Novatel Wireless LPP0108 Users manual

Integration Guide: LPP0108IG001
Enfora Enabler LPP G
Integration Guide
Version: Preliminary
Enfora Enabler LPP G Integration Guide
Document Title: Enfora Enabler LPP G Integration Guide Version: Preliminary Date: 06/20/2008 Status: Preliminary Document Control ID: LPP0108IG001 General
All efforts have been made to ensure the accuracy of material provided in this document at the time of release. However, the items described in this document are subject to continuous development and improvement. All specifications are subject to change without notice and do not represent a commitment on the part of Enfora, Inc. Enfora, Inc. will not be responsible for any loss or damages incurred related to the use of information contained in this document.
This product is not intended for use in life support appliances, devices or systems where a malfunction of the product can reasonably be expected to result in personal injury. Enfora, Inc. customers using, integrating, and/or selling this product for use in such applications do so at their own risk and agree to fully indemnify Enfora, Inc. for any damages resulting from illegal use or resale.
Copyright
Complying with all applicable copyright laws is the responsibility of the user. Without limiting the rights under copyright, no part of this document may be reproduced, stored in or introduced into a retrieval system, or transmitted in any form or by any means (electronic, mechanical, photocopying, recording or otherwise), or for any purpose, without the express written permission of Enfora, Inc.
Enfora may have patents, patent applications, trademarks, copyrights or other intellectual property rights covering subject matter in this document. Except as expressly provided in any written license agreement from Enfora, the furnishing of this document does not give you any license to these patents, trademarks, copyrights or other intellectual property.
©2002, 2003, 2004, 2005, 2006, 2007, 2008 Enfora, Inc. All rights reserved.
Enabler and Spider are either registered trademarks or trademarks of Enfora, Inc. in the United States.
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Table of Contents
1.SAFETY PRECAUTIONS ................................................................................................................................. 1
1.1. IMPORTANT SAFETY INFORMATION ................................................................................................................ 1
2.REGULATORY COMPLIANCE FCC ............................................................................................................. 1
2.1. INTEGRATION CONSIDERATIONS AND INSTALLATION REQUIREMENTS ........................................................... 1
2.2. DISCLAIMER ................................................................................................................................................... 3
3.MANUAL OVERVIEW ...................................................................................................................................... 4
3.1. REVISION HISTORY ......................................................................................................................................... 4
H3.2.REFERENCES ................................................................................................................................................... 5
3.2.1. Enfora Enabler LPP G Product Documentation ................................................................................. 5
3.2.2. GSM Device Specifications .................................................................................................................. 5
3.2.3. US Government .................................................................................................................................... 5
3.2.4. Federal Communications Commission (FCC) ..................................................................................... 5
3.2.5. FCC Office of Engineering and Technology (OET) ............................................................................. 5
3.2.6. Industry Canada .................................................................................................................................. 6
3.2.7. Environmental Regulations .................................................................................................................. 6
3.2.8. Mechanical Specifications ................................................................................................................... 6
3.2.9. RF and EMI Specifications .................................................................................................................. 6
4.INTRODUCTION ............................................................................................................................................... 7
4.1. PRODUCT OVERVIEW...................................................................................................................................... 7
4.2. KEY FEATURES OF THE ENABLER LPP G MODULE ......................................................................................... 7
4.3. PROVIDING MULTI-BAND OPERATION ........................................................................................................... 9
4.4. SUMMARY OF FEATURES FOR THE ENABLER LPP G MODULE ........................................................................ 9
4.5. GENERAL DESIGN GUIDELINES FOR UTILIZING ENFORA GSM MODU LES ...................................................... 12
4.5.1. Advanced tips for an RF friendly layout ............................................................................................ 13
4.5.1.1.Ground Plane ................................................................................................................................................... 13
4.5.1.2.Thermal Relief ................................................................................................................................................. 14
4.5.1.3.Antenna and RF Signal Trace .......................................................................................................................... 15
4.5.1.4.Vbat Input ........................................................................................................................................................ 16
4.5.2. Audio Reference Design ..................................................................................................................... 17
4.5.2.1.Audio Schematics ............................................................................................................................................ 17
4.5.2.2.Audio Layout ................................................................................................................................................... 17
4.6. HANDLING AND SOLDERING GUIDELINES ..................................................................................................... 17
5.TECHNICAL SPECIFICATIONS .................................................................................................................. 18
5.1. ENABLER LPP G MODULE BLOCK DIAGRAM ............................................................................................... 18
5.2. DETAILED PRODUCT SPECIFICATIONS .......................................................................................................... 19
