The 74HC73 is a high-speed Si-gate CMOS device and is pin compatible with low-power
Schottky TTL (LSTTL). The 74HC73 is specified in compliance with JEDEC
standard no. 7A.
The 74HC is a dual negative-edge triggered JK flip-flop featuring individual J, K, clock
(nCP) and reset (nR) inputs; also complementary nQ and nQ outputs.
The J and K inputs must be stable one set-up time prior to the HIGH-to-LOW clock
transition for predictable operation.
The reset (nR) is an asynchronous active LOW input. When LOW, it overrides the clock
and data inputs, forcing the nQ output LOW and the nQ output HIGH.
Schmitt-trigger action in the clock input makes the circuit highly tolerant to slower clock
rise and fall times.
2.Features
■ Low-power dissipation
■ Complies with JEDEC standard no. 7A
■ ESD protection:
◆ HBM EIA/JESD22-A114-B exceeds 2000 V
◆ MM EIA/JESD22-A115-A exceeds 200 V.
■ Multiple package options
■ Specified from −40 °Cto+80°C and from −40 °C to +125 °C.
Page 2
Philips Semiconductors
3.Quick reference data
Table 1:Quick reference data
GND = 0 V; T
SymbolParameterConditionsMinTypMaxUnit
, t
t
PHL
f
max
C
I
C
PD
amb
PLH
74HC73
Dual JK flip-flop with reset; negative-edge trigger
=25°C; tr=tf= 6 ns.
propagation delayCL= 15 pF; VCC=5 V--
CP to nQ-16-ns
n
CP to nQ-16-ns
n
R to nQ, nQ-15-ns
n
maximum clock
frequency
input capacitance-3.5-pF
power dissipation
capacitance per flip-flop
CL= 15 pF; VCC= 5 V-77-MHz
VI= GND to V
CC
[1]
-30-pF
[1] CPD is used to determine the dynamic power dissipation (PD in µW).
PD=CPD× V
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC= supply voltage in V;
N =number of inputs switching;
∑(CL× V
2
× fi× N+∑(CL× V
CC
2
× fo) = sum of outputs.
CC
2
× fo) where:
CC
4.Ordering information
Table 2:Ordering information
Type numberPackage
Temperature range NameDescriptionVersion
74HC73N−40 °C to +125 °CDIP14plastic dual in-line package; 14 leads (300 mil)SOT27-1
74HC73D−40 °C to +125 °CSO14plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
74HC73DB−40 °C to +125 °CSSOP14plastic shrink small outline package; 14 leads; body width
5.3 mm
74HC73PW−40 °C to +125 °CTSSOP14 plastic thin shrink small outline package; 14 leads; body
Product data sheetRev. 03 — 12 November 20044 of 21
Page 5
Philips Semiconductors
74HC73
Dual JK flip-flop with reset; negative-edge trigger
Table 3:Pin description
SymbolPinDescription
GND11ground (0 V)
1Q12true flip-flop 1 output
Q13complement flip-flop 1 output
1
1J14synchronous J input for flip-flop 1
7.Functional description
7.1 Function table
Table 4:Function table
InputOutputOperating mode
nRnCPnJnKnQnQ
LXXXLHasynchronous reset
H↓hh
[1] H = HIGH voltage level;
h = HIGH voltage level one set-up time prior to the HIGH-to-LOW CP transition;
L = LOW voltage level;
I = LOW voltage level one set-up time prior to the HIGH-to-LOW CP transition;
q = state of referenced output one set-up time prior to the HIGH-to-LOW CP transition;
X = don’t care;
↓ = HIGH-to-LOW CP transition.
…continued
[1]
qqtoggle
lhLHload 0 (reset)
hlHLload 1 (set)
llq
qhold (no change)
8.Limiting values
Table 5:Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Product data sheetRev. 03 — 12 November 20045 of 21
supply voltage−0.5+7V
input diode currentVI < −0.5 V or VI>VCC+ 0.5 V-±20mA
output diode currentVO< −0.5 V or VO>VCC+ 0.5 V-±20mA
output source or sink
VO = −0.5 V to VCC+ 0.5 V-±25mA
current
GNDVCC
or GND current-±50mA
storage temperature−65+150°C
power dissipation
[1]
DIP14 package
SO14, SSOP14 and
-750mW
[2]
-500mW
TSSOP14 packages
derates linearly with 12 mW/K.
tot
derates linearly with 8 mW/K.
tot
Page 6
Philips Semiconductors
74HC73
Dual JK flip-flop with reset; negative-edge trigger
9.Recommended operating conditions
Table 6:Recommended operating conditions
SymbolParameterConditionsMinTypMaxUnit
V
V
V
t
T
, t
r
amb
CC
I
O
f
supply voltage2.05.06.0V
input voltage0-V
output voltage0-V
input rise and fall
times except for
n
CP
ambient
= 2.0 V--1000ns
V
CC
= 4.5 V-6.0500ns
V
CC
= 6.0 V--400ns
V
CC
−40-+125°C
CC
CC
V
V
temperature
10. Static characteristics
Table 7:Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Product data sheetRev. 03 — 12 November 200411 of 21
Page 12
Philips Semiconductors
74HC73
Dual JK flip-flop with reset; negative-edge trigger
Table 8:Dynamic characteristics
…continued
GND = 0 V; tr=tf= 6 ns; CL= 50 pF; see Figure 8.
SymbolParameterConditionsMinTypMaxUnit
t
rem
t
su
t
h
f
max
[1] CPD is used to determine the dynamic power dissipation (PD in µW).
removal time nR to nCPsee Figure 7
set-up time nJ, nK to nCPsee Figure 6
hold time nJ, nK to nCPsee Figure 6
maximum clock frequencysee Figure 6
PD=CPD× V
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC= supply voltage in V;
N = number of inputs switching;
∑(CL× V
Product data sheetRev. 03 — 12 November 200413 of 21
R to nCP removal time
Page 14
Philips Semiconductors
Fig 8. Load circuitry for switching times
Table 9:Test data
SupplyInputLoad
V
CC
2.0 VV
4.5 VV
6.0 VV
5.0 VV
74HC73
Dual JK flip-flop with reset; negative-edge trigger
V
CC
V
PULSE
GENERATOR
Test data is given in Table 9.
Definitions for test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
Product data sheetRev. 03 — 12 November 200419 of 21
Page 20
Philips Semiconductors
15. Data sheet status
74HC73
Dual JK flip-flop with reset; negative-edge trigger
Level Data sheet status
IObjective dataDevelopmentThis data sheet contains data from the objective specification for product development. Philips
IIPreliminary dataQualificationThisdatasheetcontainsdatafromthepreliminary specification. Supplementary data will be published
IIIProduct dataProductionThis data sheet contains data from the product specification. Philips Semiconductors reserves the
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
[1]
Product status
16. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
[2] [3]
Definition
Semiconductors reserves the right to change the specification in any manner without notice.
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
right to make changes at any time in order to improvethe design, manufacturing and supply.Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
17. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, andmakesno representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
18. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Published in The Netherlands
Date of release: 12 November 2004
Document number: 9397 750 13815
Page 22
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