NXP BAS 16J NXP Datasheet

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BAS16 series

High-speed switching diodes

Rev. 05 — 25 August 2008 Product data sheet

1. Product proﬁle

1.1 General description

High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages.

Table 1. Product overview

Type number Package Conﬁguration Package

BAS16 SOT23 - TO-236AB single small BAS16H SOD123F - - single small and ﬂat lead BAS16J SOD323F SC-90 - single very small and ﬂat

BAS16L SOD882 - - single leadless ultra

BAS16T SOT416 SC-75 - single ultra small BAS16VV SOT666 - - triple isolated ultra small andﬂat

BAS16VY SOT363 SC-88 - triple isolated very small BAS16W SOT323 SC-70 - single very small BAS316 SOD323 SC-76 - single very small BAS516 SOD523 SC-79 - single ultra small and ﬂat

NXP JEITA JEDEC

conﬁguration

lead

small

lead

1.2 Features

n High switching speed: trr≤ 4ns n Low capacitance n Low leakage current n Reverse voltage: VR≤ 100 V n Repetitive peak reverse voltage:

≤ 100 V

RRM

n Small SMD plastic packages

1.3 Applications

n High-speed switching n General-purpose switching

NXP Semiconductors

1.4 Quick reference data

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per diode

[1] When switched from IF= 10 mA to IR= 10 mA; RL= 100 Ω; measured at IR= 1 mA.

2. Pinning information

Table 3. Pinning

Pin Description Simpliﬁed outline Graphic symbol

BAS16; BAS16T; BAS16W

1 anode 2 not connected 3 cathode

BAS16 series

High-speed switching diodes

reverse voltage - - 100 V reverse current VR= 80 V - - 0.5 µA reverse recovery time

[1]

--4ns

006aaa764

BAS16H; BAS16J; BAS316; BAS516

1 cathode 2 anode

BAS16L

1 cathode 2 anode

BAS16VV; BAS16VY

1 anode (diode 1) 2 anode (diode 2) 3 anode (diode 3) 4 cathode (diode 3) 5 cathode (diode 2) 6 cathode (diode 1)

006aaa144

[1]

001aab540

[1]

Transparent

top view

6 45

1 32

001aab555

6254

006aab040

006aab106

[1] The marking bar indicates the cathode.

Product data sheet Rev. 05 — 25 August 2008 2 of 20

NXP Semiconductors

3. Ordering information

Table 4. Ordering information

Type number Package

BAS16 - plastic surface-mounted package; 3 leads SOT23 BAS16H - plastic surface-mounted package; 2 leads SOD123F BAS16J SC-90 plastic surface-mounted package; 2 leads SOD323F BAS16L - leadless ultra small plastic package; 2 terminals;

BAS16T SC-75 plastic surface-mounted package; 3 leads SOT416 BAS16VV - plastic surface-mounted package; 6 leads SOT666 BAS16VY SC-88 plastic surface-mounted package; 6 leads SOT363 BAS16W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS316 SC-76 plastic surface-mounted package; 2 leads SOD323 BAS516 SC-79 plastic surface-mounted package; 2 leads SOD523

BAS16 series

High-speed switching diodes

Name Description Version

SOD882

body 1.0 × 0.6 × 0.5 mm

4. Marking

Table 5. Marking codes

Type number Marking code

BAS16 A6* BAS16H A1 BAS16J AR BAS16L S2 BAS16T A6 BAS16VV 53 BAS16VY 16* BAS16W A6* BAS316 A6 BAS516 6

[1] * = -: made in Hong Kong

* = p: made in Hong Kong * = t: made in Malaysia * = W: made in China

[1]

Product data sheet Rev. 05 — 25 August 2008 3 of 20

NXP Semiconductors

5. Limiting values

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

RRM

FRM

FSM

tot

BAS16 series

High-speed switching diodes

repetitive peak reverse voltage

reverse voltage - 100 V forward current

BAS16 BAS16H

BAS16L BAS16T BAS16VV

BAS16VY BAS16W BAS16J

BAS316 BAS516

repetitive peak forward current

non-repetitive peak forward current

tp≤ 0.5 µs; δ≤0.25

square wave

tp=1µs-4A

=1ms - 1 A

= 1 s - 0.5 A

total power dissipation

BAS16 T BAS16H T

BAS16J T

BAS16L T

BAS16T T BAS16VV T

BAS16VY T

BAS16W T BAS316 T BAS516 T

amb amb

amb

≤ 90 °C

sp amb

≤ 85 °C

amb

≤ 90 °C

≤ 25 °C ≤ 25 °C

≤ 25 °C

- 100 V

[1]