CLIMATIC: STORAGE AND TRANSPORTATION ........................................................................................................... 19
MECHANICAL: STORAGE AND TRANSPORTATION ..................................................................................................... 19
MECHANICAL: PROPOSED STANDARDS .................................................................................................................... 19
ELECTROMAGNETIC EMISSIONS ............................................................................................................................... 19
5.3. OPERATING POWER ...................................................................................................................................... 20
5.3.1. Typical Input Current ........................................................................................................................ 20
5.3.2. GSM Transmit Power ........................................................................................................................ 20
5.3.3. GSM Receiver Sensitivity ................................................................................................................... 21
6.PHYSICAL INTERFACES .............................................................................................................................. 21
6.1. MODULE MOUNTING TO HOST BOARD (REFERENCE) ................................................................................... 22
6.2. I/O PIN ASSIGNMENTS .................................................................................................................................. 25
6.3. CIRCUIT PROTECTION ................................................................................................................................... 26
6.4. ANTENNA ..................................................................................................................................................... 27
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6.4.1. GSM ................................................................................................................................................... 27
6.4.2. GPS .................................................................................................................................................... 27
6.5. CONTROL CONNECTOR SIGNAL DESCRIPTIONS AND FUNCTIONS ................................................................. 29
6.5.1. Module Power (Pins 30, 31) .............................................................................................................. 29
6.5.2. On/Off Signal (Pin 4) ......................................................................................................................... 30
6.5.3. On/Off Status (Pin 5) ......................................................................................................................... 30
6.5.1. General Purpose Input Signals (Pins 10, 11) .................................................................................... 30
6.5.1. General Purpose Output Signals (Pins 12, 13) .................................................................................. 30
6.5.2. Reset Signal (Pin 24) ......................................................................................................................... 30
6.5.3. USB (Pins 34, 35, 36) ........................................................................................................................ 31
6.5.4. RTC Sleep ............................................................................................ Error! Bookmark not defined.
6.5.5. Serial Interfaces ................................................................................................................................. 32
6.5.5.1.Main Serial Interface (Pins 17, 18) .................................................................................................................. 32
6.5.5.2.GPS Serial Interface (Pin 19) ................................................................................................. .......................... 33
6.5.6. Handset Microphone Input (Pins 39, 40) ........................................................................................... 34
6.5.7. Handset Speaker Output (Pins 37, 38) ............................................................................................... 34
6.6. SUBSCRIBER IDENTITY MODULE (SIM) (PINS 42, 43, 44, 45, 46) ................................................................. 35
6.6.1. Using a Remote SIM with the Enfora Enabler LPP G Module (Pins 42, 43, 44, 45, 46) .................. 36
6.6.1.1.Remote SIM Component Information .............................................................................................................. 37
7.BATTERY CHARGING CALIBRATION AND CONFIGURATION ........................................................ 38
7.1. OBJECTIVE .................................................................................................................................................... 38
7.2. SUPPORTED DEVICES .................................................................................................................................... 38
7.3. REFERENCES ................................................................................................................................................. 38
7.4. LIST OF BATTERY CHARGING COMMANDS ..................................................................................................... 38
7.4.1. Setting BCIVSF parameters ............................................................................................................... 39
7.4.2. Equipment required ........................................................................................................................... 39
7.4.3. Procedure .......................................................................................................................................... 39
7.4.4. Setting BCIISF Parameters ................................................................................................................ 40
7.4.5. Scope .................................................................................................................................................. 40
7.4.6. 6.2 Equipment required ..................................................................................................................... 40
7.4.7. 6.3 Calibration procedure ................................................................................................................. 40
7.5. SETTING BCIAVG PARAMETERS .................................................................................................................. 42
7.6. SETTING BCIMAP# PARAMETERS ................................................................................................................ 42
7.6.1. Scope .................................................................................................................................................. 42
7.6.2. Procedure .......................................................................................................................................... 42
7.6.3. Choose the BCIMAP# index .............................................................................................................. 42
7.6.4. Set the desired CI charge current for the designated charger. .......................................................... 43
