NSC LM4863LQX, LM4863LQ Datasheet

LM4863

Dual 2.2W Audio Amplifier Plus Stereo Headphone
Function

General Description

The LM4863 is a dual bridge-connected audio power ampli­fier which, when connected to a 5V supply, will deliver 2.2W
toa4Ω load (Note 1) or 2.5W to a 3Ω load (Note 2) with less
than 1.0% THD+N. In addition, the headphone input pin
allows the amplifiers to operate in single-ended mode when
driving stereo headphones.

Boomer audio power amplifiers were designed specifically to
provide high quality output power from a surface mount
package while requiring few external components. To sim­plify audio system design, the LM4863 combines dual bridge
speaker amplifiers and stereo headphone amplifiers on one
chip.

The LM4863 features an externally controlled, low-power
consumption shutdown mode, a stereo headphone amplifier
mode, and thermal shutdown protection. It also utilizes cir­cuitry to reduce “clicks and pops” during device turn-on.

Note 1: An LM4863MTE or LM4863LQ that has been properly mounted to
a circuit board will deliver 2.2W into 4Ω. The other package options for the
LM4863 will deliver 1.1W into 8Ω. See the Application Information sections
for further information concerning the LM4863MTE and LM4863LQ.

Note 2: An LM4863MTE or LM4863LQ that has been properly mounted to a
circuit board and forced-air cooled will deliver 2.5W into 3Ω.

Key Specifications

n POat 1% THD+N
n LM4863LQ, 3Ω,4Ω loads 2.5W(typ), 2.2W(typ)
n LM4863MTE, 3Ω,4Ω loads 2.5W(typ), 2.2W(typ)
n LM4863MTE, 8Ω load 1.1W(typ)
n LM4863, 8Ω 1.1W(typ)
n Single-ended mode THD+N at 75mW into

32Ω 0.5%(max)

n Shutdown current 0.7µA(typ)
n Supply voltage range 2.0V to 5.5V

Features

n Stereo headphone amplifier mode
n “Click and pop” suppression circuitry
n Unity-gain stable
n Thermal shutdown protection circuitry
n SOIC, DIP, TSSOP and exposed-DAP TSSOP and LLP

packages

Applications

n Multimedia monitors
n Portable and desktop computers
n Portable televisions

Typical Application

01288101

Note: Pin out shown for DIP and SO packages. Refer to the Connection Diagrams for the pinout of the TSSOP, Exposed-DAP TSSOP, and Exposed-DAP
LLP packages.

Boomer®is a registered trademark of National Semiconductor Corporation.

August 2002

LM4863 Dual 2.2W Audio Amplifier Plus Stereo Headphone Function

© 2002 National Semiconductor Corporation DS012881 www.national.com

Connection Diagrams

01288128

Top View

Order Number LM4863M, LM4863N
See NS Package Number M16B for SO
See NS Package Number N16E for DIP

01288129

Top View

Order Number LM4863MT

See NS Package Number MTC20 for TSSOP

01288102

Top View

Order Number LM4863MTE

See NS Package Number MXA20A for Exposed-DAP

TSSOP

01288130

Top View

Order Number LM4863LQ

See NS Package Number LQA24A for Exposed-DAP LLP

LM4863

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Absolute Maximum Ratings (Note 3)

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.

Supply Voltage 6.0V

Storage Temperature −65˚C to +150˚C

Input Voltage −0.3V to V

DD

+0.3V

Power Dissipation (Note 4) Internally limited

ESD Susceptibility(Note 5) 2000V

ESD Susceptibility (Note 6) 200V

Junction Temperature 150˚C

Solder Information

Small Outline Package

Vapor Phase (60 sec.) 215˚C

Infrared (15 sec.) 220˚C

See AN-450 “Surface Mounting and their Effects on
Product Reliablilty” for other methods of soldering
surface mount devices.

