NSC LM6264N Datasheet

LM6164/LM6264/LM6364
High Speed Operational Amplifier

LM6164/LM6264/LM6364 High Speed Operational Amplifier

May 1999

General Description

The LM6164 family of high-speed amplifiers exhibits an ex­cellent speed-power product in delivering 300V per µs and
175 MHzGBW (stable down to gains as low as +5) with only
5 mA of supply current. Further power savings and applica­tion convenience are possible by taking advantage of the
wide dynamic range in operating supply voltage which ex­tends all the way down to +5V.

These amplifiers are built with National’s VIP
tegrated PNP) process which produces fast PNP transistors
that are true complements to the already fast NPN devices.
This advanced junction-isolated process delivers high speed
performance without the need forcomplex and expensive di­electric isolation.

™

(VerticallyIn-

Connection Diagrams

Features

n High slew rate: 300 V/µs
n High GBW product: 175 MHz
n Low supply current: 5 mA
n Fast settling: 100 ns to 0.1
n Low differential gain:
n Low differential phase:
n Wide supply range: 4.75V to 32V
n Stable with unlimited capacitive load

%

<

%

0.1

<

0.1˚

Applications

n Video amplifier
n Wide-bandwidth signal conditioning
n Radar
n Sonar

10-Lead Flatpak

NS Package Number W10A

Top View

DS009153-15

DS009153-8

NS Package Number
J08A, M08A or N08E

VIP™is a trademark of National Semiconductor Corporation.

© 1999 National Semiconductor Corporation DS009153 www.national.com

Connection Diagrams (Continued)

Temperature Range Package NSC

Military Industrial Commercial

−55˚C ≤ T

LM6164J/883 8-Pin Ceramic DIP J08A
5962-8962401PA

LM6164WG/883 10-Lead Ceramic SOIC WG10A
5962-8962401XA
LM6164W/883 10-Pin W10A
5962-8962401HA Ceramic Flatpak

≤ +125˚C −25˚C ≤ TA≤ +85˚C 0˚C ≤ TA≤ +70˚C

A

LM6264N LM6364N 8-Pin Molded DIP N08E

LM6364M 8-Pin Molded Surface Mt. M08A

Drawing

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Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.

Supply Voltage (V
Differential Input Voltage

(Note 7)

Common-Mode Input Voltage

(Note 11) (V

Output Short Circuit to Gnd

(Note 2) Continuous

Soldering Information

Dual-In-Line Package (N, J)

Soldering (10 sec.) 260˚C

Small Outline Package (M)

Vapor Phase (60 sec.) 215˚C
Infrared (15 sec.) 220˚C

+−V−

) 36V

+

− 0.7V) to (V−+ 0.7V)

±

See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering

surface mount devices.
Storage Temperature Range −65˚C to +150˚C
Max Junction Temperature

(Note 3) 150˚C

ESD Tolerance (Notes 7, 8)

8V

Operating Ratings

Temperature Range (Note 3)

LM6164 −55˚C ≤ T
LM6264 −25˚C ≤ T
LM6364 0˚C ≤ T

Supply Voltage Range 4.75V to 32V

Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage
to the device may occur. Operating Ratings indicate conditions for which the
device is functional, but do not guarantee specific performance limits.

±

≤ +125˚C

J

≤ +85˚C

J

≤ +70˚C

J

700V

DC Electrical Characteristics

=

The following specifications apply for Supply Voltage
Boldface limits apply for T

=

=

T

A

to T

T

J

MIN

MAX

±

15V, V

; all other limits T

Symbol Parameter Conditions Typ Limit Limit Limit Units

V

V

Input Offset Voltage 2 4 4 9 mV

OS

Input Offset Voltage 6 µV/˚C

OS

Drift Average Drift
I

b

I

OS

I

OS

Input Bias Current 2.5 3 3 5 µA

Input Offset Current 150 350 350 1500 nA

Input Offset Current 0.3 nA/˚C
Drift Average Drift
R
C
A

Input Resistance Differential 100 kΩ

IN

Input Capacitance 3.0 pF

IN

Large Signal V

VOL

OUT

=

±

10V, R

=

2kΩ 2.5 1.8 1.8 1.3 V/mV

L

Voltage Gain (Note 10) 0.9 1.2 1.1 min

=

R

10 kΩ 9

L

=

V

Input Common-Mode Supply

CM

±

15V +14.0 +13.9 +13.9 +13.8 V

Voltage Range +13.8 +13.8 +13.7 min

Supply=+5V 4.0 3.9 3.9 3.8 V
(Note 5) 3.8 3.8 3.7 min

CMRR Common-Mode −10V ≤ V

≤ +10V 105 86 86 80 dB

CM

Rejection Ratio 80 82 78 min
PSRR Power Supply

±

10V ≤ V±≤±16V 96 86 86 80 dB

Rejection Ratio 80 82 78 min

=

≥ 100 kΩ and R

0, R

CM

L

=

=

T

25˚C.

