Noty an137f Linear Technology

Application Note 137
May 2012
Accurate Temperature Sensing with an External P-N Junction
Michael Jones
Introduction
Many Linear Technology devices use an external PNP transistor to sense temperature. Common examples are LTC3880, LTC3883 and LTC2974. Accurate temperature sensing depends on proper PNP selection, layout, and device configuration. This application note reviews the theory of temperature sensing and gives practical advice on implementation.
Why should you worry about implementing temperature sensing? Can’t you just put the sensor near your inductor and lay out your circuit any way you want? Unfortunately, poor routing can sacrifice temperature measurement performance and compensation. The purpose of this ap­plication note is to allow you the opportunity to get it right the first time, so you don’t have to change the layout after your board is fabricated.
Why Use Temperature Sensing?
Some Linear Technology devices measure internal and external temperature. Internal temperature is used to protect the device by shutting down operation or locking out features. For example, the LTC3880 family will prevent writing to the NVRAM when the internal temperature is above 130°C.
External temperature compensation is used to compen­sate for temperature dependent characteristics of exter­nal components, typically the DCR of an inductor. The LTC3880 uses inductor temperature to improve accuracy of current measurements. The LTC3883 and LTC2974 also compensate for thermal resistance between the sensor and inductor, plus the thermal time constant.
This application note will focus on external temperature sensing. Proper up front design and layout will prevent performance problems.
Temperature Sensing Theory
Linear Technology devices use an external bipolar transis­tor p-n junction to measure temperature. The relationship between forward voltage, current, and temperature is:
IC=ISe
V
⎛ ⎜
(nVT)
⎜ ⎝
kT
=
T
q
BE
–1
⎞ ⎟ ⎟
V
IC is the forward current
is the reverse bias saturation current
I
S
is the forward voltage
V
BE
is the thermal voltage
V
T
n is the ideality factor
k is Boltzmann’s constant
For V
>> VT the –1 can be ignored, and the approximate
BE
model of the forward voltage is:
VBE≈ n•
kT
q
In
I
C
I
S
The approximation eliminates the need for an iterative solution to the forward voltage. This equation can be rearranged to give the temperature
V
nk •In
BE
I
C
I
S
T =q•
L, LT, LTC, LTM, LTspice, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
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Application Note 137
Because n, k, and IS are constants, the simplest way to measure temperature is to force current, measure volt­age, and calculate temperature. However, the accuracy will depend on n and I
, the ideality factor and reverse
S
saturation current. These constants are process dependent and vary from lot to lot.
The diode voltage can be rewritten in delta form:
ΔVBE= V
BE1–VBE2
=
nkT
q
In
I
C1
I
C2
Rewriting for temperature:
V
()
BE1–VBE2
T =
nk
q
In
I
C1
I
C2
If we set the currents such that:
= N • I
I
C2
C1
we now have:
V
()
BE1–VBE2
T =
nk
q
In
1
N
V1
C1
2N3906
10μF
Figure 1.
Q1
AN137 F01
500μA
I
The operating point at 500μA gives a DC impedance of
1.27kΩ. The small signal impedance can be plotted in spice and is 52Ω out to 10MHz.(Solid line is magnitude of impedance, and dashed line is phase of impedance).
4
AN137 F02
2 0 –2 –4 –6 –8 –10 –12 –14 –16 –18 –20 –22 –24 –26
(DEGREE)
(dB)
34.3
34.2
34.1
34.0
33.9
33.8
33.7
33.6
33.5
33.4
33.3
33.2
33.1
33.0
32.9 100k
10M 100M1M
(Hz)
Figure 2.
The small signal impedance can be calculated as follows:
Now the temperature measurement only depends on the ideality factor n.
The ideality factor is relatively stable compared to the satu­ration current. Conceptually, the delta measurement is far more accurate than the single measurement, because the delta measurement cancels the saturation current and all other non-ideal mechanisms not modeled by the equations.
For both cases, the accuracy of temperature measure­ment depends on the forcing current accuracy, the voltage measurement accuracy, and relatively noise free signals.
Noise Sources
A typical diode temperature sensor is comprised of a 2N3906, 10μF capacitor, current source, and voltage measurement.
kT
R
small–signal
q
=
26mV
=
I
C
I
C
26mV
=
500μA
= 52Ω
This implies that fast clock and PWM signals may inject noise into the measurement if the driving impedance is close to 52Ω.