7.6.5. Charge empty battery in constant current with target <ci_chgireg>. ............................................... 43
7.6.6. Note the first Vbat(mA) that occurred after the charge stopped and went to 3(SUP). ....................... 44
7.6.7. Calculate the BCIMAP# values for the parameters above the index. ................................................ 45
7.6.8. Discharge the battery, determine the remaining BCIPCT# parameters. ........................................... 45
7.7. SETTING BCIBAT# PARAMETERS ................................................................................................................ 47
7.7.1. Procedure to set the battery ID .......................................................................................................... 47
7.8. SETTING BCITMP# PARAMETERS ................................................................................................................ 47
7.8.1. Scope .................................................................................................................................................. 47
7.8.2. Equipment required ........................................................................................................................... 48
7.8.3. Procedure .......................................................................................................................................... 48
7.9. SETTING BCIDEL PARAMETERS................................................................................................................... 49
7.10. SETTING BCIOFF PARAMETERS ............................................................................................................... 49
7.11. BATTERY CHARGING CALIBRATION AND CONFIGURATION - APPENDIX 1 ................................................ 50
7.12. BCI COMMAND PARAMETERS - APPENDIX 2 ............................................................................................ 52
7.13. SET BCI PARAMETERS FOR AN ACTIVEKEY2 - APPENDIX 3 ..................................................................... 54
8.GPS PERFORMANCE ..................................................................................................................................... 56
9.GSM/GPRS MODES OF OPERATION ......................................................................................................... 57
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9.1. ENABLING THE TRANSMISSION MODES FOR THE GSM/GPRS SERVICES ..................................................... 57
9.2. VOICE COMMUNICATION .............................................................................................................................. 57
9.3. SMS: SHORT MESSAGE SERVICES ................................................................................................................ 58
9.4. SIM OPERATION ........................................................................................................................................... 58
9.4.1. Provisioning the SIM ......................................................................................................................... 58
9.5. GPRS SERVICES SUPPORTED BY THE ENFORA ENABLER LPP G MODULE ................................................... 58
9.6. SELECTING THE GSM MODES OF OPERATION .............................................................................................. 59
10. SOFTWARE INTERFACE .......................................................................................................................... 60
10.1. SOFTWARE INTERFACE ............................................................................................................................. 60
10.2. FORMAT FOR THE AT COMMANDS ........................................................................................................... 60
10.3. ENFORA AT COMMAND SET ..................................................................................................................... 60
11. INTEGRATION AND TESTING ................................................................................................................ 61
12. APPENDIX A - LIMITED WARRANTY ................................................................................................... 62
12.1. SCOPE ....................................................................................................................................................... 62
12.2. HARDWARE .............................................................................................................................................. 62
12.3. SOFTWARE ................................................................................................................................................ 62
12.4. OTHER CONSIDERATIONS ......................................................................................................................... 63
13. APPENDIX B - REGULATIONS AND COMPLIANCE .......................................................................... 64
13.1. GCF/PTCRB APPROVAL (FORMERLY FTA) ............................................................................................ 64
13.2. ELECTROMAGNETIC COMPATIBILITY (EMC) AND SAFETY REQUIREMENTS ............................................. 64
13.3. EMC/SAFETY REQUIREMENTS FOR THE USA .......................................................................................... 64
13.4. HUMAN EXPOSURE COMPLIANCE STATEMENT ......................................................................................... 65
13.5. COMPLIANCE WITH FCC REGULATIONS ................................................................................................... 65
13.6. UNINTENTIONAL RADIATORS, PART 15 .................................................................................................... 66
13.7. INTENTIONAL RADIATORS, PART 22 & 24 ................................................................................................ 66
13.8. INSTRUCTIONS TO THE ORIGINAL EQUIPMENT MANUFACTURER (OEM) .................................................. 67
13.8.1. OEM Responsibilities for All Products Containing the Enabler LPP G module ............................... 69
13.8.2. Specific OEM Responsibilities for Portable Products and Applications ........................................... 70
13.8.3. Specific OEM Responsibilities for Mobile Products and Applications .............................................. 70
13.8.4. Specific OEM Responsibilities for Fixed Products and Applications ................................................ 70
13.9. EMC/SAFETY REQUIREMENTS FOR THE COUNTRIES OF THE EUROPEAN UNION (EU) .............................. 71
13.10. EMC/SAFETY REQUIREMENTS FOR OTHER COUNTRIES ........................................................................... 71
14. APPENDIX C - GLOSSARY AND ACRONYMS ...................................................................................... 72
15. APPENDIX D – TABLES AND FIGURES ................................................................................................. 74
16. APPENDIX E - CONTACTING ENFORA................................................................................................. 75
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1. Safety Precautions
1.1. Important Safety Information
The following information applies to the devices described in this manual. Always observe all standard and accepted safety precautions and guidelines when handling any electrical device.
