NXP BC 847CW NXP Datasheet

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BC847 series

45 V, 100 mA NPN general-purpose transistors

Rev. 8 — 20 August 2012 Product data sheet

1. Product profile

1.1 General description

NPN general-purpose transistors in Surface-Mounted Device (SMD) plastic packages.

Table 1. Product overview

Type number

BC847 SOT23 - TO-236AB BC857 BC847A BC857A BC847B BC857B BC847C BC857C BC847W SOT323 SC-70 - BC857W BC847AW BC857AW BC847BW BC857BW BC847CW BC857CW BC847T SOT416 SC-75 - BC857T BC847AT BC857AT BC847BT BC857BT BC847CT BC857CT BC847AM SOT883 SC-101 - BC857AM BC847BM BC857BM BC847CM BC857CM

[1]

Package PNP complement NXP JEITA JEDEC

[1] Valid for all available selection groups.

1.2 Features and benefits

 General-purpose transistors  SMD plastic packages  Three different gain selections

1.3 Applications

 General-purpose switching and amplification

NXP Semiconductors

006aaa144

sym021

1 2

Transparent

top view

sym021

1.4 Quick reference data

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V I h

CEO

collector-emitter voltage open base - - 45 V collector current - - 100 mA DC current gain VCE=5V; IC=2mA 110 - 800

2. Pinning information

Table 3. Pinning

Pin Description Simplified outline Graphic symbol

SOT23, SOT323, SOT416

1base 2emitter 3 collector

BC847 series

45 V, 100 mA NPN general-purpose transistors

group A 110 180 220

group B 200 290 450

group C 420 520 800

SOT883

1base 2emitter 3 collector

Product data sheet Rev. 8 — 20 August 2012 2 of 18

NXP Semiconductors

3. Ordering information

Table 4. Ordering information

Type number

BC847 - plastic surface-mounted package; 3 leads SOT23 BC847A BC847B BC847C BC847W SC-70 plastic surface-mounted package; 3 leads SOT323 BC847AW BC847BW BC847CW BC847T SC-75 plastic surface-mounted package; 3 leads SOT416 BC847AT BC847BT BC847CT BC847AM SC-101 leadless ultra small plastic package; 3 solder lands; BC847BM BC847CM

BC847 series

45 V, 100 mA NPN general-purpose transistors

[1]

Package Name Description Version

body 1.0  0.6  0.5 mm

SOT883

4. Marking

[1] Valid for all available selection groups.

Table 5. Marking codes

Type number Marking code

[1]

Type number Marking code

BC847 1H* BC847T 1N BC847A 1E* BC847AT 1E BC847B 1F* BC847BT 1F BC847C 1G* BC847CT 1G BC847W 1H* BC847AM D4 BC847AW 1E* BC847BM D5 BC847BW 1F* BC847CM D6 BC847CW 1G*

[1] * = placeholder for manufacturing site code

[1]

Product data sheet Rev. 8 — 20 August 2012 3 of 18

NXP Semiconductors

5. Limiting values

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

CBO

CEO

EBO

tot

amb

stg

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint.

BC847 series

45 V, 100 mA NPN general-purpose transistors

collector-base voltage open emitter - 50 V collector-emitter voltage open base - 45 V emitter-base voltage open colle ctor - 6 V collector current - 100 mA peak collector current single pulse;

 1ms

peak base current single pulse;

tp 1ms

total power dissipation T

amb

 25 C SOT23 - 250 mW SOT323 - 200 mW SOT416 - 150 mW SOT883

junction temperature - 150 C ambient temperature 65 +150 C storage temperature 65 +150 C

-200mA

-100mA

[1]

[2]

-250mW

6. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

th(j-a)

thermal resistance from

in free air

junction to ambient SOT23 - - 500 K/W SOT323 - - 625 K/W SOT416 - - 833 K/W SOT883

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint.

