Novatel Wireless EDG0408 User Manual
Integration Guide:
EDG0408IG001
Enfora Enabler IIIE-BGA
Integration Guide
Revision Draft
Enfora Enabler IIIE-BGA
Modem Integration Guide
Document Title: Enfora Enabler IIIE-BGA Modem Integration Guide
Version: Draft
Date: 05/09/08
Status: Draft
Document Control ID: EDG0408IG001
General
All efforts have been made to ensure the accuracy of material provided in this document at the time
of release. However, the items described in this document are subject to continuous development
and improvement. All specifications are subject to change without notice and do not represent a
commitment on the part of Enfora, Inc. Enfora, Inc. will not be responsible for any loss or damages
incurred related to the use of information contained in this document.
This product is not intended for use in life support appliances, devices or systems where a
malfunction of the product can reasonably be expected to result in personal injury. Enfora, Inc.
customers using, integrating, and/or selling this product for use in such applications do so at their
own risk and agree to fully indemnify Enfora, Inc. for any damages resulting from illegal use or resale.
Copyright
Complying with all applicable copyright laws is the responsibility of the user. Without limiting the
rights under copyright, no part of this document may be reproduced, stored in or introduced into a
retrieval system, or transmitted in any form or by any means (electronic, mechanical, photocopying,
recording or otherwise), or for any purpose, without the express written permission of Enfora, Inc.
Enfora may have patents, patent applications, trademarks, copyrights or other intellectual property
rights covering subject matter in this document. Except as expressly provided in any written license
agreement from Enfora, the furnishing of this document does not give you any license to these
patents, trademarks, copyrights or other intellectual property.
©2002, 2003, 2004, 2005, 2006, 2007, 2008 Enfora, Inc. All rights reserved.
Enabler and Spider are either registered trademarks or trademarks of Enfora, Inc. in the United
States.
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Modem Integration Guide
Table of Contents
1. SAFETY PRECAUTIONS ................................................................................................................................. 1
1.1. IMPORTANT SAFETY INFORMATION ................................................................................................................ 1
2. REGULATORY COMPLIANCE FCC ............................................................................................................. 1
2.1. INTEGRATION CONSIDERATIONS AND INSTALLATION REQUIREMENTS ........................................................... 1
2.2. DISCLAIMER ................................................................................................................................................... 3
3. MANUAL OVERVIEW ...................................................................................................................................... 4
3.1. REVISION HISTORY ......................................................................................................................................... 4
3.2. REFERENCE DOCUMENTS ............................................................................................................................... 5
3.2.1. Enfora Enabler IIIE Product Documentation ........................................................................................ 5
3.2.2. US Government ...................................................................................................................................... 5
3.2.3. Federal Communications Commission (FCC) ....................................................................................... 5
3.2.4. FCC Office of Engineering and Technology (OET) .............................................................................. 5
3.2.5. Industry Canada .................................................................................................................................... 5
3.2.6. Environmental Regulations .................................................................................................................... 5
3.2.7. Mechanical Specifications ..................................................................................................................... 6
3.2.8. RF and EMI Specifications .................................................................................................................... 6
4. INTRODUCTION ............................................................................................................................................... 7
4.1. PRODUCT OVERVIEW...................................................................................................................................... 7
4.2. KEY FEATURES OF THE ENABLER III MODULE ............................................................................................... 7
4.3. WIRELESS DATA APPLICATION POSSIBILITIES ................................................................................................ 8
4.4. SUMMARY OF FEATURES FOR THE ENABLER IIIE MODULE ............................................................................ 8
4.5. GENERAL DESIGN GUIDELINES FOR UTILIZING ENFORA GSM MODU LES ...................................................... 10
4.5.1. Advanced Tips for an RF Friendly Layout ........................................................................................... 11
4.5.1.1. Ground Plane ................................................................................................................................................... 11
4.5.1.2. Thermal Relief ................................................................................................................................................. 11
4.5.1.3. Antenna and RF Signal Trace .......................................................................................................................... 13
4.5.1.4. Vbat Input ........................................................................................................................................................ 13
4.5.2. Audio Reference Design ....................................................................................................................... 16
4.5.2.1. Audio Schematics ............................................................................................................................................ 16
4.5.2.2. Audio Layout ................................................................................................................................................... 16
5. TECHNICAL SPECIFICATIONS .................................................................................................................. 17
