NXP BCP 56-10 SMD Datasheet
DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D087
BCP54; BCP55; BCP56
NPN medium power transistors
Product specification
Supersedes data of 2001 Oct 10
2003 Feb 06
Philips Semiconductors Product specification
NPN medium power transistors BCP54; BCP55; BCP56
FEATURES
• High collector current
• 1.3 W power dissipation.
PINNING
PIN DESCRIPTION
1 base
2, 4 collector
APPLICATIONS
3 emitter
• General purpose medium power DC applications
• Low and medium frequency AC applications
• Peripheral drivers
handbook, halfpage
4
• Linear voltage regulators and battery chargers.
1
DESCRIPTION
NPN medium power transistor in a SOT223 plastic
package. PNPcomplements: BCP51, BCP52 and BCP53.
123
Top view
MAM287
Fig.1 Simplified outline (SOT223) and symbol.
QUICK REFERENCE DATA
SYMBOL PARAMETER MAX. UNIT
V
I
I
CEO
C
CM
collector-emitter voltage 80 V
collector current (DC) 1 A
peak collector current 1.5 A
2, 4
3
2003 Feb 06 2
Philips Semiconductors Product specification
NPN medium power transistors BCP54; BCP55; BCP56
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
collector-base voltage open emitter
BCP54 − 45 V
BCP55 − 60 V
BCP56 − 100 V
collector-emitter voltage open base
BCP54 − 45 V
BCP55 − 60 V
BCP56 − 80 V
emitter-base voltage open collector − 5V
collector current (DC) − 1A
peak collector current − 1.5 A
peak base current − 0.2 A
total power dissipation T
≤ 25 °C; note 1 − 1.33 W
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C
Note
1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm
For other mounting conditions, see
“Thermal considerations for SOT223 in the General Part of associated
2
Handbook”.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
R
th j-a
th j-s
thermal resistance from junction to ambient note 1 94 K/W
thermal resistance from junction to soldering point 13 K/W
Note
1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm
For other mounting conditions, see
“Thermal considerations for SOT223 in the General Part of associated
2
Handbook”.
.
.
2003 Feb 06 3
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