NXP 74HC 4052D NXP Datasheet

Download

INTEGRATED CIRCUITS

DATA SH EET

74HC4052; 74HCT4052

Dual 4-channel analog multiplexer, demultiplexer

Product speciﬁcation Supersedes data of 1997 Aug 27

2003 May 16

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

FEATURES

• Wide analog input voltage range from −5 V to +5 V

• Low ON-resistance:

–80Ω(typical) at VCC− VEE= 4.5 V –70Ω(typical) at VCC− VEE= 6.0 V –60Ω(typical) at VCC− VEE= 9.0 V

• Logic level translation: to enable 5 V logic to communicate with ±5 V analog signals

• Typical “break before make” built in

• Complies with JEDEC standard no. 8-1 A

• ESD protection:

– HBM EIA/JESD22-A114-A exceeds 2000 V – MM EIA/JESD22-A115-A exceeds 200 V.

• Specified from −40 to +85 °C and −40 to +125 °C.

APPLICATIONS

• Analog multiplexing and demultiplexing

• Digital multiplexing and demultiplexing

• Signal gating.

74HC4052; 74HCT4052

DESCRIPTION

The 74HC4052/74HCT4052 are high-speed Si-gate CMOS devices and are pin compatible with the HEF4052B. Theyare specified in compliance with JEDEC standard no. 7A.

The 74HC4052/74HCT4052 are dual 4-channel analog multiplexers or demultiplexers with common select logic. Each multiplexer has four independent inputs/outputs (pinsnY0 to nY3) and acommoninput/output (pin nZ). The common channel select logics include two digital select inputs (pins S0 and S1) and an active LOW enable input (pin E). When pin E = LOW, one of the four switches is selected (low-impedance ON-state) with pins S0 and S1. When pin E = HIGH, all switches are in the high-impedance OFF-state, independent of pins S0 and S1.

VCC and GND are the supply voltage pins for the digital control inputs (pins S0, S1, and E). The VCC to GND ranges are 2.0 to 10.0 V for 74HC4052 and 4.5 to 5.5 V for 74HCT4052. The analog inputs/outputs (pins nY0 to nY3and nZ) can swingbetween VCCasa positive limit and VEEas a negative limit. VCC− VEEmay not exceed 10.0 V.

For operation as a digital multiplexer/demultiplexer, VEEis connected to GND (typically ground).

FUNCTION TABLE

ES1S0

L L L nY0 and nZ L L H nY1 and nZ L H L nY2 and nZ L H H nY3 and nZ H X X none

Note

1. H = HIGH voltage level

L = LOW voltage level X = don’t care.

INPUT

(1)

CHANNEL BETWEEN

2003 May 16 2

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

QUICK REFERENCE DATA

VEE= GND = 0 V; T

SYMBOL PARAMETER CONDITIONS

PZH/tPZL

PHZ/tPLZ

turn-on time E or Sn to V

turn-off time E or Sn to V

input capacitance 3.5 3.5 pF power dissipation capacitance per switch notes 1 and 2 57 57 pF maximum switch capacitance independent (Y) 5 5 pF

Notes

1. C

is used to determine the dynamic power dissipation (PDin µW).

PD=CPD× V fi= input frequency in MHz; fo= output frequency in MHz; CL= output load capacitance in pF; CS= maximum switch capacitance in pF; VCC= supply voltage in Volts; N = total load switching outputs; Σ[(CL+CS)×V

2. For 74HC4052 the condition is VI= GND to V

For 74HCT4052 the condition is VI= GND to VCC− 1.5 V.

=25°C; tr=tf= 6 ns.

amb

× fi× N+Σ[(CL+CS)×V

× fo] = sum of the outputs.

CL= 15 pF; RL=1kΩ; VCC=5V

common (Z) 12 12 pF

× fo] where:

74HC4052; 74HCT4052

TYPICAL

UNIT

74HC4052 74HCT4052

28 18 ns

21 13 ns

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

TEMPERATURE

RANGE

PINS PACKAGE MATERIAL CODE

74HC4052D −40 to +125 °C 16 SO16 plastic SOT109-3 74HCT4052D −40 to +125 °C 16 SO16 plastic SOT109-3 74HC4052DB −40 to +125 °C 16 SSOP16 plastic SOT338-1 74HCT4052DB −40 to +125 °C 16 SSOP16 plastic SOT338-1 74HC4052N −40 to +125 °C 16 DIP16 plastic SOT38-9 74HCT4052N −40 to +125 °C 16 DIP16 plastic SOT38-9 74HC4052PW −40 to +125 °C 16 TSSOP16 plastic SOT403-1 74HC4052BQ −40 to +125 °C 16 DHVQFN16 plastic SOT763-1 74HCT4052BQ −40 to +125 °C 16 DHVQFN16 plastic SOT763-1

