Electrical Characteristics (Continued)
Specifications with standard typeface are for T
J
=
25˚C, and those in boldface type apply over full Operating Temperature
Range.V
IN
=
10V unless otherwise specified.
Symbol Parameter Conditions
Typical
(Note 5)
Limit
(Note 4)
Units
G
M
Error Amplifier
Transconductance
1250 µmho
A
V
Error Amplifier Voltage
Gain
100
I
EA_SOURCE
Error Amplifier Source
Current
VIN= 3.6V, VFB= 1.17V, V
COMP
=
2V
40
25/15
µA
µA(min)
I
EA_SINK
Error Amplifier Sink Current VIN= 3.6V, VFB= 1.31V, V
COMP
=
2V
65
30
µA
µA(min)
V
EAH
Error Amplifier Output
Swing Upper Limit
VIN= 4V, VFB= 1.17V 2.70
2.50/2.40
V
V(min)
V
EAL
Error Amplifier Output
Swing Lower Limit
VIN= 4V, VFB= 1.31V 1.25
1.35/1.50
V
V(max)
V
D
Body Diode Voltage I
DIODE
= 1.5A 1 V
F
OSC
Oscillator Frequency Measured at Switch Pin
V
IN
=4V
300
280/255
330/345
kHz
kHz(min)
kHz(max)
D
MAX
Maximum Duty Cycle VIN=4V 95
92
%
%
(min)
I
SS
Soft-Start Current Voltage at the SS Pin = 1.4V 11
7
14
µA
µA(min)
µA(max)
V
OUTUV
V
OUT
Undervoltage
Lockout Threshold Voltage
81
76
84
%
V
OUT
%
V
OUT
(min)
%
V
OUT
(max)
Hysteresis for V
OUTUV
5
%
V
OUT
V
OUTOV
V
OUT
Overvoltage Lockout
Threshold Voltage
108
106
114
%
V
OUT
%
V
OUT
(min)
%
V
OUT
(max)
Hysteresis for V
OUTOV
3
%
V
OUT
I
LDELAY__
SOURCE
LDELAY Pin Source
Current
5µA
I
PGOOD__SINK
PGOOD Pin Sink Current V
PGOOD
= 0.4V 15 mA(max)
I
PGOOD__LEAKAGE
PGOOD Pin Leakage
Current
V
PGOOD
=5V 50 nA
I
SHUTDOWN
Shutdown Pin Current Shutdown Pin Pulled Low 2.2
0.8/0.5
3.7/4.0
µA
µA(min)
µA(max)
V
SHUTDOWN
Shutdown Pin Threshold
Voltage
Rising Edge 0.6
0.3
0.9
V
V(min)
V(max)
T
SD
Thermal Shutdown
Temperature
165 ˚C
T
SD_HYST
Thermal Shutdown
Hysteresis Temperature
25 ˚C
Note 1: Absolute Maxmum Ratingsindicate limits beyond which damageto the device may occur. Operating Ratings indicate conditionsfor which the device is intended to be functional, but device parameter specifications may notbe guaranteed under these conditions.For guaranteed specifications and test conditions, see
the Electrical Characteristics.
Note 2: The maximum allowablepower dissipation is calculated by using P
DMAX
=
(T
JMAX−TA
)/θJA, whereT
JMAX
is themaximum junction temperature, TAis the
ambient temperature, and θ
JA
is the junction-to-ambient thermal resistance of the specified package. The 893 mW rating results from using 150˚C, 25˚C, and
140˚C/W forT
JMAX,TA
, and θJArespectively.A θJAof 140˚C/W represents the worst-case condition of no heat sinkingof the 16-pin TSSOP package.Heat sinking
allows the safe dissipation of more power.The Absolute Maximum power dissipationmust bederated by7.14 mWper ˚Cabove 25˚C ambient. The LM2653 actively
limits its junction temperatures to about 165˚C.
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
LM2653
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