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1PS70SB40
Schematic [ru]
22 pgs325.58 Kb0
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NXP 1PS70SB40, 1PS70SB44, 1PS70SB45, 1PS70SB46, 1PS75SB45 Schematic [ru]

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BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes

1. Product profile

1.1 General description

General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number Package Configuration
1PS70SB40 SOT323 SC-70 single diode 1PS76SB40 SOD323 SC-76 single diode 1PS79SB40 SOD523 SC-79 single diode BAS40 SOT23 - single diode BAS40H SOD123F - single diode BAS40L SOD882 - single diode BAS40W SOT323 SC-70 single diode 1PS70SB44 SOT323 SC-70 dual series BAS40-04 SOT23 - dual series BAS40-04W SOT323 SC-70 dual series 1PS70SB45 SOT323 SC-70 dual common cathode 1PS75SB45 SOT416 SC-75 dual common cathode BAS40-05 SOT23 - dual common cathode BAS40-05W SOT323 SC-70 dual common cathode 1PS70SB46 SOT323 SC-70 dual common anode BAS40-06 SOT23 - dual common anode BAS40-06W SOT323 SC-70 dual common anode BAS40-07 SOT143B - dual isolated BAS40-07V SOT666 - dual isolated BAS40-05V SOT666 - quadruple common cathode/
1PS88SB48 SOT363 SC-88 quadruple common cathode/
BAS40XY SOT363 SC-88 quadruple; 2 series
NXP JEITA
common cathode
common cathode
NXP Semiconductors
1
1
4

1.2 Features

High switching speed Low leakage currentHigh breakdown voltage Low capacitance

1.3 Applications

Ultra high-speed switching Voltage clamping

1.4 Quick reference data

Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per diode
I
F
V
F
V
R
[1] Pulse test: tp≤ 300 μs; δ≤0.02.
BAS40 series; 1PSxxSB4x series
General-purpose Schottky di od e s
forward current - - 120 mA
[1]
forward voltage IF=1mA reverse voltage - - 40 V
--380mV

2. Pinning information

Table 3. Pinning
Pin Description Simplified outline Symbol
BAS40H; 1PS76SB40; 1PS79SB40
1 cathode 2 anode
BAS40L
1 cathode 2 anode
BAS40; BAS40W; 1PS70SB40
1 anode 2 not connected 3 cathode
[1]
12
001aab540
[1]
21
Transparent
top view
3
12
006aaa14
12
12
1
sym00
sym00
3
2
n.c.
006aaa436
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 2 of 21
NXP Semiconductors
4
7
4
8
4
9
34
0
BAS40 series; 1PSxxSB4x series
General-purpose Schottky di od e s
Table 3. Pinning
…continued
Pin Description Simplified outline Symbol
BAS40-04; BAS40-04W; 1PS70SB44
1 anode (diode 1) 2 cathode (diode 2) 3 cathode (diode 1),
3
12
anode (diode 2)
12
006aaa14
BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45
1 anode (diode 1) 2 anode (diode 2) 3 cathode (diode 1),
3
12
cathode (diode 2)
12
006aaa14
BAS40-06; BAS40-06W; 1PS70SB46
1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 1),
3
12
anode (diode 2)
12
006aaa14
3
006aaa43
3
006aaa43
3
006aaa43
BAS40-07
1 cathode (diode 1) 2 cathode (diode 2) 3 anode (diode 2) 4 anode (diode 1)
BAS40-07V
1 anode (diode 1) 2 not connected 3 cathode (diode 2) 4 anode (diode 2) 5 not connected 6 cathode (diode 1)
34
21
456
123
34
2
1
006aaa4
654
123
006aaa44
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 3 of 21
NXP Semiconductors
5
6
6
BAS40 series; 1PSxxSB4x series
General-purpose Schottky di od e s
Table 3. Pinning
…continued
Pin Description Simplified outline Symbol
BAS40-05V; 1PS88SB48
1 anode (diode 1) 2 anode (diode 2)
6 45
654
3 cathode (diode 3),
cathode (diode 4) 4 anode (diode 3) 5 anode (diode 4)
1 32
001aab55
123
6 cathode (diode 1),
cathode (diode 2)
BAS40XY
1 anode (diode 1)
56
2 cathode (diode 2)
4
3 anode (diode 3),
cathode (diode 4) 4 anode (diode 4)
132
5 cathode (diode 3) 6 cathode (diode 1),
anode (diode 2)
[1] The marking bar indicates the cathode.
006aaa44
654
123
006aaa25
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 4 of 21
NXP Semiconductors

