Novatel Wireless GSM0408 Operators Guide
Integration Guide:
GSM0408IG001
Enfora Enabler IIIG BGA
Integration Guide
Version: Draft
Enfora Enabler IIIG BGA
Modem Integration Guide
Document Title: Enfora Enabler IIIG BGA Modem Integration Guide
Version: 1.0x
Date: 3/3/08
Status: Draft
Document Control ID: GSM0408IG001
General
All efforts have been made to ensure the accuracy of material provided in this document at the time
of release. However, the items described in this document are subject to continuous development
and improvement. All specifications are subject to change without notice and do not represent a
commitment on the part of Enfora, Inc. Enfora, Inc. will not be responsible for any loss or damages
incurred related to the use of information contained in this document.
This product is not intended for use in life support appliances, devices or systems where a
malfunction of the product can reasonably be expected to result in personal injury. Enfora, Inc.
customers using, integrating, and/or selling this product for use in such applications do so at their
own risk and agree to fully indemnify Enfora, Inc. for any damages resulting from illegal use or resale.
Copyright
Complying with all applicable copyright laws is the responsibility of the user. Without limiting the
rights under copyright, no part of this document may be reproduced, stored in or introduced into a
retrieval system, or transmitted in any form or by any means (electronic, mechanical, photocopying,
recording or otherwise), or for any purpose, without the express written permission of Enfora, Inc.
Enfora may have patents, patent applications, trademarks, copyrights or other intellectual property
rights covering subject matter in this document. Except as expressly provided in any written license
agreement from Enfora, the furnishing of this document does not give you any license to these
patents, trademarks, copyrights or other intellectual property.
©2002, 2003, 2004, 2005, 2006, 2007, 2008 Enfora, Inc. All rights reserved.
Enabler and Spider are either registered trademarks or trademarks of Enfora, Inc. in the United
States.
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Modem Integration Guide
Table of Contents
1. ..................................................................................................................1 SAFETY PRECAUTIONS
1.1. ..................................................................................................... 1 IMPORTANT SAFETY INFORMATION
2. ................................................................................................1 REGULATORY COMPLIANCE FCC
2.1. ................................................... 1 INTEGRATION CONSIDERATIONS AND INSTALLATION REQUIREMENTS
2.2. ......................................................................................................................................3 DISCLAIMER
3. .......................................................................................................................4 MANUAL OVERVIEW
3.1. ........................................................................................................................... 4 REVISION HISTORY
3.2. .................................................................................................................. 5 REFERENCE DOCUMENTS
3.2.1. ..................................................................5 Enfora Enabler IIIG BGA Product Documentation
3.2.2. .....................................................................................................6 GSM Device Specifications
3.2.3. .......................................................................................................................6 US Government
................................................................................6 3.2.3.1. Federal Communications Commission (FCC)
........................................................................6 3.2.3.2. FCC Office of Engineering and Technology (OET)
3.2.4. ......................................................................................................................6 Industry Canada
3.2.5. .....................................................................................................6 Environmental Regulations
3.2.6. .......................................................................................................7 Mechanical Specifications
3.2.7. ......................................................................................................7 RF and EMI Specifications
3.2.8. ..........................................................................................................7 Joint Industry Standards
4. ................................................................................................................................8 INTRODUCTION
4.1. ........................................................................................................................ 8 PRODUCT OVERVIEW
4.2. ......................................................................... 8 KEY FEATURES OF THE ENABLER IIIG BGA MODULE
4.3. ...............................................................................................10 PROVIDING MULTI-BAND OPERATION
4.4. ...................................................................................10 WIRELESS DATA APPLICATION POSSIBILITIES
4.5. .......................................................11 SUMMARY OF FEATURES FOR THE ENABLER IIIG BGA MODULE
4.6. ........................................................................... 13 LAYOUT GUIDELINES FOR THE ENABLER IIIG BGA
4.6.1. ..............................................................................................................................13 Placement
4.6.2. ........................................................................................................................14 Ground Plane
4.6.3. .......................................................................................................................15 Thermal Relief
4.6.4. ...............................................................................................15 Antenna and RF Signal Trace
4.6.5. ..............................................................................................................................16 Vbat Input
4.6.6. .........................................................................................................16 I/O Routing and Fanout
4.6.7. .......................................................................................................18 Audio Reference Design
..........................................................................................................................18 4.6.7.1. Audio Schematic
................................................................................................................................19 4.6.7.2. Audio Layout