A simulation of a capacitive coupled source shows that the filter capacitor is quite effective.
R1
V1
I
500μA
Figure 3. Pulse (0 3.30 10ps 10ps 100ns 2.5μs 10000)
C1 10μF
C2 10nF
2N3906
Q1
+ –
AN137 F03
V1
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AN137-2
Application Note 137
672
665
658
651
644
637
(mV)
630
623
616
609
602
0
(ms)
2024681012141618
AN137 F04
Figure 4.
The simulation uses a 10ps 3.3V signal (V1) injected into the p-n junction (V1) via a 10nF capacitor (C1). Even a 10nF coupled noise source with very fast 10ps edges can only generate 30mV spikes shown in the simulation plot.
Another source of error comes from ground impedances.
V1
C1
I
500μA
REMOTE
GND
Figure 5. Pulse (0 2A 0 10n 10n 100ns 2.5μs 10000)
658
656
654
652
650
648
(mV)
646
644
642
640
638
636
33
2N3906
10μF
Figure 6.
(μs)
Q1
R2
0.01Ω
I
AN137 F05
4834 35 36 37 38 39 40 41 42 43 44 45 46 47
AN137 F06
A 2A current and 10mΩ trace results in a 20mV error. A typical delta V
ΔVBE=
nkT
q
is
D
1
⎜ ⎝
10
60mV
⎟ ⎠
In
For a 10% duty cycle, this might result in a 2mV DC shift.
A third source of error is a magnetic field and loop. Magnetic coupling can be modeled as a coupling between inductors.
V1
K L2 L1 0.01
t
L1
10nH
I
500μA
C1 10μF
2N3906
Q1
I
t
L2 10nH
AN137 F07
Figure 7. Pulse (0.2A 0 10n 10n 1.25μs 2.5μs 10000)
660
655
650
645
640
635
(mV)
630
625
620
615
610
464
(μs)
478466 468 470 472 474 476
AN137 F08
Figure 8.
A 3cm PCB trace over a ground plane can have about 10nH of inductance. If 2A is injected into a parallel trace and the coupling is 1.0%, 30mV of noise can be gener­ated, possibly causing a DC shift of 3mV.
HOW NOISE AFFECTS MEASUREMENTS
Linear Technology devices typically implement a lowpass filter, which filters spikes and noise. However, in some cases filtering results in a significant DC shift.
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Application Note 137
Figure 9.
The example shown in Figure 9, from an LTC3880, shows an asymmetrical waveform on the TSENSE pin (channel
1) caused by injecting some of the switch node signal into the TSENSE pin. When this is filtered, it results in a DC shift. If temperature is calculated using a ΔV and the DC shift is the same for both V the effect will be cancelled out. This means that if the error mechanism is consistent between current measure­ments, ΔV
is robust. If the single VBE measurement is
BE
used, the DC shift from the filtering will be a source of measurement error. (LTC3880 does not support single
measurements)
ΔV
BE
calculation,
BE
measurements,
BE
Figure 10.
An Example Coupling Problem
The example shown in Figure 10 comes from an LTC3880. Signal 1 is the TSENSE signal. When the LTC3880 is ap­plying 32μA, you get the higher signal level, and when it is applying 2μA, you get the lower signal level. The last high and low portions of the waveform are where the two measurements are taken. Signal 2 is the V
OUT
of the
LTC3880, which is coupling into the 32μA measurement.
If the magnitude of noise is very large with respect to ΔV
BE
, and the noise is asymmetrical (as in the scope shot) and different between current measurements, ΔV
cannot
BE
cancel out the noise. In this case a single measurement can produce a more accurate temperature measurement. For example, suppose noise causes an error of 50mV. A typical ΔV single V
Therefore, in systems with systematic noise, the ΔV
is 70mV. The error can be as high as 70%. If a
BE
is used, the error is about 50mV/600mV, or 8%.
D
BE
measurement produces the highest accuracy by eliminating
as a source of error. (See ΔVBE equation). In systems
I
S
with large non-systematic noise, the V
measurement
BE
produces the highest accuracy.
Overall, the best accuracy comes from a good layout that ensures near zero noise that is systematic, and uses a
calculation.
ΔV
BE
Non-systematic noise sources require good layout because the ΔV
approach cannot reject them.
