NSC LMX2332LTMX, LMX2332LSLDX, LMX2332LSLBX Datasheet

LMX2330L/LMX2331L/LMX2332L

October 2001

LMX2330L/LMX2331L/LMX2332L PLLatinum Low Power Dual Frequency Synthesizer for RF

Personal Communications

PLLatinum

™

Low Power Dual Frequency Synthesizer for
RF Personal Communications
LMX2330L 2.5 GHz/510 MHz
LMX2331L 2.0 GHz/510 MHz
LMX2332L 1.2 GHz/510 MHz

General Description

The LMX233XL family of monolithic, integrated dual fre­quency synthesizers, including prescalers, is to be used as a
local oscillator for RF and first IF of a dual conversion
transceiver. It is fabricated using National’s 0.5µ ABiC V
silicon BiCMOS process.

The LMX233XL contains dual modulus prescalers. A 64/65
or a 128/129 prescaler (32/33 or 64/65 in the 2.5 GHz
LMX2330L) can be selected fortheRFsynthesizeranda8/9
or a 16/17 prescaler can be selected for the IF synthesizer.
LMX233XL, which employs a digitalphase locked looptech­nique, combined with a high quality reference oscillator,
provides the tuning voltages for voltage controlled oscillators
to generate very stable, low noise signals for RFand IF local
oscillators. Serial data is transferred into the LMX233XL via
a three wire interface (Data, Enable, Clock). Supply voltage
can range from 2.7V to5.5V.The LMX233XL family features
very low current consumption;

LMX2330L—5.0 mA at 3V, LMX2331L —4.0 mA at 3V,
LMX2332L—3.0 mA at 3V.

The LMX233XL are available in a TSSOP 20-pin, CSP
24-pin surface mount plastic package, and thin CSP 20-pin
surface mount plastic package.

Features

n Ultra low current consumption
n 2.7V to 5.5V operation
n Selectable synchronous or asynchronous powerdown

mode:
I

= 1 µA typical at 3V

CC

n Dual modulus prescaler:

LMX2330L (RF) 32/33 or 64/65
LMX2331L/32L (RF) 64/65 or 128/129
LMX2330L/31L/32L (IF) 8/9 or 16/17

n Selectable charge pump TRI-STATE
n Selectable charge pump current levels
n Selectable Fastlock
n Upgrade and compatible to LMX233XA family

™

mode

®

mode

Applications

n Portable Wireless Communications

(PCS/PCN, cordless)

n Cordless and cellular telephone systems
n Wireless Local Area Networks (WLANs)
n Cable TV tuners (CATV)
n Other wireless communication systems

Functional Block Diagram

01280601

© 2001 National Semiconductor Corporation DS012806 www.national.com

Connection Diagrams

Chip Scale Package (SLB)

(Top View)

LMX2330L/LMX2331L/LMX2332L

Order Number LMX2330LSBX, LMX2331LSLBX or

LMX2332LSLBX

NS Package Number SLB24A

20-Pin Thin Chipscale Package (SLD)

(Top View)

Thin Shrink Small Outline Package (TM)

(Top View)

01280602

Order Number LMX2330LTM, LMX2331LTM or

LMX2332LTM

Order Number LMX2330LTMX, LMX2331LTMX, or

LMX2332LTMX

NS Package Number MTC20

01280639

Order Number LMX2330LSLDX, LMX2331LSLDX, or

01280640

LMX2332LSLDX

NS Package Number SLD20A

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Pin Descriptions

LMX2330L/LMX2331L/LMX2332L

Pin No.

LMX233XLSLD

20-pin Thin

CSP Package

20 24 1 V

Pin No.

LMX233XLSLB

24-pin CSP

Package

Pin No.

LMX233XLTM

20-pin TSSOP

Package

Pin

Name

CC

I/O Description

1 — Power supply voltage input for RF analog and RF digital circuits.

Input may range from 2.7V to 5.5V. V

1 must equal VCC2.

CC

Bypass capacitors should be placed as close as possible to this

pin and be connected directly to the ground plane.
122V
233D

1 — Power Supply for RF charge pump. Must be ≥ VCC.

P

RF O Internal charge pump output. For connection to a loop filter for

o

driving the input of an external VCO.
3 4 4 GND — Ground for RF digital circuitry.
455f
566f

RF I RF prescaler input. Small signal input from the VCO.

