NXP BT 137B/800 Datasheet

Page 1
BT137B-800
D2PAK

1. Product profile

1.1 General description

1.2 Features and benefits

4Q Triac
Rev. 4 — 29 March 2011 Product data sheet
Planar passivated four quadrant triac in a SOT404 (DPAK) surface-mountable plastic package intended for use in bidirectional switching and phase control applications.
High blocking voltage capabilityLess sensitive gate for improved noise
Planar passivated for voltage
ruggedness and reliability
Surface-mountable packageTriggering in all four quadrants

1.3 Applications

General purpose motor control General purpose switching

1.4 Quick reference data

Ta ble 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
DRM
I
TSM
I
T(RMS)
Static characteristics
I
GT
repetitive peak off-state voltage
non-repetitive peak on-state current
RMS on-state current
gate trigger current
full sine wave; T
= 20 ms; see Figure 4;
t
p
see Figure 5 full sine wave; Tmb≤ 102 °C;
see Figure 1 see Figure 3
VD=12V; IT= 0.1 A; T2+ G+; T
=25°C; see Figure 7
j
=12V; IT= 0.1 A; T2+ G-;
V
D
=25°C; see Figure 7
T
j
V
=12V; IT= 0.1 A; T2- G-;
D
Tj=25°C; see Figure 7
=12V; IT= 0.1 A; T2- G+;
V
D
Tj=25°C; see Figure 7
; see Figure 2;
j(init)
=25°C;
--800V
--65A
--8A
-535mA
-835mA
-1135mA
- 3070mA
Page 2
NXP Semiconductors
s

2. Pinning information

BT137B-800
4Q Triac
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 T1 main terminal 1 2 T2 main terminal 2 3 G gate
mb
T2
ym051
mb T2 mounting base; main terminal
2
2
13
SOT404 (D2PAK)

3. Ordering information

Table 3. Ordering information
Type number Package
BT137B-800 D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads
Name Description Version
(one lead cropped)
T1
G
SOT404
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 2 of 13
Page 3
NXP Semiconductors

4. Limiting values

BT137B-800
4Q Triac
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DRM
I
T(RMS)
I
TSM
2
t I
I
/dt rate of rise of on-state current IT=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;
dI
T
I
GM
V
GM
P
GM
P
G(AV)
T
stg
T
j
repetitive peak off-state voltage - 800 V RMS on-state current full sine wave; Tmb≤ 102 °C;
-8A
see Figure 1; see Figure 2; see Figure 3
non-repetitive peak on-state current
2
t for fusing tp= 10 ms; sin-wave pulse - 21 A2s
full sine wave; T
= 20 ms; see Figure 4; see Figure 5
t
p
full sine wave; T t
=16.7ms
p
j(init)
j(init)
=25°C;
=25°C;
-65A
-71A
-50A/µs
T2+ G+
=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;
I
T
-50A/µs
T2+ G­I
=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;
T
-50A/µs
T2- G-
=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;
I
T
-10A/µs
T2- G+ peak gate current - 2 A peak gate voltage - 5 V peak gate power - 5 W average gate power over any 20 ms period - 0.5 W storage temperature -40 150 °C junction temperature - 125 °C
10
I
T(RMS)
(A)
8
6
4
2
0
50 150100050
003aae689
Tmb (°C)
I
T(RMS)
(A)
25
20
15
10
5
0
2
10
1
10
1 10
003aae692
surge duration (s)
f = 50 Hz Tmb 102 °C
Fig 1. RMS on-state current as a function of mounting
base temperature; maximum values
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 3 of 13
Fig 2. RMS on-state current as a function of surge
duration; maximum values
Page 4
NXP Semiconductors
BT137B-800
4Q Triac
12
conduction
P (W)
angle
(degrees)
tot
8
4
0
0 108462
30 60
90 120 180
form
factor
a 4
2.8
2.2
1.9
1.57
α
Fig 3. Total power dissipation as a function of RMS on-state current; maximum values
3
10
I
TSM
(A)
2
10
= 180
α
120
90
60
30
I
°
°
°
°
T
T
j(init)
°
I
T(RMS)
t
p
= 25 °C max
003aae690
(A)
003aae691
I
TSM
t
(1)
(2)
10
5
10
20 ms
t
p
(1) dI
/dt limit
T
4
10
3
10
2
10
tp (s)
1
10
(2) T2- G+ quadrant limit
Fig 4. Non-repetitive peak on-state current as a function of pulse width; maximum values
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 4 of 13
Page 5
NXP Semiconductors
BT137B-800
4Q Triac
80
I
TSM
(A)
60
40
I
T
20
T
0
1 10
10 10
2
3
10
j(init)
number of cycles
003aae693
I
TSM
1/f
= 25 °C max
t
4
f = 50 Hz
Fig 5. Non-repetitive peak on-state current as a function of the number of sinusoid al curr ent cycles; maximum
values

5. Thermal characteristics

Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from junction to mounting base
R
th(j-a)
thermal resistance from junction to ambient
half cycle; see Figure 6 --2.4K/W full cycle; see Figure 6
PCB (FR4) mounted; minimum pad
--2K/W
-55-K/W
sizes
003aae698
tp (s)
Z
th(j-mb)
(K/W)
10
1
-1
10
-2
10
-5
10
-4
10
unidirectional
-3
10
10
-2
bidirectional
-1
11010
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 5 of 13
Page 6
NXP Semiconductors