BE
Figure 11.
The same coupling can occur in the 2μA measurement as shown in Figure 11. The asymmetry comes from the fact that the coupling affects only one of two measurements, so it is not cancelled by the ΔV
calculation. Furthermore, the
BE
error will appear random because the output turn-on event and the current forcing mechanism are not synchronized. The only defense against this error is prevention of the coupling by proper layout, or widening the fault limits.
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AN137-4
Figure 12.
MITIGATING ERROR SOURCES
There are two primary methods of preventing errors, both require proper PCB layout. The first involves elimination of shared ground paths. The second involves proper signal trace routing.
Linear Technology data sheets specify how to return current from the collector and base of the temperature measurement transistor to the device. Typically the current returns to a sense ground (SGND), or an amplifier negative (–) input.
Application Note 137
The current should return to the device via its own sense trace to ensure there is no shared impedance with high current paths, and to the data sheet specified pin.
Figure 12 shows a LTC3883 and 2N3906 PNP current sense. Q10 in circle 1 is the p-n junction temperature sensor and is filtered by C99. The purpose of C99 is to provide a low AC impedance to prevent any DC offsets from rectification or non-linear waveforms, and to keep coupled noise out of the LTC3883 ADC. The routing uses two parallel pairs on the same layer so that any coupling from noise sources becomes a common mode signal to the ADC in the LTC3883 and are rejected. The anode trace routes to the sense pin to the LTC3883 Pin 32 shown in circle 2, and the cathode is routed to SGND: the exposed PAD on the back of the LTC3883. The cathode routing to the exposed PAD ensures no high current from the power ground flows through the sense line.
Figure 13 shows an LTC2991 and two 2N3906 PNP temperature sensors. As in the previous example, ca­pacitor filtering is added near the PNP. However, capaci­tor filtering was also added at the input of the LTC2991.
Figure 13.
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Application Note 137
The longer trace run offers more opportunity to pick up noise farther from the PNP due to trace inductance. Typi­cally this capacitor is added as an option and installed only if there is a problem. Additionally, notice that the routes avoid switching areas by following the edges of the plane between functional circuits. The routes from the PNP farthest to the right go right between a LTC3883 buck converter below, and a LT1683 isolated boost above.
NOTE: Linear Technology strongly recommends Placement of a filter capacitor near the PNP tem-
perature sensor, Routing differentially, and Avoiding noisy signals. Long routes may pick up more noise, so optionally add a filter capacitor near the device.
Some designs may use a power block with built in tem­perature diode. Some of these power blocks do not have a pin for the low sense of the diode. These blocks may not have a filter capacitor. In these situations, you can place a filter on your board as close to the high side diode sense pin of the power block as possible, and try to minimize all noise sources. A low sense line can still be routed from the power ground, but you can’t eliminate the shared current from the switching path, so some noise will be injected. You can mitigate some of the problems that may result by:
1. Using a slower V
ramp rate when turning on
OUT
2. Adding an offset to the measurement using the proper
register (digital power device) to lower the measured temperature
3. Raising the overtemperature fault limit
over temperature. In general, a large ideality factor will not produce an accurate temperature measurement using the
method. The large ideality factor will lead to larger
ΔV
BE
. Furthermore, VBE may be lower because of differ-
ΔV
BE
ences in I
. This may use less of the dynamic range of
S
the ADC and increase signal to noise ratio. In the case of a single V
measurement, this will degrade results more.
BE
NOTE: Use a diode connected bipolar transistor rather than a true diode. If you want to use a diode anyway, contact Linear Technology for advice on suitability for the given device.
600
570
V
(V1)
540
510
(mV)
480
450
420
390
360
330
300
270
0
30 40 50 7060 80 90 10010 20
(μA)
V
(V2)
AN137 F14
Figure 14. 2N3906 and IN4148
An LTspice® simulation demonstrates the difference be­tween a diode connected 2N3906 and a 1N4148. The diode has almost 150mV lower voltage at 30μA.
