NXP BAS 40-04 NXP Datasheet

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BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

Rev. 9 — 18 March 2015 Product data sheet

1. Product profile

1.1 General description

General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.

Table 1. Product overview

Type number Package Configuration

1PS70SB40 SOT323 SC-70 single diode 1PS76SB40 SOD323 SC-76 single diode 1PS79SB40 SOD523 SC-79 single diode BAS40 SOT23 - single diode BAS40H SOD123F - single diode BAS40L SOD882 - single diode BAS40W SOT323 SC-70 single diode 1PS70SB44 SOT323 SC-70 dual series BAS40-04 SOT23 - dual series BAS40-04W SOT323 SC-70 dual series 1PS70SB45 SOT323 SC-70 dual common cathode 1PS75SB45 SOT416 SC-75 dual common cathode BAS40-05 SOT23 - dual common cathode BAS40-05W SOT323 SC-70 dual common cathode 1PS70SB46 SOT323 SC-70 dual common anode BAS40-06 SOT23 - dual common anode BAS40-06W SOT323 SC-70 dual common anode BAS40-07 SOT143B - dual isolated BAS40-07V SOT666 - dual isolated BAS40-05V SOT666 - quadruple common cathode/

1PS88SB48 SOT363 SC-88 quadruple common cathode/

BAS40XY SOT363 SC-88 quadruple; 2 series

NXP JEITA

common cathode

NXP Semiconductors

001aab540

sym001

Transparent

top view

sym001

006aaa144

006aaa436

n.c.

1.2 Features and benefits

 High switching speed  Low leakage current  Hig h br ea kd o wn vo ltage  Low capacitance  AEC-Q101 qualified

1.3 Applications

 Ultra high-speed switching  Voltage clamping

1.4 Quick reference data

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] Pulse test: tp 300 s; 0.02.

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

forward current - - 120 mA forward voltage IF=1mA reverse voltage - - 40 V

[1]

--380mV

2. Pinning information

Table 3. Pinning

Pin Description Simplified outline Symbol

BAS40H; 1PS76SB40; 1PS79SB40

1 cathode 2 anode

BAS40L

1 cathode 2 anode

BAS40; BAS40W; 1PS70SB40

1 anode 2 not connected 3 cathode

[1]

Product data sheet Rev. 9 — 18 March 2015 2 of 22

NXP Semiconductors

006aaa144

006aaa437

006aaa144

006aaa439

006aaa434

123

456

006aaa440

654

123

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Table 3. Pinning

…continued

Pin Description Simplified outline Symbol

BAS40-04; BAS40-04W; 1PS70SB44

1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1),

anode (diode 2)

BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45

1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 1),

cathode (diode 2)

BAS40-06; BAS40-06W; 1PS70SB46

1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 1),

anode (diode 2)

BAS40-07

1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 2) 4 anode (diode 1)

BAS40-07V

1 anode (diode 1) 2 not connected 3 cathode (diode 2) 4 anode (diode 2) 5 not connected 6 cathode (diode 1)

Product data sheet Rev. 9 — 18 March 2015 3 of 22

NXP Semiconductors

001aab555

6 45

1 32

006aaa446

654

123

132

006aaa256

654

123

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Table 3. Pinning

…continued

Pin Description Simplified outline Symbol

BAS40-05V; 1PS88SB48

1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 3),

cathode (diode 4) 4 anode (diode 3) 5 anode (diode 4) 6 cathode (diode 1),

cathode (diode 2)

BAS40XY

1 anode (diode 1) 2 cathode (diode 2) 3 anode (diode 3),

cathode (diode 4) 4 anode (diode 4) 5 cathode (diode 3) 6 cathode (diode 1),

anode (diode 2)

[1] The marking bar indicates the cathode.

