Product data sheetRev. 07 — 10 December 20084 of 15
NXP Semiconductors
5.Limiting values
Table 6.Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameterConditionsMinMaxUnit
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
T
j
T
amb
T
stg
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
BC847/BC547 series
45 V, 100 mA NPN general-purpose transistors
collector-base voltageopen emitter-50V
collector-emitter voltage open base-45V
emitter-base voltageopen collector-6V
collector current-100mA
peak collector currentsingle pulse;
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
Product data sheetRev. 07 — 10 December 200810 of 15
NXP Semiconductors
4.2
3.6
BC847/BC547 series
45 V, 100 mA NPN general-purpose transistors
0.45
0.38
1.27
Fig 19. Package outline SOT54 variant
9.Packing information
Table 9.Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
Type number
BC847SOT234 mm pitch, 8 mm tape and reel-215--235
BC847A
BC847B
BC847B/DG
BC847C
BC847WSOT3234 mm pitch, 8 mm tape and reel-115--135
BC847AW
BC847BW
BC847BW/DG
BC847CW
BC847TSOT4164 mm pitch, 8 mm tape and reel-115--135
BC847AT
BC847AT/DG
BC847BT
BC847CT
BC847AMSOT8832 mm pitch, 8 mm tape and reel---315
BC847BM
BC847CM
BC547SOT54bulk, straight leads--412BC547B
BC547C
Product data sheetRev. 07 — 10 December 200813 of 15
NXP Semiconductors
11. Legal information
11.1Data sheet status
BC847/BC547 series
45 V, 100 mA NPN general-purpose transistors
Document status
Objective [short] data sheetDevelopmentThis document contains data from the objective specification for product development.
Preliminary [short] data sheet QualificationThis document contains data from the preliminary specification.
Product [short] data sheetProductionThis document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document mayhave changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
[1][2]
Product status
11.2Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall haveno liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. Ashort data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressedor implied, as to the accuracy or completeness of such
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information.
Right to make changes — NXP Semiconductors reserves the right to make
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limitation specifications and product descriptions, at any time and without
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authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
[3]
http://www.nxp.com.
Definition
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
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No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyanceor implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
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Notice: All referencedbrands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
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Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.