Datasheet LM6164WG-QMLV, LM6164W-MLS, LM6164J-QMLV, LM6164W-SMD Datasheet (NSC)

LM6164/LM6264/LM6364 High Speed Operational Amplifier
General Description
The LM6164 family of high-speed amplifiers exhibits an ex­cellent speed-power product in delivering 300V per µs and 175 MHzGBW (stable down to gains as low as +5) with only 5 mA of supply current. Further power savings and applica­tion convenience are possible by taking advantage of the wide dynamic range in operating supply voltage which ex­tends all the way down to +5V.
These amplifiers are built with National’s VIP
(VerticallyIn­tegrated PNP) process which produces fast PNP transistors that are true complements to the already fast NPN devices. This advanced junction-isolated process delivers high speed performance without the need forcomplex and expensive di­electric isolation.
Features
n High slew rate: 300 V/µs n High GBW product: 175 MHz n Low supply current: 5 mA n Fast settling: 100 ns to 0.1
%
n Low differential gain:
<
0.1
%
n Low differential phase:
<
0.1˚
n Wide supply range: 4.75V to 32V n Stable with unlimited capacitive load
Applications
n Video amplifier n Wide-bandwidth signal conditioning n Radar n Sonar
Connection Diagrams
VIP™is a trademark of National Semiconductor Corporation.
DS009153-8
NS Package Number J08A, M08A or N08E
10-Lead Flatpak
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Top View
NS Package Number W10A
May 1999
LM6164/LM6264/LM6364 High Speed Operational Amplifier
© 1999 National Semiconductor Corporation DS009153 www.national.com
Connection Diagrams (Continued)
Temperature Range Package NSC
Drawing
Military Industrial Commercial
−55˚C T
A
+125˚C −25˚C TA≤ +85˚C 0˚C TA≤ +70˚C
LM6264N LM6364N 8-Pin Molded DIP N08E LM6164J/883 8-Pin Ceramic DIP J08A 5962-8962401PA
LM6364M 8-Pin Molded Surface Mt. M08A LM6164WG/883 10-Lead Ceramic SOIC WG10A 5962-8962401XA LM6164W/883 10-Pin W10A 5962-8962401HA Ceramic Flatpak
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage (V
+−V−
) 36V
Differential Input Voltage
(Note 7)
±
8V
Common-Mode Input Voltage
(Note 11) (V
+
− 0.7V) to (V−+ 0.7V)
Output Short Circuit to Gnd
(Note 2) Continuous
Soldering Information
Dual-In-Line Package (N, J)
Soldering (10 sec.) 260˚C
Small Outline Package (M)
Vapor Phase (60 sec.) 215˚C Infrared (15 sec.) 220˚C
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering
surface mount devices. Storage Temperature Range −65˚C to +150˚C Max Junction Temperature
(Note 3) 150˚C
ESD Tolerance (Notes 7, 8)
±
700V
Operating Ratings
Temperature Range (Note 3)
LM6164 −55˚C T
J
+125˚C
LM6264 −25˚C T
J
+85˚C
LM6364 0˚C T
J
+70˚C
Supply Voltage Range 4.75V to 32V
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits.
DC Electrical Characteristics
The following specifications apply for Supply Voltage
=
±
15V, V
CM
=
0, R
L
100 kand R
S
=
50unless otherwise noted.
Boldface limits apply for T
A
=
T
J
=
T
MIN
to T
MAX
; all other limits T
A
=
T
J
=
25˚C.
LM6164 LM6264 LM6364
Symbol Parameter Conditions Typ Limit Limit Limit Units
(Notes 4, 12) (Note 4) (Note 4)
V
OS
Input Offset Voltage 2 4 4 9 mV
6611max
V
OS
Input Offset Voltage 6 µV/˚C Drift Average Drift I
b
Input Bias Current 2.5 3 3 5 µA
656max
I
OS
Input Offset Current 150 350 350 1500 nA
800 600 1900 max
I
OS
Input Offset Current 0.3 nA/˚C Drift Average Drift R
IN
Input Resistance Differential 100 k C
IN
Input Capacitance 3.0 pF A
VOL
Large Signal V
OUT
=
±
10V, R
L
=
2k 2.5 1.8 1.8 1.3 V/mV
Voltage Gain (Note 10) 0.9 1.2 1.1 min
R
L
=
10 k 9
V
CM
Input Common-Mode Supply
=
±
15V +14.0 +13.9 +13.9 +13.8 V
Voltage Range +13.8 +13.8 +13.7 min
−13.5 −13.3 −13.3 −13.2 V
−13.1 −13.1 −13.1 min Supply=+5V 4.0 3.9 3.9 3.8 V (Note 5) 3.8 3.8 3.7 min
1.5 1.7 1.7 1.8 V
1.9 1.9 1.9 max
CMRR Common-Mode −10V V
CM
+10V 105 86 86 80 dB
Rejection Ratio 80 82 78 min
PSRR Power Supply
±
10V V±≤±16V 96 86 86 80 dB
Rejection Ratio 80 82 78 min
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DC Electrical Characteristics (Continued)
The following specifications apply for Supply Voltage
=
±
15V, V
CM
=
0, R
L
100 kand R
S
=
50unless otherwise noted.