4. Adding a capacitor on the power block
CHOICE OF P-N JUNCTION DEVICE
Even though a diode can be used to measure temperature, a diode connected PNP or NPN is preferred. The ideality factor of a diode is up to twice as large as a diode con­nected bipolar transistor. Some diodes do not exhibit increasing ΔV
with temperature, resulting in large errors
BE
AN137-6
(mV)
570
V
(V1)
540
510
480
450
420
390
360
330
300
270
0
70mV
Figure 15. 2N3906 DV
(μA)
2N3906
V
(V2)V(V2)
1N4148
10010 20 30 40 6050 70 80 90
AN137 F15
BE
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Application Note 137
The diode-connected transistor shows a typical room temperature ΔV
(mV)
of 70mV.
BE
570
V
(V1)
540
510
480
450
420
390
360
330
300
270
0
Figure 16. IN4148 ΔV
127mV
(μA)
2N3906
V
(V2)V(V2)
2N4148
10010 20 30 40 6050 70 80 90
AN137 F16
BE
The diode shows a typical room temperature ΔVBE of 127mV. If the part is using a ΔV
measurement, and if
BE
the ADC has a null and diff amp with gain, you must make certain the device can handle the larger ΔV
BE
4. Avoid routing near noise generators such as switch nodes, large current traces, large transformers, etc.
5. If using a power block, add a filter cap to the block if possible, or as close as possible to the diode pin if it can’t be on the power block.
6. Use a power block with two-pin sensing of the diode if possible.
7. If you have a sub-optimal layout, add offset to the offset register if one is available, or raise the fault limit. In some designs you can make these adjustments during turn on or soft start and restore them during steady state.
APPENDIX A: GENERAL NOISE SOURCES AND MITIGATION
A more general and analytical approach to noise is offered based on material from Noise Reduction Techniques in Electronic Systems, Henry W. Ott. These principles can guide you in solving problems not directly covered in the application note.
In all cases, if a diode is used, the controller IC must have a register for setting the ideality. Some Linear Technology controller ICs have a register for this and others don’t. The ones that don’t are typically set for a 2N3904 or 2N3906.
REVIEW OF DESIGN RULES
A simple set of design rules can prevent a lot of problems:
1. Use a diode-connected transistor. Either 2N3904 or 2N3906. Follow recommendations on the data sheet.
2. Place a filter capacitor near the diode (less than a few millimeters. Add a capacitor near the controller IC if the transistor is more than a couple of inches away if there is space.
3. Route a differential connection from the transistor to the controller IC with minimum spacing whether the part has a separate -TSENSE pin or not. If not, tie the low side to the SGND pin. If there is no SGND pin, use the PGND. Connect at the pin in all cases if possible.
Noise Sources
Conduction: noise on any PCB trace will move noise from one part of the PCB to another. Generators of voltage noise are the gate drivers, the switch node, and switching currents that flow through resistors and inductive traces.
Coupling through Impedance: Any time two currents share an impedance, the resulting voltage from one current path is superimposed on the resulting voltage due to the other current path. Shared current paths include the gate-drive­loop/drain-source-loop/temperature-sense-loop.
Coupling through parasitic impedance: PCB traces that are close together can couple through parasitic capaci­tance and mutual inductance. Low impedance switching nodes can couple to higher impedance sense nodes. For example, a gate drive can couple into a temperature sense line via stray capacitance, or a switch current can couple into a temperature sense line via an inductively coupled parallel trace.
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Application Note 137
NOISE MITIGATION
Capacitive Coupling
If a noisy trace is routed next to a sensing trace, the noise will couple to the sensing trace via capacitance.
C
COUPLING
10p
+
V
NOISE
REC
C
REC
6p
R
REC
50Ω
AN137 A1
Figure A1.
The analytical expression of the coupling from Ott is:
V
REC
=
C
jω
COUPLING
⎢ ⎢
C
COUPLING+CREC
jω+
R
()
RECCCOUPLING+CREC
1
⎤ ⎥
V
NOISE
(dB)
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
100
(Hz)
AN137 A2
90.3
90.0
89.7
89.4
89.1
(DEGREE)
88.8
88.5
88.2
87.9
87.6
87.3
87.0
10M1k 10k 100k 1M
Figure A2.
At 500kHz, the noise coupled to the receiver (temp sen­sor) is 10mV.
If a shield is added, the equivalent circuit looks like this:
+ –
C
COUPLING
10p
V
NOISE
C
SHIELD
100p
REC
C
REC
6p
R 50Ω
REC
In the case where R
is smaller than the impedance
REC
of the two capacitors, the equation can be simplified to:
REC
= jω R
REC CCOUPLING VNOISE
V
To get a sense of magnitude, a simulation of the above circuit with an input of 5V to represent a gate drive signal, and 50Ω to represent a temperature sensor, the following is the frequency response:
AC 5
AN137 A3
Figure A3.
