NXP BFS 20 SMD Datasheet

DISCRETE SEMICONDUCTORS

DATA SH EET

BFS20

NPN medium frequency transistor

Product specification
Supersedes data of 2004 Jan 5

2004 Feb 05

Philips Semiconductors Product specification

NPN medium frequency transistor BFS20

FEATURES

• I

• V

C(max)

CEO(max)

=25mA

=20V

• Very low feedback capacitance (typ. 350 fF).

APPLICATIONS

• IF and VHF thick and thin-film circuit applications.

DESCRIPTION

NPN medium frequency transistor in a SOT23 plastic
package.

MARKING

TYPE NUMBER MARKING CODE

BFS20 G1*

Note

1. * = p : Made in Hong Kong.
* = t : Made in Malaysia.
* = W : Made in China.

(1)

PINNING

PIN DESCRIPTION

1 base
2 emitter
3 collector

handbook, halfpage

Top view

3

21

MAM255

Fig.1 Simplified outline (SOT23) and symbol.

3

1

2

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

BFS20 − plastic surface mounted package; 3 leads SOT23

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
V
V
I
I
P
T
T
T

CBO
CEO

EBO
C
CM

tot

stg

j

amb

collector-base voltage open emitter − 30 V
collector-emitter voltage open base − 20 V
emitter-base voltage open collector − 4V
collector current (DC) − 25 mA
peak collector current − 25 mA
total power dissipation T

≤ 25 °C; note 1 − 250 mW

amb

storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C

Note

1. Transistor mounted on an FR4 printed-circuit board.

2004 Feb 05 2

Philips Semiconductors Product specification

NPN medium frequency transistor BFS20

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

Note

1. Transistor mounted on an FR4 printed-circuit board.

CHARACTERISTICS

Tj=25°C unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

CBO

I

EBO

h

FE

V

BE

C

c

C

re

f

T

thermal resistance from junction to ambient note 1 500 K/W

collector-base cut-off current IE= 0; VCB=20V −−100 nA

IE= 0; VCB=20V; Tj= 100 °C −−10 µA
emitter-base cut-off current IC= 0; VEB=4V −−100 nA
DC current gain IC= 7 mA; VCE= 10 V 40 85 −
base-emitter voltage IC= 7 mA; VCE=10V − 740 900 mV
collector capacitance IE=Ie= 0; VCB= 10 V; f = 1 MHz − 1 − pF
feedback capacitance IC= 0; VCB= 10 V; f = 1 MHz − 350 − fF
transition frequency IC= 5 mA; VCE= 10 V; f = 100 MHz 275 450 − MHz

2004 Feb 05 3

Philips Semiconductors Product specification

NPN medium frequency transistor BFS20

PACKAGE OUTLINE

Plastic surface mounted package; 3 leads SOT23

D

3

A

A

1

12

e

1

b

p

e

w

M

B

E

H

E

detail X

AB

Q

L

p

X

v

M

A

c

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

A

1

UNIT

A

1.1

mm

0.9

OUTLINE
VERSION

SOT23 TO-236AB

max.

0.1

b

cD

p

0.48

0.15

0.09

3.0

2.8

0.38

IEC JEDEC EIAJ

e

E

1.4

1.9

1.2

REFERENCES

0.95

e

1

2004 Feb 05 4

H

2.5

2.1

L

Qwv

p

E

0.55

0.45

0.15

0.45

0.2

0.1

EUROPEAN

PROJECTION

ISSUE DATE

97-02-28
99-09-13

Philips Semiconductors Product specification

NPN medium frequency transistor BFS20

DATA SHEET STATUS

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

I Objective data Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

II Preliminary data Qualification This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III Product data Production This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For datasheets describing multiple type numbers, the highest-level product status determines the data sheet status.

DEFINITIONS

DISCLAIMERS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or atanyother conditions above thosegivenin the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationor warranty that suchapplicationswillbe
suitable for the specified use without further testing or
modification.

Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expectedto result in personal injury.Philips
Semiconductorscustomersusing or selling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes in the products ­including circuits, standard cells, and/or software ­described or contained herein in order to improve design
and/or performance. When the productis infull production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

2004 Feb 05 5

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Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: [phone]
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© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands R75/05/pp6 Date of release: 2004 Feb 05 Document order number: 9397 750 12769

SCA76