IN

RF I RF prescaler complementary input. A bypass capacitor should

IN

be placed as close as possible to this pin and be connected

directly to the ground plane. Capacitor is optional with some loss

of sensitivity.
6 7 7 GND — Ground for RF analog circuitry.
788OSC

I Oscillator input. The input has a VCC/2 input threshold and can

in

be driven from an external CMOS or TTL logic gate.
8 10 9 GND — Ground for IF digital, MICROWIRE

™

,FoLD, and oscillator

circuits.
91110F

LD O Multiplexed output of the RF/IF programmable or reference

o

dividers, RF/IF lock detect signals and Fastlock mode. CMOS

(see Programmable Modes).

output

10 12 11 Clock I High impedance CMOS Clock input. Data for the various

counters is clocked in on the rising edge, into the 22-bit shift

register.

11 14 12 Data I Binary serial data input. Data entered MSB first. The last two bits

are the control bits. High impedance CMOS input.

12 15 13 LE I Load enable high impedance CMOS input. When LE goes HIGH,

data stored in the shift registers is loaded into one of the 4

appropriate latches (control bit dependent).

13 16 14 GND — Ground for IF analog circuitry.
14 17 15 f

IF I IF prescaler complementary input. A bypass capacitor should be

IN

placed as close as possible to this pin and be connected directly

to the ground plane. Capacitor is optional with some loss of

sensitivity.

15 18 16 f
16 19 17 GND — Ground for IF digital, MICROWIRE, F
17 20 18 D

RF I IF prescaler input. Small signal input from the VCO.

IN

LD, and oscillator circuits.

o

IF O IF charge pump output. For connection to a loop filter for driving

o

the input of an external VCO.

18 22 19 V
19 23 20 V

2 — Power Supply for IF charge pump. Must be ≥ VCC.

P

2 — Power supply voltage input for IF analog, IF digital,

CC

MICROWIRE, F

2.7V to 5.5V. V

LD, and oscillator circuits. Input may range from

o

2 must equal VCC1. Bypass capacitors should

CC

be placed as close as possible to this pin and be connected

directly to the ground plane.
X 1, 9, 13, 21 X NC — No connect.

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Block Diagram

LMX2330L/LMX2331L/LMX2332L

Note: The RF prescaler for the LMX2331L/32L is either 64/65 or 128/129, while the prescaler for the LMX2330L is 32/33 or 64/65.
Note: V

R-counter along with the OSC
Note: V

1 supplies power to the RF prescaler, N-counter, R-counter and phase detector. VCC2 supplies power to the IF prescaler, N-counter, phase detector,

CC

1 and VP2 can be run separately as long as VP≥ VCC.

P

buffer, MICROWIRE, and FoLD. VCC1 and VCC2 are clamped to each other by diodes and must be run at the same voltage level.

in

01280603

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LMX2330L/LMX2331L/LMX2332L

Absolute Maximum Ratings (Notes 1,

2)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.

Power Supply Voltage

V

CC

V

P

Voltage on Any Pin

with GND = 0V (V

Storage Temperature Range (T

) −0.3V to VCC+0.3V

I

) −65˚C to +150˚C

S

Lead Temperature (solder 4 sec.)
(T

) +260˚C

L

−0.3V to +6.5V

−0.3V to +6.5V

Recommended Operating Conditions

Power Supply Voltage

V

CC

V

P

Operating Temperature (T

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to
the device may occur. Recommended Operating Conditions indicate condi­tions for which the device is intended to be functional, but do not guarantee
specific performance limits. For guaranteed specifications and test condi­tions, see the Electrical Characteristics. The guaranteed specifications apply
only for the test conditions listed.

Note 2: This device is a high performance RF integrated circuit with an ESD

<

2 keV and is ESD sensitive. Handling and assembly of this device

rating
should only be done at ESD protected work stations.

) −40˚C to +85˚C

A

2.7V to 5.5V

VCCto +5.5V

Electrical Characteristics

VCC= 3.0V, VP= 3.0V; −40˚C<T

Symbol Parameter Conditions

I

CC

Power LMX2330L RF + IF VCC= 2.7V to 5.5V 5.0 6.6
Supply LMX2330L RF Only 4.0 5.2
Current LMX2331L RF + IF 4.0 5.4

I

CC-PWDN

f

IN

Powerdown Current (Note 3) 1 10 µA

RF Operating LMX2330L 0.5 2.5

Frequency LMX2331L 0.2 2.0 GHz

f

IF Operating LMX233xL 45 510 MHz

IN

Frequency
f
f

OSC

φ

Oscillator Frequency 5 40 MHz

Maximum Phase Detector 10 MHz

Frequency
Pf

RF RF Input Sensitivity VCC= 3.0V −15 0 dBm

IN

Pf

IF IF Input Sensitivity VCC= 2.7V to 5.5V −10 0 dBm

IN

V

OSC

V

IH

V

IL

I

IH

I

IL

I

IH

I

IL

V

OH

V

OL

t

CS

t

CH

Oscillator Sensitivity OSC

High-Level Input Voltage (Note 4) 0.8 V

Low-Level Input Voltage (Note 4) 0.2 V

High-Level Input Current VIH=VCC= 5.5V (Note

Low-Level Input Current VIL= 0V, VCC= 5.5V

Oscillator Input Current VIH=VCC= 5.5V 100 µA

Oscillator Input Current VIL= 0V, VCC= 5.5V −100 µA

High-Level Output Voltage (for

LD, pin number 10)

