Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature (T
STG
) −65˚C to +150˚C
Maximum Junction Temperature (T
J
)
Ceramic +175˚C
V
EE
Pin Potential to Ground Pin −7.0V to +0.5V
Input Voltage (DC) V
EE
to +0.5V
Output Current (DC Output HIGH) −50 mA
ESD (Note 3) ≥2000V
Recommended Operating
Conditions
Case Temperature (TC)
Military −55˚C to +125˚C
Supply Voltage (V
EE
) −5.7V to −4.2V
Note 2: Absolute maximum ratings are those values beyond which the device may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
Note 3: ESD testing conforms to MIL-STD-883, Method 3015.
Military Version
DC Electrical Characteristics
V
EE
=
−4.2V to −5.7V, V
CC
=
V
CCA
=
GND, T
C
=
−55˚C to +125˚C
Symbol Parameter Min Max Units T
C
Conditions Notes
V
OH
Output HIGH Voltage −1025 −870 mV 0˚C to
+125˚C V
IN
=
V
IH (Max)
Loading with
−1085 −870 mV −55˚C or V
IL (Min)
50Ω to −2.0V (Notes 4, 5, 6)
V
OL
Output LOW Voltage −1830 −1620 mV 0˚C to
+125˚C
−1830 −1555 mV −55˚C
V
OHC
Output HIGH Voltage −1035 mV 0˚C to
+125˚C V
IN
=
V
IH (Min)
Loading with
−1085 mV −55˚C or V
IL (Max)
50Ω to −2.0V (Notes 4, 5, 6)
V
OLC
Output LOW Voltage −1610 mV 0˚C to
+125˚C
−1555 mV −55˚C
V
IH
Input HIGH Voltage −1165 −870 mV −55˚C to Guaranteed HIGH Signal (Notes 4, 5, 6, 7)
+125˚C for All Inputs
V
IL
Input LOW Voltage −1830 −1475 mV −55˚C to Guaranteed LOW Signal (Notes 4, 5, 6, 7)
+125˚C for All Inputs
I
IL
Input LOW Current 0.50 µA −55˚C to V
EE
=
−4.2V (Notes 4, 5, 6)
+125˚C V
IN
=
V
IL (Min)
I
IH
Input HIGH Current 240 µA 0˚C to V
EE
=
−5.7V
+125˚C V
IN
=
V
IH(Max)
(Notes 4, 5, 6)
340 µA −55˚C
I
EE
Power Supply Current −55˚C Inputs Open
−185 −70 mA to V
EE
=
−4.2V to −4.8V (Notes 4, 5, 6)
−195 −70 +125˚C V
EE
=
−4.2V to −5.7V
Note 4: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately
without allowing for the junction temperature to stablize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case
condition at cold temperatures.
Note 5: Screen tested 100%on each device at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.
Note 6: Sample tested (Method 5005, Table I) on each manufactured lot at −55˚C, +25˚C, +125˚C, Subgroups A1, 2, 3, 7, and 8.
Note 7: Guaranteed by applying specified input conditon and testing V
OH/VOL
.
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