Thermal Resistance

θ

JC

(typ) —M16B 20˚C/W

θ

JA

(typ) —M16B 80˚C/W

θ

JC

(typ) —N16A 20˚C/W

θ

JA

(typ) —N16A 63˚C/W

θ

JC

(typ) —MTC20 20˚C/W

θ

JA

(typ) —MTC20 80˚C/W

θ

JC

(typ) —MXA20A 2˚C/W

θ

JA

(typ) —MXA20A 41˚C/W (Note 7)

θ

JA

(typ) —MXA20A 51˚C/W (Note 8)

θ

JA

(typ) —MXA20A 90˚C/W(Note 9)

θ

JC

(typ) —LQ24A 3.0˚C/W

θ

JA

(typ) —LQ24A 42˚C/W (Note 10)

Operating Ratings

Temperature Range

T

MIN

≤ TA≤ T

MAX

−40˚C ≤ TA≤ 85˚C

Supply Voltage 2.0V ≤ V

DD

≤ 5.5V

Electrical Characteristics for Entire IC (Notes 3, 11)

The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25˚C.

Symbol Parameter Conditions LM4863 Units

(Limits)

Typical Limit

(Note 12) (Note 13)

V

DD

Supply Voltage 2 V (min)

5.5 V (max)

I

DD

Quiescent Power Supply Current VIN= 0V, IO= 0A (Note 14), HP-IN = 0V 11.5 20 mA (max)

6 mA (min)

V

IN

= 0V, IO= 0A (Note 14), HP-IN = 4V 5.8 mA

I

SD

Shutdown Current VDDapplied to the SHUTDOWN pin 0.7 2 µA (min)

V

IH

Headphone High Input Voltage 4 V (min)

V

IL

Headphone Low Input Voltage 0.8 V (max)

Electrical Characteristics for Bridged-Mode Operation (Notes 3, 11)

The following specifications apply for VDD= 5V unless otherwise specified. Limits apply for TA= 25˚C.

Symbol Parameter Conditions LM4863 Units

(Limits)

Typical

(Note 12)

Limit

(Note 13)

V

OS

Output Offset Voltage VIN= 0V 5 50 mV (max)

P

O

Output Power (Note 15) THD+N = 1%, f = 1kHz (Note 16)

LM4863MTE, R

L

=3Ω

LM4863LQ, R

L

=3Ω

2.5

2.5

W
W

LM4863MTE, R

L

=4Ω

LM4863LQ, R

L

=4Ω

2.2

2.2

W
W

LM4863, R

L

=8Ω 1.1 1.0 W (min)

THD+N = 10%, f = 1kHz (Note 16)

LM4863MTE, R

L

=3Ω

LM4863LQ, R

L

=3Ω

3.2

3.2

W
W

LM4863

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Electrical Characteristics for Bridged-Mode Operation (Notes 3, 11) (Continued)

The following specifications apply for VDD= 5V unless otherwise specified. Limits apply for TA= 25˚C.

Symbol Parameter Conditions LM4863 Units

(Limits)

Typical

(Note 12)

Limit

(Note 13)

LM4863MTE, R

L

=4Ω

LM4863LQ, R

L

=4Ω

2.7

2.7

W
W

LM4863, R

L

=8Ω 1.5 W

THD+N = 1%, f = 1kHz, R

L

=32Ω 0.34 W

THD+N Total Harmonic Distortion+Noise 20Hz ≤ f ≤ 20kHz, A

VD

=2

LM4863MTE, R

L

=4Ω,PO=2W

LM4863LQ, R

L

=4Ω,PO=2W

0.3 0.3 %

LM4863, R

L

=8Ω,PO= 1W 0.3 %

PSRR Power Supply Rejection Ratio V

DD

= 5V, V

RIPPLE

= 200mV

RMS,RL

=8Ω,

C

B

= 1.0µF

67 dB

X

TALK

Channel Separation f = 1kHz, CB= 1.0µF 90 dB

SNR Signal To Noise Ratio V

DD

= 5V, PO= 1.1W, RL=8Ω 98 dB

Electrical Characteristics for Single-Ended Operation (Notes 3, 4)

The following specifications apply for VDD= 5V unless otherwise specified. Limits apply for TA= 25˚C.