3. Ordering information

Table 4. Ordering information
Type number Package
1PS70SB40 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS76SB40 SC-76 plastic surface-mounted package; 2 leads SOD323 1PS79SB40 SC-79 plastic surface-mounted package; 2 leads SOD523 BAS40 - plastic surface-mounted package; 3 leads SOT23 BAS40H - plastic surface-mounted package; 2 leads SOD123F BAS40L - leadless ultra small plastic package; 2 terminals;
BAS40W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB44 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-04 - plastic surface-mounted package; 3 leads SOT23 BAS40-04W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB45 SC-70 plastic surface-mounted package; 3 leads SOT323 1PS75SB45 SC-75 plastic surface-mounted package; 3 leads SOT416 BAS40-05 - plastic surface-mounted package; 3 leads SOT23 BAS40-05W SC-70 plastic surface-mounted package; 3 leads SOT323 1PS70SB46 SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-06 - plastic surface-mounted package; 3 leads SOT23 BAS40-06W SC-70 plastic surface-mounted package; 3 leads SOT323 BAS40-07 - plastic surface-mounted package; 4 leads SOT143B BAS40-07V - plastic surface-mounted package; 6 leads SOT666 BAS40-05V - plastic surface-mounted package; 6 leads SOT666 1PS88SB48 SC-88 plastic surface-mounted package; 6 leads SOT363 BAS40XY SC-88 plastic surface-mounted package; 6 leads SOT363
BAS40 series; 1PSxxSB4x series
General-purpose Schottky di od e s
Name Description Version
SOD882
body 1.0 × 0.6 × 0.5 mm
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 5 of 21
NXP Semiconductors

4. Marking

Table 5. Marking codes
Type number Marking code
1PS70SB40 6*3 1PS75SB45 45 1PS76SB40 S4 BAS40-05 45* 1PS79SB40 T BAS40-05W 65* BAS40 43* 1PS70SB46 6*6 BAS40H AJ BAS40-06 46* BAS40L S6 BAS40-06W 66* BAS40W 63* BAS40-07 47* 1PS70SB44 6*4 BAS40-07V 67 BAS40-04 44* BAS40-05V 65 BAS40-04W 64* 1PS88SB48 8*5 1PS70SB45 6*5 BAS40XY 40*
[1] * = -: made in Hong Kong
BAS40 series; 1PSxxSB4x series
* = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
[1]
General-purpose Schottky di od e s
Type number Marking code
[1]

5. Limiting values

Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
V
R
I
F
I
FRM
I
FSM
T
j
T
amb
T
stg
[1] Tj=25°C prior to surge.
reverse voltage - 40 V forward current - 120 mA repetitive peak forward
tp≤ 1s; δ≤0.5 - 120 mA
current non-repetitive peak forward
tp≤ 10 ms
[1]
-200mA
current junction temperature - 150 °C ambient temperature −65 +150 °C storage temperature −65 +150 °C
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 6 of 21
NXP Semiconductors

6. Thermal characteristics

Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device
R
th(j-a)
R
th(j-sp)
thermal resistance from junction to ambient
SOT23 - - 500 K/W
SOT143B - - 500 K/W
SOT363 (1PS88SB48) - - 416 K/W
SOT416 - - 833 K/W
SOT666 (BAS40-05V)
SOT666 (BAS40-07V)
SOD123F
SOD323 - - 450 K/W
SOD523
SOD882
SOT323 - - 625 K/W
thermal resistance from junction to solder point
SOT363 (BAS40XY)
BAS40 series; 1PSxxSB4x series
General-purpose Schottky di od e s
in free air
[1]
[2]
--225K/W
[2]
--416K/W
[2]
--330K/W
[2]
--450K/W
[2]
--500K/W
[3]
--260K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint. [2] Reflow soldering is the only recommended soldering method. [3] Soldering point at pins 2, 3, 5 and 6.

7. Characteristics

Table 8. Characteristics
T
amb
Symbol Parameter Conditions Min Typ Max Unit
Per diode
V
F
I
R
C
d
[1] Pulse test: tp≤ 300 μs; δ≤0.02.
=25
°
C unless otherwise specified.
forward voltage
[1]
IF= 1 mA - - 380 mV
= 10 mA - - 500 mV
I
F
=40mA - - 1 V
I
F
reverse current VR=30V - - 1 μA
=40V - - 10 μA
V
R
diode capacitance VR=0V; f=1MHz - - 5 pF
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 7 of 21
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