NTE NTE2398 Datasheet

NTE2398 MOSFET
N–Ch, Enhancement Mode
High Speed Switch
Features:
D Dynamic dv/dt Rating D Repetitive Avalanche Rated D Fast Switching D Ease of Paralleling D Simple Drive Requirements
Absolute Maximum Ratings:
Continuous Drain Current (VGS = 10V), I
TC = +25°C 4.5A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TC = +100°C 2.9A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pulsed Drain Current (Note 1), I Power Dissipation (T
= +25°C), P
C
DM
D
Derate Linearly Above 25°C 0.59W/°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Gate–to–Source Voltage, V
GS
Single Pulse Avalanche Energy (Note 2), E Avalanche Current (Note 1), I
AR
Repetitive Avalanche Energy (Note 1), E
Peak Diode Recovery dv/dt (Note 3), dv/dt 3.5V/ns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Junction Temperature Range, T Storage Temperature Range, T
stg
Lead Temperature (During Soldering, 1.6mm from case for 10sec), T
Mounting Torque (6–32 or M3 Screw) 10 lbfin (1.1Nm). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Resistance, Junction–to–Case, R Thermal Resistance, Junction–to–Ambient, R Typical Thermal Resistance, Case–to–Sink (Flat, Greased Surface), R
D
AR
AS
J
thJC
–55° to +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–55° to +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
L
thJA
thCS
18A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
74W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±20V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
280mJ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4mJ. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
+300°C. . . . . . . . . . . . . . . . .
1.7°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
62°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0.5°C/W. . . . . . . . . . . .
Note 1. Repetitive rating; pulse width limited by maximum junction temperature. Note 2. V Note 3. I
= 50V, starting TJ = +25°C, L = 24mH, RG = 25Ω, IAS = 4.5A
DD
4.5A, di/dt 75A/µs, VDD V
SD
(BR)DSS
, TJ +150°C
Electrical Characteristics: (TJ = +25°C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Drain–to–Source Breakdown Voltage V Breakdown Voltage Temp. Coefficient ∆V
(BR)DSSVGS
(BR)DSS
T
Static Drain–to–Source On–Resistance R Gate Threshold Voltage V
DS(on) GS(th)
Forward Transconductance g Drain–to–Source Leakage Current I
Gate–to–Source Forward Leakage I Gate–to–Source Reverse Leakage I
DSS
GSS GSS
Total Gate Charge Q Gate–to–Source Charge Q Gate–to–Drain (“Miller”) Charge Q Turn–On Delay Time t
d(on)
Rise Time t Turn–Off Delay Time t
d(off)
Fall Time t Internal Drain Inductance L Internal Source Inductance L Input Capacitance C Output Capacitance C Reverse Transfer Capaticance C
fs
gs gd
r
f D S
iss
oss
rss
= 0V, ID = 250µA 500 V
Reference to +25°C, ID = 1mA 0.61 V/°C
J
VGS = 10V, ID = 2.7A, Note 4 1.5 VDS = VGS, ID = 250µA 2.0 4.0 V VDS = 50V, ID = 2.7A, Note 4 2.5 mhos VDS = 500V, VGS = 0V 25 µA VDS = 400V, VGS = 0V, TJ = +125°C 250 µA VGS = 20V 100 nA VGS = –20V –100 nA ID = 3.1A, VDS = 400V, VGS = 10V,
g
Note 4
38 nC 5.0 nC 22 nC
VDD = 250V, ID = 3.1A, RG = 12Ω, RD = 79, Note 4
8.2 ns 16 ns 42 ns 16 ns
Between lead, .250in. (6.0) m m from package and center of die contact
VGS = 0V, VDS = 25V, f = 1MHz
4.5 nH 7.5 nH 610 pF 160 pF 68 pF
Source–Drain Ratings and Characteristics:
Parameter Symbol Test Conditions Min Typ Max Unit
Continuous Source Current (Body Diode) I Pulsed Source Current (Body Diode) I Diode Forward Voltage V
S
SM
SD
Note 1 18 A TJ = +25°C, IS = 4.5A, VGS = 0V,
4.5 A
1.6 V
Note 4 Reverse Recovery Time t Reverse Recovery Charge Q Forward Turn–On Time t
on
TJ = +25°C, IF = 3.1A,
rr
di/dt = 100A/µs, Note 4
rr
Intrinsic turn–on time is neglegible (turn–on is dominated by LS+LD)
320 640 ns 1.0 2.0 µC
Note 1. Repetitive rating; pulse width limited by maximum junction temperature. Note 4. Pulse width ≤ 300µs; duty cycle 2%.
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