5.1. DETAILED PRODUCT SPECIFICATIONS .......................................................................................................... 17
CLIMATIC: STORAGE AND TRANSPORTATION ........................................................................................................... 17
ELECTROMAGNETIC EMISSIONS ............................................................................................................................... 17
5.2. TYPICAL OPERATING POWER ....................................................................................................................... 18
5.2.1. Input Voltage Range ........................................................................................................... ................. 18
5.2.2. GSM Receiver Sensitivity ..................................................................................................................... 19
6. MECHANICAL ................................................................................................................................................. 20
6.1. MODULE MOUNTING TO HOST BOARD (REFERENCE) ................................................................................... 22
6.2. CONNECTORS ............................................................................................................................................... 24
6.3. RF CONNECTION OPTIONS ........................................................................................................................... 25
6.3.1. Coaxial Connector Option ................................................................................................................... 25
6.3.2. RF Board-to-Board Connector Option ................................................................................................ 25
6.3.3. GPS Interference ................................................................................................................................. 25
6.3.4. I/O Connector Pin Assignments ........................................................................................................... 26
6.4. CIRCUIT PROTECTION ................................................................................................................................... 28
6.5. ANTENNA ..................................................................................................................................................... 28
6.6. CONTROL CONNECTOR SIGNAL DESCRIPTIONS AND FUNCTIONS ................................................................. 28
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6.6.1. Module Power (Pins 85, 87, 89, 91, 93, 95, 97, 99) ............................................................................ 29
6.6.2. Reset Signal (Pin 37) ........................................................................................................................... 29
6.6.3. Power Control (Pin 35) (PWR_CTL).................................................................................................. 30
6.6.3.1. Turning ON the Enabler IIIE ........................................................................................................................... 30
6.6.3.2. Turning OFF the Enabler IIIE .......................................................................................................................... 31
6.6.3.3. Using the Power Control Signal ....................................................................................................................... 32
6.6.4. Level Translation Reference Power (Pin 77) ....................................................................................... 34
6.6.5. General Purpose Input/Output Interface ............................................................................................. 34
6.6.6. Serial Interfaces & Handshake (Pins 15, 21, 13, 11, 17, 25, 19, 23) ................................................... 34
6.6.7. Ring Indicate (Pin 23) .......................................................................................................................... 35
6.6.8. VBACKUP (Pin 83) ............................................................................................................................. 36
6.6.9. 32 kHz (Pin 56) .................................................................................................................................... 37
6.6.10. Analog-To-Digital Input (Pin 74) ........................................................................................................ 37
6.6.11. Handset Microphone Input (Pins 65, 67) ............................................................................................. 37
6.6.12. Handset Microphone Bias Output (Pin 63) ......................................................................................... 37
6.6.13. Handset Speaker Output (Pins 71, 73)................................................................................................. 38
6.6.14. Headset Microphone Input (Pin 55) .................................................................................................... 38
6.6.15. Headset Microphone Bias Output (Pin 53) .......................................................................................... 39
6.6.16. Headset Speaker Output Left & Right (Pins 57, 59) ............................................................................ 39
6.6.17. Headset Output Common Mode (Pin 61) ............................................................................................. 39
6.6.18. Headset Detect (Pin 47) ....................................................................................................................... 40
6.7. SUBSCRIBER IDENTITY MODULE (SIM) CARRIER (PINS 76, 78, 80, 82, 84) ................................................. 40
6.7.1. SIM Integration for the Enfora Enabler IIIE Module .......................................................................... 41
6.7.2. Using a Remote SIM with the Enfora Enabler IIIE Module (Pins 76, 78, 80, 82, 84) ......................... 41
6.7.3. Remote SIM Component Information .................................................................................................. 43
7. GSM/GPRS MODES OF OPERATION ......................................................................................................... 44
7.1. ENABLING THE TRANSMISSION MODES FOR THE GSM/GPRS SERVICES ..................................................... 44
7.2. VOICE COMMUNICATION .............................................................................................................................. 44
7.3. CIRCUIT-SWITCHED DATA ........................................................................................................................... 44
7.4. SMS: SHORT MESSAGE SERVICES ................................................................................................................ 44