2003 May 16 3

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

PINNING

PIN SYMBOL DESCRIPTION

1 2Y0 independent input or output 2 2Y2 independent input or output 3 2Z common input or output 4 2Y3 independent input or output 5 2Y1 independent input or output 6 7V 8 GND ground (0 V)

9 S1 select logic input 10 S0 select logic input 11 1Y3 independent input or output 12 1Y0 independent input or output 13 1Z common input or output 14 1Y1 independent input or output 15 1Y2 independent input or output 16 V

E enable input (active LOW)

74HC4052; 74HCT4052

negative supply voltage

positive supply voltage

handbook, halfpage

2Y0 2Y2

2Z 2Y3 2Y1

GND

1 2 3 4

4052

5 6

7 8

MNB039

1Y2

1Y1

1Y0

1Y3

Fig.1 Pin configuration DIP16, SO16 and

(T)SSOP16.

handbook, halfpage

2Y2

2Y3

2Y1

611

Top view

(1) The die substrate is attached to this pad using conductive die

attach material. It can not be used as a supply pin or input.

2Y0

116

(1)

GND

MNB061

1Y2

1Y1

1Y0

1Y3

Fig.2 Pin configuration DHVQFN16.

2003 May 16 4

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

S0 S1

1Y0

1Y1

1Y2

1Y3

11 2Y0 2Y1 2Y2 2Y3

1 5 2 4

MNB040

handbook, halfpage

Fig.3 Logic symbol.

handbook, halfpage

74HC4052; 74HCT4052

4 ×

MDX

MNB041

12 14 15 11

9 6

Fig.4 IEC logic symbol.

handbook, full pagewidth

LOGIC

LEVEL

CONVERSION

GND

1 - OF - 4

DECODER

13 12

MNB042

1Z 1Y0

1Y1

1Y2

1Y3

2Y0

2Y1

2Y2

2Y3

Fig.5 Functional diagram.

2003 May 16 5

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer,

74HC4052; 74HCT4052

demultiplexer

handbook, full pagewidth

from

logic

Fig.6 Schematic diagram (one switch).

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to VEE= GND (ground = 0 V); note 1.

nYn

MNB043

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

CC;IGND

stg

tot

supply voltage −0.5 +11.0 V input diode current VI<−0.5 V or VI> VCC+ 0.5 V −±20 mA switch diode current VS<−0.5 V or VS> VCC+ 0.5 V −±20 mA switch current −0.5 V < VS< VCC+ 0.5 V −±25 mA VEE current −±20 mA VCC or GND current −±50 mA storage temperature −65 +150 °C power dissipation T

= −40 to +125 °C; note − 500 mW

amb

power dissipation per switch − 100 mW

Notes

1. To avoid drawing V

current out of pins nZ, when switch current flows in pins nYn, the voltage drop across the

bidirectional switch must not exceed 0.4 V. If the switch current flows into pins nZ, no VCC current will flow out of pins nYn. In this case thereis no limit for the voltage drop across theswitch, but the voltages at pins nYn and nZmay not exceed VCC or VEE.

2. For DIP16 packages: above 70 °C derate linearly with 12 mW/K. For SO16 packages: above 70 °C derate linearly with 8 mW/K. For SSOP16 and TSSOP16 packages: above 60 °C derate linearly with 5.5 mW/K. For DHVQFN16 packages: above 60 °C derate linearly with 4.5 mW/K.

2003 May 16 6

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER CONDITIONS

amb

, t

supply voltage see Figs 7 and 8

− GND 2.0 5.0 10.0 4.5 5.0 5.5 V

− V

input voltage GND − V switch voltage V operating ambient

temperature

see DC and AC characteristics per device

input rise and fall times VCC= 2.0 V − 6.0 1000 − 6.0 500 ns

= 4.5 V − 6.0 500 − 6.0 500 ns

= 6.0 V − 6.0 400 − 6.0 500 ns

= 10.0 V − 6.0 250 − 6.0 500 ns

74HC4052; 74HCT4052

74HC4052 74HCT4052

MIN. TYP. MAX. MIN. TYP. MAX.