Product data sheet Rev. 8 — 20 August 2012 4 of 18

[1]

[2]

--500K/W

NXP Semiconductors

7. Characteristics

Table 8. Characteristics

amb

Symbol Parameter Conditions Min Typ Max Unit

CBO

EBO

CEsat

BEsat

NF noise figure I

45 V, 100 mA NPN general-purpose transistors

=25C unless otherwise specified.

collector-base cut-off current

emitter-base cut-off current

DC current gain VCE=5V; IC=10A

group A - 90 -

group B - 150 -

group C - 270 -

DC current gain V

group A 110 180 220

group B 200 290 450

group C 420 520 800

collector-emitter saturation voltage

base-emitter saturation voltage

base-emitter voltage IC=2mA; VCE=5V

transition frequency VCE=5V; IC=10mA;

collector capacitance VCB=10V; IE=ie=0A;

emitter capacitance VEB=0.5V; IC=ic=0A;

VCB=30V; IE=0A - - 15 nA

=30V; IE=0A;

= 150 C

VEB=5V; IC= 0 A - - 100 nA

=5V; IC=2mA 110 - 800

IC=10mA; IB=0.5mA - 90 200 mV

=100mA; IB=5mA

IC=10mA; IB=0.5mA

=100mA; IB=5mA

=10mA; VCE=5V - - 770 mV

f=100MHz

f=1MHz

=200A; VCE=5V;

=2k; f = 1 kHz;

B=200Hz

BC847 series

--5A

[1]

- 200 400 mV

[2]

- 700 - mV

[2]

- 900 - mV

[2]

580 660 700 mV

100--MHz

--1.5pF

-11-pF

-210dB

[1] Pulse test: tp 300 s;  = 0.02. [2] V

Product data sheet Rev. 8 — 20 August 2012 5 of 18

decreases by approximately 2 mV/K with increasing temperature.

NXP Semiconductors

mgt723

−1

11010210

IC (mA)

400

300

200

100

(1)

(2)

(3)

mgt724

−1

11010210

IC (mA)

1200

1000

800

600

400

200

(mV)

(1)

(2)

(3)

mgt725

−1

11010210

IC (mA)

CEsat

(mV)

(1) (2)

(3)

mgt726

−1

11010210

IC (mA)

1200

1000

800

600

400

200

BEsat

(mV)

(1)

(2)

(3)

BC847 series

45 V, 100 mA NPN general-purpose transistors

VCE=5V

amb amb amb

= 150 C =25C = 55 C

(1) T (2) T (3) T

Fig 1. Group A: DC current gain as a function of

collector current; typical values

=5V

CE amb amb amb

= 55 C =25C = 150 C

(1) T (2) T (3) T

Fig 2. Group A: Base-emitter voltage as a function of

collector current; typical values

IC/IB=20 (1) T (2) T (3) T

Fig 3. Group A: Collector-emitter saturation voltage

= 150 C

amb amb amb

=25C = 55 C

as a function of collector current; typical

values

(1) T (2) T (3) T

Fig 4. Group A: Base-emitter saturation vo ltage as a

=10

C/IB

= 55 C

amb

=25C

amb

= 150 C

amb

function of collector current; typical values

Product data sheet Rev. 8 — 20 August 2012 6 of 18

NXP Semiconductors

mgt727

−1

11010210

IC (mA)

600

500

400

300

200

100

(1)

(2)

(3)

1200

1000

800

600

400

200

mgt728

−2

−1

11010210

(mA)

(mV)

(1)

(2)

(3)

mgt729

−1

11010210

IC (mA)

CEsat

(mV)

(1)

(2)

(3)

mgt730

−1

11010210

IC (mA)

1200

1000

800

600

400

200

BEsat

(mV)

(1)

(2)

(3)