Product data sheet Rev. 9 — 18 March 2015 4 of 22

NXP Semiconductors

3. Ordering information

Table 4. Ordering information

Type number Package

1PS70SB40 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS76SB40 SC-76 plastic surface-mounted package; 2 leads SOD323 1PS79SB40 SC-79 plastic surface-mounted package; 2 leads SOD523 BAS40 - plastic surface-mounted package; 3 leads SOT23 BAS40H - plastic surface-mounted package; 2 leads SOD123F BAS40L - leadless ultra small plastic package; 2 terminals;

BAS40W SC-70 plastic surface-mounted package; 3 lea ds SOT323 1PS70SB44 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-04 - plastic surface-mounted package; 3 leads SOT23 BAS40-04W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB45 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS75SB45 SC-75 plastic surface-mounted package; 3 leads SOT416 BAS40-05 - plastic surface-mounted package; 3 leads SOT23 BAS40-05W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB46 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-06 - plastic surface-mounted package; 3 leads SOT23 BAS40-06W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-07 - plastic surface-mounted package; 4 leads SOT143B BAS40-07V - plastic surface-mounted package; 6 leads SOT666 BAS40-05V - plastic surface-mounted package; 6 leads SOT666 1PS88SB48 SC-88 plastic surface-mounted package; 6 leads SOT363 BAS40XY SC-88 plastic surface-mounted package; 6 leads SOT363

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Name Description Version

SOD882

body 1.0  0.6  0.5 mm

Product data sheet Rev. 9 — 18 March 2015 5 of 22

NXP Semiconductors

4. Marking

Table 5. Marking codes

Type number Marking code

1PS70SB40 6*3 1PS75SB45 45 1PS76SB40 S4 BAS40-05 45* 1PS79SB40 T BAS40-05W 65* BAS40 43* 1PS70SB46 6*6 BAS40H AJ BAS40-06 46* BAS40L S6 BAS40-06W 66* BAS40W 63* BAS40-07 47* 1PS70SB44 6*4 BAS40-07V 67 BAS40-04 44* BAS40-05V 65 BAS40-04W 64* 1PS88SB48 8*5 1PS70SB45 6*5 BAS40XY 40*

[1] * = -: made in Hong Kong

BAS40 series; 1PSxxSB4x series

* = p: made in Hong Kong * = t: made in Malaysia * = W: made in China

[1]

General-purpose Schottky di od e s

Type number Marking code

[1]

5. Limiting values

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

FRM

FSM

amb

stg

[1] Tj=25C prior to surge.

reverse voltage - 40 V forward current - 120 mA repetitive peak forward

tp 1s; 0.5 - 120 mA

current non-repetitive peak forward

tp 10 ms

[1]

-200mA

current junction temperature - 150 C ambient temperature 65 +150 C storage temperature 65 +150 C

Product data sheet Rev. 9 — 18 March 2015 6 of 22

NXP Semiconductors

6. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Per device

th(j-a)

th(j-sp)

thermal resistance from junction to ambient

SOT23 - - 500 K/W

SOT143B - - 500 K/W

SOT363 (1PS88SB48) - - 416 K/W

SOT416 - - 833 K/W

SOT666 (BAS40-05V)

SOT666 (BAS40-07V)

SOD123F

SOD323 - - 450 K/W

SOD523

SOD882

SOT323 - - 625 K/W

thermal resistance from junction to solder point

SOT363 (BAS40XY)

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

in free air

[1]

[2]

--225K/W

[2]

--416K/W

[2]

--330K/W

[2]

--450K/W

[2]

--500K/W

[3]

--260K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point at pins 2, 3, 5 and 6.

7. Characteristics

Table 8. Characteristics

amb

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] Pulse test: tp 300 s; 0.02.

=25C unless otherwise specified.

forward voltage

[1]

IF= 1 mA - - 380 mV

= 10 mA - - 500 mV

=40mA - - 1 V

reverse current VR=30V - - 1 A

=40V - - 10 A

diode capacitance VR=0V; f=1MHz - - 5 pF

Product data sheet Rev. 9 — 18 March 2015 7 of 22

NXP Semiconductors

−1

−2

mlc361

0.6 0.80.40.2 1 V

(V)

(mA)

(1) (2) (3) (4)

−1

−2

mlc362

2010 4030

VR (V)

(μA)

(1)

(2)

(3)

mlc364

−1

110

dif

(Ω)

(mA)