- 215 mA

[2]

- 215 mA

[1]

- 155 mA

[1][3]

- 200 mA

[1]

- 175 mA

[1]

- 250 mA

- 500 mA

[4]

[1]

- 250 mW

[2][5]

- 380 mW

[6]

[5][6]

- 830 mW

[7]

[5][6]

- 550 mW

[7]

[2][5]

- 250 mW

[6] [1]

- 170 mW

[1][3]

- 180 mW

[5][8] [1][3]

- 250 mW

[8] [1]

- 200 mW

[1][6]

- 400 mW

[1][5]

- 500 mW

[6]

Product data sheet Rev. 05 — 25 August 2008 4 of 20

NXP Semiconductors

BAS16 series

High-speed switching diodes

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per device

amb

stg

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint. [2] Device mounted on an FR4 PCB with 60 µm copper strip line. [3] Single diode loaded. [4] Tj=25°C prior to surge. [5] Reﬂow soldering is the only recommended soldering method. [6] Soldering point of cathode tab. [7] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [8] Soldering points at pins 4, 5 and 6.

junction temperature - 150 °C ambient temperature −65 +150 °C storage temperature −65 +150 °C

6. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

th(j-a)

th(j-t)

thermal resistance from junction to ambient

BAS16 BAS16H

BAS16J BAS16L BAS16VV

BAS16W

thermal resistance from junction to tie-point

BAS16 - - 330 K/W BAS16W - - 300 K/W

…continued

in free air

[1]

- - 500 K/W

[2][3]

- - 330 K/W

[3][4]

- - 150 K/W

[3][4]

- - 230 K/W

[2][3]

- - 500 K/W

[2][3]

- - 700 K/W

[5]

[3][4]

- - 410 K/W

[5] [1]

- - 625 K/W

Product data sheet Rev. 05 — 25 August 2008 5 of 20

NXP Semiconductors

BAS16 series

High-speed switching diodes

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

th(j-sp)

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with 60 µm copper strip line. [3] Reﬂow soldering is the only recommended soldering method. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [5] Single diode loaded. [6] Soldering point of cathode tab. [7] Soldering points at pins 4, 5 and 6.

7. Characteristics

…continued

thermal resistance from junction to solder point

[6]

BAS16H BAS16J

--70K/W

[6]

--55K/W

BAS16T - - 350 K/W

[5][7]

BAS16VY BAS316 BAS516

- - 260 K/W

[6]

- - 150 K/W

[6]

- - 120 K/W

Table 8. Characteristics

=25°C unless otherwise speciﬁed.

amb

Symbol Parameter Conditions Min Typ Max Unit

Per diode

forward voltage

[1]

IF= 1 mA - - 715 mV

= 10 mA - - 855 mV

=50mA --1V

= 150 mA - - 1.25 V

reverse current VR=25V --30nA

= 80 V - - 0.5 µA

= 25 V; Tj= 150 °C --30µA

= 80 V; Tj= 150 °C --50µA

diode capacitance f = 1 MHz; VR=0V

BAS16; BAS16H;

- - 1.5 pF BAS16J; BAS16L; BAS16T; BAS16VV; BAS16VY; BAS16W; BAS316

BAS516 - - 1 pF

[1] Pulse test: tp≤ 300 µs; δ≤0.02. [2] When switched from IF= 10 mA to IR= 10 mA; RL= 100 Ω; measured at IR= 1 mA. [3] When switched from IF= 10 mA; tr=20ns.

Product data sheet Rev. 05 — 25 August 2008 6 of 20

reverse recovery time forward recovery voltage

[2]

--4ns

[3]

- - 1.75 V

NXP Semiconductors

BAS16 series

High-speed switching diodes

(mA)

−1

0 1.41.00.4 0.80.2 1.20.6

(1) T (2) T (3) T (4) T

amb amb amb amb

= 150 °C =85°C =25°C = −40 °C

(1) (2) (3) (4)

006aab132

VF (V)

Fig 1. Forward current as a function of forward

voltage; typical values

FSM

(A)

−1

110

10 10

mbg704

tp (µs)

Based on square wave currents. Tj=25°C; prior to surge

Fig 2. Non-repetitive peak forward current as a

function of pulse duration; maximum values

(µA)

(1) T (2) T (3) T (4) T

−1

−2

−3

−4

−5

0 1008040 6020

amb amb amb amb

(1)

(2)

(3)

(4)

= 150 °C =85°C =25°C = −40 °C

006aab133

(V)

Fig 3. Reverse current as a function of reverse

voltage; typical values

0.8

(pF

)

0.6

0.4

0.2

0816124

f = 1 MHz; T

amb

=25°C

mbg446

VR (V)

Fig 4. Diode capacitance as a function of reverse

voltage; typical values

Product data sheet Rev. 05 — 25 August 2008 7 of 20

NXP Semiconductors

8. Test information

BAS16 series

High-speed switching diodes

D.U.T.