4.7. ..................................................................................20 BGA HANDLING AND SOLDERING GUIDELINES
5. .....................................................................................................21 TECHNICAL SPECIFICATIONS
5.1. .................................................................................21 ENABLER IIIG BGA MODULE BLOCK DIAGRAM
5.2. ..............................................................................................22 DETAILED PRODUCT SPECIFICATIONS
5.3. ........................................................................................................................23 OPERATING POWER
5.3.1. .............................................................................................................23 Typical Input Current
5.3.2. ............................................................................................................23 GSM Transmit Power
5.3.3. ......................................................................................................24 GSM Receiver Sensitivity
5.4. ....................................................................................................................24 PHYSICAL INTERFACES
5.4.1. ...................................................................................................................................24 Module
5.4.2. ...............................................................................................................24 Host PCB Footprint
5.5. .............................................................................................................25 ELECTRICAL CONNECTIONS
5.5.1. ...............................................................................................................................30 BGA Map
5.6. .....................................................................................................................31 CIRCUIT PROTECTION
5.7. ...................................................................................32 PAD SIGNAL DESCRIPTIONS AND FUNCTIONS
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5.7.1. .....................................................................32 Module Power (Pads C1, C2, D1, D2, E1, E2)
5.7.2. ..................................................................................................................33 Antenna (Pad A1)
5.7.3. .................................................................33 Reset Signal (Pad F6, also known as ON_\OFF)
5.7.4. ...................................................................................34 Power Control (Pad K9) (PWR_CTL)
5.7.5. ......................................................................37 Level Translation Reference Power (Pad G5)
5.7.6. ....................................................................................................37 USB (Pads J2, J3, K1, K2)
5.7.7. ...............................................................................37 General Purpose Input/Output Interface
5.7.8. .............................................................................................................................39 RTC Sleep
5.7.9. ......................................................................................................................40 Serial Interface
5.7.10. .................................41 MCSI – Multi-Channel Serial Interface (Pads D13, D14, E13, E14)
5.7.11. .................................................................................................42 VBACKUP Input (Pad G6)
5.7.12. ...................................................................................................43 32 kHz output (Pad A11)
5.7.13. .......................................................................................43 Analog-To-Digital Input (Pad K3)
5.7.14. .........................................................................43 Handset Microphone Input (Pads K4, L4)
5.7.15. .......................................................................44 Handset Microphone Bias Output (Pad J4)
5.7.16. ..........................................................................44 Handset Speaker Output (Pads M4, M5)
5.7.17. .................................................................................45 Headset Microphone Input (Pad M2)
5.7.18. .......................................................................45 Headset Microphone Bias Output (Pad J5)
5.7.19. .......................................................46 Headset Speaker Output Left & Right (Pads M3, L3)
5.7.20. ........................................................................46 Headset Output Common Mode (Pad M6)
5.7.21. ...................................................................................................47 Headset Detect (Pad H4)
5.7.22. ..............................47 Remote Subscriber Identity Module (SIM) (Pads A7, A9, B7, B8, H5)
...........................................................................................49 5.7.22.1. Remote SIM Component Information
6. ...........................................................................................50 GSM/GPRS MODES OF OPERATION
6.1. ...........................................50 ENABLING THE TRANSMISSION MODES FOR THE GSM/GPRS SERVICES
6.2. ..................................................................................................................50 VOICE COMMUNICATION
6.3. ...............................................................................................................50 CIRCUIT-SWITCHED DATA
6.4. ..................................................................................................51 SMS: SHORT MESSAGE SERVICES
7. .............................................................................................................................52 SIM OPERATION
7.1. ..................................................................................................................52 PROVISIONING THE SIM
7.2. ...................................................52 GSM SERVICES SUPPORTED BY THE ENABLER IIIG BGA MODULE
7.3. .................................................52 GPRS SERVICES SUPPORTED BY THE ENABLER IIIG BGA MODULE
7.4. ..................................................................................52 SELECTING THE GSM MODES OF OPERATION
8. ...............................................................................................................54 SOFTWARE INTERFACE
8.1. ....................................................................................................................54 SOFTWARE INTERFACE
8.2. ............................................................................................................55 ENFORA AT COMMAND SET
8.3. ...............................................................55 ENFORA PACKET APPLICATION PROGRAMMING INTERFACE
8.3.1. API Architecture.....................................................................................................................55