Symbol Parameter Conditions LM4863 Units

(Limits)

Typical

(Note 12)

Limit

(Note 13)

V

OS

Output Offset Voltage VIN= 0V 5 50 mV (max)

P

O

Output Power THD+N = 0.5%, f = 1kHz, RL=32Ω 85 75 mW (min)

THD+N = 1%, f = 1kHz, R

L

=8Ω 340 mW

THD+N = 10%, f = 1kHz, R

L

=8Ω 440 mW

THD+N Total Harmonic Distortion+Noise A

V

= −1, PO= 75mW, 20Hz ≤ f ≤ 20kHz,

R

L

=32Ω

0.2 %

PSRR Power Supply Rejection Ratio C

B

= 1.0µF, V

RIPPLE

= 200mV

RMS

,

f = 1kHz

52 dB

X

TALK

Channel Separation f = 1kHz, CB= 1.0µF 60 dB

SNR Signal To Noise Ratio V

DD

= 5V, PO= 340mW, RL=8Ω 95 dB

Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC andAC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.

Note 4: The maximum power dissipation is dictated by T

JMAX

, θJA, and the ambient temperature TAand must be derated at elevated temperatures. The maximum

allowable power dissipation is P

DMAX

=(T

JMAX−TA

)/θJA. For the LM4863, T

JMAX

= 150˚C. For the θJAs for different packages, please see the Application

Information section or the Absolute Maximum Ratings section.

Note 5: Human body model, 100 pF discharged through a 1.5 kΩ resistor.

Note 6: Machine model, 220 pF– 240 pF discharged through all pins.

Note 7: The given θ

JA

is for an LM4863 packaged in an MXA20A with the exposed−DAP soldered to an exposed 2in2area of 1oz printed circuit board copper.

Note 8: The given θ

JA

is for an LM4863 packaged in an MXA20A with the exposed−DAP soldered to an exposed 1in2area of 1oz printed circuit board copper.

Note 9: The given θ

JA

is for an LM4863 packaged in an MXA20A with the exposed-DAP not soldered to printed circuit board copper.

Note 10: The given θ

JA

is for an LM4863 packaged in an LQA24A with the exposed−DAP soldered to an exposed 2in2area of 1oz printed circuit board copper.

Note 11: All voltages are measured with respect to the ground (GND) pins unless otherwise specified.

Note 12: Typicals are measured at 25˚C and represent the parametric norm.

Note 13: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).

Note 14: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.

Note 15: Output power is measured at the device terminals.

Note 16: When driving 3Ω or 4Ω and operating on a 5V supply, the LM4863LQ and LM4863MTE must be mounted to the circuit board that has a minimum of 2.5in

2

of exposed, uninterrupted copper area connected to the LLP package’s exposed DAP.

LM4863

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Typical Performance Characteristics
MTE Specific Characteristics

LM4863MTE

THD+N vs Output Power

LM4863MTE

THD+N vs Frequency

01288197

01288199

LM4863MTE

THD+N vs Output Power

LM4863MTE

THD+N vs Frequency

01288196

01288198

LM4863MTE

Power Dissipation vs Power Output

LM4863MTE

Power Derating Curve

01288190

01288195

LM4863

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Typical Performance Characteristics
MTE Specific Characteristics

(Continued)

LM4863MTE (Note 17)

Power Derating Curve

01288137

Note 17: This curve shows the LM4863MTE’s thermal dissipation ability at different ambient temperatures given these conditions:

500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across it.
Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.

500LFPM + 2.5in

2

: The part is soldered to a 2.5in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.

2.5in

2

: The part is soldered to a 2.5in2, 1oz. copper plane.

Not Attached: The part is not soldered down and is not forced-air cooled.

Non-MTE Specific Characteristics

THD+N vs Frequency THD+N vs Frequency

01288103 01288104

THD+N vs Frequency THD+N vs Output Power

01288105 01288106

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Non-MTE Specific Characteristics (Continued)

THD+N vs Output Power THD+N vs Output Power

01288107 01288108

THD+N vs Output Power THD+N vs Frequency

01288187

01288189

THD+N vs Output Power THD+N vs Frequency

01288186 01288188

LM4863

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