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BCP 69-25 SMD
Datasheet
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NXP BCP 69-25 SMD Datasheet

BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
Rev. 7 — 12 October 2011 Product data sheet

1. Product profile

1.1 General description

PNP medium power transistor series in Surface-M ounted De vice (SMD) plastic packages.
Table 1. Product overview
Type number
BCP69 SOT223 SC-73 - BCP68 BC869 SOT89 SC-62 TO-243 BC868 BC69PA SOT1061 - - BC68PA
[1] Valid for all available selection groups.
[1]
Package NPN complement NXP JEITA JEDEC

1.2 Features and benefits

High currentThree current gain selectionsHigh power dissipation capabilityExposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)Leadless very small SMD plastic package with medium power capability (SOT1061)AEC-Q101 qualified

1.3 Applications

Linear voltage regulators Power managementHigh-side switches MOSFET driversBattery-driven devices Amplifiers

1.4 Quick reference data

Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V I I
CEO C CM
collector-emitter voltage open base - - 20 V collector current - - 2A peak collector current single pulse; tp 1ms - - 3A
NXP Semiconductors
132
4
sym028
2, 4
3
1
321
006aaa231
2
1
3
Transparent top view
12
3
sym013
3
2
1
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
h
FE
[1] Pulse test: tp 300 s;  = 0.02.
DC current gain VCE= 1V;

2. Pinning information

Table 3. Pinning
Pin Description Simplified outline Graphic symbol
SOT223
1base 2 collector 3emitter 4 collector
…continued
= 500 mA
I
C
h
selection -16 VCE= 1V;
FE
IC= 500 mA
selection -25 VCE= 1V;
h
FE
IC= 500 mA
[1]
85 - 375
[1]
100 - 250
[1]
160 - 375
SOT89
1emitter 2 collector 3base
SOT1061
1base 2emitter 3 collector
BCP69_BC869_BC69PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 12 October 2011 2 of 24
NXP Semiconductors

3. Ordering information

Table 4. Ordering information
Type number
BCP69 SC-73 plastic surface-mounted package with increased
BC869 SC-62 plastic surface-mounted package; exposed die pad for
BC69PA HUSON3 plastic thermal enhanced ultra thin small outline
[1] Valid for all available selection groups.

4. Marking

Table 5. Marking codes
Type number Marking code
BCP69 BCP69 BCP69-16 BCP69/16 BCP69-25 BCP69/25 BC869 CEC BC869-16 CGC BC869-25 CHC BC69PA B3 BC69-16PA BM BC69-25PA BN
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
[1]
Package Name Description Version
heatsink; 4 leads
good heat transfer; 3 leads
package; no leads; 3 terminals; body 2  2  0.65 mm
SOT223
SOT89
SOT1061
BCP69_BC869_BC69PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 12 October 2011 3 of 24
NXP Semiconductors

5. Limiting values

Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
B
I
BM
P
tot
T
j
T
amb
T
stg
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
collector-base voltage open emitter - 32 V collector-emitter voltage open base - 20 V emitter-base voltage open collector - 5V collector current - 2A peak collector current single pulse;
1ms
t
p
base current - 0.4 A peak base current single pulse;
tp 1ms
total power dissipation T
amb
25 C
BCP69
BC869
BC69PA
junction temperature - 150 C ambient temperature 55 +150 C storage temperature 65 +150 C
- 3A
- 0.4 A
[1]
-0.65W
[2]
-1.00W
[3]
-1.35W
[1]
-0.50W
[2]
-0.95W
[3]
-1.35W
[1]
-0.42W
[2]
-0.83W
[3]
-1.10W
[4]
-0.81W
[5]
-1.65W
2
.
2
.
2
.
BCP69_BC869_BC69PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 12 October 2011 4 of 24
NXP Semiconductors
T
amb
(°C)
–75 17512525 75–25
006aac676
1.0
0.5
1.5
2.0
P
tot
(W)
0.0
(1)
(2)
(3) (4)
(5)
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
1.5
P
tot
(W)
1.0
0.5
0.0 –75 17512525 75–25
(1)
(2)
(3)
(1) FR4 PCB, mounting pad for collector 6 cm (2) FR4 PCB, mounting pad for collector 1 cm (3) FR4 PCB, standard footprint
006aac674
T
(°C)
amb
1.5
(1)
P
tot
(W)
1.0
0.5
0.0 –75 17512525 75–25
2 2
(1) FR4 PCB, mounting pad for collector 6 cm (2) FR4 PCB, mounting pad for collector 1 cm
(2)
(3)
(3) FR4 PCB, standard footprint
Fig 1. Power derating curves SOT223 Fig 2. Power derating curves SOT89
006aac675
T
(°C)
amb
2 2
(1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm (2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm (3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm
2
2 2
(4) FR4 PCB, 4-layer copper, standard footprint (5) FR4 PCB, single-sided copper, standard footprint
Fig 3. Power derating curves SOT1061
BCP69_BC869_BC69PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 12 October 2011 5 of 24
NXP Semiconductors

6. Thermal characteristics

Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
R
th(j-sp)
thermal resistance from junction to ambient
BCP69
BC869
BC69PA
thermal resistance from junction to solder point
BCP69 - - 16 K/W BC869 - - 16 K/W BC69PA - - 20 K/W
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
in free air
[1]
--192K/W
[2]
--125K/W
[3]
--93K/W
[1]
--250K/W
[2]
--132K/W
[3]
--93K/W
[1]
--298K/W
[2]
--151K/W
[3]
--114K/W
[4]
--154K/W
[5]
--76K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm
2
.
2
.
2
.
BCP69_BC869_BC69PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 12 October 2011 6 of 24
NXP Semiconductors
006aac677
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
–1
10
–5
1010
–2
10
–4
10
2
10
–1
tp (s)
10
–3
10
3
1
0
duty cycle = 1
0.01
0.02
0.05
0.1
0.2
0.33
0.5
0.75
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
FR4 PCB, standard footprint
Fig 4. Transi en t the rmal impe da n ce from ju nc tio n to ambient as a function of pulse duration for SOT223;
typical values
3
10
Z
th(j-a)
(K/W)
10
10
2
10
1
–1
–5
10
duty cycle = 1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0
0.01
10
–4
FR4 PCB, mounting pad for collector 1 cm
–3
10
–2
2
–1
10
1
1010
006aac678
2
10
tp (s)
Fig 5. Transi en t the rmal impe da n ce from ju nc tio n to ambient as a function of pulse duration for SOT223;
typical values
BCP69_BC869_BC69PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 12 October 2011 7 of 24
3
10
NXP Semiconductors
006aac679
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
–1
10
–5
1010
–2
10
–4
10
2
10
–1
tp (s)
10
–3
10
3
1
0
duty cycle = 1
0.01
0.02
0.05
0.1
0.2
0.33
0.5
0.75
006aac680
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
–1
10
–5
1010
–2
10
–4
10
2
10
–1
tp (s)
10
–3
10
3
1
0
duty cycle = 1
0.01
0.02
0.05
0.1
0.2
0.33
0.5
0.75
BCP69; BC869; BC69PA
20 V, 2 A PNP medium power transistors
FR4 PCB, mounting pad for collector 6 cm
2
Fig 6. Transi en t the rmal impe da n ce from ju nc tio n to ambient as a function of pulse duration for SOT223;
typical values
FR4 PCB, standard footprint
Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;
typical values
BCP69_BC869_BC69PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 12 October 2011 8 of 24
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