8.4. ...............................................................................................................55 SETUP AND INITIALIZATION
8.4.1. .......................................................................................................................55 General Setup
8.4.2. ...........................................55 HyperTerminal Configuration for the Enabler IIIG BGA module
8.4.3. ...................................................................................56 Initialization (AT Command Interface)
8.4.4. ...................................................................................57 Initial Response to the AT Command
8.4.5. ..........................................57 Sending an Initialization String to the Enabler IIIG BGA Module
8.4.6. ..............................58 Setting Up the Communication Mode for the Enabler IIIG BGA Module
8.4.7. ...........................................................58 Querying the Status of the Enabler IIIG BGA Module
8.4.8. .................................................58 Setting Module Reporting Parameters for GSM and GPRS
8.5. ....................................................................................................................58 GSM/SMS EXAMPLES
8.5.1. .............58 Initialize the Enabler IIIG BGA Module to Send and Receive SMS Text Messages
8.5.2. ....................................................................................................58 Managing SMS Messages
8.5.3. .........................................................................................................58 Data Call Configuration
8.5.4. ........................................................................................................58 Voice Call Configuration
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8.6. ..............................................................................................................58 GPRS PACKET EXAMPLES
8.6.1. ...........................................................................................58 GPRS ATTACH and ACTIVATE
8.6.2. .............................................................................................................59 Windows PPP Setup
9. .......................................................................................................60 INTEGRATION AND TESTING
9.1. ..................................................................60 INTEGRATING THE ENFORA ENABLER IIIG BGA MODULE
10. ...........................................................................................62 APPENDIX A - LIMITED WARRANTY
10.1. ........................................................................................................................................62 SCOPE
10.2. .................................................................................................................................62 HARDWARE
10.3. .................................................................................................................................62 SOFTWARE
10.4. ............................................................................................................63 OTHER CONSIDERATIONS
11. ....................................................................64 APPENDIX B - REGULATIONS AND COMPLIANCE
11.1. .................................................................................64 GCF/PTCRB APPROVAL (FORMERLY FTA)
11.2. ......................................64 ELECTROMAGNETIC COMPATIBILITY (EMC) AND SAFETY REQUIREMENTS
11.3. ...............................................................................64 EMC/SAFETY REQUIREMENTS FOR THE USA
11.4. ..............................................................................65 HUMAN EXPOSURE COMPLIANCE STATEMENT
11.5. ........................................................................................65 COMPLIANCE WITH FCC REGULATIONS
11.6. .........................................................................................65 UNINTENTIONAL RADIATORS, PART 15
11.7. .....................................................................................66 INTENTIONAL RADIATORS, PART 22 & 24
11.8. ..........................................66 INSTRUCTIONS TO THE ORIGINAL EQUIPMENT MANUFACTURER (OEM)
11.8.1. .............67 OEM Responsibilities for All Products Containing the Enabler IIIG BGA module
11.8.2. ............................69 Specific OEM Responsibilities for Portable Products and Applications
11.8.3. ...............................69 Specific OEM Responsibilities for Mobile Products and Applications
11.8.4. .................................69 Specific OEM Responsibilities for Fixed Products and Applications
11.9. .....................70 EMC/SAFETY REQUIREMENTS FOR THE COUNTRIES OF THE EUROPEAN UNION (EU)
11.10. ................................................................70 EMC/SAFETY REQUIREMENTS FOR OTHER COUNTRIES
12. .............................................................................71 APPENDIX C - GLOSSARY AND ACRONYMS
13. .......................................................................................73 APPENDIX D – TABLES AND FIGURES
14. ........................................................................................74 APPENDIX E - CONTACTING ENFORA
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Modem Integration Guide
1. Safety Precautions
1.1. Important Safety Information
The following information applies to the devices described in this manual. Always observe all
standard and accepted safety precautions and guidelines when handling any electrical device.
• Save this manual: it contains important safety information and operating instructions.
• Do not expose the Enfora Enabler IIIG BGA product to open flames.
• Ensure that liquids do not spill onto the device.
• Do not attempt to disassemble the product: Doing so will void the warranty. This product
does not contain consumer-serviceable components.
2. Regulatory Compliance FCC
2.1. Integration Considerations and Installation Requirements
The Enabler IIIG BGA modem is designed for use in a variety of host units, "enabling" the host
platform to perform wireless data communications. However, there are certain criteria relative to
integrating the modem into a host platform such as a PC, laptop, handheld or PocketPC
and control unit, etc. that must be considered to ensure continued compliance with FCC
compliance requirements.
• Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
In order to use the Enabler IIIG BGA modem without additional FCC certification approvals, the
installation must meet the following conditions:
• Maximum RF output power and antenna gain to meet Maximum Permissible Exposure
Requirements: GSM850 mode: Power at antenna port is +33 dBm, the maximum gain is 1.4
dBi. GSM1900 mode: Power at antenna port is 30 dBm, the maximum gain is 7.0 dBi.
