Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D087
BCP54; BCP55; BCP56
NPN medium power transistors
Product specification
Supersedes data of 2001 Oct 10
2003 Feb 06
Page 2
Philips Semiconductors Product specification
NPN medium power transistors BCP54; BCP55; BCP56
FEATURES
• High collector current
• 1.3 W power dissipation.
PINNING
PIN DESCRIPTION
1 base
2, 4 collector
APPLICATIONS
3 emitter
• General purpose medium power DC applications
• Low and medium frequency AC applications
• Peripheral drivers
handbook, halfpage
4
• Linear voltage regulators and battery chargers.
1
DESCRIPTION
NPN medium power transistor in a SOT223 plastic
package. PNPcomplements: BCP51, BCP52 and BCP53.
123
Top view
MAM287
Fig.1 Simplified outline (SOT223) and symbol.
QUICK REFERENCE DATA
SYMBOL PARAMETER MAX. UNIT
V
I
I
CEO
C
CM
collector-emitter voltage 80 V
collector current (DC) 1 A
peak collector current 1.5 A
2, 4
3
2003 Feb 06 2
Page 3
Philips Semiconductors Product specification
NPN medium power transistors BCP54; BCP55; BCP56
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
collector-base voltage open emitter
BCP54 − 45 V
BCP55 − 60 V
BCP56 − 100 V
collector-emitter voltage open base
BCP54 − 45 V
BCP55 − 60 V
BCP56 − 80 V
emitter-base voltage open collector − 5V
collector current (DC) − 1A
peak collector current − 1.5 A
peak base current − 0.2 A
total power dissipation T
≤ 25 °C; note 1 − 1.33 W
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C
Note
1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm
For other mounting conditions, see
“Thermal considerations for SOT223 in the General Part of associated
2
Handbook”.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
R
th j-a
th j-s
thermal resistance from junction to ambient note 1 94 K/W
thermal resistance from junction to soldering point 13 K/W
Note
1. Device mounted on printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm
For other mounting conditions, see
“Thermal considerations for SOT223 in the General Part of associated
2
Handbook”.
.
.
2003 Feb 06 3
Page 4
Philips Semiconductors Product specification
NPN medium power transistors BCP54; BCP55; BCP56
CHARACTERISTICS
T
=25°C unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CBO
I
EBO
h
FE
h
FE
V
CEsat
V
BE
f
T
h
FE1
----------h
FE2
collector cut-off current IE= 0; VCB=30V −−100 nA
I
= 0; VCB=30V; Tj= 125 °C −−10 µA
E
emitter cut-off current IC= 0; VEB=5V −−100 nA
DC current gain IC= 5 mA; VCE=2V 63 −−
I
= 150 mA; VCE=2V 63 − 250
C
= 500 mA; VCE=2V 40 −−
I
C
DC current gain IC= 150 mA; VCE=2V −
BCP54-10; BCP55-10; BCP56-10 63 − 160
BCP54-16; BCP55-16; BCP56-16 100 − 250
collector-emitter saturation voltage IC= 0.5 A; IB=50mA −−500 mV
base-emitter voltage IC= 0.5 A; VCE=2V −−1V
transition frequency IC= 10 mA; VCE= 5 V; f = 100 MHz − 130 − MHz
DC current gain ratio of the
I
= 150 mA; VCE =2V −−1.6
C
complementary pairs
2003 Feb 06 4
Page 5
Philips Semiconductors Product specification
NPN medium power transistors BCP54; BCP55; BCP56
PACKAGE OUTLINE
Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223
D
c
y
b
1
4
132
e
1
b
p
e
w M
B
E
H
E
A
1
detail X
AB
L
X
v M
A
Q
A
p
0 2 4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A1b
A
0.10
1.8
mm
OUTLINE
VERSION
SOT223 SC-73
1.5
0.01
p
0.80
0.60
IEC JEDEC EIAJ
b
3.1
2.9
1
cD
0.32
6.7
0.22
6.3
e
E
3.7
4.6
3.3
REFERENCES
e1HELpQywv
2.3
2003 Feb 06 5
7.3
6.7
1.1
0.7
0.95
0.85
0.1 0.10.2
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
Page 6
Philips Semiconductors Product specification
NPN medium power transistors BCP54; BCP55; BCP56
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyotherconditionsabovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuch applications will be
suitable for the specified use without further testing or
modification.
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result inpersonal injury. Philips
Semiconductorscustomersusingorsellingthese products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2003 Feb 06 6
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Philips Semiconductors Product specification
NPN medium power transistors BCP54; BCP55; BCP56
NOTES
2003 Feb 06 7
Page 8
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 613514/05/pp8 Date of release: 2003 Feb 06 Document order number: 9397 750 10763
SCA75
Page 9
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