The information in this chapter addresses some of the scenarios likely to
be encountered by Customer Field Engineering (CFE) team members.
This troubleshooting guide was created as an interim reference document
for use in the field. It provides basic “what to do if” basic
troubleshooting suggestions when the BTS equipment does not perform
per the procedure documented in the manual.
Comments are consolidated from inputs provided by CFEs in the field
and information gained form experience in Motorola labs and
classrooms.
Follow the procedure in Table 6-1 to troubleshoot any Login Failure
problem during normal operation.
StepAction
1If MGLI3 LED is solid RED, it implies a hardware failure. Reset MGLI3 by re-seating it. If this
persists, install RGLI3 card in MGLI3 slot and retry. A Red LED may also indicate no Ethernet
termination at top of frame.
2Verify that T1 is disconnected at the Channel Signaling Unit (CSU). If T1 is still connected,
verify the CBSC has disabled the BTS.
6
3Try ‘ping’ing the MGLI3.
4Verify the LMF is connected to the Primary LMF port (LAN A) in front of the BTS.
5Verify the LMF was configured properly.
6Verify the BTS-LMF cable is RG-58 (flexible black cable of less than 2.5 feet length).
7Verify the Ethernet ports are terminated properly.
8Verify a T-adapter is not used on LMF side port if connected to the BTS front LMF primary
port.
9Try connecting to the I/O panel (back of frame). Use Tri-Ax to BNC adapter at the LMF port for
this connection.
10Re-boot the CDMA LMF and retry.
11Re-seat the MGLI3 and retry.
Follow the procedure in Table 6-2 to troubleshoot a power meter
communication failure.
Table 6-2: Troubleshooting a Power Meter Communication Failure
StepAction
1Verify Power Meter is connected to LMF with GPIB adapter.
2Verify cable setup as specified in Chapter 3.
3Verify the GP-IB address of the Power Meter is set to 13. Refer to Test Equipment setup section
of Chapter 3 for details.
4Verify that Com1 port is not used by another application.
5Verify that the communications analyzer is in Talk&Listen, not Control mode.
Cannot Communicate to Communications Analyzer
Follow the procedure in Table 6-3 to troubleshoot a communication
analyzer failure.
Troubleshooting68P09255A57-2
Table 6-3: Troubleshooting a Communications Analyzer Communication Failure
StepAction
1Verify analyzer is connected to LMF with GPIB adapter.
2Verify cable setup.
3Verify the GPIB address is set to 18.
4Verify the GPIB adapter DIP switch settings are correct. Refer to Test Equipment setup section
for details.
5Verify the GPIB adapter is not locked up. Under normal conditions, only 2 green LEDs must be
‘ON’ (Power and Ready). If any other LED is continuously ‘ON’, then power-cycle the GPIB
Box and retry.
6If a Hyperterm window is open for MMI, close it.
7Verify the LMF GPIB address is set to 18
8Verify the analyzer is in Talk and Listen not Control mode.
Code Download Failure
Follow the procedure in Table 6-4 to troubleshoot any code download
failure.
6
Table 6-4: Troubleshooting Code Download Failure
StepAction
1Verify T1 is disconnected from the BTS at CSU.
2Verify LMF can communicate with the BTS device using the Status function.
3Communication to MGLI3 must first be established before trying to talk to any other BTS
device. MGLI3 must be INS_ACT state (green).
4Verify the card is physically present in the cage and powered-up.
5If card LED is solid RED, it implies hardware failure. Reset card by re-seating it. If this persists,
replace card from another slot & retry.
NOTE
The card can only be replaced by a card of the same type.
6Re-seat card and try again.
7If BBX reports a failure message and is OOS_RAM, the code load was OK. Status it.
8If the download portion completes and the reset portion fails, reset the device by selecting the
device and reset.
Cannot Download DATA to Any Device (Card)
68P09255A57-2
Follow the procedure in Table 6-5 to troubleshoot any data download
failure.
Table 6-5: Troubleshooting Data Download Failure
StepAction
1Re-seat card and repeat code and data load procedure.
6
2Verify the ROM and RAM code loads are of the same release by statusing the card. Refer to
Chapter 3, “Download the BTS” for more information.
Cannot ENABLE Device
Before a device can be enabled (placed in-service), it must be in the
OOS_RAM state (yellow on the LMF) with data downloaded to the
device. The color of the device on the LMF changes to green, once it is
enabled.
4Verify 19.6608 MHz CSM clock; MCCs will not go INS otherwise.
5The BBX should not be enabled for ATP tests.
6If MCCs give “invalid or no system time,” verify the CSM is enabled.
LPA Errors
Follow the procedure in Table 6-7 to troubleshoot any LPA errors.
Table 6-7: LPA Errors
StepAction
Troubleshooting68P09255A57-2
1If LPAs continue to give alarms, even after cycling power at the circuit breakers, then connect an
MMI cable to the LPA and set up a Hyperterminal connection. Enter
Hyperterminal window. The resulting LMF display may provide an indication of the problem.
(Call Field Support for further assistance.)
Bay Level Offset Calibration Failure
Follow the procedure in Table 6-8 to troubleshoot a BLO calibration
failure.
1Verify that TX audit passes for the BBX(s).
2If performing manual measurement, verify analyzer setup.
3Verify that no LPA in the sector is in alarm state (flashing red LED). Re-set the LPA by pulling
the circuit breaker, and, after 5 seconds, pushing it back in.
Cannot Perform Rho or Pilot Time Offset Measurement
Follow the procedure in Table 6-12 to troubleshoot a rhoand pilot time
offset measurement failure.