F

o

Low-Level Output Voltage (for

LD, pin number 10)

F

o

Data to Clock Set Up Time See Data Input Timing 50 ns

Data to Clock Hold Time See Data Input Timing 10 ns

<

85˚C, except as specified

A

Value

Min Typ Max

LMX2331L RF Only 3.0 4.0 mA
LMX2332L IF + RF 3.0 4.1
LMX2332L RF Only 2.0 2.7
LMX233xL IF Only 1.0 1.4

LMX2332L 0.1 1.2

V

= 5.0V −10 0 dBm

CC

in

0.5 V

CC

−1.0 1.0 µA

4)

−1.0 1.0 µA

(Note 4)

I

= −500 µA VCC− 0.4 V

OH

I

= 500 µA 0.4 V

OL

CC

Units

PP

V
V

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Electrical Characteristics (Continued)

VCC= 3.0V, VP= 3.0V; −40˚C<T

Symbol Parameter Conditions

t

CWH

t

CWL

t

ES

t

EW

Note 3: Clock, Data and LE = GND or Vcc.
Note 4: Clock, Data and LE does not include f

Clock Pulse Width High See Data Input Timing 50 ns
Clock Pulse Width Low See Data Input Timing 50 ns
Clock to Load Enable Set Up Time See Data Input Timing 50 ns
Load Enable Pulse Width See Data Input Timing 50 ns

LMX2330L/LMX2331L/LMX2332L

<

85˚C, except as specified

A

RF, fINIF and OSCIN.

IN

Value

Min Typ Max

Charge Pump Characteristics

VCC= 3.0V, VP= 3.0V; −40˚C<TA≤ 85˚C, except as specified

Symbol Parameter Conditions

I

-SOURCE Charge Pump Output VDo=VP/2, I

Do

I

-SINK Current VDo=VP/2, I

Do

I

-SOURCE VDo=VP/2, I

Do

I

-SINK VDo=VP/2, I

Do

I

-TRI Charge Pump 0.5V ≤ VDo≤ VP− 0.5V −2.5 2.5

Do

<

= 25˚C

A

T

TRI-STATE Current −40˚C

I

-SINK vs CP Sink vs VDo=VP/2 3 10 %

Do

I

SOURCE Source Mismatch (Note 7) TA= 25˚C

Do-

I

vs V

Do

Do

CP Current vs Voltage 0.5 ≤ VDo≤ VP− 0.5V 10 15 %
(Note 6) T

I

vs T

Do

A

CP Current vs VDo=VP/2 10 %
Temperature (Note 8) −40˚C ≤ T

Note 5: See PROGRAMMABLE MODES for I

description.

CPo

= HIGH (Note 5) −4.0 mA

CPo

= HIGH (Note 5) 4.0 mA

CPo

= LOW (Note 5) −1 mA

CPo

= LOW (Note 5) 1 mA

CPo

<

85˚C

A

≤ 85˚C

A

Min Typ Max

Value

Units

Units

nA

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Charge Pump Current Specification Definitions

LMX2330L/LMX2331L/LMX2332L

I1 = CP sink current at VDo=VP−∆V
I2 = CP sink current at V
I3 = CP sink current at V
I4 = CP source current at V
I5 = CP source current at V
I6 = CP source current at V

Do=VP

= ∆V

Do

Do=VP
Do=VP
Do

/2

−∆V

/2

= ∆V

∆V = Voltage offset from positive and negative rails. Dependent on VCO tuning range relative to V

Note 6: I

Note 7: I

Note 8: I

vs VDo= Charge Pump Output Current magnitude variation vs Voltage =

Do

1

*

[

⁄

2

{|I1| − |I3|}]/[1⁄

vs I

Do-sink

[|I2| − |I5|]/[

vs TA= Charge Pump Output Current magnitude variation vs Temperature =

Do

@

[|I2

temp| − |I2@25˚C|]/|I2@25˚C|*100% and [|I5@temp| − |I5@25˚C|]/|I5@25˚C|*100%

*

2

{|I1| + |I3|}]*100% and [1⁄

= Charge Pump Output Current Sink vs Source Mismatch =

Do-source

1

*

⁄

2

{|I2| + |I5|}]*100%

*

2

{|I4| − |I6|}]/[1⁄

*

2

{|I4| + |I6|}]*100%

01280637

and ground. Typical values are between 0.5V and 1.0V.

CC

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