8. SIM OPERATION ............................................................................................................................................ 45
8.1. PROVISIONING THE SIM ............................................................................................................................... 45
8.2. GSM SERVICES SUPPORTED BY THE ENFORA ENABLER IIIE MODULE......................................................... 45
8.3. GPRS SERVICES SUPPORTED BY THE ENFORA ENABLER IIIE MODULE ....................................................... 45
8.4. SELECTING THE GSM MODES OF OPERATION .............................................................................................. 46
9. SOFTWARE INTERFACE .............................................................................................................................. 47
9.1. SOFTWARE INTERFACE ................................................................................................................................. 47
9.2. FORMAT FOR THE AT COMMANDS ............................................................................................................... 47
9.3. ENFORA AT COMMAND SET ......................................................................................................................... 47
10. SETUP AND INITIALIZATION ................................................................................................................. 48
10.1. GENERAL SETUP ....................................................................................................................................... 48
10.1.1. HyperTerminal Configuration for Enabler IIIE module ...................................................................... 48
10.1.2. Initialization (AT Command Interface) ................................................................................................ 49
10.1.3. Initial Response to the AT Command ................................................................................................... 50
10.1.4. Sending an Initialization String to the Enfora Enabler IIIE Module ................................................... 50
10.1.5. Setting Up the Communication Mode for the Enfora Enabler IIIE Module ........................................ 50
11. INTEGRATION AND TESTING ................................................................................................................ 51
11.1. INTEGRATING THE ENFORA ENABLER IIIE MODULE ................................................................................ 51
12. APPENDIX A - LIMITED WARRANTY ................................................................................................... 53
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12.1. SCOPE ....................................................................................................................................................... 53
12.2. HARDWARE .............................................................................................................................................. 53
12.3. SOFTWARE ................................................................................................................................................ 53
12.4. OTHER CONSIDERATIONS ......................................................................................................................... 54
13. APPENDIX B - REGULATIONS AND COMPLIANCE .......................................................................... 55
13.1. GCF/PTCRB APPROVAL (FORMERLY FTA) ............................................................................................ 55
13.2. ELECTROMAGNETIC COMPATIBILITY (EMC) AND SAFETY REQUIREMENTS ............................................. 55
13.3. EMC/SAFETY REQUIREMENTS FOR THE USA .......................................................................................... 55
13.4. HUMAN EXPOSURE COMPLIANCE STATEMENT ......................................................................................... 56
13.5. COMPLIANCE WITH FCC REGULATIONS ................................................................................................... 56
13.6. UNINTENTIONAL RADIATORS, PART 15 .................................................................................................... 57
13.7. INTENTIONAL RADIATORS, PART 22 & 24 ................................................................................................ 57
13.8. INSTRUCTIONS TO THE ORIGINAL EQUIPMENT MANUFACTURER (OEM) .................................................. 58
13.8.1. OEM Responsibilities for All Products Containing the Enabler IIIE module ..................................... 60
13.8.2. Specific OEM Responsibilities for Portable Products and Applications ............................................. 61
13.8.3. Specific OEM Responsibilities for Mobile Products and Applications ................................................ 61
13.8.4. Specific OEM Responsibilities for Fixed Products and Applications .................................................. 61
13.9. EMC/SAFETY REQUIREMENTS FOR THE COUNTRIES OF THE EUROPEAN UNION (EU) .............................. 62
13.10. EMC/SAFETY REQUIREMENTS FOR OTHER COUNTRIES ........................................................................... 62
14. APPENDIX C - GLOSSARY AND ACRONYMS ...................................................................................... 63
15. APPENDIX D – TABLES AND FIGURES ................................................................................................. 65
16. APPENDIX E - CONTACTING ENFORA................................................................................................. 66
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1. Safety Precautions
1.1. Important Safety Information
The following information applies to the devices described in this manual. Always observe all
standard and accepted safety precautions and guidelines when handling any electrical device.
Save this manual: it contains important safety information and operating instructions.
Do not expose the Enfora Enabler IIIE product to open flames.
Ensure that liquids do not spill onto the devices.
Do not attempt to disassemble the product: Doing so will void the warranty. With the
exception of the Subscriber Identification Module (SIM), this product does not contain
consumer-serviceable components.
2. Regulatory Compliance FCC
2.1. Integration Considerations and Installation Requirements
The Enabler IIIE modem is designed for use in a variety of host units, "enabling" the host platform
to perform wireless data communications. However, there are certain criteria relative to
integrating the modem into a host platform such as a PC, laptop, handheld or PocketPC
and control unit, etc. that must be considered to ensure continued compliance with FCC
compliance requirements.