In this case there is no coupling to the receiver at all. An example of shielding is given in the LTC2991 data sheet as shown in Figure A4:
GND SHIELD
TRACE
470pF
NPN SENSOR
Figure A4.
LTC2991
V1 V2 V3 V4 V5 V6 V7 V8
V ADR2 ADR1 ADR0
PWM
SCL SDA GND
CC
0.1μF
AN137 A4
In this case, the signals are routed differentially, so the shield is protecting against capacitive coupling into both traces. Notice that a portion of the traces is not shielded. This area must be kept small and away from noise sources.
AN137-8
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Application Note 137
The example uses 10pF coupling to give some general idea of magnitudes of coupling. It is best to make real estimates of coupling capacitance and calculate the effect.
Also note, that parallel routing does not protect against capacitive coupling if the low sense is not a high imped­ance input.
C
COUPLING
10p
+
V
NOISE
C1
10p
C
REC
6p
C2 6p
+
REC
R
REC
50Ω
R1
REC
10
AN137 A5
Figure A5.
The model in Figure A5 shows capacitive coupling into both traces.
The frequency response is almost identical to the single route because the impedance of the negative sense is almost zero, therefore the noise can’t couple into it to cancel the high side.
If the impedance on the negative sense is very high, such as 1M shown in Figure A6:
AN137 A8
99
90
81
72
63
(DEGREE)
54
45
36
27
18
9
0
–9
10M1k 10k 100k 1M
(dB)
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
100
(Hz)
Figure A8.
(dB)
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
C
COUPLING
10p
+
V
NOISE
C1
10p
C
REC
6p
REC
+
R 50Ω
REC
the attenuation is 80dB at 10kHz.
Therefore, parallel routing would work on an LTC2991 current/temperature monitor, which has ± high imped­ance inputs, but would not work on an LTC3880 family
AC 5
C2 6p
Figure A6.
R1 1M
REC
AN137 A6
digital power buck converter which has a low impedance minus input.
1
One last note: looking at the coupling equation:
V
If R
= jωR
REC
REC
REC CCOUPLING VNOISE
is reduced, so is the coupled noise. Adding a capacitor to the input of the receiver will lower the AC impedance. The simulation of this is left to the reader.
Inductive Coupling
Inductive coupling occurs when high currents flow through a trace, creating a magnetic field, and the field enters the current loop of another circuit. The current loop will have a series voltage noise source from the external field.
REC
= jωMI
V
100
(Hz)
AN137 A7
89.6
89.2
88.8
88.4
(DEGREE)
88.0
87.6
87.2
86.8
86.4
86.0
85.6
10M1k 10k 100k 1M
Figure A7.
Note 1: Parallel routing will still eliminate shared current coupling from
power ground
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Application Note 137
inductance and current. For example:
L
COUPLING1
20n
K1 L
+
V1
COUPLING1 LCOUPLING2 0.5
L
COUPLING2
20n
REC
t
t
AC 5
R
SENSOR
50Ω
R 1M
Figure A9.
Suppose the noise source is 5V, like a gate driver, driving 15Ω, which is about 300mA, similar to a typical gate driver. This couples into a 50Ω sensor that drives an amplifier input with 1M input impedance.
–10
–20
–30
–40
–50
–60
(dB)
–70
–80
–90
–100
–110
–120
100
(Hz)
Figure A10.
This will produce about 10mV at the receiver at 500kHz, (shown in Figure A10) a value similar to the capacitive coupling example.
The trace length causes the inductance, but the mutual in­ductance (represented as coupling factor in the simulation) causes the coupling. The mutual inductance is proportional to the area of the loop with the sensor and receiver.
REC
AN137 A10
10M1k 10k 100k 1M
R1 15Ω
AN137 A9
89.5
90.0
90.5
91.0
91.5
92.0
92.5
93.0
93.5
94.0
94.5
95.0
(DEGREE)
Suppose the coupling was reduced to 0.05:The received noise voltage is proportional to the mutual
AN137 A11
89.5
90.0
90.5
91.0
91.5
(DEGREE)
92.0
92.5
93.0
93.5
94.0
94.5
95.0
10M1k 10k 100k 1M
(dB)
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
–140
100
(Hz)
Figure A11.