Save this manual: it contains important safety information and operating instructions.
Do not expose the Enfora Enabler LPP G product to open flames.
Ensure that liquids do not spill onto the devices.
Do not attempt to disassemble the product: Doing so will void the warranty. With the
exception of the Subscriber Identification Module (SIM), this product does not contain consumer-serviceable components.
2. Regulatory Compliance FCC
2.1. Integration Considerations and Installation Requirements
The Enabler LPP G module is designed for use in a variety of host units, "enabling" the host platform to perform wireless data communications. However, there are certain criteria relative to integrating the Enabler LPP G module into a host platform such as a PC, laptop, handheld or PocketPC compliance with FCC compliance requirements.
Operation is subject to the following two conditions: (1) this device may not cause
In order to use the Enabler LPP G module without additional FCC certification approvals, the
®
, monitor and control unit, etc. that must be considered to ensure continued
interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
installation must meet the following conditions:
Maximum RF output power and antenna gain to meet Maximum Permissible Exposure Requirements: GSM850 mode: Power at antenna port is +33 dBm. The maximum gain is 1.4 dBi. GSM1900 mode: Power at antenna port is 30 dBm. The maximum gain is 7 dBi in order to meet the requirements of maximum 2 watts EIRP for mobile transmitters. If RF power and/or antenna gain is desired, a separate FCC certification is required.
If used in a "portable" application such as a handheld or body worn device with the
antenna less than 20 cm (7.9 in.) from the human body when the device is operating, then the integrator is responsible for passing additional "as installed" testing and the device will require its own FCC ID:
SAR (Specific Absorption Rate) testing, with results submitted to the FCC for
approval prior to selling the integrated unit. If unable to meet SAR requirements, then the host unit must be restricted to "mobile" use (see below).
Unintentional emissions, FCC Part 15; results do not have to be submitted to the
FCC unless requested, although the test provides substantiation for required labeling (see below).
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ERP and EIRP measurements for FCC Parts 22 and 24, alternatively a full retest on
FCC Parts 22 and 24 can be performed.
If used in a "mobile" application where the antenna is normally separated at least 20 cm
(7.9 in) from the human body during device operation, then an appropriate warning label must be placed on the host unit adjacent to the antenna. The label should contain a statement such as the following:
WARNING
RF exposure. Keep at least 20 cm
(7.9 in) separation distance from
the antenna and the human body.
Host unit user manuals and other documentation must also include appropriate caution
and warning statements and information.
If the FCCID for the Enabler LPP G module is not visible when installed in the host
platform, then a permanently attached or marked label must be displayed on the host unit referring to the enclosed module.
For example, the label should contain wording such as:
Contains GSM/GPRS modem transmitter module
FCC ID: MIVLPP0108
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2)
This device must accept any interference received,
including interference that may cause undesired
operation.
OR
Contains FCC ID: MIVLPP0108
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2)
This device must accept any interference received,
including interference that may cause undesired
operation.
Any antenna used with the Enabler LPP G module must be approved by the FCC or as a
Class II Permissive Change (including MPEL or SAR data as applicable). The "professional installation" provision of FCC Part 15.203 does not apply.
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2.2. Disclaimer
The information and instructions contained within this publication comply with all FCC, GCF, PTCRB, R&TTE, IMEI and other applicable codes that are in effect at the time of publication. Enfora disclaims all responsibility for any act or omissions, or for breach of law, code or regulation, including local or state codes, performed by a third party.
Enfora strongly recommends that all installations, hookups, transmissions, etc., be performed by persons who are experienced in the fields of radio frequency technologies. Enfora acknowledges that the installation, setup and transmission guidelines contained within this publication are guidelines, and that each installation may have variables outside of the guidelines contained herein. Said variables must be taken into consideration when installing or using the product, and Enfora shall not be responsible for installations or transmissions that fall outside of the parameters set forth in this publication.
Enfora shall not be liable for consequential or incidental damages, injury to any person or property, anticipated or lost profits, loss of time, or other losses incurred by Customer or any third party in connection with the installation of the Products or Customer's failure to comply with the information and instructions contained herein.
The transmitter and antenna must not be co-located or operating in conjunction with any
other antenna or transmitter. Violation of this would allow a user to plug another transmitter in to the product and potentially create an RF exposure condition.
WARNING
The transmitter and antenna must not be collocated
or operating in conjunction with any
other antenna or transmitter. Failure to observe
this warning could produce an RF exposure
condition.