2.0 5.0 10.0 2.0 5.0 10.0 V GND − V

− V

−40 +25 +85 −40 +25 +85 °C

−40 − +125 −40 − +125 °C

CC CC

UNIT

V V

handbook, halfpage

VCC − GND

(V)

operating area

04 12

VCC − VEE (V)

MNB044

Fig.7 Guaranteed operating area as a function of

the supply voltages for 74HC4052.

handbook, halfpage

VCC − GND

(V)

04 128

operating area

VCC − VEE (V)

MNB045

Fig.8 Guaranteed operating area as a function of

the supply voltages for 74HCT4052.

2003 May 16 7

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer,

74HC4052; 74HCT4052

demultiplexer

DC CHARACTERISTICS Family 74HC4052

Visis the input voltage at pins nYn or nZ, whichever is assigned as an input; Vosis the output voltage at pins nZ or nYn, whichever is assigned as an output; voltages are referenced to GND (ground = 0 V).

SYMBOL PARAMETER

= −40 to +85 °C; note 1

amb

HIGH-level input voltage

LOW-level input voltage

S(OFF)

input leakage current VI=VCCor GND 6.0 0 −−±1.0 µA

analog switch OFF-state current

S(ON)

analog switch ON-state current

quiescent supply current

VI=VIHor VIL; VS =VCC− VEE; see Fig.9

per channel 10.0 0 −−±1.0 µA all channels 10.0 0 −−±2.0 µA

VI=VIHor VIL; VS =VCC− VEE; see Fig.10

VI=VCCor GND; Vis=VEEor VCC; Vos=VCCor V

TEST CONDITIONS

OTHER V

2.0 − 1.5 1.2 − V

4.5 − 3.15 2.4 − V

6.0 − 4.2 3.2 − V

9.0 − 6.3 4.7 − V

2.0 −−0.8 0.5 V

4.5 −−2.1 1.35 V

6.0 −−2.8 1.8 V

9.0 −−4.3 2.7 V

10.0 0 −−±2.0 µA

6.0 0 −−80.0 µA

10.0 0 −−160.0 µA

(V) VEE(V)

MIN. TYP. MAX. UNIT

2003 May 16 8

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

SYMBOL PARAMETER

= −40 to +125 °C

amb

S(OFF)

S(ON)

Note

1. All typical values are measured at T

HIGH-level input voltage

LOW-level input voltage

input leakage current VI=VCCor GND 6.0 0 −−±1.0 µA

analog switch OFF-state current

VI=VIHor VIL; VS =VCC− VEE; see Fig.9

per channel 10.0 0 −−±1.0 µA all channels 10.0 0 −−±2.0 µA

analog switch ON-state current

quiescent supply current

VI=VIHor VIL; VS =VCC− VEE; see Fig.10

VI=VCCor GND; Vis=VEEor VCC; Vos=VCCor V

=25°C.

amb

TEST CONDITIONS

OTHER V

2.0 − 1.5 −−V

4.5 − 3.15 −− V

6.0 − 4.2 −−V

9.0 − 6.3 −−V

2.0 −−−0.5 V

4.5 −−−1.35 V

6.0 −−−1.8 V

9.0 −−−2.7 V

10.0 0 −−±2.0 µA

6.0 0 −−160 µA

10.0 0 −−320.0 µA

(V) VEE(V)

74HC4052; 74HCT4052

MIN. TYP. MAX. UNIT

2003 May 16 9

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer,

74HC4052; 74HCT4052

demultiplexer

Family 74HCT4052

SYMBOL PARAMETER

= −40 to +85 °C; note 1

amb

HIGH-level input voltage

LOW-level input voltage

S(OFF)

input leakage current VI=VCCor GND 5.5 0 −−±1.0 µA analog switch

OFF-state current

S(ON)

analog switch ON-state current

quiescent supply current

∆I

additional quiescent supply current per input

= −40 to +125 °C

amb

HIGH-level input voltage

LOW-level input voltage

S(OFF)

input leakage current VI=VCCor GND 5.5 0 −−±1.0 µA analog switch

OFF-state current

S(ON)