The result is a 20dB improvement, or 1mV of coupled noise at 500kHz (shown in Figure A11).
There are several ways to make the loop smaller. The high side sense can be routed over a ground plane. This will only help at high frequencies because at low frequencies the current will take the shortest path through the ground plane, which will not be under the trace. Furthermore, the shared ground may cause coupling, which is discussed in the next section.
The high side and low side of the sensor can be routed as parallel traces as close together as possible. As long as the current only flows through the low side sense and not an alternate ground path, this will make the loop area very small. If there is an alternate ground path, the current will only flow through the low sense line if the frequency is high. Most situations allow this routing except some power blocks discussed in the main portion of the ap­plication note.
Also, a shield may be added around the parallel traces. Shields may be grounded at either end, so this must be considered. Ott gave experimental data that will aid intu­ition in deciding how to ground the low sense and shield.
AN137-10
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Application Note 137
AN137 A12
Figure A12.
The data in Figure A12 applies shielding and routing where the low sense is grounded at the sensor and receiver. This applies to the case where a power block is used and the low sense cannot be removed from the power ground return signal. Assume the sensor is the 100Ω resistor, and the receiver is the 1M resistor.
Case C represents routing the high and low sense in parallel with minimal spacing (low sense on both sides, and with low sense a ground), with a ground plane in parallel as the alternate path. Case F represents Case C with an additional shield. The minor difference in attenuation suggests that Case C is the better choice because routing is simpler. Case D represents a simple parallel routing, again with the low sense a ground.
This shows that the traditional parallel sense traces can be improved by routing the low sense (ground) on both sides of the high sense and grounding at both ends. This would apply to a power block when the low sense is tied to power ground in the module.
AN137 A13
Figure A13.
Things are better when it is possible to ground at only one end.
As in the previous cases, the sensor is the 100Ω resistor, and the receiver is the 1M resistor. Case H represents the traditional parallel close routing. This is more than 15dB better than the previous case where you are forced to ground both ends.
Case G represents routing the low sense (ground) on both sides of the high sense. This is more than 50dB better than Case C and 25dB better than Case H. This is even 10dB better than Case I, which was the example from LTC2991 used in the capacitive coupling section. However, the LTC2991 low sense is high impedance and not ground as in this example. Therefore, don’t disregard the LTC2991 data sheet.
55dB would be 8mV for a 5V noise source. 80dB would be 0.5mV for a 5V noise source. This is not an apples to apples comparison, as the experimental data was taken at 50kHz. However, the principles are clear. If you have the space, consider routing the low sense/ground on both sides of the high sense.
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa­tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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Application Note 137
Ground Coupling
Grounding loops are not typically the first source of noise coupling. However, if a sensor low sense is grounded at both ends, as when using a power block, a ground loop is formed. This loop can receive a magnetic field, hence inductive coupling, as discussed in the previous section. Not much can be done about this other than to make the shortest low sense route possible back to the receiver, and keep the layers between the trace and ground plane as thin as possible.
A more serious problem are share ground paths where one path contains high current. While it is possible to design a DC/DC converter using a parallel ground system (all loops have separate routes to the PGND pin), it is not typi­cally done because at high switching frequencies ground signals will have inductive and capacitive coupling. The typical grounding system is a multipoint ground, almost always a ground plane, or a couple of very large plane sections that attempt to separate the gate loop from the power path loop.
For sensing, the main concern is allowing sensor low sense current to share any of these paths. If the singled grounded shielding is used, then the high current grounds are avoided. If a power block is used, current will be shared on the module and its ground pin. The best you can do is route the low sense from the module ground pin to minimize the shared path.
Most devices will have two grounds that are connected at a single point. One will be called signal ground, and one power ground. The shield used to prevent capacitive and inductive grounding is always tied to the signal ground. This prevents a shared ground path at the device end of the sensor connection.
Therefore, the worst scenario is a power block without a low sense pin, with a device that only has a power ground. The best case is a sensor with access to both high and low sense, where the low sense is not grounded, and the device has a signal ground and a power ground. Controlling these cases has to be done early in the design process during component selection, long before layout.
AN137-12
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