NSC DS36C200MX, DS36C200M Datasheet

DS36C200 Dual High Speed Bi-Directional Differential Transceiver
General Description
The DS36C200 is a dual transceiver device optimized for high data rate and low power applications. This device pro­vides a single chip solution for a dual high speed bi-directional interface.Also,both control pins may be routed together for single bit control of datastreams. Both control pins are adjacent to each other for ease of routing them to­gether. The DS36C200 is compatible with IEEE 1394 physi­cal layer and may be used as an economical solution with some considerations. Please reference the application infor­mation on 1394 for more information. The device is in a 14-lead small outline package. The differential driver outputs provides low EMI with its low output swings typically 210 mV. The receiver offers
±
100 mV threshold sensitivity, in addition
to common-mode noise protection.
Features
n Optimized for DSS to DVHS interface link n Compatible IEEE 1394 signaling voltage levels n Operates above 100 Mbps n Bi-directional transceivers n 14-lead SOIC package n Ultra low power dissipation
n
±
100 mV receiver sensitivity
n Low differential output swing typical 210 mV n High impedance during power off
Connection Diagram Functional Diagram
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
DS012621-1
Note:*denotes active LOW pin
Order Number DS36C200M
See NS Package Number M14A
DS012621-2
June 1998
DS36C200 Dual High Speed Bi-Directional Differential Transceiver
© 1998 National Semiconductor Corporation DS012621 www.national.com
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +6V
Enable Input Voltage
(DE, RE
*
) −0.3V to (VCC+ 0.3V) Voltage (DI/RO) −0.3V to +5.9V Voltage (DO/RI
±
) −0.3V to +5.9V
Maximum Package Power Dissipation
@
+25˚C
M Package 1255 mW Derate M Package 10.04 mW/˚C above +25˚C Storage Temperature Range −65˚C to +150˚C Lead Temperature Range
(Soldering, 4 sec.) +260˚C
ESD Rating (Note 4)
(HBM, 1.5 k, 100 pF) 3.5 kV (EIAJ, 0 , 200 pF) 300V
Recommended Operating Conditions
Min Typ Max Units
Supply Voltage (V
CC
) +4.5 +5.0 +5.5 V Receiver Input Voltage 0 2.4 V Operating Free Air Temperature (T
A
) 0 25 70 ˚C
Electrical Characteristics (Notes 2, 3, 7)
Over supply voltage and operating temperature ranges, unless otherwise specified
Symbol Parameter Conditions Pin Min Typ Max Units DIFFERENTIAL DRIVER CHARACTERISTICS (RE
*
=
V
CC
)
V
OD
Output Differential Voltage R
L
=
55,(
Figure 1
) DO+,
DO−
172 210 285 mV
V
OD
VODMagnitude Change 0 4 35 mV
V
OH
Output High Voltage 1.36 V
V
OL
Output Low Voltage 1.15 V
V
OS
Offset Voltage 1.0 1.25 1.6 V
V
OS
Offset Magnitude Change 0 5 25 mV
I
OZD
TRI-STATE®Leakage V
OUT
=
V
CC
or GND −10
±
1 +10 µA
I
OXD
Power-Off Leakage V
OUT
=
5.5V or GND, V
CC
=
0V −10
±
1 +10 µA
I
OSD
Output Short Circuit Current V
OUT
=
0V −4 −9 mA
DIFFERENTIAL RECEIVER CHARACTERISTICS (DE=GND)
V
TH
Input Threshold High V
CM
=
0V to 2.3V RI+,
RI−
+100 mV
V
TL
Input Threshold Low −100 mV
I
IN
Input Current V
IN
=
+2.4V or 0V −10
±
1 +10 µA
V
OH
Output High Voltage I
OH
=
−400 µA RO 3.8 4.9 V Inputs Open 3.8 4.9 V Inputs Terminated, R
t
=
55 3.8 4.9 V
Inputs Shorted, V
ID
=
0V 4.9 V
V
OL
Output Low Voltage I
OL
=
2.0 mA, V
ID
=
−200 mV 0.1 0.4 V
I
OSR
Output Short Circuit Current V
OUT
=
0V −15 −60 −100 mA
DEVICE CHARACTERISTICS
V
IH
Input High Voltage DI,
DE
RE
*
2.0 V
CC
V
V
IL
Input Low Voltage GND 0.8 V
I
IH
Input High Current V
IN
=
V
CC
or 2.4V
±
1
±
10 µA
I
IL
Input Low Current V
IN
=
GND or 0.4V
±
1
±
10 µA
V
CL
Input Clamp Voltage I
CL
=
−18 mA −1.5 −0.8 V
I
CCD
Power Supply Current No Load, DE=RE
*
=
V
CC
V
CC
37mA
R
L
=
55,DE=RE
*
=
V
CC
11 17 mA
I
CCR
DE=RE
*
=
0V 6 10 mA
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except V
OD
and VID.