BC847 series

45 V, 100 mA NPN general-purpose transistors

VCE=5V (1) T (2) T (3) T

amb amb amb

= 150 C =25C = 55 C

Fig 5. Group B: DC current gain as a function of

collector current; typical values

=5V

(1) T (2) T (3) T

amb amb amb

= 55 C =25C = 150 C

Fig 6. Group B: Base-emitter voltage as a function of

collector current; typical values

IC/IB=20

amb amb amb

= 150 C =25C = 55 C

(1) T (2) T (3) T

Fig 8. Group B: Base-emitter saturation vo ltage as a

(1) T (2) T (3) T

Fig 7. Group B: Collector-emitter saturation voltage

as a function of collector current; typical

values

Product data sheet Rev. 8 — 20 August 2012 7 of 18

=10

C/IB

= 55 C

amb

=25C

amb

= 150 C

amb

function of collector current; typical values

NXP Semiconductors

mgt731

−1

11010210

IC (mA)

1200

1000

800

600

400

200

(1)

(2)

(3)

1200

1000

800

600

400

200

mgt732

−2

−1

11010210

IC (mA)

(mV)

(1)

(2)

(3)

mgt733

−1

11010210

IC (mA)

CEsat

(mV)

(1)

(2)(3)

mgt734

−1

11010210

IC (mA)

1200

1000

800

600

400

200

BEsat

(mV)

(1)

(2)

(3)

BC847 series

45 V, 100 mA NPN general-purpose transistors

VCE=5V (1) T (2) T (3) T

amb amb amb

= 150 C =25C = 55 C

Fig 9. Group C: DC current gain as a function of

collector current; typical values

=5V

(1) T (2) T (3) T

amb amb amb

= 55 C =25C = 150 C

Fig 10. Group C: Base-emitter voltage as a function of

collector current; typical values

IC/IB=20 (1) T (2) T (3) T

Fig 11. Group C: Collector-emitter saturation voltage

Product data sheet Rev. 8 — 20 August 2012 8 of 18

= 150 C

amb amb amb

=25C = 55 C

as a function of collector current; typical

values

(1) T (2) T (3) T

Fig 12. Group C: Base-emitter saturation voltage as a

=10

C/IB

= 55 C

amb

=25C

amb

= 150 C

amb

function of collector current; typical values

NXP Semiconductors

04-11-04Dimensions in mm

0.45

0.15

1.9

1.1

0.9

3.0

2.8

2.5

2.1

1.4

1.2

0.48

0.38

0.15

0.09

04-11-04Dimensions in mm

0.45

0.15

1.1

0.8

2.2

1.8

2.2

2.0

1.35

1.15

1.3

0.4

0.3

0.25

0.10

8. Package outline

Fig 13. Package outline SOT23 (TO-236AB)

BC847 series

45 V, 100 mA NPN general-purpose transistors

Fig 14. Package outline SOT323 (SC-70)

Product data sheet Rev. 8 — 20 August 2012 9 of 18

NXP Semiconductors

04-11-04Dimensions in mm

0.95

0.60

1.8

1.4

1.75

1.45

0.9

0.7

0.25

0.10

0.30

0.15

0.45

0.15

03-04-03Dimensions in mm

0.62

0.55

0.47

0.50

0.46

0.65

0.20

0.12

0.30

0.22

0.30

0.22

1.02

0.95

0.35

Fig 15. Package outline SOT416 (SC-75)

BC847 series

45 V, 100 mA NPN general-purpose transistors

Fig 16. Package outline SOT883 (SC-101)

Product data sheet Rev. 8 — 20 August 2012 10 of 18

NXP Semiconductors

9. Packing information

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number

BC847 SOT23 4 mm pitch, 8 mm tape and reel -215 - -235 BC847A BC847B BC847C BC847W SOT323 4 mm pitch, 8 mm tape and reel -115 - -135 BC847AW BC847BW BC847CW BC847T SOT416 4 mm pitch, 8 mm tape and reel -115 - -135 BC847AT BC847BT BC847CT BC847AM SOT883 2 mm pitch, 8 mm tape and reel - - -315 BC847BM BC847CM

[2]

BC847 series

45 V, 100 mA NPN general-purpose transistors

[1]

Package Description Packing quantity

3000 5000 10000

[1] For further information and the availability of packing methods, see Section 13. [2] Valid for all available selection groups.