®
, monitor
Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
In order to use the Enabler IIIE modem without additional FCC certification approvals, the
installation must meet the following conditions:
Maximum RF output power and antenna gain to meet Maximum Permissible Exposure
Requirements: GSM850 mode: Power at antenna port is +33 dBm, the maximum gain
is 1.4 dBi. GSM1900 mode: Power at antenna port is 30 dBm, the maximum gain is 7.0
dBi.
If used in a "portable" application such as a handheld or body worn device with the
antenna less than 20 cm (7.9 in.) from the human body when the device is operating,
then the integrator is responsible for passing additional "as installed" testing and the
device will require it’s own FCC ID:
- SAR (Specific Absorption Rate) testing, with results submitted to the FCC for
approval prior to selling the integrated unit. If unable to meet SAR requirements,
then the host unit must be restricted to "mobile" use (see below).
- Unintentional emissions, FCC Part 15; results do not have to be submitted to the
FCC unless requested, although the test provides substantiation for required labeling
(see below).
- ERP and EIRP measurements for FCC Parts 22 and 24, alternatively a full retest on
FCC Parts 22 and 24 can be performed
If used in a "mobile" application where the antenna is normally separated at least 20 cm
(7.9 in) from the human body during device operation, then an appropriate warning label
must be placed on the host unit adjacent to the antenna. The label should contain a
statement such as the following:
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Modem Integration Guide
Host unit user manuals and other documentation must also include appropriate caution and
warning statements and information.
If the FCCID for the modem is not visible when installed in the host platform, then a
permanently attached or marked label must be displayed on the host unit referring to the
enclosed modem. For example, the label should contain wording such as:
Contains GSM/GPRS/EDGE modem transmitter module
Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2)
including interference that may cause undesired operation
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2)
including interference that may cause undesired operation
RF exposure. Keep at least 20 cm
(7.9 in) separation distance from
the antenna and the human body.
This device complies with Part 15 of the FCC Rules.
This device must accept any interference received,
Contains FCC ID: MIVEDG0308
This device must accept any interference received,
WARNING
FCC ID: MIVEDG0308
OR
Any antenna used with the modem must be approved by the FCC or as a Class II Permissive
Change (including MPEL or SAR data as applicable). The "professional installation"
provision of FCC Part 15.203 does not apply.
The transmitter and antenna must not be co-located or operating in conjunction with any
other antenna or transmitter. Violation of this would allow a user to plug another transmitter
in to the product and potentially create an RF exposure condition.
The transmitter and antenna must not be collocated
or operating in conjunction with any other
antenna or transmitter. Failure to observe this
warning could produce an RF exposure condition.
WARNING
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2.2. Disclaimer
The information and instructions contained within this publication comply with all FCC, GCF,
PTCRB, R&TTE, IMEI and other applicable codes that are in effect at the time of publication.
Enfora disclaims all responsibility for any act or omissions, or for breach of law, code or
regulation, including local or state codes, performed by a third party.
Enfora strongly recommends that all installations, hookups, transmissions, etc., be performed by
persons who are experienced in the fields of radio frequency technologies. Enfora acknowledges
that the installation, setup and transmission guidelines contained within this publication are
guidelines, and that each installation may have variables outside of the guidelines contained
herein. Said variables must be taken into consideration when installing or using the product, and
Enfora shall not be responsible for installations or transmissions that fall outside of the
parameters set forth in this publication.
Enfora shall not be liable for consequential or incidental damages, injury to any person or
property, anticipated or lost profits, loss of time, or other losses incurred by Customer or any third
party in connection with the installation of the Products or Customer's failure to comply with the
information and instructions contained herein.
The Enabler IIIE platform is designed with features to
support a robust connection. There are instances
where the module performance is beyond the control
of the intended design. Integrated designs that require
24 by 7 operation must implement power control via an
external circuit or by implementing power management
as specified within this design guide.
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3. Manual Overview
This document describes the hardware interface of the Enabler IIIE modem. The purpose of this
document is to define the electrical, mechanical and software interfaces while providing detailed
technical information in order to streamline the process of hardware and system integration.