Boldface limits apply for T
A
=
T
J
=
T
MIN
to T
MAX
; all other limits T
A
=
T
J
=
25˚C.
LM6164 LM6264 LM6364
Symbol Parameter Conditions Typ Limit Limit Limit Units
(Notes 4, 12) (Note 4) (Note 4)
V
O
Output Voltage Supply=+5V +14.2 +13.5 +13.5 +13.4 V Swing and R
L
=
2k +13.3 +13.3 +13.3 min
−13.4 −13.0 −13.0 −12.9 V
−12.7 −12.8 −12.8 min Supply=+5V 4.2 3.5 3.5 3.4 V and R
L
=
2k 3.3 3.3 3.3 min
(Note 10) 1.3 1.7 1.7 1.8 V
2.0 1.9 1.9 max Output Short Source 65 30 30 30 mA Circuit Current 20 25 25 min
Sink 65 30 30 30 mA
20 25 25 min
I
S
Supply Current 5.0 6.5 6.5 6.8 mA
6.8 6.7 6.9 min
AC Electrical Characteristics
The following specifications apply for Supply Voltage
=
±
15V, V
CM
=
0, R
L
100 kand R
S
=
50unless otherwise noted.
Boldface limits apply for T
A
=
T
J
=
T
MIN
to T
MAX
; all other limits T
A
=
T
J
=
25˚C.
LM6164 LM6264 LM6364
Symbol Parameter Conditions Typ Limit Limit Limit Units
(Notes 4, 12) (Note 4) (Note 4)
GBW Gain-Bandwidth F=20 MHz 175 140 140 120 MHz
min
Product 100 120 100
Supply
=
±
5V 120
SR Slew Rate A
V
=
+5 (Note 9) 300 200 200 200 V/µs
min
180 180 180
Supply
=
±
5V 200
PBW Power Bandwidth V
OUT
=
20 V
PP
4.5 MHz
T
S
Settling Time 10V Step to 0.1
%
100 ns
A
V
=
−4, R
L
=
2k
φ
m
Phase Margin A
V
=
+5 45 Deg
A
D
Differential Gain NTSC, A
V
=
+10
<
0.1
%
φ
D
Differential Phase NTSC, A
V
=
+10
<
0.1 Deg
e
np-p
Input Noise F=10 kHz 8
Voltage
i
np-p
Input Noise F=10 kHz 1.5 Current
Note 2: Continuous short-circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C. Note 3: The typical junction-to-ambient thermal resistance of the molded plastic DIP (N) is 105˚C/Watt, the molded plastic SO (M) package is 155˚C/Watt, and the
cerdip (J) package is 125˚C/Watt. All numbers apply for packages soldered directly into a printed circuit board.
Note 4: Limits are guaranteed by testing or correlation. Note 5: For single supply operation, the following conditions apply: V
+
=
5V,V
=
0V,V
CM
=
2.5V,V
OUT
=
2.5V.Pin1&Pin8(V
OS
Adjust) are each connected to
Pin4(V
) to realize maximum output swing. This connection will degrade VOS.
Note 6: C
L
5pF.
Note 7: Inorder to achieve optimum AC performance, the input stage was designed without protective clamps. Exceeding the maximum differential input voltage re­sults in reverse breakdown of the base-emitter junction of one of the input transistors and probable degradation of the input parameters (especially V
OS,IOS
, and
Noise). Note 8: Theaveragevoltagethattheweakestpincombinations(thoseinvolvingPin2orPin 3) can withstand and still conform to the datasheet limits. The test circuit
used consists of the human body model of 100 pF in series with 1500.
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AC Electrical Characteristics (Continued)
Note 9: V
IN
=
4V step. For supply
=
±
5V, V
IN
=
1V step.
Note 10: Voltage Gain is the total output swing (20V) divided by the input signal required to produce that swing. Note 11: The voltage between V
+
and either input pin must not exceed 36V.
Note 12: AmilitaryRETS electrical test specification is available on request. At the time of printing, the LM6164J/883 RETS spec complied with the Boldface limits in this column. The LM6164J/883 may also be procured as Standard Military Drawing
#
5962-8962401PA.