analog switch ON-state current

quiescent supply current

∆I

additional quiescent supply current per input

VI=VIHor VIL; VS =VCC− VEE; see Fig.9

per channel 10.0 0 −−±1.0 µA all channels 10.0 0 −−±2.0 µA

VI=VIHor VIL; VS =VCC− VEE; see Fig.10

VI=VCCor GND; Vis=VEEor VCC; Vos=VCCor V

VI=VCC− 2.1 V;otherinputs at VCC or GND

VI=VIHor VIL; VS =VCC− VEE; see Fig.9

per channel 10.0 0 −−±1.0 µA all channels 10.0 0 −−±2.0 µA

VI=VIHor VIL; VS =VCC− VEE; see Fig.10

VI=VCCor GND; Vis=VEEor VCC; Vos=VCCor V

VI=VCC− 2.1 V;otherinputs at VCC or GND

TEST CONDITIONS

OTHER V

4.5 to 5.5 − 2.0 1.6 − V

4.5 to 5.5 −−1.2 0.8 V

10.0 0 −−±2.0 µA

5.5 0 −−80.0 µA

5.0 −5.0 −−160.0 µA

4.5 to 5.5 0 − 45 202.5 µA

4.5 to 5.5 − 2.0 −− V

4.5 to 5.5 −−−0.8 V

10.0 0 −−±2.0 µA

5.5 0 −−160.0 µA

5.0 −5.0 −−320.0 µA

4.5 to 5.5 0 −−220.5 µA

(V) VEE(V)

MIN. TYP. MAX. UNIT

Note

1. All typical values are measured at T

amb

=25°C.

2003 May 16 10

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

handbook, full pagewidth

(from select input)

LOW

VI = VCC or V

nYn nZ

VO = VEE or V

MNB048

74HC4052; 74HCT4052

handbook, full pagewidth

Fig.9 Test circuit for measuring OFF-state current.

(from select input)

HIGH

nYn nZ

VI = VEE or V

VO (open circuit)

MNB049

Fig.10 Test circuit for measuring ON-state current.

2003 May 16 11

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer,

74HC4052; 74HCT4052

demultiplexer

Resistance RON for 74HC4052 and 74HCT4052

is the input voltage at pins nYn or nZ, whichever is assigned as an input; see notes 1 and 2; see Fig.11.

SYMBOL PARAMETER

= −40 to +85 °C; note 3

amb

ON(peak)

ON-resistance (peak)

ON(rail)

∆R

ON-resistance (rail) Vis=VEE;

maximum ON-resistance difference between any two channels

= −40 to +125 °C

amb

ON(peak)

ON-resistance (peak)

ON(rail)

ON-resistance (rail) Vis=VEE;

OTHER V

Vis=VCCto VEE; VI=VIHor V

VI=VIHor V

Vis=VCC; VI=VIHor V

Vis=VCC to VEE; VI=VIHor V

VI=VIHor V

is=VCC

VI=VIHor V

TEST CONDITIONS

;

(V) VEE(V) IS (µA)

2.0 0 100 −−−Ω

4.5 0 1000 − 100 225 Ω

6.0 0 1000 − 90 200 Ω

4.5 −4.5 1000 − 70 165 Ω

2.0 0 100 − 150 −Ω

4.5 0 1000 − 80 175 Ω

6.0 0 1000 − 70 150 Ω

4.5 −4.5 1000 − 60 130 Ω

2.0 0 100 − 150 −Ω

4.5 0 1000 − 90 200 Ω

6.0 0 1000 − 80 175 Ω

4.5 −4.5 1000 − 65 150 Ω

2.0 0 − −−−Ω

4.5 0 −−9−Ω

6.0 0 −−8−Ω

4.5 −4.5 −−6−Ω

2.0 0 100 −−−Ω

4.5 0 1000 −−270 Ω

6.0 0 1000 −−240 Ω

4.5 −4.5 1000 −−195 Ω

2.0 0 100 −−−Ω

4.5 0 1000 −−210 Ω

6.0 0 1000 −−180 Ω

4.5 −4.5 1000 −−160 Ω

2.0 0 100 −−−Ω

4.5 0 1000 −−240 Ω

6.0 0 1000 −−210 Ω

4.5 −4.5 1000 −−180 Ω

MIN. TYP. MAX. UNIT

Notes

1. For 74HC4052: V

− GND or VCC− VEE= 2.0, 4.5, 6.0 and 9.0 V; for 74HCT4052: VCC− GND = 4.5 and 5.5 V,

VCC− VEE= 2.0, 4.5, 6.0 and 9.0 V.

