In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameterConditionsMinMaxUnit
V
V
V
I
I
I
T
T
T
CBO
CEO
EBO
C
CM
BM
tot
j
amb
stg
collector-base voltageopen emitter-50V
collector-emitter voltageopen base-45V
emitter-base voltageopen collector-5V
collector current-500mA
peak collector currentsingle pulse; tp ≤ 1 ms-1A
peak base currentsingle pulse; tp ≤ 1 ms-200mA
[1] [2]
total power dissipationT
amb
≤ 25 °C
-250mWP
[3] [2]
-345mW
junction temperature-150°C
ambient temperature-65150°C
storage temperature-65150°C
[1] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated and standard footprint.
[2] Valid for all available selection groups.
[3] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated; mounting pad for collector 1 cm2.
[1] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated and standard footprint.
[2] Valid for all available selection groups.
[3] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated; mounting pad for collector 1 cm2 .
--500K/WR
[3] [2]
--362K/W
FR4 PCB; single-sided copper; tin-plated and standard footprint
Figure 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
FR4 PCB; single-sided copper; tin-plated; mounting pad for collector 1 cm
Figure 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values