NXP BT 137B/800 Datasheet

BT137B-800

D2PAK

1. Product profile

1.1 General description

1.2 Features and benefits

4Q Triac

Rev. 4 — 29 March 2011 Product data sheet

Planar passivated four quadrant triac in a SOT404 (DPAK) surface-mountable plastic
package intended for use in bidirectional switching and phase control applications.

 High blocking voltage capability
 Less sensitive gate for improved noise

immunity

 Planar passivated for voltage

ruggedness and reliability

 Surface-mountable package
 Triggering in all four quadrants

1.3 Applications

 General purpose motor control  General purpose switching

1.4 Quick reference data

Ta ble 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V

DRM

I

TSM

I

T(RMS)

Static characteristics

I

GT

repetitive peak
off-state voltage

non-repetitive
peak on-state
current

RMS on-state
current

gate trigger
current

full sine wave; T

= 20 ms; see Figure 4;

t

p

see Figure 5
full sine wave; Tmb≤ 102 °C;

see Figure 1
see Figure 3

VD=12V; IT= 0.1 A; T2+ G+;
T

=25°C; see Figure 7

j

=12V; IT= 0.1 A; T2+ G-;

V

D

=25°C; see Figure 7

T

j

V

=12V; IT= 0.1 A; T2- G-;

D

Tj=25°C; see Figure 7

=12V; IT= 0.1 A; T2- G+;

V

D

Tj=25°C; see Figure 7

; see Figure 2;

j(init)

=25°C;

--800V

--65A

--8A

-535mA

-835mA

-1135mA

- 3070mA

NXP Semiconductors

s

2. Pinning information

BT137B-800

4Q Triac

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1 T1 main terminal 1
2 T2 main terminal 2
3 G gate

mb

T2

ym051

mb T2 mounting base; main terminal

2

2

13

SOT404 (D2PAK)

3. Ordering information

Table 3. Ordering information

Type number Package

BT137B-800 D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads

Name Description Version

(one lead cropped)

T1

G

SOT404

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 4 — 29 March 2011 2 of 13

NXP Semiconductors

4. Limiting values

BT137B-800

4Q Triac

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V

DRM

I

T(RMS)

I

TSM

2

t I

I

/dt rate of rise of on-state current IT=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;

dI

T

I

GM

V

GM

P

GM

P

G(AV)

T

stg

T

j

repetitive peak off-state voltage - 800 V
RMS on-state current full sine wave; Tmb≤ 102 °C;

-8A

see Figure 1; see Figure 2; see Figure 3

non-repetitive peak on-state
current

2

t for fusing tp= 10 ms; sin-wave pulse - 21 A2s

full sine wave; T

= 20 ms; see Figure 4; see Figure 5

t

p

full sine wave; T
t

=16.7ms

p

j(init)

j(init)

=25°C;

=25°C;

-65A

-71A

-50A/µs

T2+ G+

=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;

I

T

-50A/µs

T2+ G­I

=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;

T

-50A/µs

T2- G-

=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;

I

T

-10A/µs

T2- G+
peak gate current - 2 A
peak gate voltage - 5 V
peak gate power - 5 W
average gate power over any 20 ms period - 0.5 W
storage temperature -40 150 °C
junction temperature - 125 °C

10

I

T(RMS)

(A)

8

6

4

2

0

−50 150100050

003aae689

Tmb (°C)

I

T(RMS)

(A)

25

20

15

10

5

0

−2

10

−1

10

1 10

003aae692

surge duration (s)

f = 50 Hz
Tmb ≤ 102 °C

Fig 1. RMS on-state current as a function of mounting

base temperature; maximum values

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 4 — 29 March 2011 3 of 13

Fig 2. RMS on-state current as a function of surge

duration; maximum values

NXP Semiconductors

BT137B-800

4Q Triac

12

conduction

P
(W)

angle

(degrees)

tot

8

4

0

0 108462

30
60

90
120
180

form

factor

a
4

2.8

2.2

1.9

1.57

α

Fig 3. Total power dissipation as a function of RMS on-state current; maximum values