3.1. Revision History
Date Rev Author Description
04/08/08 Draft Tom Cone Initial Release
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3.2. Reference Documents
3.2.1. Enfora Enabler IIIE Product Documentation
Manuals
EDG0308AT001 - Enfora Enabler IIIE AT Command Set
GSM Device Specifications
3GPP TS 51010-1 (850, 900,1800,1900 MHz devices)
To view the latest release, go to:
http://www.3gpp.org/ftp/Specs/html-info/51010-1.htm
3.2.2. US Government
3.2.3. Federal Communications Commission (FCC)
Internet: http://www.fcc.gov/
FCC Rules, Part 24
47 CFR Subpart E--Broadband PCS
47 CFR § 24.52, sections 1.1307(b), 2.1091, and 2.1093
FCC Rules, Part 22 for GSM 850
FCC Rules, Part 15
FCC Rules, Part 2
Subpart J--Equipment Authorization Procedures
Section 2.925
3.2.4. FCC Office of Engineering and Technology (OET)
Internet: http://www.fcc.gov.oet/
Bulletin Number 65 "Evaluating Compliance with FCC Guidelines for Human Exposure to
Radio Frequency Electromagnetic Fields"
Supplement C "Additional Information for Evaluating Compliance of Mobile and Portable
Devices with FCC Limits for Exposure to Radio Frequency Emissions"
3.2.5. Industry Canada
RSS-132
RSS-133
ICES-003
3.2.6. Environmental Regulations
National Environmental Policy Act (NEPA) of 1969 (Part 1, Subpart 1)
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3.2.7. Mechanical Specifications
ASTM D999
ASTM D775
IEC 68-2-27
Bellcore Gr-63-CORE
ETS 300 019-1-1 Class 1.2
ETS 300 019-1-2 Class 2.1
ETS 300 019-1-3 Class 3.1
3.2.8. RF and EMI Specifications
ETSI Standards
EN 61000-4-6
EN 61000-4-3
3GPP TS 51.010-1, Section 12.2
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4. Introduction
4.1. Product Overview
Enfora Enabler IIIE modem is a compact, wireless OEM module that utilizes the Global System
for Mobile Communications (GSM), GPRS (General Packet Radio Services) and EDGE
(Enhanced Data rates for GSM Evolution) international communications standards to provide twoway wireless capabilities via GSM services. The Enfora Enabler IIIE module is a fully Typeapproved GSM/GPRS/EDGE device, enabling application-specific, two-way communication and
control.
The small size of the Enfora Enabler IIIE module allows it to be integrated easily into the
application and packaging.
4.2. Key Features of the Enabler III Module
The following table summarizes the main features of the Enfora Enabler IIIE Radio Module.
Interface
GSM/GPRS
Functionality
Data input/output interface 100 position 0.4mm pitch connector
Primary serial port V.24 protocol, 1.8V level, full 9-pin, UART implementation
Secondary serial port UART 1.8V Debug only (Enfora Use only)
GPIO 8 GPIO.
USB USB full-speed (FS) device compatible with the USB
Revision 2.0 and USB Revision 1.1
Voice Supports four vocoder modes: full-rate (FR), enhanced full-
rate (EFR), half-rate (HR), and adaptive multi-rate (AMR)
Antenna Interface Ultra-Miniature Coaxial Interconnect (MCD) or Board-to-
Board Spring contact
Command protocol GSM AT command set
Subscriber Identification
Module (SIM)