Typical Performance Characteristics (R
L
=
10 k,T
A
=
25˚C unless otherwise specified)
Supply Current vs Supply Voltage
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Common-Mode Rejection Ratio
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Power Supply Rejection Ratio
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Gain-Bandwidth Product
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Propagation Delay Rise and Fall Time
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Gain-Bandwidth Product vs Load Capacitance
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Slew Rate vs Load Capacitance
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Overshoot vs Load Capacitance
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Slew Rate
DS009153-24
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Typical Performance Characteristics (R
L
=
10 k,T
A
=
25˚C unless otherwise
specified) (Continued)
Voltage Gain vs Load Resistance
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Gain vs Supply Voltage
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Differential Gain
(Note 13)
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Differential Phase
(Note 13)
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Note 13: Differential gain and differential phase measured for four series LM6364 op amps in series with an LM6321 buffer. Error added by LM6321 is negligible. Test performed using Tektronix Type 520 NTSC test system. Configured with a gain of +5 (each output attenuated by 80%)
Step Response; Av=+5
TIME (50 ns /div)
Input (1v /div) Output (5v/div)
DS009153-1
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Typical Performance Characteristics (R
L
=
10 k,T
A
=
25˚C unless otherwise
specified) (Continued)
Input Noise Voltage
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Input Noise Current
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Power Bandwidth
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Open-Loop Frequency Response
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Open-Loop Frequency Response
DS009153-31
Output Resistance Open-Loop
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Common-Mode Input Saturation Voltage
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Output Saturation Voltage
DS009153-34
Bias Current vs Common-Mode Voltage
DS009153-35
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Simplified Schematic
Applications Tips
The LM6364 hasbeen compensated forgains of 5or greater (over specified rangesof temperature, powersupply voltage, and load). Since this compensation involved adding emitter-degeneration resistors in the op amp’s input stage, the open-loop gain was reduced as the stability increased. Gain error due to reduced A
VOL
is most apparent at high gains; thus, the uncompensated LM6365 is appropriate for gains of 25 or more. If unity-gain operation is desired, the LM6361 should be used. The LM6361, LM6364, and LM6365 have the same high slew rate (typically 300 V/µs), regardless of their compensation.
The LM6364 is unusually tolerant of capacitive loads. Most op amps tend to oscillate when their load capacitance is greater than about 200 pF (in low-gain circuits). However, load capacitance on the LM6364 effectively increases its compensation capacitance, thus slowing the op amp’s re­sponse and reducing its bandwidth. The compensation is not ideal, though, and ringing or oscillation may occur in low-gain circuits with large capacitiveloads. Toovercompen­sate the LM6364 for operation at gains less than 5, a series resistor-capacitor network should be added between the in­put pins (as shown in the Typical Applications, Noise Gain Compensation) so that the high-frequency noise gain rises to at least 5.
Power supply bypassing will improve the stability and tran­sient response of the LM6364, and is recommended for ev­ery design. 0.01 µF to 0.1 µF ceramic capacitors should be used (from each supply “rail” to ground); if the device is far away from its power supply source, an additional 2.2 µF to 10 µF (tantalum) may be required for extra noise reduction.
Keep all leads short to reduce stray capacitance and lead in­ductance, and make sure ground paths are low-impedance, especially where heavier currents will be flowing. Stray ca­pacitance in the circuit layout can cause signal coupling be­tween adjacent nodes, so that circuit gain unintentionally varies with frequency.
Breadboarded circuits will work best if they are built using generic PC boards with a good ground plane. If the op amps are used with sockets, asopposed to being soldered into the circuit, the additional input capacitance may degrade circuit performance.
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Typical Applications
Offset Voltage Adjustment
DS009153-10
Video-Bandwidth Amplifier
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Noise-Gain Compensation for Gains 5
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RXCX≥ (2π•25 MHz)
−1
5R
X
=
R
1+RF
(1+R1/R2)
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Physical Dimensions inches (millimeters) unless otherwise noted
Ceramic Dual-In-Line Package (J)
Order Number LM6164J/883
NS Package Number J08A
Molded Package SO (M)
Order Number LM6364M
NS Package Number M08A
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Molded Dual-In-Line Package (N)
Order Number LM6264N or LM6364N
NS Package Number N08E
10-Pin Ceramic Flatpak
Order Number LM6164W/883
NS Package Number W10A
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Notes
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
National Semiconductor Corporation
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Tel: 81-3-5639-7560 Fax: 81-3-5639-7507
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LM6164/LM6264/LM6364 High Speed Operational Amplifier
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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