BAT54 series
Schottky barrier diodes
Rev. 5 — 5 October 2012 Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier diodes with an integrated guard ring for stress protection,
encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic
package.
1.2 Features and benefits
Low forward voltage
Low capacitance
AEC-Q101 qualified
1.3 Applications
Ultra high-speed switching Voltage clamping
Line termination Reverse polarity protection
1.4 Quick reference data
Table 1. Quick reference data
T
=25C unless otherwise specified.
amb
Symbol Parameter Conditions Min Typ Max Unit
Per diode
V
R
V
F
I
R
[1] Pulse test: tp 300 s; 0.02.
2. Pinning information
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
BAT54
1 anode
2 not connected
3 cathode
reverse voltage - - 30 V
forward voltage IF=100mA
reverse current VR=25V
[1]
--800mV
[1]
--2A
NXP Semiconductors
BAT54 series
Schottky barrier diodes
Table 2. Pinning
…continued
Pin Description Simplified outline Graphic symbol
BAT54A
1 cathode (diode 1)
2 cathode (diode 2)
3 common anode
BAT54C
1 anode (diode 1)
2 anode (diode 2)
3 common cathode
BAT54S
1 anode (diode 1)
2 cathode (diode 2)
3 cathode (diode 1),
anode (diode 2)
3. Ordering information
Table 3. Ordering information
Type number Package
BAT54 series - plastic surface-mounted package; 3 leads SOT23
4. Marking
Table 4. Marking codes
Type number Marking code
BAT54 L4*
BAT54A *V3
BAT54C *W1
BAT54S *V4
[1] * = placeholder for manufacturing site code.
Name Description Version
[1]
BAT54_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 October 2012 2 of 11
NXP Semiconductors
5. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
V
R
I
F
I
FRM
I
FSM
Per device; one diode loaded
P
tot
T
j
T
amb
T
stg
[1] Tj=25C before surge.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
BAT54 series
Schottky barrier diodes
reverse voltage - 30 V
forward current T
repetitive peak forward
current
non-repetitive peak
forward current
total power dissipation T
junction temperature - 150 C
ambient temperature 55 +150 C
storage temperature 65 +150 C
=25C-200mA
amb
tp 1s; 0.5;
=25C
T
amb
square wave;
t
<10ms
p
25 C
amb
-300mA
[1]
-600mA
[2]
-250mW
6. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device; one diode loaded
R
th(j-a)
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses P
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
thermal resistance from
junction to ambient
R
in free air
are a significant part of the total power losses.
[1][2]
- - 500 K/W
BAT54_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 October 2012 3 of 11
NXP Semiconductors
006aac829
VF (V)
0.0 1.20.80.4
1
10
10
2
10
3
I
F
(mA)
10
-1
(1)
(1)
(2)
(2) (3)
(3)
,
5
$
7. Characteristics
Table 7. Characteristics
T
amb
Symbol Parameter Conditions Min Typ Max Unit
Per diode
V
F
I
R
C
d
t
rr
[1] Pulse test: tp 300 s; 0.02.
[2] When switched from I
BAT54 series
Schottky barrier diodes
=25C unless otherwise specified.
forward voltage
IF= 0.1 mA - - 240 mV
= 1 mA - - 320 mV
I
F
= 10 mA - - 400 mV
I
F
= 30 mA - - 500 mV
I
F
= 100 mA - - 800 mV
I
F
reverse current VR=25V
diode capacitance f = 1 MHz; VR=1V --10pF
reverse recovery time
= 10 mA to IR=10mA; RL= 100 ; measured at IR=1mA.
F
[1]
[1]
--2A
[2]
--5ns
(1) T
(2) T
(3) T
amb
amb
amb
= 125 C
=85C
=25C
Fig 1. Forward current as a function of forward
voltage; typical values
(1) T
(2) T
(3) T
amb
amb
amb
= 125 C
=85C
=25C
Fig 2. Reverse current as a function of reverse
voltage; typical values
BAT54_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 October 2012 4 of 11