2. Whensupplyvoltages (VCC− VEE)near2.0 V the analog switchON-resistancebecomesextremely non-linear. When using a supply of 2 V, it is recommended to use these devices only for transmitting digital signals.

3. All typical values are measured at T

amb

=25°C.

2003 May 16 12

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

handbook, full pagewidth

(from select input)

= 0 to VCC − V

HIGH

nYn

74HC4052; 74HCT4052

MNB046

Vis= 0 to VCC− V (1) VCC= 4.5 V (2) VCC=6V (3) VCC=9V

Fig.11 Test circuit for measuring RON.

100

handbook, halfpage

(Ω)

1.8 3.6 5.4 7.2

(1)

(2)

(3)

MNB047

Vis (V)

Fig.12 Typical RON as a function of input voltage Vis.

2003 May 16 13

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

AC CHARACTERISTICS Type 74HC4052

GND = 0 V; tr=tf= 6 ns; CL=50pF.

SYMBOL PARAMETER

= −40 to +85 °C; note 1

amb

PHL/tPLH

PZH/tPZL

PHZ/tPLZ

amb

PHL/tPLH

PZH/tPZL

PHZ/tPLZ

propagation delay Vis to VosRL= ∞; see Fig.19 2.0 0 − 14 75 ns

turn-on time E, Sn to V

RL= ∞; see Figs 20,

22 and 21

turn-off time E, Sn to V

RL=1kΩ; see Figs 20,

22 and 21

= −40 to +125 °C

propagation delay Vis to VosRL= ∞; see Fig.19 2.0 0 −−90 ns

turn-on time E, Sn to V

RL= ∞; see Figs 20,

22 and 21

turn-off time E, Sn to V

RL=1kΩ; see Figs 20,

22 and 21

TEST CONDITIONS

OTHER V

74HC4052; 74HCT4052

(V) VEE(V)

4.5 0 − 515ns

6.0 0 − 413ns

4.5 −4.5 − 410ns

2.0 0 − 105 405 ns

4.5 0 − 38 81 ns

6.0 0 − 30 69 ns

4.5 −4.5 − 26 58 ns

2.0 0 − 74 315 ns

4.5 0 − 27 63 ns

6.0 0 − 22 54 ns

4.5 −4.5 − 22 48 ns

4.5 0 −−18 ns

6.0 0 −−15 ns

4.5 −4.5 −−12 ns

2.0 0 −−490 ns

4.5 0 −−98 ns

6.0 0 −−83 ns

4.5 −4.5 −−69 ns

2.0 0 −−375 ns

4.5 0 −−75 ns

6.0 0 −−64 ns

4.5 −4.5 −−57 ns

MIN. TYP. MAX. UNIT

Note

1. All typical values are measured at T

amb

=25°C.

2003 May 16 14

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

Type 74HCT4052

GND = 0 V; tr=tf= 6 ns; CL=50pF.

SYMBOL PARAMETER

= −40 to +85 °C; note 1

amb

PHL/tPLH

PZH/tPZL

PHZ tPLZ

amb

PHL/tPLH

PZH/tPZL

PHZ/tPLZ

propagation delay Visto VosRL= ∞; see Fig.19 4.5 0 − 515ns

turn-on time E, Sn to V

RL=1kΩ; see Figs 20,

22 and 21

turn-off time E, Sn to V

RL=1kΩ; see Figs 20,

22 and 21

= −40 to +125 °C

propagation delay Vis to VosRL= ∞; see Fig.19 4.5 0 −−18 ns

turn-on time E, Sn to V

RL=1kΩ; see Figs 20,

22 and 21

turn-off time E, Sn to V

RL=1kΩ; see Figs 20,

22 and 21

TEST CONDITIONS

OTHER V

74HC4052; 74HCT4052

(V) VEE(V)

4.5 −4.5 − 410ns

4.5 0 − 41 88 ns

4.5 −4.5 − 28 60 ns

4.5 0 − 26 63 ns

4.5 −4.5 − 21 48 ns

4.5 −4.5 −−12 ns

4.5 0 −−105 ns

4.5 −4.5 −−72 ns

4.5 0 −−75 ns

4.5 −4.5 −−57 ns

MIN. TYP. MAX. UNIT

Note

1. All typical values are measured at T

amb

=25°C.