Product data sheet Rev. 8 — 20 August 2012 11 of 18

NXP Semiconductors

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3×)

0.6

(3×)

0.6

(3×)

0.7

(3×)

3.3

2.9

1.7

1.9

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2×)

1.2

(2×)

2.2

2.6

Dimensions in mm

10. Soldering

BC847 series

45 V, 100 mA NPN general-purpose transistors

Fig 17. Reflow soldering footprint SOT23 (TO-236AB)

Fig 18. Wave soldering footprint SOT23 (TO-236AB)

Product data sheet Rev. 8 — 20 August 2012 12 of 18

NXP Semiconductors

solder lands

solder resist

occupied area

solder paste

sot323_fr

2.65

2.35

0.6

(3×)

0.5

(3×)

0.55 (3×)

1.325

1.85

1.3

Dimensions in mm

sot323_fw

3.65 2.1

1.425 (3×)

4.6

(2×)

2.575

1.8

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Fig 19. Reflow soldering footprint SOT323 (SC-70)

BC847 series

45 V, 100 mA NPN general-purpose transistors

Fig 20. Wave soldering footprint SOT323 (SC-70)

Product data sheet Rev. 8 — 20 August 2012 13 of 18

NXP Semiconductors

solder lands

solder resist

occupied area

solder paste

sot416_fr

0.85

1.7

2.2

0.5

(3×)

0.6

(3×)

1.3

Dimensions in mm

solder lands

solder resist

occupied area

solder paste

sot883_fr

1.3

0.3

0.6

0.7

0.4

0.9

0.3

(2×)

0.4

(2×)

0.25 (2×)

R0.05 (12×)

0.7

Dimensions in mm

Fig 21. Reflow soldering footprint SOT416 (SC-75)

BC847 series

45 V, 100 mA NPN general-purpose transistors

Fig 22. Reflow soldering footprint SOT883 (SC-101)

Product data sheet Rev. 8 — 20 August 2012 14 of 18

NXP Semiconductors

BC847 series

45 V, 100 mA NPN general-purpose transistors

11. Revision history

Table 10. Revision history

Document ID Relea se date Data sheet status Change notice Supersedes

BC847_SER v.8 20120820 Product data sheet - BC847_BC547_SER v.7 Modifications:

BC847_BC547_SER v.7 20081210 Product data sheet - BC847_BC547_SER v.6 BC847_BC547_SER v.6 20050519 Product data sheet - -

• Type numbers removed: BC847B/DG, BC847BW/DG, BC847AT/DG, BC857, BC857B

and BC857C

• Section 12 “Legal information”: updated

Product data sheet Rev. 8 — 20 August 2012 15 of 18

NXP Semiconductors

BC847 series

45 V, 100 mA NPN general-purpose transistors

12. Legal information

12.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this docu ment may have change d since this d ocument was p ublished and may dif fe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

12.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the cust omer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is open for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

, unless otherwise

Product data sheet Rev. 8 — 20 August 2012 16 of 18

NXP Semiconductors

BC847 series

45 V, 100 mA NPN general-purpose transistors

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It i s neit her qua lif ied nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and st andards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, da mages or failed produ ct claims result ing from custome r design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

12.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trademarks are the property of their respective owners.

13. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 8 — 20 August 2012 17 of 18

NXP Semiconductors

14. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

9 Packing information . . . . . . . . . . . . . . . . . . . . 11

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17

13 Contact information. . . . . . . . . . . . . . . . . . . . . 17

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

BC847 series

45 V, 100 mA NPN general-purpose transistors

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 20 August 2012

Document identifier: BC84 7_SER

NXP BC 847CW NXP Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Product profile

1.1 General description

1.2 Features and benefits

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Package outline

9. Packing information

10. Soldering

11. Revision history

12. Legal information

12.1 Data sheet status

12.2 Definitions

12.3 Disclaimers

12.4 Trademarks

13. Contact information

14. Contents