Note 3: All typicals are given for V
CC
=
+5.0V and T
A
=
+25˚C.
Note 4: ESD Rating: HBM (1.5 k, 100 pF) 3.5 kV
EIAJ (0, 200 pF) 300V
Note 5: C
L
includes probe and fixture capacitance.
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Electrical Characteristics (Notes 2, 3, 7) (Continued)
Note 6: Generator waveform for all tests unless otherwise specified: f=1 MHz, Z
O
=
50,t
r
1 ns, tf≤ 1ns(0%–100%).
Note 7: The DS36C200 is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs.
Switching Characteristic
Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 5, 6)
Symbol Parameter Conditions Min Typ Max Units DIFFERENTIAL DRIVER CHARACTERISTICS
t
PHLD
Differential Propagation Delay High to Low R
L
=
55,C
L
=
10 pF
(
Figure 2
and
Figure 3
)
1.0 2.5 5.5 ns
t
PLHD
Differential Propagation Delay Low to High 1.0 2.6 5.5 ns
t
SKD
Differential Skew |t
PHLD–tPLHD
| 0 0.1 2 ns
t
TLH
Transition Time Low to High 0 0.5 2 ns
t
THL
Transition Time High to Low 0 0.5 2 ns
t
PHZ
Disable Time High to Z R
L
=
55
(
Figure 4
and
Figure 5
)
0.3 5 20 ns
t
PLZ
Disable Time Low to Z 0.3 5 20 ns
t
PZH
Enable Time Z to High 0.3 10 30 ns
t
PZL
Enable Time Z to Low 0.3 10 30 ns
DIFFERENTIAL RECEIVER CHARACTERISTICS
t
PHLD
Differential Propagation Delay High to Low C
L
=
10 pF, V
ID
=
200 mV
(
Figure 6
and
Figure 7
)
1.5 5 9 ns
t
PLHD
Differential Propagation Delay Low to High 1.5 4.6 9 ns
t
SKD
Differential Skew |t
PHLD–tPLHD
| 0 0.4 3 ns
t
r
Rise Time 0 1.5 5 ns
t
f
Fall Time 0 1.5 5 ns
t
PHZ
Disable Time High to Z C
L
=
10 pF
(
Figure 8
and
Figure 9
)
1 5 20 ns
t
PLZ
Disable Time Low to Z 1 5 20 ns
t
PZH
Enable Time Z to High 0.3 10 30 ns
t
PZL
Enable Time Z to Low 0.3 10 30 ns
Parameter Measurement Information
DS012621-3
FIGURE 1. Differential Driver DC Test Circuit
DS012621-4
FIGURE 2. Differential Driver Propagation Delay and Transition Time Test Circuit
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Parameter Measurement Information (Continued)
DS012621-5
FIGURE 3. Differential Driver Propagation Delay and Transition Time Waveforms
DS012621-6
FIGURE 4. Driver TRI-STATE Delay Test Circuit
DS012621-7
FIGURE 5. Driver TRI-STATE Delay Waveforms
DS012621-8
FIGURE 6. Receiver Propagation Delay and Transition Time Test Circuit
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Parameter Measurement Information (Continued)
Application Information
TRUTH TABLES
The DS36C200 has two enable pins DE and RE
*
, however, the driver and receiver should never be enabled simulta­neously.Enabling both could cause multiple channel conten­tion between the receiver output and the driving logic. It is recommended to route the enables together on the PC board. This will allow a single bit [DE/RE
*
] to control the
chip. This DE/RE
*
