NTE NTE3035A Datasheet

NTE3035A

Phototransistor Detector

Description:

The NTE3035A is designed for a wide variety of industrial processing and control applications requir­ing a sensitive detector. The NTE3034A is is an identical package and is designed to be used with
the NTE3029A infrared emitter.

Features:

D Miniature, Low Profile, Clear Plastic Package
D Designed for Automatic Handling and Accurate Positioning
D Side Looking, with Molded Lens
D High Volume, Economical

Absolute Maximum Ratings: (TA = +25°C unless otherwise specified)
Collector–Emitter Voltage, V

Total Device Dissipation (TA = +25°C), P

CEO

D

Derate Above 25°C (Note 1) 2mW/°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Junction Temperature Range, T
Storage Temperature Range, T

stg

J

Lead Temperature (During Soldering, 1/16” from case, 5sec max., Note 2), T

–40° to +100°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–40° to +100°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

L

60V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

+260°C. . . . . . . . . .

Electrical Characteristics: (TA = +25°C unless otherwise specified)

Parameter Symbol Test Conditions Min Typ Max Unit

Collector Dark Current I
Collector–Emitter Breakdown Voltage V
Capacitance C

(BR)CEOIC

D

ce

VCE = 10V, H [ 0 – – 100 nA

= 10mA, H [ 0 60 – – V

VCC = 5V, f = 1MHz – 3.9 – pF

Optical Characteristics: (TA = +25°C unless otherwise specified)

Parameter Symbol Test Conditions Min Typ Max Unit

Collector Light Current I

Turn–On Time t
Turn–Off Time t
Saturation Voltage V

Wavelength of Maximum Sensitivity λ

CE(sat)

L

on
off

VCE = 5V, H = 500µW/cm2,
λ = 940nm

H = 500µW/cm2, VCC = 5V,
RL = 100Ω

H = 500µW/cm2, λ = 940nm,
I

= 2mA, VCC = 5V

C

s

5 25 – mA

– 125 – µs
– 150 – µs
– 0.75 1.0 V

– 0.8 – µm

Note 1. Measured with device soldered into a typical PC board.
Note 2. Heat sink should be applied to leads during soldering to prevent case temperature from ex-

ceeding +100°C.

.125

(3.17)

.750

(19.05)

Max

.160 (4.06)

.120

(3.04)

.020 (.508)

EC

.045 (1.14) Dia

.168

(4.27)

.103

(2.62)

.100 (2.54)

.060 (1.52)