01020 4030

mlc363

VR (V)

(pF)

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

(1) T (2) T (3) T (4) T

amb amb amb amb

= 125 C =85C =25C = 40 C

Fig 1. Forward current as a function of forward

voltage; typical values

amb amb amb

= 125 C =85C =25C

(1) T (2) T (3) T

Fig 2. Reverse current as a function of reverse

voltage; typical values

f=10kHz T

Fig 3. Differential resistance as a function of forward

Product data sheet Rev. 9 — 18 March 2015 8 of 22

current; typical values

=25C; f = 1 MHz

amb

Fig 4. Diode capacitance as a function of reverse

voltage; typical values

NXP Semiconductors

03-12-17Dimensions in mm

0.25

0.10

0.45

0.15

2.7

2.3

1.8

1.6

0.40

0.25

1.1

0.8

1.35

1.15

02-12-13Dimensions in mm

1.65

1.55

1.25

1.15

0.17

0.11

0.34

0.26

0.65

0.58

0.85

0.75

04-11-04Dimensions in mm

0.45

0.15

1.9

1.1

0.9

3.0

2.8

2.5

2.1

1.4

1.2

0.48

0.38

0.15

0.09

04-11-29Dimensions in mm

1.2

1.0

0.25

0.10

3.6

3.4

2.7

2.5

0.55

0.35

0.70

0.55

1.7

1.5

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.

9. Package outline

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Fig 5. Package outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC-79)

Fig 7. Package outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F

Product data sheet Rev. 9 — 18 March 2015 9 of 22

NXP Semiconductors

04-11-04Dimensions in mm

0.45

0.15

1.1

0.8

2.2

1.8

2.2

2.0

1.35

1.15

1.3

0.4

0.3

0.25

0.10

04-11-16Dimensions in mm

3.0

2.8

1.1

0.9

2.5

2.1

1.4

1.2

1.7

1.9

0.48

0.38

0.15

0.09

0.45

0.15

0.88

0.78

0.25

0.10

0.3

0.2

pin 1 index

1.3

0.65

2.2

2.0

1.35

1.15

2.2

1.8

1.1

0.8

0.45

0.15

132

465

14-10-03Dimensions in mm

04-11-04Dimensions in mm

0.95

0.60

1.8

1.4

1.75

1.45

0.9

0.7

0.25

0.10

0.30

0.15

0.45

0.15

Dimensions in mm

04-11-08

1.7

1.5

1.7

1.5

1.3

1.1

0.18

0.08

0.27

0.17

0.5

pin 1 index

123

456

0.6

0.5

0.3

0.1

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

0.50

0.46

1.02

0.95

03-04-17Dimensions in mm

0.30

0.22

0.30

0.22

0.62

0.55

0.47

0.65

cathode marking on top side (if applicable)

Fig 9. Package outline SOD882 Fig 10. Package outline SOT323 (SC-70)

Fig 11. Package outline SOT143B Fig 12. Package outline SOT363 (SC-88)

Fig 13. Package outline SOT416 (SC-75) Fig 14. Packag e outline SOT666

Product data sheet Rev. 9 — 18 March 2015 10 of 22

NXP Semiconductors

10. Packing information

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

1PS70SB40 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS76SB40 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS79SB40 SOD523 2 mm pitch, 8 mm tape and reel - - -315 -

BAS40 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40L SOD882 2 mm pitch, 8 mm tape and reel - - - -315 BAS40W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -1 35 1PS70SB44 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-04 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-04W SOT323 4 mm pitch, 8 m m tape and reel -115 - - -135 1PS70SB45 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 1PS75SB45 SOT416 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-05 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-05W SOT323 4 mm pitch, 8 m m tape and reel -115 - - -135 1PS70SB46 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS40-06 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS40-06W SOT323 4 mm pitch, 8 m m tape and reel -115 - - -135 BAS40-07 SOT143B 4 mm pitch , 8 mm tape and reel -215 - - -235 BAS40-07V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

BAS40-05V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

1PS88SB48 SOT363 4 mm pitch, 8 mm tape and reel; T1

BAS40XY SOT363 4 mm pitch, 8 mm tape and reel; T1

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

[1]

