NXP BZV55 Technical data

BZV55 series
Voltage regulator diodes
Rev. 04 — 19 July 2007 Product data sheet
1. Product profile

1.1 General description

Low-power voltage regulator diodes in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages. The diodes are available in the normalized E24 ±2 % (BZV55-B) and approximately ±5 % (BZV55-C) tolerance range. The series consists of 37 types with nominal working voltages from 2.4 V to 75 V.

1.2 Features

n Non-repetitive peak reverse power
dissipation: 40 W
n Total power dissipation: 500 mW n Low differential resistance n Two tolerance series: ±2 % and ±5% n Small hermetically sealed glass SMD

1.3 Applications

1.4 Quick reference data

Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
F
P
ZSM
[1] tp= 100µs; square wave; Tj=25°C prior to surge
forward voltage IF= 10 mA - - 0.9 V non-repetitive peak reverse
power dissipation

2. Pinning information

Table 2. Pinning
Pin Description Simplified outline Symbol
1 cathode 2 anode
n Wide working voltage range: nominal
2.4 V to 75 V (E24 range)
package
[1]
--40W
[1]
ka
1
006aaa152
2
[1] The marking band indicates the cathode.
NXP Semiconductors

3. Ordering information

Table 3. Ordering information
Type number Package
BZV55-B2V4 to BZV55-C75
[1] The series consists of 74 types with nominal working voltages from 2.4V to 75 V.
[1]

4. Marking

Table 4. Marking codes
Type number Marking code
BZV55-B2V4 to BZV55-C75 marking band
[1] blue: made in China
yellow: made in Philippines
BZV55 series
Voltage regulator diodes
Name Description Version
- hermetically sealed glass surface-mounted package; 2 connectors
[1]
SOD80C

5. Limiting values

Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
I
F
I
ZSM
forward current - 250 mA non-repetitive peak reverse
current
P
ZSM
non-repetitive peak reverse power dissipation
P
tot
T
stg
T
j
[1] tp= 100 µs; square wave; Tj=25°C prior to surge [2] Device mounted on a ceramic substrate of 10 × 10 × 0.6 mm.
total power dissipation T
storage temperature 65 +200 °C junction temperature 65 +200 °C

6. Thermal characteristics

Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
R
th(j-a)
th(j-t)
thermal resistance from junction to ambient
thermal resistance from junction to tie-point
50 °C
amb
50 °C
T
tp
in free air
[1]
- see
Table 8
and
9
[1]
-40W
[2]
- 400 mW
[2]
- 500 mW
[1]
- - 380 K/W
- - 300 K/W
[1] Device mounted on a ceramic substrate of 10 × 10 × 0.6 mm.
BZV55_SER_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 19 July 2007 2 of 12
NXP Semiconductors
BZV55 series
Voltage regulator diodes
tp (ms)
006aab072
10
Z
th(j-a)
(K/W)
3
10
δ = 1
0.75
0.50
0.33
2
10
0.20
0.10
0.05
0.02
0.01
10
0.001
1
1
10
110
2
10
3
10
4
10
Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

7. Characteristics

Table 7. Characteristics
Tj=25°C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V
F
I
R
forward voltage IF= 10 mA - - 0.9 V reverse current
BZV55-B/C2V4 V BZV55-B/C2V7 V BZV55-B/C3V0 V BZV55-B/C3V3 V BZV55-B/C3V6 V BZV55-B/C3V9 V BZV55-B/C4V3 V BZV55-B/C4V7 V BZV55-B/C5V1 V BZV55-B/C5V6 V BZV55-B/C6V2 V BZV55-B/C6V8 V BZV55-B/C7V5 V BZV55-B/C8V2 V BZV55-B/C9V1 V BZV55-B/C10 V BZV55-B/C11 V BZV55-B/C12 V BZV55-B/C13 V BZV55-B/C15 to BZV55-B/C75 V
=1V --50µA
R
=1V --20µA
R
=1V --10µA
R
=1V --5µA
R
=1V --5µA
R
=1V --3µA
R
=1V --3µA
R
=2V --3µA
R
=2V --2µA
R
=2V --1µA
R
=4V --3µA
R
=4V --2µA
R
=5V --1µA
R
= 5 V - - 700 nA
R
= 6 V - - 500 nA
R
= 7 V - - 200 nA
R
= 8 V - - 100 nA
R
= 8 V - - 100 nA
R
= 8 V - - 100 nA
R
= 0.7V
R
Z(nom)
--50nA
5
BZV55_SER_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 19 July 2007 3 of 12
NXP Semiconductors
BZV55 series
Voltage regulator diodes
Table 8. Characteristics per type; BZV55-B2V4 to BZV55-C24
Tj=25°C unless otherwise specified.
BZV55-xxxSel Working
voltage
(V)
V
Z
IZ=5mA IZ=1mA IZ=5mA IZ=5mA Min Max Typ Max Typ Max Min Typ Max Max Max
2V4 B 2.35 2.45 275 600 70 100 3.5 1.6 0 450 6.0
C 2.2 2.6
2V7 B 2.65 2.75 300 600 75 100 3.5 2.0 0 450 6.0
C 2.5 2.9
3V0 B 2.94 3.06 325 600 80 95 3.5 2.1 0 450 6.0
C 2.8 3.2
3V3 B 3.23 3.37 350 600 85 95 3.5 2.4 0 450 6.0
C 3.1 3.5
3V6 B 3.53 3.67 375 600 85 90 3.5 2.4 0 450 6.0
C 3.4 3.8
3V9 B 3.82 3.98 400 600 85 90 3.5 2.5 0 450 6.0
C 3.7 4.1
4V3 B 4.21 4.39 410 600 80 90 3.5 2.5 0 450 6.0
C 4.0 4.6
4V7 B 4.61 4.79 425 500 50 80 3.5 1.4 0.2 300 6.0
C 4.4 5.0
5V1 B 5.0 5.2 400 480 40 60 2.7 0.8 1.2 300 6.0
C 4.8 5.4
5V6 B 5.49 5.71 80 400 15 40 2.0 1.2 2.5 300 6.0
C 5.2 6.0
6V2 B 6.08 6.32 40 150 6 10 0.4 2.3 3.7 200 6.0
C 5.8 6.6
6V8 B 6.66 6.94 30 80 6 15 1.2 3.0 4.5 200 6.0
C 6.4 7.2
7V5 B 7.35 7.65 30 80 6 15 2.5 4.0 5.3 150 4.0
C 7.0 7.9
8V2 B 8.04 8.36 40 80 6 15 3.2 4.6 6.2 150 4.0
C 7.7 8.7
9V1 B 8.92 9.28 40 100 6 15 3.8 5.5 7.0 150 3.0
C 8.5 9.6
10 B 9.8 10.2 50 150 8 20 4.5 6.4 8.0 90 3.0
C 9.4 10.6
11 B 10.8 11.2 50 150 10 20 5.4 7.4 9.0 85 2.5
C 10.4 11.6
12 B 11.8 12.2 50 150 10 25 6.0 8.4 10.0 85 2.5
C 11.4 12.7
BZV55_SER_4 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 04 — 19 July 2007 4 of 12
Differential resistance
()
r
dif
Temperature coefficient
(mV/K)
S
Z
Diode capacitance
[1]
(pF)
C
d
Non-repetitive peak reverse current
ZSM
(A)
[2]
I
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