The Enabler LPP G platform is designed with features to support a robust connection. There are instances where the module performance is beyond the control of the intended design. Integrated designs that require 24 by 7 operation must implement power control via an external circuit or by implementing power management as specified within this design guide.
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3. Manual Overview
This document describes the available hardware interface of the Enabler LPP G module. The purpose of this document is to define the electrical, mechanical and software interfaces while providing detailed technical information in order to streamline the process of hardware and system integration.
3.1. Revision History
Date Rev Author Description
06/20/08 1.00 Chuck Todd Preliminary
LPP0108IG001 4 Version - Preliminary – 06/20/08
3.2. References
3.2.1. Enfora Enabler LPP G Product Documentation
Manuals
LPP0108AT001 - Enfora Enabler LPP G AT Command Set Reference  GSM0308UG001 - Enfora GSM-GPRS Family API Reference  LPP0108PR001 – Enfora Enabler LPP G Programming Reference  LPP0108SD001 – Enfora Enabler LPP G SDK Reference  LPP0108UG001 – Enfora Enabler LPP G Power Management Developer Tool Guide
3.2.2. GSM Device Specifications
3GPP TS 51010-1 (850, 900,1800,1900 MHz devices)
To view the latest release, go to: http://www.3gpp.org/ftp/Specs/html-info/51010-1.htm
3.2.3. US Government
3.2.4. Federal Communications Commission (FCC)
Internet: http://www.fcc.gov/
FCC Rules, Part 24
47 CFR Subpart E--Broadband PCS 47 CFR § 24.52, sections 1.1307(b), 2.1091, and 2.1093
FCC Rules, Part 22 for GSM 850
FCC Rules, Part 15
FCC Rules, Part 2
Subpart J--Equipment Authorization Procedures Section 2.925
3.2.5. FCC Office of Engineering and Techn ology (OET)
Internet: http://www.fcc.gov.oet/
Bulletin Number 65 "Evaluating Compliance with FCC Guidelines for Human Exposure
to Radio Frequency Electromagnetic Fields"
Supplement C "Additional Information for Evaluating Compliance of Mobile and
Portable Devices with FCC Limits for Exposure to Radio Frequency Emissions"
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3.2.6. Industry Canada
RSS-132 RSS-133 ICES-003
3.2.7. Environmental Regulations
National Environmental Policy Act (NEPA) of 1969 (Part 1, Subpart 1)  RoHS Compiant
3.2.8. Mechanical Specifications
 ASTM D999  ASTM D775  IEC 68-2-27  Bellcore Gr-63-CORE  ETS 300 019-1-1 Class 1.2  ETS 300 019-1-2 Class 2.1  ETS 300 019-1-3 Class 3.1
3.2.9. RF and EMI Specifications
ETSI Standards EN 61000-4-6 EN 61000-4-3 3GPP TS 51.010-1, Section 12.2
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4. Introduction
4.1. Product Overview
4.2. Key Features of the Enabler LPP G Module
The Enfora Enabler LPP G module is a compact, wireless OEM module that utilizes the Global System for Mobile Communications (GSM) and General Packet Radio Services (GPRS) international communications standard to provide two-way wireless capabilities via GSM services. This GSM/GPRS module is combined with a Global Positioning System (GPS) chipset to provide physical location, a host processor to ensure very low power standby configurations, and vibration sensor to detect movement of the module. The Enfora Enabler LPP G module is a fully Type-approved GSM/GPRS device, enabling application-specific, two-way communication and control.
The small size of the Enfora Enabler LPP G module allows it to be integrated easily into the application and packaging.
The following table summarizes the main features of the Enfora Enabler LPP G Radio Module.
Interface
Power
Radio Features
Regulatory
GSM/GPRS Functionality
Data input/output interface 50 position 1.27mm pitch Primary serial port 3.3V levels, ‘2-wire’ UART implementation Secondary serial Port Single TX from GPS, NMEA data only. USB port USB Debug and Configuration Audio Digital audio Command protocol Enfora Packet API, GSM AT command set, Enfora
Subscriber Identification Module (SIM) Battery Charger Lithium Ion battery charger, temperature and
Electrical power 3.3 to 4.5 Vdc (vbat) Peak currents and average
power dissipation
Frequency bands EGSM 900, GSM1800, GSM 850 and GSM 1900
GSM/GPRS features supported Provides for all GSM/GPRS authentication,
Agency approvals
Mobile-originated and mobile-terminated SMS messages: up to 140 bytes or
up to 160 GSM 7-bit ASCII characters.