Voltage backup Voltage backup pin available to maintain RTC, battery
Reference clock 32kHz output reference clock (accessible via 100-pin
ADC 1 ADC port
Optional remote SIM Accessible via the 100-pin connector
Frequency bands: EGSM 900, GSM1800, GSM 850 and GSM 1900
Provides for all GSM/GPRS/EGPRS authentication, encryption, and frequency
hopping algorithms
Mobile-originated and mobile-terminated SMS messages: up to 140 bytes or up to
160 GSM 7-bit ASCII characters.
Reception of Cell Broadcast Message
SMS Receipt acknowledgement
Circuit Switched Data (Transparent & Non-transparent up to 9.6 Kbps)
Voice (EFR, FR, HR)
Supports Unstructured Supplementary Service Data (USSD)
Multi-Slot Class 10 Supported (4Rx/2TX), (5 Slot Max)
PBCCH/PCCCH Supported
EGPRS Release 99
Optional 1.8/3 V mini-SIM carrier and interface on board
capable
connector)
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Audio
Features
Outputs
Handset Microphone biasing
Headset Microphone biasing
Headset Plug/Unplug detection
High output dynamic differential Earphone mode, using Headset outputs
Pop Noise attenuation circuitry implemented for all single-ended output stages
Mono Voice memo capability: Voice memo function is supported for both 8 kHz
Narrowband and 16 kHz
Handset microphone input (MICIN, MICIP pins)
Headset microphone input (HSMIC pin)
Handset earphone outputs (EARP, EARN pins)
Headset 32 stereo outputs (HSOL, HSOR pins)
Table 1 - Enabler IIIE Key Features
4.3. Wireless Data Application Possibilities
A variety of applications can use the Enfora Enabler IIIE module for transmitting/receiving
data/voice, such as:
Automated Meter Reading (AMR)
Point of Sale Applications
E-mail and Internet access
Automated Vehicle Location (AVL)
Machine to Machine communication (M2M)
Telematics
Telemetry
Wireless Security
Smart Phones
Telemedicine
4.4. Summary of Features for the Enabler IIIE Module
The following summarizes the main features of the Enfora Enabler IIIE Module.
Packet Data Transfer:
Protocol ......................................................... GPRS Release 99, EGPRS Release 4
Coding Schemes ........................................... CS1-CS4, MCS1-MCS9
Multi-Slot Class: (Demonstrated @MSC10) . MSC10 (4RX/2TX) (Max 5 Slots)
Packet Channel Support ............................... PBCCH/PCCCH
Circuit Switched Data Transfer:
V110 ................................................. 300 bps/1200 bps/2400 bps/4800 bps/9600 bps/14,400 bps
Non-Transparent .............................. 300 bps/1200 bps/2400 bps/4800 bps/9600 bps/14,400 bps
Short Message Services:
GSM SMS ..................................................... MO, MT, CB, Text and PDU Modes
GPRS SMS ................................................... MO, MT, CB, Text and PDU Modes
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Voice Capability:
Speech Codec ............................................... EFR, FR, HR, AMR
GSM/GPRS/EGPRS Radio Performance Multi-Band:
EDG0308 Radio Frequencies ....................... 850 MHz, 900 MHz, 1800 MHz, and 1900 MHz
Sensitivity ...................................................... <-106 dBm
850 & 900 MHz Transmit Power ................... Class 4 (2 W)
1800 & 1900 MHz Transmit Power ............... Class 1 (1 W)
Application Interface:
Host Protocol ................................................. AT Commands
Internal Protocols .......................................... PPP and CMUX
Physical Interface .......................................... 1 serial UART primary (default baud rate 460800), 1
Audio Interface .............................................. Handset microphone input (MICIN, MICIP pins),
SIM Interface:
Serial Debug (RX and TX only)
Headset microphone input (HSMIC pin), Handset
earphone outputs (EARP, EARN pins), Headset 32
stereo outputs (HSOL, HSOR pins)
Remote SIM Option ....................................... 1.8/3-Volt SIM Capability
Environmental:
Compliant Operating Temperature ............... -20 °C to 60 °C (Fully GSM Spec Compliant)
Operating Temperature ................................. -30 °C to 70 °C
Storage Temperature .................................... -40 °C to 85 °C
Humidity ........................................................ 5 to 95% non-condensing
EMC:
Emissions ...................................................... FCC Parts 15,22 & 24, Class B
3GPP TS 51010-1, Section 12.2
Operating Power (TYPICAL):
GSM Operation
GSM 850/900 (1 RX/1 TX, full power) .......... 275 mA average, 1.0 A peak
GSM 1800 (1 RX/1 TX, full power) ............... 250 mA average, .885 A peak
GSM 1900 (1 RX/1 TX, full power) ............... 230 mA average, .810 A peak
Idle ................................................................. <2.2 mA Average in DRX 5
Shutdown ...................................................... 45 uA
GPRS Operation Power
EGSM 850/900 (4 RX/1 TX, full power) ........ 275 mA average, 1.0 A peak
EGSM 850/900 (2 RX/2 TX, full power) ........ 455 mA average, 1.35 A peak