6. Characteristics

BT137B-800
4Q Triac
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
I
GT
gate trigger current VD=12V; IT= 0.1 A; T2+ G+;
-535mA
Tj=25°C; see Figure 7
=12V; IT= 0.1 A; T2+ G-;
V
D
=25°C; see Figure 7
T
j
V
=12V; IT= 0.1 A; T2- G-;
D
T
=25°C; see Figure 7
j
=12V; IT= 0.1 A; T2- G+;
V
D
-835mA
-1135mA
- 3070mA
Tj=25°C; see Figure 7
I
L
latching current VD=12V; IG= 0.1 A; T2+ G+;
=25°C; see Figure 8
T
j
V
=12V; IG= 0.1 A; T2+ G-;
D
-730mA
- 1645mA
Tj=25°C; see Figure 8
=12V; IG= 0.1 A; T2- G-;
V
D
-530mA
Tj=25°C; see Figure 8
=12V; IG= 0.1 A; T2- G+;
V
D
=25°C; see Figure 8
T
j
I
H
V
T
V
GT
holding current VD=12V; Tj=25°C; see Figure 9 -520mA on-state voltage IT=10A; Tj= 25 °C; see Figure 10 - 1.3 1.65 V gate trigger voltage VD=12V; IT= 0.1 A; Tj=25°C;
-745mA
-0.71.5V
see Figure 11
=400V; IT= 0.1 A; Tj=125°C;
V
D
0.25 0.4 - V
see Figure 11
I
D
off-state current VD=800V; Tj= 125 °C - 0.1 0.5 mA
Dynamic characteristi cs
/dt rate of rise of off-state
dV
D
voltage
/dt rate of change of
dV
com
commutating voltage
VDM=536V; Tj= 125 °C; exponential waveform; gate open circuit
VD=400V; Tj=95°C; dI
/dt = 3.6 A/ms; IT= 8 A; gate open
com
100 250 - V/µs
-20-V/µs
circuit
t
gt
gate-controlled turn-on time
ITM=12A; VD= 800 V; IG= 0.1 mA;
/dt = 5 A/µs
dI
G
-2-µs
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 6 of 13
Page 7
NXP Semiconductors
BT137B-800
4Q Triac
3
I
GT
IGT (25 °C)
2
1
0
60 14090−10 40
(1) (2)
(3) (4)
003aae809
(1)
(2) (3)
(4)
Tj (°C)
(1) T2- G+ (2) T2- G­(3) T2+ G­(4) T2+ G+
Fig 7. Normalized gate trigger current as a function of
junction temperature
003aae699
I
H
I
H(25°C)
2.0
1.5
3
I
L
I
L(25°C)
2
1
0
60 14090−10 40
003aae697
Tj (°C)
Fig 8. Normalized latching current as a function of
junction temperature
003aae696
(A)
30
I
T
20
1.0
10
0.5
0
60 14090−10 40 Tj (°C)
0
0321
V
= 1.264 V
o
R (1) T
(1)
(2) (3)
= 0.038
s
= 125 °C; typical values
j
VT (V)
(2) Tj = 125 °C; maximum values (3) T
= 25 °C; maximum values
j
Fig 9. Normalized holding current as a function of
junction temperature
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 7 of 13
Fig 10. On-state current as a function of on-state
voltage
Page 8
NXP Semiconductors
BT137B-800
4Q Triac
1.6
V
GT
V
(25°C)
GT
1.2
0.8
0.4
0
60 14090−10 40
003aae694
Tj (°C)
Fig 11. Normalized gate trigger voltage as a function of junction temperature
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 8 of 13
Page 9
NXP Semiconductors
4

7. Package outline

BT137B-800
4Q Triac
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
E
D
1
D
H
D
mounting
base
2
L
13
SOT40
A
A
1
p
e e
DIMENSIONS (mm are the original dimensions)
0.64
0.46
D
max.
11
UNIT
mm
A
4.50
4.10
OUTLINE VERSION
SOT404
A
1.40
1.27
b
1
0.85
0.60
IEC JEDEC JEITA
Fig 12. Package outline SOT404 (D2PAK)
D
1
1.60
10.30
1.20
9.70
REFERENCES
b
0 2.5 5 mm
scale
E
eLpH
2.90
2.54
2.10
D
15.80
14.80
Qc
2.60
2.20
c
Q
EUROPEAN
PROJECTION
ISSUE DATE
05-02-11 06-03-16
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 9 of 13
Page 10
NXP Semiconductors

8. Revision history

BT137B-800
4Q Triac
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BT137B-800 v.4 201 10329 Product data sheet - BT137B_SERIES_3 Modifications:
The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Type number BT137B-800 separated from data sheet BT137B_SERIES_3.
BT137B_SERIES_3 20110601 Product specification - BT137B_SERIES_2
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 10 of 13
Page 11
NXP Semiconductors
BT137B-800
4Q Triac

9. Legal information

9.1 Data sheet status

Document status
Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) descr ibed in this document may have changed since this document was publish ed and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
[1] [2]
Product status
[3]
Definition

9.2 Definitions

Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied u pon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

9.3 Disclaimers

Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonabl y be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteri stics sections of this document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective
, unless otherwise
Product data sheet Rev. 4 — 29 March 2011 11 of 13
Page 12
NXP Semiconductors
BT137B-800
4Q Triac
agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpret ed or construed as an offer to sell products that is open f or acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It i s neither qua lif ied nor test ed in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equ ipment or applications.
In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, da mages or failed produ ct cl aims resulting from custome r design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

9.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trad emarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.

10. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 12 of 13
Page 13
NXP Semiconductors

11. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .10
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .11
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .11
9.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .11
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12
10 Contact information. . . . . . . . . . . . . . . . . . . . . .12
BT137B-800
4Q Triac
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 March 2011
Document identifier: BT13 7B-800
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