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NTE2941
MOSFET
N–Ch, Enhancement Mode
High Speed Switch
Features:
D Low Static Drain–Source ON Resistance
D Improved Inductive Ruggedness
D Fast Switching Times
D Low Input Capacitance
D Extended Safe Operating Area
D TO220 Type Isolated Package
Absolute Maximum Ratings:
Drain–Source Voltage (Note 1), V
Drain–Gate Voltage (R
Gate–Source Voltage, V
Drain Current, I
D
= 1MΩ, Note 1), V
GS
GS
Continuous
T
= +25°C 28A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C
= +100°C 19.6A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
T
C
Pulsed (Note 2) 200A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Gate Current (Pulsed), I
GM
Single Pulsed Avalanche Energy (Note 3), E
Avalanche Current, I
AS
Total Power Dissipation (TC = +25°C), P
Derate Above 25°C 0.52W/°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Junction Temperature Range, T
Storage Temperature Range, T
Maximum Lead Temperature (During Soldering, 1/8” from case, 5sec), T
Thermal Resistance:
Maximum Junction–to–Case, R
Typical Case–to–Sink (Mounting surface flat, smooth, and greased), R
Maximum Junction–to–Ambient (Free Air Operation), R
DSS
DGR
AS
D
J
stg
thJC
thJA
60V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
60V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±20V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±1.5A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
48mJ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
28A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
48W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–55° to +175°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–55° to +175°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
L
+300°C. . . . . . . . . . . . . .
1.92K/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
thCS
0.5K/W. . . . . . .
62.5K/W. . . . . . . . . . . . . . . . . . . .
Note 1. T
= +25° to +175°C.
J
Note 2. Repetitive Rating: Pulse width limited by maximum junction temperature.
Note 3. L = 50µH, V
= 25V, RG = 25Ω, Starting TJ = +25°C.
DD
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Electrical Characteristics: (TC = +25°C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Drain–Source Breakdown Voltage BV
Gate Threshold Voltage V
Gate–Source Leakage Forward I
Gate–Source Leakage Reverse I
Zero Gate Voltage Drain Current I
DSSVGS
GS(th)VDS
GSS
GSS
DSS
VGS = 20V – – 100 nA
VGS = –20V – – –100 nA
VDS = Max. Rating, VGS = 0 – – 250 µA
VDS = 0.8 Max. Rating, TC = +150°C – – 1000 µA
Static Drain–Source ON Resistance R
Forward Transconductance g
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Turn–On Delay Time t
Rise Time t
Turn–Off Delay Time t
Fall Time t
DS(on)VGS
VDS ≥ 50V, ID = 25A, Note 4 15 – – mho
fs
VGS = 0V, VDS = 25V, f = 1MHz – 2450 – pF
iss
oss
rss
d(on)
VDD = 0.5 BV
(MOSFET switching times are essentially
r
independent of operating temperature)
independent of operating temperature)
d(off)
f
Total Gate Charge
(Gate–Source Plus Gate–Drain)
Gate–Source Charge Q
Gate–Drain (“Miller”) Charge Q
Q
VGS = 10V, ID = 50A, VDS = 0.8 Max.
g
Rating, (Gate charge is essentially
gs
independent of operating temperature)
independent of operating temperature)
gd
Source–Drain Diode Ratings and Characteristics
= 0V, ID = 250µA 60 – – V
= VGS, ID = 250µA 2.0 – 4.0 V
= 10V, ID = 25A, Note 4 – – 0.028 Ω
– 740 – pF
– 360 – pF
ID = 50A, ZO = 9.1Ω,
DSS,
– – 32 ns
– – 210 ns
– – 75 ns
– – 130 ns
– – 87 nC
– 26.6 – nC
– 30.6 – nC
s
Continuous Source Current I
Pulse Source Current I
Diode Forward Voltage V
Reverse Recovery Time t
SM
(Body Diode) – – 150 A
S
(Body Diode) Note 2 – – 200 A
TJ = +25°C, IS = 50A, VGS = 0V, Note 4 – – 2.5 V
SD
TJ = +25°C, IF = 50A, dIF/dt = 100A/µs – – 250 ns
rr
Note 2. Repetitive Rating: Pulse width limited by maximum junction temperature.
Note 4. Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 2%.