2003 May 16 15

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

Type 74HC4052 and 74HCT4052

Recommended conditions and typical values; GND = 0 V; T or nZ, whichever is assigned as an input. V output.

SYMBOL PARAMETER

sin

OFF(feedthr)

sine-wave distortion f = 1 kHz; RL=10kΩ;

switch OFF signal feed-through

ct(s)

crosstalk between two switches/multiplexers

ct(p-p)

crosstalk voltage between control and any switch (peak-to-peak value)

max

minimum frequency response (−3dB)

maximum switch capacitance

is the output voltage at pins nYn or nZ, whichever is assigned as an

OTHER

see Fig.13 f = 10 kHz; R

=10kΩ;

see Fig.13 RL= 600 Ω; f = 1 MHz;

see Figs 14 and 15 RL= 600 Ω; f = 1 MHz;

see Fig.16 RL= 600 Ω; f = 1 MHz; E or Sn,

square-wave between VCC and GND, tr=tf= 6 ns; see Fig.17

RL=50Ω; see Figs 13 and 18 note 2 2.25 −2.25 170 MHz

independent (Y) −−−5pF common (Z) −−−12 pF

74HC4052; 74HCT4052

=25°C; CL=50pF.Visis the input voltage at pins nYn

amb

TEST CONDITIONS

is(p-p)

(V)

VCC (V) VEE (V)

4.0 2.25 −2.25 0.04 %

8.0 4.5 −4.5 0.02 %

4.0 2.25 −2.25 0.12 %

8.0 4.5 −4.5 0.06 % note 1 2.25 −2.25 −50 dB

4.5 −4.5 −50 dB

note 1 2.25 −2.25 −60 dB

4.5 −4.5 −60 dB

− 4.5 0 110 mV

4.5 −4.5 220 mV

4.5 −4.5 180 MHz

TYP. UNIT

Notes

1. Adjust input voltage V

to 0 dBm level (0 dBm = 1 mW into 600 Ω).

2. Adjust input voltage Vis to 0 dBm level at Vos for 1 MHz (0 dBm = 1 mW into 50 Ω).

handbook, full pagewidth

10 µF

CLdB

channel

nZ/nYnnYn/nZ

MNB052

GND

Fig.13 Test circuit for measuring sine-wave distortion and minimum frequency response.

2003 May 16 16

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

handbook, full pagewidth



−0

Fig.14 Test circuit for measuring switch OFF signal feed-through.

0.1 µF

channel

OFF

74HC4052; 74HCT4052

nZ/nYnnYn/nZ

CLdB

GND

MNB053



−0

−0

−0

−00

0 0

Test conditions: VCC= 4.5 V; GND = 0 V; VEE= −4.5 V; RL=50Ω;R



Fig.15 Typical switch OFF signal feed-through as a function of frequency.

handbook, full pagewidth

0.1 µF

channel

(a)

nZ/nYnnYn/nZ



0

=1kΩ.

source

GND



0

channel

OFF

(b)



0



nZ/nYnnYn/nZ

MNB054

0

GND



(a) channel ON condition. (b) channel OFF condition.

Fig.16 Test circuits for measuring crosstalk between any two switches/multiplexers.

2003 May 16 17

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

handbook, full pagewidth

The crosstalk is defined as follows (oscilloscope output):

V(p−p)

74HC4052; 74HCT4052

Sn or E

DUT

nZ/nYnnYn/nZ

oscilloscope

MNB055

GND V

handbook, full pagewidth



−5 0 0

Fig.17 Test circuit for measuring crosstalk between control and any switch.





0



0







0

Test conditions: VCC= 4.5 V; GND = 0 V; VEE= −4.5 V; RL=50Ω; R

source

Fig.18 Typical frequency response.

2003 May 16 18

=1kΩ.

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

AC WAVEFORMS

input

GND

handbook, halfpage

output

50%

PLH

74HC4052; 74HCT4052

PHL

MNB056

Fig.19 Waveforms showing the input (Vis) to output (Vos) propagation delays.

handbook, full pagewidth

E, Sn input

Vos output

For 74HC4052: VM= 50%; VI= GND to VCC. For 74HCT4052: VM= 1.3 V; VI= GND to 3 V.