A

J

=

50Ω unless otherwise noted.

S

LM6164 LM6264 LM6364

(Notes 4, 12) (Note 4) (Note 4)

6611max

656max

800 600 1900 max

−13.5 −13.3 −13.3 −13.2 V

−13.1 −13.1 −13.1 min

1.5 1.7 1.7 1.8 V

1.9 1.9 1.9 max

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DC Electrical Characteristics (Continued)

=

The following specifications apply for Supply Voltage
Boldface limits apply for T

=

=

T

A

to T

T

J

MIN

MAX

±

15V, V

; all other limits T

Symbol Parameter Conditions Typ Limit Limit Limit Units

V

Output Voltage Supply=+5V +14.2 +13.5 +13.5 +13.4 V

O

Swing and R

=

2kΩ +13.3 +13.3 +13.3 min

L

Supply=+5V 4.2 3.5 3.5 3.4 V

=

and R

2kΩ 3.3 3.3 3.3 min

L

(Note 10) 1.3 1.7 1.7 1.8 V

Output Short Source 65 30 30 30 mA
Circuit Current 20 25 25 min

Sink 65 30 30 30 mA

I

S

Supply Current 5.0 6.5 6.5 6.8 mA

=

≥ 100 kΩ and R

0, R

CM

L

=

=

T

25˚C.

A

J

=

50Ω unless otherwise noted.

S

LM6164 LM6264 LM6364

(Notes 4, 12) (Note 4) (Note 4)

−13.4 −13.0 −13.0 −12.9 V

−12.7 −12.8 −12.8 min

2.0 1.9 1.9 max

20 25 25 min

6.8 6.7 6.9 min

AC Electrical Characteristics

=

The following specifications apply for Supply Voltage
Boldface limits apply for T

=

=

T

A

to T

T

J

MIN

MAX

±

15V, V

; all other limits T

Symbol Parameter Conditions Typ Limit Limit Limit Units

GBW Gain-Bandwidth F=20 MHz 175 140 140 120 MHz

Product 100 120 100

=

±

5V 120

=

+5 (Note 9) 300 200 200 200 V/µs

=

±

5V 200

=

20 V

PP

%
=
=

=

−4, R

2kΩ

L

+5 45 Deg

=

+10

V

=

+10

V

SR Slew Rate A

PBW Power Bandwidth V
T

S

φ

m

A

D

φ

D

e

np-p

Settling Time 10V Step to 0.1

Phase Margin A
Differential Gain NTSC, A
Differential Phase NTSC, A
Input Noise F=10 kHz 8

Supply

V

Supply

OUT

A

V
V

Voltage

i

np-p

Input Noise F=10 kHz 1.5
Current

Note 2: Continuous short-circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C.
Note 3: The typical junction-to-ambient thermal resistance of the molded plastic DIP (N) is 105˚C/Watt, the molded plastic SO (M) package is 155˚C/Watt, and the

cerdip (J) package is 125˚C/Watt. All numbers apply for packages soldered directly into a printed circuit board.

Note 4: Limits are guaranteed by testing or correlation.
Note 5: For single supply operation, the following conditions apply: V

−

) to realize maximum output swing. This connection will degrade VOS.

Pin4(V
Note 6: C

≤ 5pF.

L

Note 7: Inorder to achieve optimum AC performance, the input stage was designed without protective clamps. Exceeding the maximum differential input voltage re­sults in reverse breakdown of the base-emitter junction of one of the input transistors and probable degradation of the input parameters (especially V
Noise).

Note 8: Theaveragevoltagethattheweakestpincombinations(thoseinvolvingPin2orPin 3) can withstand and still conform to the datasheet limits. The test circuit
used consists of the human body model of 100 pF in series with 1500Ω.

+

=

5V,V

=

≥ 100 kΩ and R

0, R

CM

L

=

=

T

A

25˚C.

J

=

50Ω unless otherwise noted.

S

LM6164 LM6264 LM6364

(Notes 4, 12) (Note 4) (Note 4)

180 180 180

4.5 MHz

100 ns

<

0.1

<

0.1 Deg

−

=

0V,V

=

CM

2.5V,V

=

2.5V.Pin1&Pin8(V

OUT

Adjust) are each connected to

OS

OS,IOS

min

min

%

, and

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