Reception of Cell Broadcast Message  SMS Receipt acknowledgement  Voice (EFR, FR, HR, AMR)  Supports Unstructured Supplementary Service Data (USSD)  Multi-Slot Class 10 Supported (4Rx/2TX), (5 Slot Max) PBCCH/PCCCH
Supported
MCP USIM port with SIM detect, Optional embedded SIM.
battery ID analog inputs
Refer to the Operating Power table in the Technical Specifications for peak currents and average power dissipation for various modes of operation.
capability.
encryption, and frequency hopping algorithms. GPRS Coding Schemes CS1-CS4 supported. Multi-Slot Class 10 (4RX/2TX, Max 5 Slots).
GCF Type Approval
 PTCRB Type Approval  FCC Certification  RTTE  CE (European Community Certification)  IC (Industry Canada) Approval
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Audio Features
Outputs SIM
Software
Handset Microphone biasing, internal  Handset microphone input (MICIN, MICIP pins)
Handset earphone outputs (EARP, EARN pins)
1.8/3 V Mini-Subscriber Identity Module (SIM) compatible
Free RTOS included
Table 1 - Enabler LPP G Key Features
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4.3. Providing Multi-Band Operation
The Enfora Enabler LPP G module provides 4 frequency bands for compatibility with worldwide frequency standards. 850/1900 frequency bands are primarily used in North and South America, while 900/1800 bands are used throughout the world. The Enabler LPP G offers all four bands for use worldwide.
4.4. Summary of Features for the Enabler LPP G Module
The following summarizes the main features of the Enfora Enabler LPP G Module.
Mechanical
Dimensions ................................... 38.5 mm x 33.6 mm x 4.19 mm
Weight .......................................... 8.6g
Packet Data Transfer:
Protocol……………………………………………GPRS Release 97 Coding Schemes…………………………………CS1-CS4 Multi-Slot Capability:
Packet Channel Support .............. ……………..PBCCH/PCCCH
Short Message Services:
(Demonstrated @MS10)…….MS10 (4RX/2TX) (Max 5 Slots)
GSM SMS .................................... MO, MT, CB, Text and PDU Modes
GPRS SMS .................................. MO, MT, CB, Text and PDU Modes
Voice Capability:
Speech Codec .............................. EFR, FR, HR, AMR
GSM/GPRS Radio Performance Multi-Band:
LPP0108 Radio Frequencies ....... 850 MHz, 900 MHz, 1800 MHz, and 1900 MHz
Sensitivity ..................................... <-106 dBm (Typical GPRS CS1)
850 & 900 MHz Transmit Power .. Class 4 (2 W)
1800 & 1900 MHz Transmit ......... PowerClass 1 (1 W)
System Requirements:
Host Interface ............................... Serial Interface
DC Voltage ................................... 3.3 to 4.5 Vdc
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Application Interface:
Host Protocol ................................ MCP Protocol, AT Commands, OTA Enfora Packet API and
USB.
Internal Protocols ......................... UDP stack and TCP/IP stack
Physical Interface ......................... 2 serial (primary - Default rate 115,200 baud; secondary -
rate 19,200 baud), 1 USB (debug)
Audio Interface .............................. Handset microphone input (MICIN, MICIP pins), Handset
earphone outputs (EARP, EARN pins).
SIM Interface:
Remote SIM…………………………1.8/3-Volt SIM Capability
Environmental:
Compliant Operating Temp. ......... -20 °C to 60 °C (Fully GSM Spec Compliant)
Operating Temperature ………….-30 °C to 70 °C (Not fully GSM Spec Compliant)
Storage Temperature ................... -40 °C to 85 °C
Humidity ....................................... 5 to 95% non-condensing
EMC:
Emissions ..................................... FCC Parts 15,22 & 24, Class B
3GPP TS 51010-1, Section 12.2 EN 55022 Class B
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A
Operating Power (TYPICAL):
NOTE: UART disabled during testing; data average taken for 5 minutes; Vbat = 3.7V.
