
= 25 °C
amb
ZSM
(A)
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX384 series

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
R
th(j-s)
Notes
1. Device mounted on an FR4 printed-circuit board.
2. Soldering point of the cathode tab.
thermal resistance from junction to ambient
thermal resistance from junction to soldering point
note 1 415 K/W
note 2 110 K/W
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX384 series

GRAPHICAL DATA

3
10
handbook, halfpage
P
ZSM (W)
2
10
10
1
1
10
(1) Tj = 25 °C (prior to surge). (2) Tj = 150 °C (prior to surge).
(1)
(2)
1 duration (ms)
MBG801
Fig.2 Maximum permissible non-repetitive peak
reverse power dissipation versus duration.
300
handbook, halfpage
I
F
(mA)
200
100
0
10
0.6 1
Tj = 25 °C.
0.8
MBG781
VF (V)
Fig.3 Forward current as a function of forward
voltage; typical values.
handbook, halfpage
0
S
Z
(mV/K)
1
2
3
060
BZX384-B/C2V4 to B/C4V3.
T
= 25 to 150 °C.
j
4V3
20 40
MBG783
3V9
3V6
3V3
3V0
2V4 2V7
IZ (mA)
Fig.4 Temperature coefficient as a function of
working current; typical values.
10
handbook, halfpage
S
Z
(mV/K)
5
0
5 02016
BZX384-B/C4V7 to B/C12.
T
= 25 to 150 °C.
j
4812
12 11
10 9V1 8V2
7V5 6V8
6V2 5V6 5V1
4V7
Fig.5 Temperature coefficient as a function of
working current; typical values.
MBG782
IZ (mA)
NXP Semiconductors Product data sheet
3
P
Voltage regulator diodes BZX384 series

PACKAGE OUTLINE

lastic surface-mounted package; 2 leads
D
A
E
X
M
H
D
vA
SOD32
Q
21
(1)
01
DIMENSIONS (mm are the original dimensions)
A
1
b
UNIT
A
max
1.1
mm 0.05
0.8
Note
1. The marking bar indicates the cathode
OUTLINE VERSION
SOD323 SC-76
c D E H
p
0.40
0.25
1.8
0.25
0.10
IEC JEDEC JEITA
1.6
1.35
1.15
D
2.7
2.3
REFERENCES
L
0.45
0.15
b
p
scale
Q
0.25
0.15
v
0.2
p
A
A
2 mm
1
L
detail X
EUROPEAN
PROJECTION
p
c
ISSUE DATE
03-12-17
06-03-16
NXP Semiconductors Product data sheet
Voltage regulator diodes BZX384 series

DATA SHEET STATUS

DOCUMENT
STATUS
Objective data sheet Development This document contains data from the objective specification for product
Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or co mpleting a design.
2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at
http://www.nxp.com.
URL
DISCLAIMERS General Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be su itable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modificati on .
(1)
PRODUCT STATUS
(2)
DEFINITION
development.
above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.
No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveya nce or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC the device. Limiting values are stress ratings only an d operation of the device at these or any other conditions
2004 Mar 22 10
60134) may cause permanent damage to
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this documen t d oes not form part of any quotation or contract, is believe d t o b e a ccur ate a nd re li a ble and may be chan ged without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industri al or intellectual property rights.
Printed in The Netherlands R76/02/pp11 Date of release: 2004 Mar 22 Document order number: 9397 750 12616
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