NXP BT 137S-600D NXP Datasheet

BT137S-600D

4Q Triac

12 June 2014 Product data sheet

1. General description

Planar passivated very sensitive gate four quadrant triac in a SOT428 (DPAK) surface-mountable plastic package intended for use in general purpose bidirectional switching and phase control applications, where high sensitivity is required in all four quadrants. This very sensitive gate "series D" triac is intended to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits.

2. Features and benefits

Direct triggering from low power drivers and logic ICs

•

High blocking voltage capability

•

Low holding current for low current loads and lowest EMI at commutation

•

Planar passivated for voltage ruggedness and reliability

•

Surface-mountable package

•

Triggering in all four quadrants

•

Very sensitive gate

•

3. Applications

General purpose motor control

•

General purpose switching

•

4. Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

DRM

TSM

T(RMS)

Static characteristics

repetitive peak offstate voltage

non-repetitive peak onstate current

RMS on-state current full sine wave; Tmb ≤ 102 °C; Fig. 1;

gate trigger current

full sine wave; T

tp = 20 ms; Fig. 4; Fig. 5

Fig. 2; Fig. 3

VD = 12 V; IT = 0.1 A; T2+ G+;

Tj = 25 °C

VD = 12 V; IT = 0.1 A; T2+ G-;

Tj = 25 °C; Fig. 7

j(init)

= 25 °C;

- - 600 V

- - 65 A

- - 8 A

- 2.5 5 mAI

- 3.5 5 mA

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NXP Semiconductors

sym051

BT137S-600D

4Q Triac

Symbol Parameter Conditions Min Typ Max Unit

VD = 12 V; IT = 0.1 A; T2- G-;

Tj = 25 °C; Fig. 7

- 3.5 5 mA

VD = 12 V; IT = 0.1 A; T2- G+;

- 6.5 10 mA

Tj = 25 °C; Fig. 7

holding current VD = 12 V; Tj = 25 °C; Fig. 9 - 1.5 10 mA

5. Pinning information

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1 T1 main terminal 1

2 T2 main terminal 2

3 G gate

mb T2 mounting base; main

terminal 2

DPAK (SOT428)

6. Ordering information

Table 3. Ordering information

PackageType number

Name Description Version

BT137S-600D DPAK plastic single-ended surface-mounted package (DPAK); 3 leads

(one lead cropped)

SOT428

Product data sheet 12 June 2014 2 / 13

NXP Semiconductors

BT137S-600D

4Q Triac

7. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

DRM

T(RMS)

TSM

repetitive peak off-state voltage - 600 V

RMS on-state current full sine wave; Tmb ≤ 102 °C; Fig. 1;

- 8 A

Fig. 2; Fig. 3

non-repetitive peak on-state current

full sine wave; T

tp = 20 ms; Fig. 4; Fig. 5

j(init)

= 25 °C;

- 65 AI

I2t I2t for fusing

dIT/dt rate of rise of on-state current

G(AV)

stg

peak gate current - 2 A

peak gate power - 5 W

average gate power over any 20 ms period - 0.5 W

storage temperature -40 150 °C

junction temperature - 125 °C

full sine wave; T

j(init)

= 25 °C;

- 71 A

tp = 16.7 ms

tp = 10 ms; SIN - 21

IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs;

- 50 A/µs

T2+ G+

IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs;

- 50 A/µs

T2+ G-

IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs;

- 50 A/µs

T2- G-

IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs;

- 10 A/µs

T2- G+

A2s

Product data sheet 12 June 2014 3 / 13

NXP Semiconductors

Tmb(°C)

- 50 1501000 50

003aae689

T(RMS)

(A)

003aae692

- 2

- 1

1 10

surge duration (s)

T(RMS)

(A)

003aae690

tot

(W)

T(RMS)

(A)