bit toggles the DS36C200 between Re­ceive mode and Transmit mode. When the bit is asserted HIGH the device is in Transmit mode. When the bit is as­serted LOW the device is in Receive mode. The mode deter­mines the function of the I/O pins: DI/RO, DO/RI+, and DO/RI−.Please note that some of the pins have been identi­fied by its function in the corresponding mode in the three tables below.For example, in Transmit mode the DO/RI+ pin is identified as DO+. This was done for clarity in the tables only and should not be confused with the pin identification throughout the rest of this document. Also note that a logic low on the DE/RE
*
bit corresponds to a logic low on both the
DE pin and the RE
*
pin. Similarly, a logic high on the
DE/RE
*
bit corresponds to a logic high on both the DE pin
and the RE
*
pin.
DS012621-9
FIGURE 7. Receiver Propagation Delay and Transition Time Waveforms
DS012621-10
FIGURE 8. Receiver TRI-STATE Delay Test Circuit
DS012621-11
FIGURE 9. Receiver TRI-STATE Delay Waveforms
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Application Information (Continued) Receive Mode
Input(s) Input/Output
DE RE
*
[RI+] − [RI−] RO
LL
>
+100 mV H
LL
<
−100 mV L
L L 100 mV
>&>
−100 mV X
LH X Z
Transmit Mode
Input(s) Input/Output
DE RE
*
DI DO+ DO−
HH L L H HHHHL HH2
>
&
>
0.8 X X
LH X Z Z
H
=
Logic high level L=Logic low level X=Indeterminant state Z=High impedance state
TABLE 1. Device Pin Descriptions
Pin
#
Name Mode Description
(In mode only)
3 DE Transmit Driver Enable: When asserted low driver is disabled. And when
asserted high driver is enabled.
1, 7 DI TTL/CMOS driver input pins 10, 13 DO+ Non-inverting driver output pin 11, 12 DO− Inverting driver output pin
4RE
*
Receive Receiver Enable: When asserted low receiver is enabled. And when
asserted high receiver is disabled.
1, 7 RO Receiver output pin 10, 13 RI+ Positive receiver input pin 11, 12 RI− Negative receiver input pin
5 GND Transmit and Ground pin 2V
CC
Receive Positive power supply pin, +5V±10
%
6, 8, 9, 14 NC No Connect
IEEE 1394
The DS36C200 drives and receives IEEE 1394 physical layer signal levels. The current mode driver is capable of driving a 55load with V
OD
between 172 mV and 285 mV. The DS36C200 is not designed to work with a link layer con­troller IC requiring full 1394 physical layer compliancy to the standard. No clock generator, no arbitration, and no encode/ decode logic is provided with this device. For a 1394 link where speed sensing, bus arbitration, and other functions are not required, a controller and the DS36C200 will provide a cost effective, high speed dedicated link. This is shown in
Figure 10
. In applications that require fully compliant 1394 protocol, a link layer controller and physical layer controller will be required as shown in
Figure 10
. The physical layer controller supports up to three DC36C200 devices (not shown).