GSM 1800 (4 RX/1 TX, full power) ............... 250 mA average, .885 A peak
GSM 1800 (2 RX/2 TX, full power) ............... 410 mA average, 1.18 A peak
GSM 1900 (4 RX/1 TX, full power) ............... 222 mA average, .815 A peak
GSM 1900 (2 RX/2 TX, full power) ............... 375 mA average, 1.1 A peak
Idle ................................................................. <2.2 mA average in DRX 5
Shutdown ...................................................... 45 uA
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EGPRS Operation Power
EGSM 850/900 (3 RX/1 TX, full power) ........ 185 mA average, .875 A peak
EGSM 850/900 (2 RX/2 TX, full power) ........ 280 mA average, .9 A peak
GSM 1800 (3 RX/1 TX, full power) ............... 180 mA average, .68 A peak
GSM 1800 (2 RX/2 TX, full power) ............... 290 mA average, .85 A peak
GSM 1900 (3 RX/1 TX, full power) ............... 175 mA average, .72 A peak
GSM 1900 (2 RX/2 TX, full power) ............... 280 mA average, .8 A peak
Idle ................................................................. <2.2 mA average in DRX 5
Shutdown ...................................................... 45 uA
GSM Transmit Power
1800/1900 MHz ................................ GSM Power Class 1 (30 dBm 2 dB @ antenna connection)
850/900 MHz .................................... GSM Power Class 4 (33 dBm 2 dB @ antenna connection)
GSM/GPRS/EDGE Receiver Sensitivity (Typical)
1800/1900 MHz ............................................. <-106 dBm
850/900 MHz ................................................. <-106 dBm
4.5. General design guidelines for utilizing Enfora GSM modules
The following guidelines are provided in an effort to allow Enabler IIIE module users to successfully
implement their PCB layout to obtain the best performance. This includes the lowest possible EMI
emissions, maximum thermal conduction, mechanical integrity, and voice quality. The Enabler IIIE
module is a very compact, high performance design, yet it is easy to interface into the final product.
In order to realize its full potential, designers should pay close attention to ground structures, the
routing of RF and Digital traces, and the size of the power supply lines.
These design tips are strictly guidelines and are not
meant to be a complete list of items that guarantee
actual performance. Each application is different and
may require variation from these guidelines, however,
care should be given to utilize these sound engineering
principles whenever possible.
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4.5.1. Advanced Tips for an RF Friendly Layout
4.5.1.1. Ground Plane
To ensure the lowest possible EMI emissions and maximum thermal conductivity, it is
recommended that all metal tabs on the GSM module shield must be soldered down onto a
continuous ground plane that runs under the entire module. Ample ground vias should be
provided around the metal tabs to create a low impedance ground. It is recommended to
minimize the number of I/O and power traces and vias under the GSM module to allow for as
much ground plane as possible. If the integrated unit includes more than one board, the
design must guarantee a good RF ground connection between the boards in order to make
sure the ground planes are at the same RF potential. An example of a good ground structure
and pad layout is shown below in Figure 1.
Figure 1 - Example of good ground plane for GSM modules
4.5.1.2. Thermal Relief
Because the ground plane acts as a large heat sink, it can affect the solderability of
components. A common method to reduce this effect is to use thermal relief around the pad
in question. However, great care must be taken when using thermal relief for high current or
high frequency applications
For example, a large thermal relief like the one shown in Figure 2 can serve the purpose for
general applications such as low current, low speed data lines, DC connections and audio
frequency applications. Such thermal relief structures should be avoided for applications
where high current and/or high frequency is involved, such as those using the Enabler
Module. Depending on the frequency of operation, the long narrow thermal relief traces
between the pad and the ground plane act like an RF choke. These RF chokes become
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higher impedance at harmonics of the fundamental frequency making it problematic for high
frequency suppression. This can make it difficult to pass type approval testing.
POOR RF thermal relief
Figure 2 - Example of a POOR RF Thermal Relief
If thermal relief is necessary, it is recommended that you use short, fat traces similar to those
shown in Figure 3. This will still provide a solderable connection, while providing a better RF
connection. Making them shorter also allows for a more continuous ground plane due to less
copper being removed from the area. It is also recommended to have ground vias around all
thermal relief of critical ground pins such as the five Enabler shield tabs.
