DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D087
BCP51; BCP52; BCP53
PNP medium power transistors
Product specification
Supersedes data of 1999 Apr 08
2001 Oct 10
Philips Semiconductors Product specification
PNP medium power transistors BCP51; BCP52; BCP53
FEATURES
• High current (max. 1 A)
PINNING
PIN DESCRIPTION
• Low voltage (max. 80 V)
• Medium power (max. 1.3 W).
2, 4 collector
APPLICATIONS
• Audio, telephony and automotive applications
• Thick and thin-film circuits.
handbook, halfpage
DESCRIPTION
PNP medium power transistor in a SOT223 plastic
package. NPNcomplements: BCP54, BCP55 and BCP56.
Fig.1 Simplified outline (SOT223) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
1 base
3 emitter
4
123
Top view
2, 4
1
3
MAM288
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
collector-base voltage open emitter
BCP51 −−45 V
BCP52 −−60 V
BCP53 −−100 V
V
CEO
collector-emitter voltage open base
BCP51 −−45 V
BCP52 −−60 V
BCP53 −−80 V
V
EBO
I
C
I
CM
I
BM
P
tot
T
stg
T
j
T
amb
emitter-base voltage open collector −−5V
collector current (DC) −−1A
peak collector current −−1.5 A
peak base current −−0.2 A
total power dissipation T
≤ 25 °C; note 1 − 1.3 W
amb
storage temperature −65 +150 °C
junction temperature − 150 °C
operating ambient temperature −65 +150 °C
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm
For other mounting conditions, see
“Thermal considerations for SOT223 in the General Part of associated
2
Handbook”.
.
2001 Oct 10 2
Philips Semiconductors Product specification
PNP medium power transistors BCP51; BCP52; BCP53
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
R
th j-s
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2.
For other mounting conditions, see
Handbook”.
CHARACTERISTICS
T
=25°C unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CBO
I
EBO
h
FE
h
FE
V
CEsat
V
BE
f
T
thermal resistance from junction to ambient note 1 95 K/W
thermal resistance from junction to soldering point 14 K/W
“Thermal considerations for SOT223 in the General Part of associated
collector cut-off current IE= 0; VCB= −30 V −−−100 nA
= 0; VCB= −30 V; Tj= 125 °C −−−10 µA
I
E
emitter cut-off current IC= 0; VEB= −5V −−−100 nA
DC current gain VCE= −2 V; see Fig.2
= −5mA 63 −−
I
C
I
=−150 mA 63 − 250
C
I
= −500 mA 40 −−
C
DC current gain IC= 150 mA; VCE= −2 V; see Fig.2
BCP53-10 63 − 160
BCP51-16; BCP52-16; BCP53-16 100 − 250
collector-emitter saturation voltage IC= −500 mA; IB= −50 mA −−−0.5 V
base-emitter voltage IC= −500 mA; VCE= −2V −−−1V
transition frequency IC= −10 mA; VCE= −5V;
− 115 − MHz
f = 100 MHz
2001 Oct 10 3
Philips Semiconductors Product specification
PNP medium power transistors BCP51; BCP52; BCP53
160
handbook, full pagewidth
h
FE
120
80
40
0
−1
−10
MBH730
VCE = −2 V
−1
−10 −10
−10
2
3
IC (mA)
−10
4
Fig.2 DC current gain; typical values.
2001 Oct 10 4
Philips Semiconductors Product specification
PNP medium power transistors BCP51; BCP52; BCP53
PACKAGE OUTLINE
Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223
D
c
y
b
1
4
132
e
1
b
p
e
w M
B
E
H
E
A
1
detail X
AB
L
X
v M
A
Q
A
p
0 2 4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A1b
A
0.10
1.8
mm
OUTLINE
VERSION
SOT223 SC-73
1.5
0.01
p
0.80
0.60
IEC JEDEC EIAJ
b
3.1
2.9
1
cD
0.32
6.7
0.22
6.3
e
E
3.7
4.6
3.3
REFERENCES
e1HELpQywv
2.3
2001 Oct 10 5
7.3
6.7
1.1
0.7
0.95
0.85
0.1 0.10.2
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
Philips Semiconductors Product specification
PNP medium power transistors BCP51; BCP52; BCP53
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS
Objective data Development This data sheet contains data from the objective specification for product
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Product data Production This data sheet contains data from the product specification. Philips
(1)
STATUS
(2)
DEFINITIONS
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or at any otherconditionsabovethose given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorselling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseof any of these products, conveysnolicenceortitle
under any patent, copyright, or mask work right to these
products,and makes no representations orwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2001 Oct 10 6
Philips Semiconductors Product specification
PNP medium power transistors BCP51; BCP52; BCP53
NOTES
2001 Oct 10 7
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands 613514/04/pp8 Date of release: 2001 Oct 10 Document order number: 9397 750 08741
SCA73
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