The DS36C200 drivers are current mode drivers and in­tended to work with a two 110termination resistors in par­allel with each other. The termination resistors should match the characteristic impedance of the transmission media. The drivers are current mode devices therefore the resistors are required. Both resistors are required for half duplex opera­tion and should be placed as close to the DO/RI+ and DO/ RI− pins as possible at opposite ends of the bus. However,if your application only requires simplex operation, only one termination resistor is required. In addition, note the voltage levels will vary from those in the datasheet due to different loading. Also, AC or unterminated configurations are not used with this device. Multiple node configurations are pos-
sible as long as transmission line effects are taken into ac­count. Discontinuities are caused by mid-bus stubs, connec­tors, and devices that affect signal integrity.
The differential line driver is a balanced current source de­sign. A current mode driver, generally speaking has a high output impedance and supplies a constant current for a range of loads (a voltage mode driver on the other hand sup­plies a constant voltage for a range of loads). Current is switched through the load in one direction to produce a logic state and in the other direction to produce the other logic state. The typical output current is mere 3.8 mA, a minimum of 3.1 mA, and a maximum of 5.2 mA. The current mode re- quires that a resistive termination be employed to terminate the signal and to complete the loop as shown in
Figure 11
. The 3.8 mA loop current will develop a differential voltage of 210 mV across the 55termination resistor which the re­ceiver detects with a 110mV minimum differential noise mar­gin neglecting resistive line losses (driven signal minus re­ceiver threshold (210 mV – 100 mV=110 mV)). The signal is centered around +1.2V (Driver Offset, V
OS
) with respect to
ground as shown in
Figure 7
.
The current mode driver provides substantial benefits over voltage mode drivers, such as an RS-422 driver. Its quies­cent current remains relatively flat versus switching fre­quency.Whereas the RS-422 voltage mode driver increases exponentially in most case between 20 MHz–50 MHz. This is due to the overlap current that flows between the rails of the device when the internal gates switch. Whereas the cur­rent mode driver switches a fixed current between its output without any substantial overlap current. This is similar to
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Application Information (Continued)
some ECL and PECL devices, but without the heavy static I
CC
requirements of the ECL/PECL designs. LVDS requires
>
80%less current than similar PECL devices. AC specifica­tions for the driver are a tenfold improvement over other ex­isting RS-422 drivers.
Fail-safe Feature:
The LVDS receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to CMOS logic levels. Due to the high gain and tight threshold of the re­ceiver,care should be taken to prevent noise from appearing as a valid signal.
The receiver’s internal fail-safe circuitry is designed to source/sink a small amount of current, providing fail-safe protection (a stable known state of HIGH output voltage) for floating, terminated or shorted receiver inputs.
1. Open Input Pins. The DS36C200 is a dual transceiver
device, and if an application requires only one receiver, the unused channel inputs should be left OPEN. Do not tie the receiver inputs to ground or any other voltages. The input is biased by internal high value pull up or pull
down resistors to set the output to a HIGH state. This in­ternal circuitry will guarantee a HIGH, stable output state for open inputs.
2. Terminated Input. If the driver is disconnected (cable unplugged), or if the driver is in a TRI-STATE or power-off condition, the receiver output will again be in a HIGH state, even with the end of the cable 100termi­nation resistor across the input pins. The unplugged cable can become a floating antenna which can pick up noise. If the cable picks up more than 10mV of differen­tial noise, the receiver may see the noise as a valid sig­nal and switch. To insure that any noise is seen as common-mode and not differential, a balanced intercon­nect should be used. Twisted pair cable will offer better balance than flat ribbon cable.
2.4V). It is only supported with inputs shorted and no ex­ternal common-mode voltage applied.
DS012621-14
FIGURE 10. (A) Dedicated IEEE 1394 Link
(B) Full IEEE 1394 Compliant Link
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Application Information (Continued)
DS012621-12
FIGURE 11. Typical in Home Application
DS012621-13
FIGURE 12. Typical Interface Connection (Note 7)
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9
Physical Dimensions inches (millimeters) unless otherwise noted
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14-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number DS36C200M NS Package Number M14A
DS36C200 Dual High Speed Bi-Directional Differential Transceiver
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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