• If used in a "portable" application such as a handheld or body worn device with the antenna
less than 20 cm (7.9 in.) from the human body when the device is operating, then the
integrator is responsible for passing additional "as installed" testing and the device will require
its own FCC ID:
i. SAR (Specific Absorption Rate) testing, with results submitted to the FCC for
approval prior to selling the integrated unit. If unable to meet SAR requirements,
then the host unit must be restricted to "mobile" use (see below).
ii. Unintentional emissions, FCC Part 15; results do not have to be submitted to the
FCC unless requested, although the test provides substantiation for required
labeling (see below).
iii. ERP and EIRP measurements for FCC Parts 22 and 24, alternatively a full retest
on FCC Parts 22 and 24 can be performed
®
, monitor
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• If used in a "mobile" application where the antenna is normally separated at least 20 cm (7.9
in) from the human body during device operation, then an appropriate warning label must be
placed on the host unit adjacent to the antenna. The label should contain a statement such
as the following:
• Host unit user manuals and other documentation must also include appropriate caution and
warning statements and information.
• If the FCCID for the modem is not visible when installed in the host platform, then a
permanently attached or marked label must be displayed on the host unit referring to the
enclosed modem. For example, the label should contain wording such as:
WARNING
RF exposure. Keep at least 20 cm
(7.9 in) separation distance from
the antenna and the human body.
Contains GSM/GPRS modem transmitter module
FCC ID: MIVGSM0408
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received,
including interference that may cause undesired
eration.
o
OR
Contains FCC ID: MIVGSM0408
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received,
including interference that may cause undesired
operation.
• Any antenna used with the modem must be approved by the FCC or as a Class II Permissive
Change (including MPEL or SAR data as applicable). The "professional installation"
provision of FCC Part 15.203 does not apply.
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• The transmitter and antenna must not be co-located or operating in conjunction with any
other antenna or transmitter. Violation of this would allow a user to plug another transmitter
in to the product and potentially create an RF exposure condition.
2.2. Disclaimer
The information and instructions contained within this publication comply with all FCC, GCF,
PTCRB, R&TTE, IMEI and other applicable codes that are in effect at the time of publication.
Enfora disclaims all responsibility for any act or omissions, or for breach of law, code or
regulation, including local or state codes, performed by a third party.
Enfora strongly recommends that all installations, hookups, transmissions, etc., be performed by
persons who are experienced in the fields of radio frequency technologies. Enfora acknowledges
that the installation, setup and transmission guidelines contained within this publication are
guidelines, and that each installation may have variables outside of the guidelines contained
herein. Said variables must be taken into consideration when installing or using the product, and
Enfora shall not be responsible for installations or transmissions that fall outside of the
parameters set forth in this publication.
WARNING
The transmitter and antenna must not be collocated
or operating in conjunction with any
other antenna or transmitter. Failure to observe
this warning could produce an RF exposure
condition.
Enfora shall not be liable for consequential or incidental damages, injury to any person or
property, anticipated or lost profits, loss of time, or other losses incurred by Customer or any third
party in connection with the installation of the Products or Customer's failure to comply with the
information and instructions contained herein.
The Enabler IIIG BGA platform is designed with
features to support a robust connection. There are
instances where the module performance is beyond
the control of the intended design. Integrated designs
that require 24 by 7 operation must implement power
control via an external circuit or by implementing power
management as specified within this design guide.
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3. Manual Overview
This document describes the available hardware interface of the Enabler IIIG BGA modem
(herein also noted as “modem” or “module”). The purpose of this document is to define the
electrical, mechanical and software interfaces while providing detailed technical information in
order to streamline the process of hardware and system integration.