3000 4000 8000 10000

4 mm pitch, 8 mm tape and reel -115 - - -135

4 mm pitch, 8 mm tape and reel - -115 - -

[2]

-115---135

[3]

4 mm pitch, 8 mm tape and reel; T2

-125 - - -165

[2]

-115---135

[3]

-125 - - -165

[1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T2: reverse taping

Product data sheet Rev. 9 — 18 March 2015 11 of 22

NXP Semiconductors

msa433

1.65

0.50 (2×)

2.10

1.60

2.80

0.60

3.05

0.500.95

solder lands

solder resist

occupied area

solder paste

msa415

1.40

4.40

5.00

1.202.75

preferred transport direction during soldering

solder lands solder resist occupied area

mgs343

1.80

1.90

0.30

0.40

0.50

1.20

0.60

2.15

solder lands

solder resist occupied area

solder paste

11. Soldering

Fig 15. Reflow soldering footprint SOD323 (SC-76)

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Dimensions in mm

Fig 16. Wave soldering footprint SOD323 (SC-76)

Product data sheet Rev. 9 — 18 March 2015 12 of 22

Fig 17. Reflow soldering footprint SOD523 (SC-79)

Reflow soldering is the only recommended soldering method. Dimensions in mm

NXP Semiconductors

MSA439

1.00

0.60 (3x)

1.30

2.50

3.00

0.85

2.70

2.90

0.50 (3x)

0.60 (3x)

3.30

0.85

solder lands

solder resist

occupied area

solder paste

MSA427

4.00

4.60

2.80

4.50

1.20

3.40

1.20 (2x)

preferred transport direction during soldering

solder lands

solder resist

occupied area

Fig 18. Reflow soldering footprint SOT23 (TO-236AB)

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Dimensions in mm

Fig 19. Wave soldering footprint SOT23 (TO-236AB)

Product data sheet Rev. 9 — 18 March 2015 13 of 22

NXP Semiconductors

1.6

2.9

4.4

1.1 1.22.1

1.1

(2×)

solder lands

solder resist

occupied area

solder paste

mbl872

1.30

0.30R = 0.05 (8×) R = 0.05 (8×)

0.60 (2×)

0.70 (2×)

0.80 (2×)

0.90

0.30 (2×)

0.40 (2×)

0.50 (2×)

solder lands

solder resist occupied area

solder paste

Fig 20. Reflow soldering footprint SOD123F

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Reflow soldering is the only recommended soldering method. Dimensions in mm

Fig 21. Reflow soldering footprint SOD882

Product data sheet Rev. 9 — 18 March 2015 14 of 22

NXP Semiconductors

msa429

0.852.35

0.55 (3×)

1.3250.75

2.40

2.65

1.30

0.60

(3×)

0.50 (3×)

1.90

solder lands

solder resist occupied area

solder paste

Dimensions in mm

msa419

4.00

4.60

2.103.65

1.15

2.70

0.90 (2×)

preferred transport direction during soldering

solder lands solder resist occupied area

Dimensions in mm

Fig 22. Reflow soldering footprint SOT323 (SC-70)

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Product data sheet Rev. 9 — 18 March 2015 15 of 22

Fig 23. Wave soldering footprint SOT323 (SC-70)

NXP Semiconductors

msa441

0.60 (4x)

1.30

2.50

3.00

2.70

0.50 (3x)

0.60 (3x)

3.25

0.90

1.00

solder lands

solder resist

occupied area

solder paste

msa422

4.00

4.60

1.20 (3×)

4.45

1.15

3.40

1.00

preferred transport direction during soldering

solder lands solder resist occupied area

Dimensions in mm

Fig 24. Reflow soldering footprint SOT143B

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Dimensions in mm

Fig 25. Wave soldering footprint SOT143B

Product data sheet Rev. 9 — 18 March 2015 16 of 22

NXP Semiconductors

solder lands

solder resist

occupied area

solder paste

sot363_fr

2.65

2.35

0.4 (2×)

0.6

(2×)

0.5

(4×)