Function
Block
State
Min
Current
verage
Current
Peak
Current
MSP
Idle
3.3V TBD <2.5uA 25uA
GSM only
Idle
GPS only
Acquisition
Tracking
Motion sensor on (no movement)
Motion sensor with movement
Power on to modem register
GPS enable to first 3D fix ­130dbm (~45sec)
(@ -155dbm)
2.2V TBD <2uA 22uA
2.2V TBD <7uA 40uA
3.3V TBD 3.5uA 21.5uA
2.2V TBD 14uA 2250uA
3.3V TBD 25.5uA 3750uA
TBD TBD TBD
TBD TBD TBD
TBD 56.6mA 247.5mA
TBD 76mA 80mA
TBD 72mA 78mA
GSM &
GPS
Acquisition
Tracking
Shutdown
TBD TBD TBD
TBD TBD TBD
TBD TBD TBD
Table 2: Typical Operating Power
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GSM Transmit Power
1800/1900 MHz ............................ GSM Power Class 1 (30 dBm 2 dB @ antenna connection)
850/900 MHz ................................ GSM Power Class 4 (33 dBm 2 dB @ antenna connection)
GSM/GPRS Receiver Sensitivity (Typical)
1800/1900 MHz ............................ <-106 dBm, GPRS Coding Scheme 1 (CS1)
850/900 MHz ................................ <-106 dBm, GPRS Coding Scheme 1 (CS1)
4.5. General design guidelines for utilizing Enfora GSM modules
The following guidelines are provided in an effort to allow Enabler LPP G module users to successfully implement their PCB layout to obtain the best performance. This includes the lowest possible EMI emissions, maximum thermal conduction, mechanical integrity, and voice quality. The Enabler LPP G module is a very compact, high performance design, yet it is easy to interface into the final product. In order to realize its full potential, designers should pay close attention to ground structures, the routing of RF and Digital traces, and the size of the power supply lines.
These design tips are strictly guidelines and are not meant to be a complete list of items that guarantee actual performance. Each application is different and may require variation from these guidelines; however, care should be given to utilize these sound engineering principles whenever possible.
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4.5.1. Advanced tips for an RF friendly layout
4.5.1.1. Ground Plane
To ensure the lowest possible EMI emissions and maximum thermal conductivity, it is recommended that all metal tabs on the GSM module shield must be soldered down onto a continuous ground plane that runs under the entire module. Ample ground vias should be provided to create a low impedance ground. It is recommended to minimize the number of I/O and power traces under the GSM module to allow for as much ground plane as possible. An example of a good ground structure and pad layout is shown below in Figure 1 - Example of good ground plane for GSM modules.
Figure 1 - Example of good ground plane for GSM modules
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4.5.1.2. Thermal Relief
Because the ground plane acts as a large heat sink, it can affect the solderability of components. A common method to reduce this effect is to use thermal relief around the pad in question. However, great care must be taken when using thermal relief for high current or high frequency applications
For example, a large thermal relief like the one shown in Figure 2 can serve the purpose for general applications such as low current, low speed data lines, DC connections and audio frequency applications. However, such thermal relief structures should be avoided for applications where high current and/or high frequency is involved, such as those using the Enabler Module. Depending on the frequency of operation, the long narrow thermal relief traces between the pad and the ground plane act like an RF choke. These RF chokes become higher impedance at harmonics of the fundamental frequency making it problematic for high frequency suppression. This can make it difficult to pass type approval testing.
POOR RF thermal relief
Figure 2 - Example of a POOR RF Thermal Relief
If thermal relief is necessary, it is recommended that you use short, fat traces similar to those shown in Figure 3. This will still provide a solderable connection, while providing a better RF connection. Making them shorter also allows for a more continuous ground plane due to less copper being removed from the area. It is also recommended to have ground vias around all thermal relief of critical ground pins.
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GOOD RF thermal relief
Figure 3 - Example of a GOOD RF Thermal Relief
4.5.1.3. Antenna and RF Signal Trace
The PCB trace that feeds the RF output port must be designed for a 50 ohm characteristic impedance, coplanar, or routed into internal layers to keep the top layer continuous around and underneath the Enabler module. Ample ground vias should be provided around the RF contacts, the RF trace and launch pad. If possible, keep I/O and power traces away from the RF port. This includes traces running parallel or orthogonal to it. Thermal relief should not be used on the antenna output port ground pads. The designer must pay close attention to the size of the pad and thickness of the dielectric beneath the signal pad and trace. Most PCB manufacturers can adjust the trace width to maintain 50 ohms impedance if the traces are identified and instructions are included on the FAB drawing. This service is typically provided at no or minimal additional cost.