RS = 50 Ω

V = V

R + IF × RS

SAMPLING

OSCILLOSCOPE

= 50 Ω

mga881

(1) IR=1mA

Input signal: reverse pulse rise time tr= 0.6 ns; reverse voltage pulse duration tp= 100 ns; duty cycle δ = 0.05 Oscilloscope: rise time tr= 0.35 ns

Fig 5. Reverse recovery time test circuit and waveforms

RS = 50 Ω

1 kΩ 450 Ω

D.U.T.

OSCILLOSCOPE

Ri = 50 Ω

10 %

90 %

input signal

+ I

output signal

(1)

mga882

Input signal: forward pulse rise time tr= 20 ns; forward current pulse duration tp≥ 100 ns; duty cycle δ≤0.005

Fig 6. Forward recovery voltage test circuit and waveforms

9. Package outline

1.7

1.5

0.70

0.55

0.35

2.5

2.1

3.0

2.8

0.45

0.15

1.4

1.2

0.48

1.9

0.38

1.1

0.9

0.15

0.09

3.6

2.7

3.4

2.5

04-11-04Dimensions in mm

Fig 7. Package outline BAS16 (SOT23/TO-236AB) Fig 8. Package outline BAS16H (SOD123F)

1.2

1.0

0.25

0.10 04-11-29Dimensions in mm

Product data sheet Rev. 05 — 25 August 2008 8 of 20

NXP Semiconductors

BAS16 series

High-speed switching diodes

0.5

0.3

0.80

0.65

0.25

0.10

0.62

0.55

0.47

0.65

cathode marking on top side

0.30

0.22

0.30

0.22

04-09-13Dimensions in mm

0.50

0.46

2.7

2.3

1.8

1.6

1.35

1.15

0.40

0.25

Fig 9. Package outline BAS16J (SOD323F/SC-90) Fig 10. Package outline BAS16L (SOD882)

1.7

1.5

456

0.3

0.1

1.75

1.45

0.9

0.7

1.8

1.4

0.95

0.60

0.45

0.15

1.7

1.5

1.3

1.1 pin 1 index

0.6

0.5

1.02

0.95

03-04-17Dimensions in mm

0.30

0.15

0.25

0.10

04-11-04Dimensions in mm

Dimensions in mm

123

0.5 1

0.27

0.17

0.18

0.08

04-11-08

Fig 11. Package outline BAS16T (SOT416/SC-75) Fig 12. Package outline BAS16VV (SOT666)

2.2

2.0

1.35

1.15

2.2

1.8

pin 1 index

132

0.65

1.3

0.45

465

0.15

0.3

0.2

1.1

0.8

0.25

0.10

2.2

1.8

0.4

0.3

0.45

0.15

2.2

1.35

2.0

1.15

1.3

06-03-16Dimensions in mm

1.1

0.8

0.25

0.10

04-11-04Dimensions in mm

Fig 13. Package outline BAS16VY (SOT363) Fig 14. Package outline BAS16W (SOT323/SC-70)

Product data sheet Rev. 05 — 25 August 2008 9 of 20

NXP Semiconductors

BAS16 series

High-speed switching diodes

0.65

0.58

0.17

0.11 02-12-13Dimensions in mm

2.7

2.3

1.8

1.6

1.35

1.15

1.1

0.8

0.40

0.25

0.45

0.15

0.25

0.10

1.65

1.25

1.55

1.15

03-12-17Dimensions in mm

0.85

0.75

0.34

0.26

Fig 15. Package outline BAS316 (SOD323/SC-76) Fig 16. Package outline BAS516 (SOD523/SC-79)

10. Packing information

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

Type number Package Description Packing quantity

BAS16 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235 BAS16H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS16J SOD323F 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS16L SOD882 2 mm pitch, 8 mm tape and reel - - - -315 BAS16T SOT416 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS16VV SOT666 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel - -115 - -