10%

90%

PLZ

10%

PHZ

90%

switch

OFF

PZL

50%

PZH

50%

switch ON

MNB057

Fig.20 Waveforms showing the turn-on and turn-off times.

2003 May 16 19

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

handbook, full pagewidth

90%

10%

90%

10%

; PULSE WIDTH OTHER

max

FAMILY AMPLITUDE V

74HC4052 V

negative

input pulse

positive

input pulse

50% <2ns 6ns

74HCT4052 3.0 V 1.3 V <2ns 6ns

(tf)t

THL

(tr)t

TLH

tr and t

TLH THL

74HC4052; 74HCT4052

amplitude

0 V

(tr) (tf)

amplitude

0 V

MNB059

Fig.21 Input pulse definitions.

handbook, full pagewidth

VCCV

TEST SWITCH V

PZH

PZL

PHZ

PLZ

V V V V

PULSE

GENERATOR

CC EE CC EE

D.U.T.

other open pulse

Definitions for test circuit: RL= load resistance CL= load capacitance including jig and probe capacitance. RT= termination resistance should be equal to the output impedance ZO of the pulse generator. tr=tf= 6 ns; when measuring f

, there is no constraint to trand tf with 50% duty factor.

max

switch

V open

MNB058

GND V

Fig.22 Test circuit for measuring AC performance.

2003 May 16 20

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer,

74HC4052; 74HCT4052

demultiplexer

PACKAGE OUTLINES

SO16: plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm

SOT109-3

v M

pin 1 index

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

max.

1.75

0.069

OUTLINE

VERSION

SOT109-3

A1A2A3b

0.25

1.55

0.10

0.010

0.004

0.25

1.40

0.061

0.01

0.055

IEC JEDEC JEITA

0.49

0.36

0.019

0.014

0.25

0.19

0.0100

0.0075

MS-012AC

(1)E(1) (1)

10.0

9.8

0.39

0.38

REFERENCES

4.0

3.8

0.16

0.15

w M

scale

eHELL

6.2

1.27

5.8

0.244

0.05

0.228

1.05

0.041

detail X

1.0

0.25

0.4

0.039

0.01 0.004

0.016

PROJECTION

(A )

0.25 0.1

0.01

EUROPEAN

Zywv θ

0.7

0.3

0.028

0.012

ISSUE DATE

98-12-23 03-02-19

2003 May 16 21

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm

74HC4052; 74HCT4052

SOT338-1

v M

pin 1 index

DIMENSIONS (mm are the original dimensions)

max.

0.21

0.05

A2A3b

1.80

0.25

1.65

0.38

0.25

UNIT A

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.20

6.4

0.09

6.0

w M

0 2.5 5 mm

scale

(1)E(1)

eHELLpQZywv θ

5.4

0.65 1.25

5.2

7.9

7.6

detail X

1.03

0.9

0.63

0.7

(A )

0.130.2 0.1

(1)

1.00

0.55

OUTLINE VERSION

SOT338-1

IEC JEDEC JEITA

REFERENCES

MO-150

2003 May 16 22

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27 03-02-19

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

DIP16: plastic dual in-line package; 16 leads (300 mil)

seating plane

74HC4052; 74HCT4052

SOT38-9

w M

(e1) M

pin 1 index

0 5 10 mm

DIMENSIONS (mm dimensions are derived from the original inch dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

max.

OUTLINE

VERSION

SOT38-9

min.

max.

IEC JEDEC JEITA

1.65

1.40

0.065

0.055

0.51

0.41

0.020

0.016

1.14

0.76

0.045

0.030

REFERENCES

cD E e M

0.36

0.20

0.014

0.008

scale

(1) (1)

19.3

18.8

0.76

0.74

6.45

6.24

0.254

0.246

(1)

0.150

0.115

3.81

8.23

2.92

7.62

0.324

0.300

EUROPEAN

PROJECTION

9.40

8.38

0.37

0.33

0.2542.54 7.62

0.010.1 0.3

ISSUE DATE

97-07-24 03-03-12

max.

0.764.32 0.38 3.56

0.030.17 0.015 0.14

2003 May 16 23

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer,

74HC4052; 74HCT4052

demultiplexer

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

v M

pin 1 index

w M

DIMENSIONS (mm are the original dimensions)

UNIT A1A2A3b

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

max.