3

10

I

TSM

(A)

2

10

= 180

α

120

90

60

30

I

°

°

°

°

T

T

j(init)

°

I

T(RMS)

t

p

= 25 °C max

003aae690

(A)

003aae691

I

TSM

t

(1)

(2)

10

−5

10

≤ 20 ms

t

p

(1) dI

/dt limit

T

−4

10

−3

10

−2

10

tp (s)

−1

10

(2) T2- G+ quadrant limit

Fig 4. Non-repetitive peak on-state current as a function of pulse width; maximum values

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 4 — 29 March 2011 4 of 13

NXP Semiconductors

BT137B-800

4Q Triac

80

I

TSM

(A)

60

40

I

T

20

T

0

1 10

10 10

2

3

10

j(init)

number of cycles

003aae693

I

TSM

1/f

= 25 °C max

t

4

f = 50 Hz

Fig 5. Non-repetitive peak on-state current as a function of the number of sinusoid al curr ent cycles; maximum

values

5. Thermal characteristics

Table 5. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

R

th(j-mb)

thermal resistance
from junction to
mounting base

R

th(j-a)

thermal resistance
from junction to
ambient

half cycle; see Figure 6 --2.4K/W
full cycle; see Figure 6

PCB (FR4) mounted; minimum pad

--2K/W

-55-K/W

sizes

003aae698

tp (s)

Z

th(j-mb)

(K/W)

10

1

-1

10

-2

10

-5

10

-4

10

unidirectional

-3

10

10

-2

bidirectional

-1

11010

Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 4 — 29 March 2011 5 of 13

NXP Semiconductors

6. Characteristics

BT137B-800

4Q Triac

Table 6. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

I

GT

gate trigger current VD=12V; IT= 0.1 A; T2+ G+;

-535mA

Tj=25°C; see Figure 7

=12V; IT= 0.1 A; T2+ G-;

V

D

=25°C; see Figure 7

T

j

V

=12V; IT= 0.1 A; T2- G-;

D

T

=25°C; see Figure 7

j

=12V; IT= 0.1 A; T2- G+;

V

D

-835mA

-1135mA

- 3070mA

Tj=25°C; see Figure 7

I

L

latching current VD=12V; IG= 0.1 A; T2+ G+;

=25°C; see Figure 8

T

j

V

=12V; IG= 0.1 A; T2+ G-;

D

-730mA

- 1645mA

Tj=25°C; see Figure 8

=12V; IG= 0.1 A; T2- G-;

V

D

-530mA

Tj=25°C; see Figure 8

=12V; IG= 0.1 A; T2- G+;

V

D

=25°C; see Figure 8

T

j

I

H

V

T

V

GT

holding current VD=12V; Tj=25°C; see Figure 9 -520mA
on-state voltage IT=10A; Tj= 25 °C; see Figure 10 - 1.3 1.65 V
gate trigger voltage VD=12V; IT= 0.1 A; Tj=25°C;

-745mA

-0.71.5V

see Figure 11

=400V; IT= 0.1 A; Tj=125°C;

V

D

0.25 0.4 - V

see Figure 11

I

D

off-state current VD=800V; Tj= 125 °C - 0.1 0.5 mA

Dynamic characteristi cs

/dt rate of rise of off-state

dV

D

voltage

/dt rate of change of

dV

com

commutating voltage

VDM=536V; Tj= 125 °C; exponential
waveform; gate open circuit

VD=400V; Tj=95°C;
dI

/dt = 3.6 A/ms; IT= 8 A; gate open

com

100 250 - V/µs

-20-V/µs

circuit

t

gt

gate-controlled turn-on
time

ITM=12A; VD= 800 V; IG= 0.1 mA;

/dt = 5 A/µs

dI

G

-2-µs

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 4 — 29 March 2011 6 of 13

NXP Semiconductors

BT137B-800

4Q Triac

3

I

GT

IGT (25 °C)

2

1

0

−60 14090−10 40

(1)
(2)