0.5

(4×)

0.6

(4×)

0.6

(4×)

1.5

1.8

Dimensions in mm

sot363_fw

solder lands

solder resist

occupied area

preferred transport

direction during soldering

5.3

1.3 1.3

1.5

0.3

1.5

4.5

2.45

2.5

Dimensions in mm

Fig 26. Reflow soldering footprint SOT363 (SC-88)

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Fig 27. Wave soldering footprint SOT363 (SC-88)

Product data sheet Rev. 9 — 18 March 2015 17 of 22

NXP Semiconductors

solder resist

occupied area

solder lands

solder pasteDimensions in mm

msa438

2.0

0.6

(3x)

0.7

1.5

1.1

2.2

0.5

(3x)

0.85

0.6

1.9

solder lands

placement area

occupied area

solder paste

sot666_fr

2.75

2.45

2.1

1.6

0.4

(6×)

0.55 (2×)

0.25 (2×)

0.6

(2×)

0.65 (2×)

0.3

(2×)

0.325 (4×)

0.45 (4×)

0.5

(4×)

0.375 (4×)

1.72

1.7

1.075

0.538

Dimensions in mm

Fig 28. Reflow soldering footprint SOT416

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

Reflow soldering is the only recommended soldering method.

Fig 29. Reflow soldering footprint SOT666

Product data sheet Rev. 9 — 18 March 2015 18 of 22

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

12. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAS40_1PSXXSB4X_SER v.9

Modifications:

BAS40_1PSXXSB4X_SER_8 20100113 Product data sheet - BAS40_1PSXXSB4X_SER_7 BAS40_1PSXXSB4X_SER_7 20060512 Product data sheet - BAS40_1PSXXSB4X_SER_6 BAS40_1PSXXSB4X_SER_6 20050809 Product data sheet - 1PS70SB40_3

1PS70SB40_3 19990426 Product specification - 1PS70SB40_2 1PS75SB45_2 19990426 Product specification - 1PS75SB45_1 1PS76SB40_3 20040126 Product specification - 1PS76SB40_2 1PS79SB40_2 19990426 Product specification - 1PS79SB40_1 1PS88SB48_3 20021107 Product specification - 1PS88SB48_2 BAS40H_1 20050425 Product data sheet - BAS40L_1 20030520 Product specification - BAS40-05V_1 20021121 Product specification - BAS40-07V_1 20020327 Product specification - BAS40W_3 19990426 Product specification - BAS40W_2 BAS40_SERIES_5 20011010 Product specification - BAS40_4

20150318 Product data sheet - BAS40_1PSXXSB4X_SER_8

• The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

1PS75SB45_2 1PS76SB40_3 1PS79SB40_2 1PS88SB48_3 BAS40H_1 BAS40L_1 BAS40-05V_1 BAS40-07V_1 BAS40W_3 BAS40_SERIES_5

Product data sheet Rev. 9 — 18 March 2015 19 of 22

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

13. Legal information

13.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this docu ment may have changed si nce this docum ent was pub lished and may dif fer in case of multiple devices. The latest product statu s

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied u pon to cont ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

13.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonabl y be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclu sion and/ or use is at the cust omer's own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

, unless otherwise

Product data sheet Rev. 9 — 18 March 2015 20 of 22

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky di od e s

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open f or acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.

Translations — A non-English (t ranslated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

13.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trad emarks are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 9 — 18 March 2015 21 of 22

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 2

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 5

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 7

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

10 Packing information . . . . . . . . . . . . . . . . . . . . 11

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21

14 Contact information. . . . . . . . . . . . . . . . . . . . . 21

15 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

General-purpose Schottky di od e s

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Document identifier: BAS40_1PSXXSB4X_SER

Date of release: 18 March 2015

NXP BAS 40-04 NXP Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Product profile

1.1 General description

1.2 Features and benefits

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Test information

8.1 Quality information

9. Package outline

10. Packing information

11. Soldering

12. Revision history

13. Legal information

13.1 Data sheet status

13.2 Definitions

13.3 Disclaimers

13.4 Trademarks

14. Contact information

15. Contents