3.1. Revision History
Date Rev Description
03/10/08 .01 Initial Release Draft
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3.2. Reference Documents
3.2.1. Enfora Enabler IIIG BGA Product Documentation
Manuals
• GSM0308AT001 - Enfora GSM/GPRS OEM Module AT Command Set Reference
• GSM0308UG001 - Enfora GSM-GPRS Family API Reference
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3.2.2. GSM Device Specifications
• 3GPP TS 51010-1 (850, 900,1800,1900 MHz devices)
To view the latest release, go to:
http://www.3gpp.org/ftp/Specs/html-info/51010-1.htm
3.2.3. US Government
3.2.3.1. Federal Communications Commission (FCC)
Internet:
• FCC Rules, Part 24
• 47 CFR Subpart E--Broadband PCS
• 47 CFR § 24.52, sections 1.1307(b), 2.1091, and 2.1093
• FCC Rules, Part 22 for GSM 850
• FCC Rules, Part 15
• FCC Rules, Part 2
• Subpart J--Equipment Authorization Procedures
• Section 2.925
http://www.fcc.gov
3.2.3.2. FCC Office of Engineering and Technology (OET)
Internet:
• Bulletin Number 65 "Evaluating Compliance with FCC Guidelines for Human Exposure
http://www.fcc.gov/oet
to Radio Frequency Electromagnetic Fields"
• Supplement C "Additional Information for Evaluating Compliance of Mobile and
Portable Devices with FCC Limits for Exposure to Radio Frequency Emissions"
3.2.4. Industry Canada
• RSS-132
• RSS-133
• ICES-003
3.2.5. Environmental Regulations
• National Environmental Policy Act (NEPA) of 1969 (Part 1, Subpart 1)
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3.2.6. Mechanical Specifications
• ASTM D999
• ASTM D775
• IEC 68-2-27
• Bellcore Gr-63-CORE
• ETS 300 019-1-1 Class 1.2
• ETS 300 019-1-2 Class 2.1
• ETS 300 019-1-3 Class 3.1
3.2.7. RF and EMI Specifications
• ETSI Standards
• EN 61000-4-6
• EN 61000-4-3
• 3GPP TS 51.010-1, Section 12.2
• EN 55022 Class B
3.2.8. Joint Industry Standards
• IPC/JEDEC J-STD-020C
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4. Introduction
4.1. Product Overview
The Enfora Enabler IIIG BGA modem is a compact, wireless Ball Grid Array surface mount OEM
module that utilizes the Global System for Mobile Communications (GSM) and GPRS (General
Packet Radio Services) international communications standards to provide two-way wireless
capabilities via GSM services. The module is a fully Type-approved GSM/GPRS device, enabling
application-specific, two-way communication and control.
The small size of the module allows it to be integrated easily into the application and packaging.
4.2. Key Features of the Enabler IIIG BGA Module
The following table summarizes the main features of the module.
Table 1 - Enabler IIIG BGA Key Features
Interface
Power
Radio Features
Regulatory
Data, RF input/output interface 167 pad soldered BGA
Primary serial port V.24 protocol, 1.8V levels, full 9-pin, UART
implementation
USB port USB – Debug only (Enfora Use only)
GPIO Up to 20 GPIO Some GPIO pins have dual-
purpose functionality.
Audio Digital audio via MCSI port
Voice Supports four vocoder modes: full-rate (FR),
enhanced full-rate (EFR), half-rate (HR), and
adaptive multi-rate (AMR)
Command protocol Enfora Packet API, GSM AT command set
Voltage backup Voltage backup pad available to maintain RTC,
battery capable
Reference clock 32kHz output reference clock
ADC 1 ADC port
Remote Subscriber Identity
Module (SIM)
Electrical power 3.3 to 4.5 Vdc (VBAT)
Peak currents and average
power consumption
Frequency bands EGSM 900, GSM1800, GSM 850 and GSM 1900
GSM/GPRS features supported Provides for all GSM/GPRS authentication,
Agency approvals
1.8/3 V compatible with SIM detect
Refer to the Operating Power table in the
Technical Specifications for peak currents and
average power consumption for various modes of
operation.
capability.
encryption, and frequency hopping algorithms.
GPRS Coding Schemes CS1-CS4 supported.
Multi-Slot Class 10 (4RX/2TX, Max 5 Slots).
• GCF Type Approval
• PTCRB Type Approval
• FCC Certification
• RTTE
• CE (European Community Certification)
• IC (Industry Canada) Approval
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GSM/GPRS
Functionality
Audio Features
Outputs
• Mobile-originated and mobile-terminated SMS messages: up to 140 bytes or
up to 160 GSM 7-bit ASCII characters.