(3)
(4)

003aae809

(1)

(2)
(3)

(4)

Tj (°C)

(1) T2- G+
(2) T2- G­(3) T2+ G­(4) T2+ G+

Fig 7. Normalized gate trigger current as a function of

junction temperature

003aae699

I

H

I

H(25°C)

2.0

1.5

3

I

L

I

L(25°C)

2

1

0

−60 14090−10 40

003aae697

Tj (°C)

Fig 8. Normalized latching current as a function of

junction temperature

003aae696

(A)

30

I

T

20

1.0

10

0.5

0

−60 14090−10 40
Tj (°C)

0

0321

V

= 1.264 V

o

R
(1) T

(1)

(2) (3)

= 0.038 Ω

s

= 125 °C; typical values

j

VT (V)

(2) Tj = 125 °C; maximum values
(3) T

= 25 °C; maximum values

j

Fig 9. Normalized holding current as a function of

junction temperature

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 4 — 29 March 2011 7 of 13

Fig 10. On-state current as a function of on-state

voltage

NXP Semiconductors

BT137B-800

4Q Triac

1.6

V

GT

V

(25°C)

GT

1.2

0.8

0.4

0

−60 14090−10 40

003aae694

Tj (°C)

Fig 11. Normalized gate trigger voltage as a function of junction temperature

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 4 — 29 March 2011 8 of 13

NXP Semiconductors

4

7. Package outline

BT137B-800

4Q Triac

Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)

E

D

1

D

H

D

mounting

base

2

L

13

SOT40

A

A

1

p

e e

DIMENSIONS (mm are the original dimensions)

0.64

0.46

D

max.

11

UNIT

mm

A

4.50

4.10

OUTLINE
VERSION

SOT404

A

1.40

1.27

b

1

0.85

0.60

IEC JEDEC JEITA

Fig 12. Package outline SOT404 (D2PAK)

D

1

1.60

10.30

1.20

9.70

REFERENCES

b

0 2.5 5 mm

scale

E

eLpH

2.90

2.54

2.10

D

15.80

14.80

Qc

2.60

2.20

c

Q

EUROPEAN

PROJECTION

ISSUE DATE

05-02-11
06-03-16

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 4 — 29 March 2011 9 of 13

NXP Semiconductors

8. Revision history

BT137B-800

4Q Triac

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BT137B-800 v.4 201 10329 Product data sheet - BT137B_SERIES_3
Modifications:

• The format of this data sheet has been redesigned to comply with the new identity guidelines

of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Type number BT137B-800 separated from data sheet BT137B_SERIES_3.

BT137B_SERIES_3 20110601 Product specification - BT137B_SERIES_2

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 4 — 29 March 2011 10 of 13

NXP Semiconductors

BT137B-800

4Q Triac

9. Legal information

9.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) descr ibed in this document may have changed since this document was publish ed and may differ in case of multiple devices. The latest product

status information is available on the Internet at URL http://www.nxp.com.

[1] [2]

Product status

[3]

Definition

9.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied u pon to co nt ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.

Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.

9.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.

Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonabl y be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteri stics sections of this
document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.

Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.

NXP Semiconductors does not accept any liability related to any default ,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third part y
customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.

Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective

, unless otherwise

Product data sheet Rev. 4 — 29 March 2011 11 of 13

NXP Semiconductors

BT137B-800

4Q Triac

agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpret ed or
construed as an offer to sell products that is open f or acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.

Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neither qua lif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equ ipment or applications.

In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, da mages or failed produ ct cl aims resulting from custome r design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.

9.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trad emarks
are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

10. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]

BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.

Product data sheet Rev. 4 — 29 March 2011 12 of 13

NXP Semiconductors

11. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6

7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9

8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .10

9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .11

9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .11

9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .11

9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12

10 Contact information. . . . . . . . . . . . . . . . . . . . . .12

BT137B-800

4Q Triac

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2011. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]

Date of release: 29 March 2011

Document identifier: BT13 7B-800