For minimum RF emissions due to the fundamental frequency of operation, the Enabler module works best with an antenna load that has a VSWR of 1.5:1 or better. The antenna should not have gain at the harmonic frequencies, otherwise, the conducted harmonics could get amplified to a point where the product no longer passes type approval. However, for applications where antenna quality is less than ideal, it is recommended to have a low pass filter (Pi structure with N=3) in the RF path to the antenna. This is a secondary plan should there be a need to lower harmonic levels at frequencies above the PCS band. The pad structure may also be used to match the antenna load impedance, if required. If it is not needed, a capacitor of low reactance may be used to bridge the Pi structure.
The RF cable going between the Enable module and the antenna is very lossy, therefore, the length of this cable should be kept as short as possible.
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4.5.1.4. Vbat Input
The Enabler Vbat input can have a relative high current draw that can fluctuate rapidly, especially when transmitting at max power and burst mode. The Vbat interface must be designed to provide the required instantaneous voltage and current with minimal voltage droop. This includes both sufficient bulk decoupling capacitance as well as adequate layout provisions.
Similar to the discussion on thermal relief, the use of narrow traces to connect the Vbat pins to the source voltage can act like a high impedance and cause a significant voltage droop when higher currents are required as shown in Figure 4. If the Vbat drops too low, the Enabler modules will reset. To minimize the trace loss, it is suggested to use a larger trace that spans several pins. The layout should provide sufficient trace width over the entire trace from the Enabler module all the way to the source of the Vbat voltage. Any transitions between layers for this trace should utilize multiple vias.
Figure 4 - Example of Vbat Voltage Droop
Two 470 uF, low ESR, tantalum capacitors are included in the design to provide decoupling of Vbat input voltage. Bulk decoupling capacitance is not required at the Vbat input external to the Enabler module.
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4.5.2. Audio Reference Design
The audio quality is very dependent on the circuit design and layout. As an aid to obtaining good audio quality, a reference design has been included below. It has been proven to provide good performance on the SDK module.
4.5.2.1. Audio Schematics
Figure 5 - Audio Reference Design Schematic
4.5.2.2. Audio Layout
Layout plots for the audio section of the SDK are available upon request.
4.6. Handling and Soldering Guidelines
The guidelines presented in IPC/JEDEC J-STD-020C for handling, preparation, and reflow of lead-free devices should be applied to the Enabler LPP G module. Care should be taken to minimize module moisture exposure before reflow. The module is classified as a Type 3 MSL (moisture sensitivity level).
Additional information forthcoming
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5. Technical Specifications
5.1. Enabler LPP G Module Block Diagram
LPP0108 Module
MSP430
16.368 MHz TCXO
Locosto/Triton Lite
Motion Sensor
GPS
TI 5350
(I2C mode)
Power Regulation
VIO
Serial Host Interface
Reset
GPS Antenna
50 pin edge connector
GSM Antenna
Enfora
debug
SIM
interface
Handset Audio
Figure 6 - Enabler LPP G Module Block Diagram
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Battery
2
5.2. Detailed Product Specifications
Physical Dimensions and Weight
Size (L x W x H) 38.5 mm x 33.6 mm x 4.19 mm
Weight < 8.6 grams
Climatic: Operational
GSM Compliant temperature Operating temperature
-20°C to +60°C
-30°C to +70°C
Relative humidity
5 - 95%
Air pressure (altitude) 70 kPa to 106 kPa (-400 m to 3000 m)
Climatic: Storage and Transportation
Duration 24 months Ambient temperature -40°C to +85°C Relative humidity
5% to 95%, non condensing (at 4C) Thermal shock -50°C to +23°C, +70°C to +23°C; < 5 min Altitude -400 m to 15,000 m
Mechanical: Operational
Operational vibration, sinusoidal 3.0 mm disp, 2 to 9 Hz; 1 m/s
, 9 to 350 Hz
Operational vibration, random 0.1 m2 /s3 , 2 to 200 Hz
Mechanical: Storage and Transportation
Transportation vibration, packaged ASTM D999 Drop, packaged ASTM D775 method A, 10 drops Shock, un-packaged 150 m/s2 , 11 ms, half-sine per IEC 68-2-27 Drop, un-packaged 4-inch drop per Bellcore GR-63-CORE
Mechanical: Proposed Standards
Transportation ETSI Standard ETS 300 019-1-2 Class 2.3
Transportation Operational ETSI Standard ETS 300 019-1-3 Class 3.1
Operational Storage ETSI Standard ETS 300 019-1-1 Class 1.2
Storage
Electromagnetic Emissions
Radiated spurious FCC Part 22 & 24 / Part 15 Class \ B
3GPP TS 51.010-1 Section 12.2
EN 55022 Class B
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