NSC 5962-9214801QRA, 5962-9214801QSA, 5962-9214801Q2A, 54ABT245MWA, 54ABT245MDA Datasheet

54ABT245 Octal Bidirectional Transceiver with TRI-STATE
®
Outputs
General Description
The ’ABT245 contains eight non-inverting bidirectional buff­ers withTRI-STATE outputs and is intended for bus-oriented applications. Current sinking capability is 48 mA on both the A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional trans­ceiver.Transmit(active HIGH) enables datafromAports to B ports; Receive (active LOW) enables data from B ports to A ports. The Output Enable input, when HIGH, disables both A and B ports by placing them in a High Z condition.
Features
n Bidirectional non-inverting buffers n A and B output sink capability of 48 mA, source
capability of 24 mA
n Guaranteed output skew n Guaranteed multiple output switching specifications n Output switching specified for both 50 pF and 250 pF
loads
n Guaranteed simultaneous switching, noise level and
dynamic threshold performance
n Guaranteed latchup protection n High impedance glitch-free bus loading during entire
power up and power down cycle
n Non-destructive hot insertion capability n Disable time is less than enable time to avoid bus
contention
n Standard Microcircuit Drawing (SMD) 5962-9214801
Ordering Code:
Military Package Package Description
Number
54ABT245J-QML J20A 20-Lead Ceramic Dual-In-Line 54ABT245W-QML W20A 20-Lead Cerpak 54ABT245E-QML E20A 20-Lead Ceramic Leadless Chip Carrier, Type C
Logic Symbol
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
DS100204-1
July 1998
54ABT245 Octal Bidirectional Transceiver with TRI-STATE Outputs
© 1998 National Semiconductor Corporation DS100204 www.national.com
Connection Diagrams
Pin Descriptions
Pin Names Description
OE
Output Enable Input (Active LOW)
T/R
Transmit/Receive Input
A
0–A7
Side A Inputs or TRI-STATE Outputs
B
0–B7
Side B Inputs or TRI-STATE Outputs
Truth Table
Inputs Output
OE
T/R
L L Bus B Data to Bus A L H Bus A Data to Bus B H X High Z State
H=HIGH Voltage Level L=LOW Voltage Level X=Immaterial
Logic Diagram
Pin Assignment for DIP
and Flatpak.
DS100204-5
Pin Assignment for LCC
DS100204-3
DS100204-4
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.
Storage Temperature −65˚C to +150˚C Ambient Temperature under Bias −55˚C to +125˚C Junction Temperature under Bias
Ceramic −55˚C to +175˚C
V
CC
Pin Potential to
Ground Pin −0.5V to +7.0V Input Voltage (Note 2) −0.5V to +7.0V Input Current (Note 2) −30 mA to +5.0 mA Voltage Applied to Any Output
in the Disabled or
Power-off State −0.5V to 5.5V
in the HIGH State −0.5V to V
CC
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA) DC Latchup Source Current −500 mA Over Voltage Latchup (I/O) 10V
Recommended Operating Conditions
Free Air Ambient Temperature
Military −55˚C to +125˚C
Supply Voltage
Military +4.5V to +5.5V
Minimum Input Edge Rate (V/t)
Data Input 50 mV/ns Enable Input 20 mV/ns
Note 1: Absolutemaximumratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol Parameter ABT245
Units V
CC
Conditions
Min Typ Max
V
IH
Input HIGH Voltage 2.0 V Recognized HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized LOW Signal
V
CD
Input Clamp Diode Voltage −1.2 V Min I
IN
=
−18 mA (OE, T/R)
V
OH
Output HIGH Voltage
54ABT 2.5 V Min I
OH
=
−3 mA (A
n,Bn
)
54ABT 2.0 V Min I
OH
=
−24 mA (A
n,Bn
)
V
OL
Output LOW Voltage
54ABT 0.55
V Min
I
OL
=
48 mA (A
n,Bn
)
I
IH
Input HIGH Current 5
µA Max
V
IN
=
2.7V (OE, T/R) (Note 3)
5V
IN
=
V
CC
(OE, T/R)
I
BVI
Input HIGH Current Breakdown Test 7 µA Max V
IN
=
7.0V (OE, T/R)
I
BVIT
Input HIGH Current Breakdown Test (I/O)
100
µA Max
V
IN
=
5.5V (A
n,Bn
)
I
IL
Input LOW Current −5
µA Max
V
IN
=
0.5V (OE, T/R) (Note 3)
−5 V
IN
=
0.0V (OE, T/R)
V
ID
Input Leakage Test 4.75
V 0.0
I
ID
=
1.9 µA (OE, T/R)
All Other Pins Grounded
I
IH+IOZH
Output Leakage Current 50 µA 0 − 5.5V V
OUT
=
2.7V (A
n,Bn
); OE=2.0V
IIL+I
OZL
Output Leakage Current −50 µA 0 − 5.5V V
OUT
=
0.5V (A
n,Bn
); OE=2.0V
I
OS
Output Short-Circuit Current −100 −275 mA Max V
OUT
=
0.0V (A
n,Bn
)
I
CEX
Output High Leakage Current 50 µA Max V
OUT
=
V
CC(An,Bn
)
I
ZZ
Bus Drainage Test 100
µA 0.0
V
OUT
=
5.5V (A
n,Bn
);
All Others GND
I
CCH
Power Supply Current 50 µA Max All Outputs HIGH
I
CCL
Power Supply Current 30 mA Max All Outputs LOW
I
CCZ
Power Supply Current 50
µA Max
OE=VCC, T/R=GND or VCC; All Other GND or V
CC
I
CCT
Additional Outputs Enabled 2.5 mA V
I
=
V
CC
− 2.1V
I
CC
/Input Outputs TRI-STATE 2.5 mA Max OE, T/R V
I
=
V
CC
− 2.1V
Outputs TRI-STATE 50 µA Data Input V
I
=
V
CC
− 2.1V
All Others at V
CC
or GND.
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