BAS16VY SOT363 4 mm pitch, 8 mm tape and reel; T1

4 mm pitch, 8 mm tape and reel; T2 BAS16W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS316 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135 BAS516 SOD523 2 mm pitch, 8 mm tape and reel - - -315 -

4 mm pitch, 8 mm tape and reel -115 - - -135

[1]

3000 4000 8000 10000

[2]

-115 - - -135

[3]

-125 - - -165

[1] For further information and the availability of packing methods, seeSection14. [2] T1: normal taping [3] T2: reverse taping

Product data sheet Rev. 05 — 25 August 2008 10 of 20

NXP Semiconductors

11. Soldering

BAS16 series

High-speed switching diodes

3.3

2.9

1.9

solder lands

1.7

0.7

(3×)

0.5

(3×)

0.6

(3×)

0.6

(3×)

Fig 17. Reﬂow soldering footprint BAS16 (SOT23/TO-236AB)

2.2

1.2

(2×)

1.4

(2×)

solder resist

solder paste

occupied area

Dimensions in mm

sot023_fr

solder lands

4.6

2.6

Dimensions in mm

1.4

preferred transport direction during soldering

2.8

4.5

solder resist

occupied area

sot023_fw

Fig 18. Wave soldering footprint BAS16 (SOT23/TO-236AB)

Product data sheet Rev. 05 — 25 August 2008 11 of 20

NXP Semiconductors

Fig 19. Reﬂow soldering footprint BAS16H (SOD123F)

4.4 4

2.9

1.6

1.1

(2×)

1.1 1.22.1

Reﬂow soldering is the only recommended soldering method. Dimensions in mm

3.05

2.2

2.1

BAS16 series

High-speed switching diodes

solder lands

solder resist

solder paste

occupied area

solder lands

0.951.65

0.5

(2×)

0.6

(2×)

0.6 (2×)0.5 (2×)

Reﬂow soldering is the only recommended soldering method.

Fig 20. Reﬂow soldering footprint BAS16J (SOD323F)

solder resist

solder paste

occupied area

Dimensions in mm

sod323f_fr

Product data sheet Rev. 05 — 25 August 2008 12 of 20

NXP Semiconductors

1.3

0.7

BAS16 series

High-speed switching diodes

R0.05 (8×)

solder lands

0.6

0.9

0.3

(2×)

0.4

(2×)

0.7

(2×)

Reﬂow soldering is the only recommended soldering method.

Fig 21. Reﬂow soldering footprint BAS16L (SOD882)

2.2

1.7

0.85

0.5

(3×)

solder resist

solder paste

occupied area

Dimensions in mm

sod882_fr

solder lands

solder resist

solder paste

occupied area

0.6

(3×)

1.3

Dimensions in mm

sot416_fr

Fig 22. Reﬂow soldering footprint BAS16T (SOT416/SC-75)

Product data sheet Rev. 05 — 25 August 2008 13 of 20

NXP Semiconductors

BAS16 series

High-speed switching diodes

2.75

2.45

2.1

1.6

0.4

0.538

1.075

1.72

0.55 (2×)

0.45 (4×)

0.5

(4×)

1.7

0.6

(2×)

0.65 (2×)

(6×)

Reﬂow soldering is the only recommended soldering method.

Fig 23. Reﬂow soldering footprint BAS16VV (SOT666)

2.65

2.35

1.5

0.6

(4×)

0.5

(4×)

0.4 (2×)

0.25 (2×)

0.325 (4×)

0.3

(2×)

0.375 (4×)

solder lands

placement area

solder paste

occupied area

Dimensions in mm

sot666_fr

solder lands

solder resist

solder paste

1.8

0.6

(2×)

occupied area

Dimensions in mm

sot363_fr

0.5

(4×)

0.6

(4×)

Fig 24. Reﬂow soldering footprint BAS16VY (SOT363/SC-88)

Product data sheet Rev. 05 — 25 August 2008 14 of 20

NXP Semiconductors

4.5

1.5

0.3

BAS16 series

High-speed switching diodes

solder lands

2.5 solder resist

1.5

1.3 1.3

2.45

5.3

Fig 25. Wave soldering footprint BAS16VY (SOT363/SC-88)

2.65

1.85

1.325

0.55 (3×)

1.3

0.5

(3×)

2.35

0.6

(3×)

occupied area

Dimensions in mm

preferred transport

direction during soldering

sot363_fw

solder lands

solder resist

solder paste

occupied area

Dimensions in mm

sot323_fr

Fig 26. Reﬂow soldering footprint BAS16W (SOT323/SC-70)