0 1084 62

conductio

angle

(degrees)

for

facto

0 120 180

2.8

2.2

1.9

1.5

= 180

120°

90°

60°

BT137S-600D

4Q Triac

Fig. 1. RMS on-state current as a function of mounting

base temperature; maximum values

f = 50 Hz Tmb ≤ 102 °C

Fig. 2. RMS on-state current as a function of surge

duration; maximum values

α = conduction angle a = form factor = I

T(RMS)/IT(AV)

Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values

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NXP Semiconductors

003aae691

- 5

- 4

- 3

- 2

- 1

TSM

j(init)

=25°C max

(1)

(2)

tp(s)

TSM

(A)

003aae693

TSM

(A)

number of cycles

1 10

10 10

TSM

j(init)

=25°C max

1/f

tp ≤ 20 ms

(1) dIT/dt limit

(2) T2- G+ quadrant limit

Fig. 4. Non-repetitive peak on-state current as a function of pulse width; maximum values

BT137S-600D

4Q Triac

f = 50 Hz

Fig. 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum

values

Product data sheet 12 June 2014 5 / 13

NXP Semiconductors

003aae698

tp(s)

-5

1 1010

-1

-2

-4

-3

-1

th(j-mb)

(K/W)

-2

bidirectional

unidirectional

BT137S-600D

4Q Triac

8. Thermal characteristics

Table 5. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

th(j-mb)

th(j-a)

thermal resistance from junction to mounting base

thermal resistance from junction to ambient

half cycle; Fig. 6 - - 2.4 K/WR

full cycle; Fig. 6 - - 2 K/W

PCB (FR4) mounted; minimum pad

- 75 - K/W

sizes

Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width

Product data sheet 12 June 2014 6 / 13

NXP Semiconductors

BT137S-600D

4Q Triac

9. Characteristics

Table 6. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

gate trigger current

VD = 12 V; IT = 0.1 A; T2+ G+;

Tj = 25 °C

- 2.5 5 mA

latching current

holding current VD = 12 V; Tj = 25 °C; Fig. 9 - 1.5 10 mA

on-state voltage IT = 10 A; Tj = 25 °C; Fig. 10 - 1.3 1.65 V

gate trigger voltage

off-state current VD = 600 V; Tj = 125 °C - 0.1 0.5 mA

Dynamic characteristics

dVD/dt rate of rise of off-state

voltage

gate-controlled turn-on time

VD = 12 V; IT = 0.1 A; T2+ G-;

Tj = 25 °C; Fig. 7

VD = 12 V; IT = 0.1 A; T2- G-;

Tj = 25 °C; Fig. 7

VD = 12 V; IT = 0.1 A; T2- G+;

Tj = 25 °C; Fig. 7

VD = 12 V; IG = 0.1 A; T2+ G+;

Tj = 25 °C; Fig. 8

VD = 12 V; IG = 0.1 A; T2+ G-;

Tj = 25 °C; Fig. 8

VD = 12 V; IG = 0.1 A; T2- G-;

Tj = 25 °C; Fig. 8

VD = 12 V; IG = 0.1 A; T2- G+;

Tj = 25 °C; Fig. 8

VD = 12 V; IT = 0.1 A; Tj = 25 °C;

Fig. 11

VD = 400 V; IT = 0.1 A; Tj = 125 °C;

Fig. 11

VDM = 402 V; Tj = 125 °C; R

(VDM = 67% of V

); exponential

DRM

GT1

= 1 kΩ;

waveform

ITM = 12 A; VD = 600 V; IG = 0.1 A; dIG/

dt = 5 A/µs

- 3.5 5 mA

- 6.5 10 mA

- 1.6 15 mA

- 8.5 20 mA

- 1.2 15 mA

- 2.5 20 mA

- 0.7 1 VV

0.25 0.4 - V

- 5 - V/µs

- 2 - µs

Product data sheet 12 June 2014 7 / 13

NXP Semiconductors

Tj(°C)

- 60 14090- 10 40

003aae809

(1)

(2)