• Reception of Cell Broadcast Message
• SMS Receipt acknowledgement
• Circuit Switched Data (Transparent & Non-transparent up to 9.6 Kbps)
• Voice (EFR, FR, HR)
• Supports Unstructured Supplementary Service Data (USSD)
• Multi-Slot Class 10 Supported (4Rx/2TX), (5 Slot Max)
• PBCCH/PCCCH Supported
• Handset Microphone biasing
• Headset Microphone biasing
• Headset Plug/Unplug detection
• Headset Hook detection (call answer/end button on equipped Headset
microphone device)
• High output dynamic differential Earphone mode, using Headset outputs
• Pop Noise attenuation circuitry implemented for all single-ended output
stages
• Handset microphone input (MICIN, MICIP pads)
• Headset microphone input (HSMIC pad)
• Handset earphone outputs (EARP, EARN pads)
• Headset 32 stereo outputs (HSOL, HSOR pads)
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4.3. Providing Multi-Band Operation
The Enfora Enabler IIIG BGA module provides 4 frequency bands for compatibility with worldwide
frequency standards. 850/1900 frequency bands are primarily used in North and South America,
while 900/1800 bands are used through out the world.
4.4. Wireless Data Application Possibilities
A variety of applications can use the module for transmitting/receiving data/voice, such as:
• Automated Meter Reading
• Point of Sale Applications
• E-mail and Internet access
• Automated Vehicle Location (AVL)
• Machine to Machine communication (M2M)
• Telematics
• Telemetry
• Wireless Security
• Smart Phones
• Telemedicine
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4.5. Summary of Features for the Enabler IIIG BGA Module
The following summarizes the main features of the module.
Mechanical
Dimensions................................... 28.0 mm x 24.0 mm x 2.50 mm
Weight .......................................... 3.6g
Packet Data Transfer:
Protocol................................................................... GPRS Release 97 and 99
Coding Schemes .................................................... CS1-CS4
Multi-Slot Capability: (
Demonstrated @MS10) .............. MS10 (4RX/2TX) (Max 5 Slots)
Packet Channel Support......................................... PBCCH/PCCCH
Circuit Switched Data Transfer:
V110 ............................................. 300 bps/1200 bps/2400 bps/4800 bps/9600 bps/14,400 bps
Non-Transparent .......................... 300 bps/1200 bps/2400 bps/4800 bps/9600 bps/14,400 bps
Short Message Services:
GSM SMS .................................... MO, MT, CB, Text and PDU Modes
GPRS SMS .................................. MO, MT, CB, Text and PDU Modes
Voice Capability:
Speech Codec.............................. EFR, FR, HR, AMR
GSM/GPRS Radio Performance Multi-Band:
GSM0408 Radio Frequencies............. 850 MHz, 900 MHz, 1800 MHz, and 1900 MHz
Sensitivity ............................................ <-106 dBm (Typical GPRS CS1)
850 & 900 MHz Transmit Power ......... Class 4 (2 W)
1800 & 1900 MHz Transmit Power .....Class 1 (1 W)
System Requirements:
Host Interface............................... Serial Interface
DC Voltage................................... 3.3 to 4.5 Vdc
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Application Interface:
Host Protocol................................ Enfora Packet API and AT Commands
Internal Protocols ......................... UDP stack, TCP/IP stack, PPP, PAD, and CMUX
Physical Interface......................... 1 serial (primary/Default, rate auto baud), 1 USB (debug)
Audio Interface.............................. Handset microphone input (MICIN, MICIP pads); Headset
SIM Interface:
Remote SIM ................................. 1.8/3-Volt SIM Compatible
Environmental:
Compliant Operating Temp.......... -20 °C to 60 °C (Fully GSM Spec Compliant)
Operating Temperature................ -30 °C to 70 °C
Storage Temperature ................... -40 °C to 85 °C
Humidity ....................................... 5 to 95% non-condensing
MCSI (PCM Audio only)
microphone input (HSMIC pad); Handset earphone outputs
(EARP, EARN pads); Headset 32 stereo outputs (HSOL,
HSOR pads).
