
BT137B-800
D2PAK
1. Product profile
1.1 General description
1.2 Features and benefits
4Q Triac
Rev. 4 — 29 March 2011 Product data sheet
Planar passivated four quadrant triac in a SOT404 (DPAK) surface-mountable plastic
package intended for use in bidirectional switching and phase control applications.
High blocking voltage capability
Less sensitive gate for improved noise
immunity
Planar passivated for voltage
ruggedness and reliability
Surface-mountable package
Triggering in all four quadrants
1.3 Applications
General purpose motor control General purpose switching
1.4 Quick reference data
Ta ble 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
DRM
I
TSM
I
T(RMS)
Static characteristics
I
GT
repetitive peak
off-state voltage
non-repetitive
peak on-state
current
RMS on-state
current
gate trigger
current
full sine wave; T
= 20 ms; see Figure 4;
t
p
see Figure 5
full sine wave; Tmb≤ 102 °C;
see Figure 1
see Figure 3
VD=12V; IT= 0.1 A; T2+ G+;
T
=25°C; see Figure 7
j
=12V; IT= 0.1 A; T2+ G-;
V
D
=25°C; see Figure 7
T
j
V
=12V; IT= 0.1 A; T2- G-;
D
Tj=25°C; see Figure 7
=12V; IT= 0.1 A; T2- G+;
V
D
Tj=25°C; see Figure 7
; see Figure 2;
j(init)
=25°C;
--800V
--65A
--8A
-535mA
-835mA
-1135mA
- 3070mA

NXP Semiconductors
2. Pinning information
BT137B-800
4Q Triac
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 T1 main terminal 1
2 T2 main terminal 2
3 G gate
mb
T2
ym051
mb T2 mounting base; main terminal
2
2
13
SOT404 (D2PAK)
3. Ordering information
Table 3. Ordering information
Type number Package
BT137B-800 D2PAK plastic single-ended surface-mounted package (D2PAK); 3 leads
Name Description Version
(one lead cropped)
T1
G
SOT404
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 2 of 13

NXP Semiconductors
4. Limiting values
BT137B-800
4Q Triac
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DRM
I
T(RMS)
I
TSM
2
t I
I
/dt rate of rise of on-state current IT=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;
dI
T
I
GM
V
GM
P
GM
P
G(AV)
T
stg
T
j
repetitive peak off-state voltage - 800 V
RMS on-state current full sine wave; Tmb≤ 102 °C;
-8A
see Figure 1; see Figure 2; see Figure 3
non-repetitive peak on-state
current
2
t for fusing tp= 10 ms; sin-wave pulse - 21 A2s
full sine wave; T
= 20 ms; see Figure 4; see Figure 5
t
p
full sine wave; T
t
=16.7ms
p
j(init)
j(init)
=25°C;
=25°C;
-65A
-71A
-50A/µs
T2+ G+
=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;
I
T
-50A/µs
T2+ GI
=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;
T
-50A/µs
T2- G-
=12A; IG= 0.2 A; dIG/dt = 0.2 A/µs;
I
T
-10A/µs
T2- G+
peak gate current - 2 A
peak gate voltage - 5 V
peak gate power - 5 W
average gate power over any 20 ms period - 0.5 W
storage temperature -40 150 °C
junction temperature - 125 °C
10
I
T(RMS)
(A)
8
6
4
2
0
−50 150100050
003aae689
Tmb (°C)
I
T(RMS)
(A)
25
20
15
10
5
0
−2
10
−1
10
1 10
003aae692
surge duration (s)
f = 50 Hz
Tmb ≤ 102 °C
Fig 1. RMS on-state current as a function of mounting
base temperature; maximum values
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 3 of 13
Fig 2. RMS on-state current as a function of surge
duration; maximum values

NXP Semiconductors
BT137B-800
4Q Triac
12
conduction
P
(W)
angle
(degrees)
tot
8
4
0
0 108462
30
60
90
120
180
form
factor
a
4
2.8
2.2
1.9
1.57
α
Fig 3. Total power dissipation as a function of RMS on-state current; maximum values
3
10
I
TSM
(A)
2
10
= 180
α
120
90
60
30
I
°
°
°
°
T
T
j(init)
°
I
T(RMS)
t
p
= 25 °C max
003aae690
(A)
003aae691
I
TSM
t
(1)
(2)
10
−5
10
≤ 20 ms
t
p
(1) dI
/dt limit
T
−4
10
−3
10
−2
10
tp (s)
−1
10
(2) T2- G+ quadrant limit
Fig 4. Non-repetitive peak on-state current as a function of pulse width; maximum values
BT137B-800 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 29 March 2011 4 of 13