NXP AN13204 Application Note

AN13204

i.MX RT1170 ECC Application

Rev. 0 — 03/2021

1 Introduction

i.MX RT1170 covers auto area, so, compared with previous i.MX RT product
like i.MX RT1060, the ECC feature is enhanced a lot. For use case with high
safety level requirement, we need to detect the ECC error when it happens and
informs application system to decide how to process this error.

This document discusses the ECC application on memory, including TCM,
Cache, OCRAM and external memory, and shares some key points and
experience. It does not cover ECC application on peripherals like FlexSPI,
Fuse, OCOTP, CSI, MIPI CSI, MIPI DSI, ENET QOS and FLEX CAN.

For memory ECC application on i.MX RT1170, we need to consider:

• On which memory to apply ECC?

i.MX RT 1170 contains the following memory types:

— TCM

Application Note

Contents

1 Introduction......................................1

2 i.MX RT1170 ECC feature list......... 1

3 Fuse setting and SW configuration

related with ECC feature................. 2

4 Fuse setting implementation by MCU

boot utility tool................................. 3

5 Preloading operation....................... 5

6 ECC error injection..........................6

7 SDK example related with ECC

feature............................................. 6

8 Attentions for i.MX RT1170 ECC

application....................................... 7

9 References......................................7

10 Revision history...............................7

— Cache

— OCRAM

— External memory

• How to inject/capture ECC error?

• Fuse setting and SW configuration related with ECC.

• ROM feature related with ECC.

2 i.MX RT1170 ECC feature list

Table 1 lists i.MXRT1170 ECC features.

Table 1. i.MX RT1170 ECC feature list

Items ECC feature

[CM7] TCM from CM7 FlexRAM

[CM7] Cache

[CM4] TCM/LMEM

ITCM: 64bit data + 8bit ECC

DTCM: 32bit data + 7bit ECC

I-Cache: 64 bit data + 8 bit ECC

D-Cache: 32 bit data + 7 bit ECC

Hsiao odd-weight column criteria ECC code

32 bit data + 7 bit ECC

Table continues on the next page...

NXP Semiconductors

Table 1. i.MX RT1170 ECC feature list (continued)

Items ECC feature

[CM4] Cache Parity check

Fuse setting and SW configuration related with ECC feature

[CM7/CM4] OCRAM1/OCRAM2

[CM7/CM4] OCRAM from CM7 FlexRAM Hsiao Hamming algorithm 64 bit data + 8 bit ECC

[CM7/CM4] OCRAM from CM4 TCM/LMEM

[CM7/CM4] XECC

Hsiao Hamming algorithm

64 bit data + 8 bit ECC

Hsiao odd-weight column criteria ECC code

32 bit data + 7 bit ECC

Hsiao Hamming algorithm 4 bit data + 4 bit ECC

Extend to be: 32 bit data + 32 bit ECC

3 Fuse setting and SW configuration related with ECC feature

To enable ECC feature, enable related fuse settings and software configurations.

Table 2 lists fuse settings related with ECC.

Table 2. Fuse settings related with ECC

Fuse map Function

0x840[2] MECC, for OCRAM1/OCRAM2

0x840[3] XECC for external memory like SDRAM, SRAM, FlexSPI device.

0x840[15] CM7 Flex RAM ECC(Include CM7 Flex RAM TCM and CM7 Flex RAM OCRAM)

0x950[0] ROM preloading

Table 3 lists the software configurations.

Table 3. SW configurations related with ECC

Items SW config requirement Executed by ROM?

SCB->ITCMCR |
= SCB_ITCMCR_RMW_Msk;

[CM7] TCM from CM7 FlexRAM

[CM7] Cache CACR &= ~ECCEN_Msk No, enabled by default.

[CM4] TCM/LMEM

SCB->DTCMCR |
= SCB_DTCMCR_RMW_Msk;

FLEXRAM_CTRL |= TCM_ECC_EN_Msk

LMDR0 |= 0xB;

LMDR1 |= 0xB;

(By CM4 only)

Yes, if 0x840[15] fused.

Yes, if 0x840[2] fused.

Table continues on the next page...

i.MX RT1170 ECC Application, Rev. 0, 03/2021

Application Note 2 / 8

NXP Semiconductors

Table 3. SW configurations related with ECC (continued)

Items SW config requirement Executed by ROM?

LMDR2 |= 0xF0;

Fuse setting implementation by MCU boot utility tool

[CM4] Cache

[CM7/CM4] OCRAM1/OCRAM2

[CM7/CM4] OCRAM from CM7 FlexRAM FLEXRAM_CTRL |= OCRAM_ECC_EN_Msk No

[CM7/CM4] OCRAM from CM4
TCM/LMEM

[CM7/CM4] XECC XECC_ECC_CTRL |= 7; No

LMDR3 |= 0xF0;

(By CM4 only)

MECC1_PIPE_ECC_EN |= ECC_EN_Msk

MECC2_PIPE_ECC_EN |= ECC_EN_Msk

LMDR0 |= 0xB;

LMDR1 |= 0xB;

(By CM4 only)

No

Yes, if 0x840[2] fused.

Yes, if 0x840[2] fused.

4 Fuse setting implementation by MCU boot utility tool

MCU boot utility tool is used for fuse setting.

1. Config boot mode, config power jumper (not a must), and connect USB1 port, as shown in Figure 1.

Figure 1. Hardware setup

2. Launch MCU boot utility tool, with PID and VID recognized correctly.

i.MX RT1170 ECC Application, Rev. 0, 03/2021

Application Note 3 / 8