EMC:
Emissions ..................................... FCC Parts 15,22 & 24, Class B
3GPP TS 51010-1, Section 12.2
EN 55022 Class B
Operating Power (TYPICAL):
GSM Operation
GSM 850/900 (1 RX/1 TX, full power) .............250 mA average, 1.6 A peak
GSM 1800 (1 RX/1 TX, full power) ..................215 mA average, 1.3 A peak
GSM 1900 (1 RX/1 TX, full power) ..................204 mA average, 1.2 A peak
Idle.................................................................... <2.5 mA Average in DFX 5
Shutdown ......................................................... ≈ 55 uA
GPRS Operation Power
EGSM 850/900 (4 RX/1 TX, full power) ...........272 mA average,
EGSM 850/900 (2 RX/2 TX, full power) ...........420 mA average,
1.6 A peak
1.6 A peak
GSM 1800 (4 RX/1 TX, full power) ..................242 mA average, A peak
GSM 1800 (2 RX/2 TX, full power) ..................354 mA average, A peak
GSM 1900 (4 RX/1 TX, full power) ..................235 mA average, A peak
GSM 1900 (2 RX/2 TX, full power) ..................340 mA average, A peak
Idle.................................................................... <2.5 mA average in DFX 5
Shutdown .........................................................≈ 55 uA
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GSM Transmit Power
1800/1900 MHz............................ GSM Power Class 1 (30 dBm ± 2 dB @ antenna connection)
850/900 MHz................................ GSM Power Class 4 (33 dBm ± 2 dB @ antenna connection)
GSM/GPRS Receiver Sensitivity (Typical)
1800/1900 MHz............................ <-106 dBm, GPRS Coding Scheme 1 (CS1)
850/900 MHz................................ <-106 dBm, GPRS Coding Scheme 1 (CS1)
4.6. Layout Guidelines for the Enabler IIIG BGA
The following guidelines are provided in an effort to allow Enabler IIIG BGA module users to
successfully implement their PCB layout to obtain the best performance. This includes the lowest
possible EMI emissions, maximum thermal conduction, mechanical integrity, and voice quality. The
module is a very compact, high performance design, yet it is easy to interface into the final product.
In order to realize its full potential, designers should pay close attention to ground structures, the
routing of RF and Digital traces, and the size of the power supply lines.
These design tips are strictly guidelines and are not
meant to be a complete list of items that guarantee
actual performance. Each application is different and
may require variation from these guidelines, however,
care should be given to utilize these sound engineering
principles whenever possible.
4.6.1. Placement
When integrating the Enabler IIIG BGA into a host design, it is critical for the design engineer and
system architect to take steps early on in the design to minimize the potential noise and
interference issues associated with proximity of RF sources, clock sources and receivers.
Carefully determining the optimum placement for the module will ensure the best performance for
GSM communication. All potential sources of noise and interference should be taken into
consideration before determining where each module and circuit should be physically placed in
the design. A system frequency plan is recommended in order to avoid system clock frequencies
with harmonics at 13MHz, 26MHz, or the GSM 850/900/1800/1900 operational bands.
Please refer to
trace is as short as possible. Refer to section
Bulk bypass capacitance should be placed adjacent to the power input pads as shown, and
power traces should be 0.1” (2.54mm) wide as a minimum, or wider if routing is longer than 5”
(127mm). Refer to section
Figure 1. The module should be rotated and placed such that the RF antenna
4.6.4 for more detail on RF routing.
4.6.5 for detailed discussion of power input.
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Figure 1 – Example of placement and ground plane for the module host board
4.6.2. Ground Plane
To ensure the lowest possible EMI emissions and maximum thermal conductivity, it is imperative
that all ground balls on the Enabler IIIG BGA module be soldered to a continuous ground plane.
This ground plane should cover a minimum of the RF/power quadrant of the module, as shown in
the upper left area of
Figure 1, and should be interconnected to ground flooding on other layers
so that there are no ground loops between module pads. Ground vias should be provided under
or adjacent to each ground pad to create a low impedance ground. It is recommended to
minimize the number of top-layer I/O traces under the module to allow for as much ground plane
as possible. An example of a good ground structure and pad layout is shown in
solid grounding through via interconnect in
Figure 2.
Figure 1, and
Figure 2 – Example of solid flooding on layer 4 with via interconnect
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4.6.3. Thermal Relief
Because the ground plane acts as a large heat sink, it can affect the solder adhesion of the
module. A common method to reduce this effect is to use thermal relief around the pad in
question. However, great care must be taken when using thermal relief for high current or high
frequency applications. Insufficient grounding caused by narrow elongated thermals will result in
poor thermal transfer, constricted ground current return, and inadequate RF grounding. Poor RF
grounding may be manifested by excessive radiated or conducted harmonics.
example of host board grounding in the RF/power area of the module. Recommended design
parameters are 10 mils (.254 mm) copper flood clearance and 15 mils (.381 mm) thermal spoke
width. A grounding via should be located either directly adjacent to the pad if using thru-hole vias
or can optionally be located in the pad for blind via design. For blind via technology with via-inpad, the vias must be filled and plated over to remove the dimple. See section ??? for process
specifications with regard to module attachment to the host.