Product data sheet Rev. 05 — 25 August 2008 15 of 20

NXP Semiconductors

BAS16 series

High-speed switching diodes

4.6

2.575

1.425 (3×)

solder lands

solder resist

occupied area

3.65 2.1

1.8

(2×)

Fig 27. Wave soldering footprint BAS16W (SOT323/SC-70)

3.05

2.1

0.951.65

2.2

0.5

(2×)

0.6

(2×)

0.6 (2×)0.5 (2×)

Fig 28. Reﬂow soldering footprint BAS316 (SOD323/SC-76)

Dimensions in mm

preferred transport

direction during soldering

sot323_fw

solder lands

solder resist

solder paste

occupied area

Dimensions in mm

sod323_fr

Product data sheet Rev. 05 — 25 August 2008 16 of 20

NXP Semiconductors

Fig 29. Wave soldering footprint BAS316 (SOD323/SC-76)

2.75

1.2

(2×)

BAS16 series

High-speed switching diodes

2.9

1.5 (2×) solder lands

solder resist

occupied area

Dimensions in mm

preferred transport

direction during soldering

sod323_fw

2.15

1.1

0.5

1.2

0.7

(2×)

0.8

(2×)

0.6

(2×)

Reﬂow soldering is the only recommended soldering method.

Fig 30. Reﬂow soldering footprint BAS516 (SOD523/SC-79)

solder lands

solder resist

solder paste

occupied area

Dimensions in mm

sod523_fr

Product data sheet Rev. 05 — 25 August 2008 17 of 20

NXP Semiconductors

BAS16 series

High-speed switching diodes

12. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAS16_SER_5 20080825 Product data sheet - BAS16_4

BAS16H_1 BAS16J_1 BAS16L_1 BAS16T_1 BAS16VV_BAS16VY_3 BAS16W_4 BAS316_4 BAS516_1

Modiﬁcations:

BAS16_4 20011010 Product speciﬁcation - BAS16_3 BAS16H_1 20050415 Product data sheet - BAS16J_1 20070308 Product data sheet - BAS16L_1 20030623 Product speciﬁcation - BAS16T_1 19980120 Product speciﬁcation - BAS16VV_BAS16VY_3 20070420 Product data sheet - BAS16VV_BAS16VY_2 BAS16W_4 19990506 Product speciﬁcation - BAS16W_3 BAS316_4 20040204 Product speciﬁcation - BAS316_3 BAS516_1 19980831 Product speciﬁcation - -

• The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Table 5 “Marking codes”: marking code amended for BAS16W

• Table 6 “Limiting values”: for BAS16, BAS16T, BAS16W and BAS516 change of

maximum value from 85 V to 100 V

RRM

• Table 6 “Limiting values”: for BAS16, BAS16L, BAS16T, BAS16W and BAS516 change of

maximum value from 75 V to 100 V

• Table 8 “Characteristics”: change of I

and T

=25°C

• Table 8 “Characteristics”: change of I

condition VR from 75 V to 80 V for Tj=25°C

maximum value from 1.0 µAto0.5µA for VR=80V

condition VR from 75 V to 80 V for Tj= 150 °C

• Section 13 “Legal information”: updated

Product data sheet Rev. 05 — 25 August 2008 18 of 20

NXP Semiconductors

13. Legal information

13.1 Data sheet status

BAS16 series

High-speed switching diodes

Document status

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development. Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation. Product [short] data sheet Production This document contains the product speciﬁcation.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Deﬁnitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

13.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modiﬁcations or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the full data sheet shall prevail.

13.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or warranties, expressedor implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation speciﬁcations and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental

[3]

http://www.nxp.com.

Deﬁnition

damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at

http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conﬂict between information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyanceor implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced brands,product names, service names and trademarks are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 05 — 25 August 2008 19 of 20

NXP Semiconductors

15. Contents

1 Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

10 Packing information. . . . . . . . . . . . . . . . . . . . . 10

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19

13.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

14 Contact information. . . . . . . . . . . . . . . . . . . . . 19

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

BAS16 series

High-speed switching diodes

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 August 2008

Document identifier: BAS16_SER_5

NXP BAS 16J NXP Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

1.1 General description

1.2 Features

1.3 Applications

1.4 Quick reference data

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

8. Test information

9. Package outline

10. Packing information

11. Soldering

12. Revision history

13. Legal information

13.1 Data sheet status

13.3 Disclaimers

13.4 Trademarks

14. Contact information

15. Contents