(3) (4)

(1)

(2) (3)

(4)

IGT(25 °C)

Tj(°C)

- 60 14090- 10 40

003aae697

L(25°C)

Tj(°C)

- 60 14090- 10 40

003aae699

1.0

0.5

1.5

2.0

H(25°C)

VT(V)

0 321

003aae696

(A)

(1)

(2) (3)

BT137S-600D

4Q Triac

(1) T2- G+ (2) T2- G-

Fig. 8. Normalized latching current as a function of

junction temperature

(3) T2+ G(4) T2+ G+

Fig. 7. Normalized gate trigger current as a function of

junction temperature

Fig. 9. Normalized holding current as a function of

junction temperature

Vo = 1.264 V

Rs = 0.038 Ω

(1) Tj = 125 °C; typical values

(2) Tj = 125 °C; maximum values

Fig. 10. On-state current as a function of on-state

(3) Tj = 25 °C; maximum values

voltage

Product data sheet 12 June 2014 8 / 13

NXP Semiconductors

Tj(°C)

- 60 14090- 10 40

003aae694

0.8

0.4

1.2

1.6

VGT(25°C)

Fig. 11. Normalized gate trigger voltage as a function of junction temperature

BT137S-600D

4Q Triac

Product data sheet 12 June 2014 9 / 13

NXP Semiconductors

References

Outline version

European projection

Issue date

IEC JEDEC JEITA

SOT428 SC-63

TO-252

sot428_po

06-03-16 14-06-10

Unit

max nom

min

2.38 0.93 1.1 5.46 0.56 6.22

4.57

0.9

Dimensions (mm are the original dimensions)

Note

1. Plastic body may have 45° chamfer.

Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped) SOT428

A1b

0.89

b1b2c D1D2E E1e

2.285

e1HDL

2.95

0.2

L2w

6.47 4.454.0 9.62.22 0.46 0.9 5.00 0.20 5.98 0.50.71 2.55 0.5

6.73 10.4 0.2

0 5 10 mm

scale

1 3

mounting base

w A

see Note 1

BT137S-600D

10. Package outline

4Q Triac

Fig. 12. Package outline DPAK (SOT428)

Product data sheet 12 June 2014 10 / 13

NXP Semiconductors

11. Legal information

11.1 Data sheet status

Document status [1][2]

Objective [short] data sheet

Preliminary [short] data sheet

Product [short] data sheet

[1] Please consult the most recently issued document before initiating or

completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the Internet at URL http://www.nxp.com.

Product status [3]

Development This document contains data from

Qualification This document contains data from the

Production This document contains the product

Definition

the objective specification for product development.

preliminary specification.

specification.

BT137S-600D

4Q Triac

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

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Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

11.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

11.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.

products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the

Product data sheet 12 June 2014 11 / 13

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grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.

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In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

BT137S-600D

4Q Triac

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, ICODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP

Semiconductors N.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation.

Product data sheet 12 June 2014 12 / 13

NXP Semiconductors

12. Contents

1 General description ............................................... 1

2 Features and benefits ............................................1

3 Applications ........................................................... 1

4 Quick reference data ............................................. 1

5 Pinning information ............................................... 2

6 Ordering information ............................................. 2

7 Limiting values .......................................................3

8 Thermal characteristics .........................................6

9 Characteristics .......................................................7

10 Package outline ................................................... 10

11 Legal information .................................................11

11.1 Data sheet status ............................................... 11

11.2 Definitions ...........................................................11

11.3 Disclaimers .........................................................11

11.4 Trademarks ........................................................ 12

BT137S-600D

4Q Triac

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 12 June 2014

Product data sheet 12 June 2014 13 / 13

NXP BT 137S-600D NXP Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features and benefits

3. Applications

4. Quick reference data

5. Pinning information

6. Ordering information

7. Limiting values

8. Thermal characteristics

9. Characteristics

10. Package outline

11. Legal information