Figure 3 shows an
Figure 3 – Example of thermal relief and Vbat feed
4.6.4. Antenna and RF Signal Trace
The PCB trace that feeds the RF output port must be designed for a 50 ohm characteristic
impedance. It should be coplanar, or routed into internal layers to keep the top layer continuous
around and underneath the Enabler module. Ample ground vias should be provided around the
RF trace and launch pad. Special care should be taken when the RF trace changes layers
between the module and the antenna port or connector, as such transitions can introduce an
additional mismatch and degrade system sensitivity. If possible, keep I/O and power traces away
from the RF port. This includes traces running parallel or orthogonal to it. The designer must pay
close attention to the thickness of the dielectric beneath the signal pad and trace. Most PCB
manufacturers can adjust the trace width to maintain 50 ohms impedance if the traces are
identified and instructions are included on the FAB drawing. This service is typically provided at
no or minimal additional cost.
For minimum RF emissions due to the fundamental frequency of operation, the Enabler module
works best with an antenna load that has a VSWR of 1.5:1 or better. The antenna should not
have gain at the harmonic frequencies; otherwise, the conducted harmonics could be amplified to
a point where the product no longer passes type approval. However, for applications where
antenna quality is less than ideal, it is recommended to have a low pass filter (Pi structure with
N=3) in the RF path to the antenna. This is a secondary plan should there be a need to lower
harmonic levels at frequencies above the PCS band. The pad structure may also be used to
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match the antenna load impedance, if required. If it is not needed, a capacitor of low reactance
may be used to bridge the Pi structure.
4.6.5. Vbat Input
The Enabler Vbat input can have a relative high current draw that can fluctuate rapidly, especially
when transmitting at max power and burst mode. The Vbat interface must be designed to provide
the required instantaneous voltage and current with minimal voltage droop. This includes both
sufficient bulk decoupling capacitance as well as adequate layout provisions.
When routing connections to the Enabler Vbat pads, it would seem reasonable to use traces of
the same width as the pads. However, such traces will not have sufficient copper. The use of
narrow traces to connect the Vbat pads to the source voltage can act like a high impedance and
cause a significant voltage droop when higher currents are required, as shown in
Figure 4.
Figure 4 - Example of Vbat Voltage Droop
If Vbat drops too low, the Enabler module will reset. To minimize the trace loss, it is
recommended to use a larger trace that spans several pads as shown in
Figure 3. The layout
should provide sufficient trace width over the entire route from the module to the source of the
Vbat voltage. Any transitions between layers for this trace should utilize multiple vias.
Since even the best layout will have some impedance from the source to the Enabler module,
sufficient bulk decoupling capacitance is required at the Vbat input to the module. It is suggested
to use at least two 1000 uF low ESR tantalum capacitors located adjacent to the module Vbat
pads. Any thermal relief used on these capacitors should comply with the information given
above in order to provide the lowest impedance possible. The design should include multiple vias
to the internal ground plane, placed close to the capacitors, as grounding of these capacitors is
critical.
4.6.6. I/O Routing and Fanout
The Enabler IIIG BGA interface is grouped by functions, as shown in the BGA map of section
5.5.1. Each functional group should be fanned out and routed as a group from the module. It is
preferred to route as much of the I/O nets as possible on internal layers in order to maintain
continuous grounding. Pad spacing on the module allows for flexibility in placing vias adjacent to
the pads.
Figure 5 and Figure 6 are both examples of functional grouping and fanout. Note that
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I/O is routed down/away from the power/RF area of the module in order to minimize interference.
Recommended audio I/O design is detailed in section
USB
4.6.7 below.
I2S
Figure 5 – Example of layer 2 routing fanout
Figure 6 – Example of layer 3 UART and audio fanout
UART
udio
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4.6.7. Audio Reference Design
The audio quality is very dependent on the circuit design and layout. As an aid to obtaining good
audio quality, a reference design has been included below. It has been proven to provide good
performance on the SDK module.
4.6.7.1. Audio Schematic
Figure 8 and Figure 8 show examples for both handset and headset audio connections. The
47pF capacitors should be placed as close as possible to the interface connector in order to
filter the 217Hz noise inherent in GSM mobile devices. All capacitors are low ESR ceramic;
small values are NP0, while larger values are X7R or X5R. Resistors are all 5% thick film
chip. The connector part numbers shown in the last line of each callout are available from
CUI Inc.
Figure 7– Handset Audio Reference Schematic
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Figure 8 – Headset Audio Reference Schematic
4.6.7.2. Audio Layout
Layout plots for the audio interface section of the SDK are shown below in
lines should be routed from the module on internal layers in groups with differential pairs
routed together. Care should be taken to isolate the audio signals from Vbat, higher speed
digital I/O, and RF. An audio routing example is shown in
Figure 5.
Figure 9. Audio
Figure 9 – Audio interface layout examples
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