0.15

1.1

OUTLINE

VERSION

SOT403-1 MO-153

0.05

0.95

0.25

0.80

IEC JEDEC JEITA

0.30

0.19

0 2.5 5 mm

scale

(1)E(2) (1)

0.2

5.1

0.1

4.9

REFERENCES

eHELLpQZywv θ

4.5

0.65

4.3

6.6

6.2

(A )

detail X

0.75

0.4

0.50

0.3

EUROPEAN

PROJECTION

0.13 0.10.21

0.40

0.06

ISSUE DATE

99-12-27 03-02-18

2003 May 16 24

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer,

74HC4052; 74HCT4052

demultiplexer

DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm

terminal 1 index area

detail X

SOT763-1

terminal 1 index area

DIMENSIONS (mm are the original dimensions)

(1)

UNIT

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

max.

0.05

0.00

0.30

0.2

0.18

0 2.5 5 mm

3.6

3.4

(1)

2.15

1.85

(1)

2.6

2.4

1.15

0.85

scale

2.5

0.51

ACCB

0.5

0.3

0.1v0.05

0.05 0.1

OUTLINE

VERSION

SOT763-1 MO-241 - - -- - -

IEC JEDEC JEITA

REFERENCES

2003 May 16 25

EUROPEAN

PROJECTION

ISSUE DATE

02-10-17 03-01-27

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

SOLDERING Introduction to soldering surface mount packages

Thistext gives a very briefinsightto a complex technology. A more in-depth account of soldering ICs can be found in our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011). There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for certainsurfacemount ICs, but itisnotsuitable for fine pitch SMDs. In these situations reflow soldering is recommended.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied tothe printed-circuit boardbyscreen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:

• below 220 °C (SnPb process) or below 245 °C (Pb-free process)

– for all the BGA packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a

volume ≥ 350 mm3 so called thick/large packages.

• below 235 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

74HC4052; 74HCT4052

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• Forpackageswith leads on foursides,thefootprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement andbefore soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Wave soldering

Conventional single wave soldering is not recommended forsurfacemount devices (SMDs) orprinted-circuitboards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

2003 May 16 26

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer,

74HC4052; 74HCT4052

demultiplexer

Suitability of surface mount IC packages for wave and reﬂow soldering methods

PACKAGE

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, HVQFN, HVSON, SMS

(4)

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO, VSSOP not recommended

Notes

1. Formore detailed information onthe BGA packages refertothe

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

, SO, SOJ suitable suitable

from your Philips Semiconductors sales office.

temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface.

The package footprint must incorporate solder thieves downstream and at the side corners.

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

(1)

not suitable

“(LF)BGAApplication Note

SOLDERING METHOD

WAVE REFLOW

(3)

suitable

(4)(5)

suitable

(6)

suitable

”(AN01026); order a copy

(2)

2003 May 16 27

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer,

74HC4052; 74HCT4052

demultiplexer

DATA SHEET STATUS

LEVEL

I Objective data Development This data sheet contains data from the objective speciﬁcation for product

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product statusdetermines thedata sheetstatus.

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

development. Philips Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

DEFINITION

DEFINITIONS Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device atthese or at anyotherconditions above those giveninthe Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentationor warranty that such applications willbe suitable for the specified use without further testing or modification.

DISCLAIMERS Life support applications  These products are not

designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expectedto result inpersonal injury. Philips Semiconductorscustomersusingor selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes  Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. Whenthe productis in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

2003 May 16 28

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

74HC4052; 74HCT4052

NOTES

2003 May 16 29

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

74HC4052; 74HCT4052

NOTES

2003 May 16 30

Philips Semiconductors Product speciﬁcation

Dual 4-channel analog multiplexer, demultiplexer

74HC4052; 74HCT4052

NOTES

2003 May 16 31

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 613508/03/pp32 Date of release: 2003 May 16 Document order number: 9397 750 11266

SCA75

NXP 74HC 4052D NXP Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

DESCRIPTION

FUNCTION TABLE

QUICK REFERENCE DATA

ORDERING INFORMATION

PINNING

LIMITING VALUES

RECOMMENDED OPERATING CONDITIONS

AC WAVEFORMS

PACKAGE OUTLINES

SOT109-3

SOT338-1

SOT38-9

SOT403-1

SOT763-1

DATA SHEET STATUS