GOOD RF thermal relief
Figure 3 - Example of a GOOD RF Thermal Relief
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4.5.1.3. Antenna and RF Signal Trace
The PCB trace that feeds the RF output port must be designed for a 50 ohm characteristic
impedance, coplanar, or routed into internal layers to keep the top layer continuous around
and underneath the Enabler module. Ample ground vias should be provided around the RF
contacts, the RF trace and launch pad. If possible, keep I/O and power traces away from the
RF port. This includes traces running parallel or orthogonal to it. Thermal relief should not
be used on the antenna output port ground pads. The designer must pay close attention to
the size of the pad and thickness of the dielectric beneath the signal pad and trace. Most
PCB manufacturers can adjust the trace width to maintain 50 ohms impedance if the traces
are identified and instructions are included on the FAB drawing. This service is typically
provided at no or minimal additional cost.
For minimum RF emissions due to the fundamental frequency of operation, the Enabler
module works best with an antenna load that has a VSWR of 1.5:1 or better. The antenna
should not have gain at the harmonic frequencies; otherwise, the conducted harmonics could
get amplified to a point where the product no longer passes type approval. However, for
applications where antenna quality is less than ideal, it is recommended to have a low pass
filter (Pi structure with N=3) in the RF path to the antenna. This is a secondary plan should
there be a need to lower harmonic levels at frequencies above the PCS band. The pad
structure may also be used to match the antenna load impedance, if required. If it is not
needed, a capacitor of low reactance may be used to bridge the Pi structure.
The RF cable going between the Enable module and the antenna is very lossy, therefore, the
length of this cable should be kept as short a possible.
If multiple antennas are used in their design, care should be taken during placement selection
to minimize the coupling between the GSM antenna and the other antennas.
4.5.1.4. Vbat Input
The Enabler Vbat input can have a relative high current draw that can fluctuate rapidly,
especially when transmitting at max power and burst mode. The Vbat interface must be
designed to provide the required instantaneous voltage and current with minimal voltage
droop. This includes both sufficient bulk decoupling capacitance as well as adequate layout
provisions.
When laying out the connections to the Enabler interface connector, it is tempting to use
traces of the same width as the connector pins. However, this is a very compact connector
and traces of that width will not have sufficient copper. Similar to the discussion on thermal
relief, the use of narrow traces to connect the Vbat pins to the source voltage can act like a
high impedance and cause a significant voltage droop when higher currents are required as
shown in Figure 4.
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Figure 4 - Example of Vbat Voltage Droop
If the Vbat drops too low, the Enabler modules will reset. To minimize the trace loss, it is
suggested to use a larger trace that spans several pins as shown in Figure 5. Any concern
about solderability can be mitigated by using solder mask with cutouts for the individual pins
as shown by the blue lines in the figure. The layout should provide sufficient trace width over
the entire trace from the Enable modules all the way to the source of the Vbat voltage. Any
transitions between layers for this trace should utilize multiple vias.
Since even the best layout will have some impedance from the source to the Enabler module,
sufficient bulk decoupling capacitance is required at the Vbat input to the Enabler module. It
is suggested to use at least two 1000 uF, low ESR, tantalum capacitors located very close to
the Enabler interface connector Vbat pins. Any thermal relief used on these capacitors
should comply with the information given above in order to provide the lowest impedance
possible. The grounding of these capacitors is critical. Therefore, it should be a low
impedance and should utilize multiple vias to the internal ground plane close to the capacitor
as well.
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Vbat trace
Figure 5 - Example of GOOD Vbat layout
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4.5.2. Audio Reference Design
The audio quality is very dependent on the circuit design and layout. As an aid to obtaining good
audio quality, a reference design has been included in Figure 6 below. It has been proven to
provide good performance on the SDK module.
4.5.2.1. Audio Schematics
Figure 6 - Audio Reference Design Schematic
4.5.2.2. Audio Layout
Layout plots for the audio section of the SDK are available upon request.
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5. Technical Specifications
5.1. Detailed Product Specifications
Physical Dimensions and Weight
Size (L x W x H)
Weight
Climatic: Operational
GSM Compliant temperature
Operating temperature
Relative humidity
Air pressure (altitude) 70 kPa to 106 kPa (-400 m to 3000 m)
34mm x 28mm x 2.5mm
Without SIM Connector –
< 4.8 grams
With SIM Connector (no SIM inserted) –
< 5.2 grams
-20°C to +60°C
-30°C to +70°C
5 - 95%
Climatic: Storage and Transportation
Ambient temperature -40°C to +85°C
Relative humidity 5% to 95%, non condensing (at 40C)
Electromagnetic Emissions
Radiated spurious FCC Part 22 & 24 / Part 15 Class \ B
3GPP TS 51.010-1 Section 12.2
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