Table 6-12: Troubleshooting Rho and Pilot Time Offset Measurement Failure
Troubleshooting68P09255A57-2
StepAction
1Verify presence of RF signal by switching to spectrum analyzer screen.
2Verify PN offsets displayed on the analyzer is the same as the PN offset in the CDF file.
3Re-load MGLI3 data and repeat the test.
4If performing manual measurement, verify analyzer setup.
5Verify that no LPA in the sector is in alarm state (flashing red LED). Reset the LPA by pulling
the circuit breaker, and, after 5 seconds, pushing back in.
6If Rho value is unstable and varies considerably (e.g. .95,.92,.93), this may indicate that the
GPS is still phasing (i.e. trying to reach and maintain 0 freq. error). Go to the freq. bar in the
upper right corner of the Rho meter and select Hz. Press <Shift-avg> and enter 10, to obtain an
average Rho value. This is an indication the GPS has not stabilized before going INS and may
need to be re-initialized.
Cannot Perform Code Domain Power and Noise Floor Measurement
Follow the procedure in Table 6-13 to troubleshoot code domain and
noise floor measurement failure.
6
Table 6-13: Troubleshooting Code Domain Power and Noise Floor Measurement Failure
StepAction
1Verify presence of RF signal by switching to spectrum analyzer screen.
2Verify PN offset displayed on analyzer is same as PN offset being used in the CDF file.
3Disable and re-enable MCC (one or more MCCs based on extent of failure).
1Perform the test manually, using the spread CDMA signal. Verify High Stability 10 MHz
Rubidium Standard is warmed up (60 minutes) and properly connected to test set-up.
Multi-FER Test Failure
Follow the procedure in Table 6-15 to troubleshoot multi-FER failure.
Table 6-15: Troubleshooting Multi-FER Failure
StepAction
1Verify test equipment set up is correct for a FER test.
2Verify test equipment is locked to 19.6608 and even second clocks. The yellow
LED (REF UNLOCK) must be OFF.
68P09255A57-2
3Verify MCCs have been loaded with data and are INS-ACT.
4Disable and re-enable the MCC (one or more based on extent of failure).
5Disable, re-load code and data, and re-enable MCC (one or more MCCs based on
extent of failure).
6Verify antenna connections to frame are correct based on the directions messages.
6
Problem Description
Many of the Clock Synchronization Manager (CSM) boards may be
resolved in the field before sending the boards to the factory for repair.
This section describes known CSM problems identified in field returns,
some of which are field-repairable. Check these problems before
returning suspect CSM boards.
If having any problems with CSM board kit numbers, SGLN1145 or
SGLN4132, check the suffix with the kit number. If the kit has version
“AB,” then replace with version ‘‘BC’’ or higher, and return model AB
to the repair center.
No GPS Reference Source
Check the CSM boards for proper hardware configuration. RF-GPS
(Local GPS) - CSM kit SGLN1145, which should be installed in Slot l,
has an on-board GPS receiver; while kit SGLN4132, in Slot 2, does not
have a GPS receiver.
Remote GPS (R-GPS) - Kit SGLN4132ED or later, which should be
installed in both Slot 1 and Slot 2, does not have a GPS receiver. Any
incorrectly configured board must be returned to the repair center. Do notattempt to change hardware configuration in the field. Also, verify the
GPS antenna is not damaged and is installed per recommended
guidelines.
The CSM could have corrupted data in its firmware resulting in a
non-executable code. The problem is usually caused by either electrical
disturbance, or interruption of data during a download. Attempt another
download with no interruptions in the data transfer. Return CSM board
back to repair center if the attempt to reload fails.
GPS Bad RX Message T ype
This is believed to be caused by a later version of CSM software (3.5 or
higher) being downloaded, via LMF, followed by an earlier version of
CSM software (3.4 or lower), being downloaded from the CBSC.
Download again with CSM software code 3.5 or higher. Return CSM
board back to repair center if attempt to reload fails.
CSM Reference Source Configuration Error
This is caused by incorrect reference source configuration performed in
the field by software download. CSM kit SGLN1145 and SGLN4132
must have proper reference sources configured (as shown below) to
function correctly.
This may be caused by a delay in GPS acquisition. Check the accuracy
flag status and/or current position. Refer to the GSM system time/GPS
and LFR/HSO verification section in Chapter 3. At least 1 satellite
should be visible and tracked for the “surveyed” mode and 4 satellites
should be visible and tracked for the “estimated” mode. Also, verify
correct base site position data used in “surveyed” mode.
The C-CCP backplane is a multi-layer board that interconnects all the
C-CCP modules. The complexity of this board lends itself to possible
improper diagnoses when problems occur.
The following connector overview describes the major types of
backplane connectors along with the functionality of each. This will
allow the Cellular Field Engineer (CFE) to:
Determine which connector(s) is associated with a specific problem
type.
Allow the isolation of problems to a specific cable or connector.
Primary “A” and Redundant “B” ISB (Inter Shelf Bus)
connectors
The 40 pin ISB connectors provide an interface bus from the master
GLI3 to all other GLI3s in the modem frame. Its basic function is to
provide clock synchronization from the master GLI3 to all other GLI3s
in the frame.
The ISB is also provides the following functions:
Groom span line when a single span is used for multiple cages.
Provide MMI connection to/from the master GLI3 to cell site modem.
Provide interface between GLI3s and the AMR (for reporting BTS
alarms).
6
Span Line Connector
The span line input is an 8 pin RJ-45 connector that provides a primary
and secondary (if used) span line interface to each GLI3 in the C-CCP
shelf. The span line is used for MM/EMX switch control of the Master
GLI3 and also all the BBX traffic.
Power Input (Return A, B, and C connectors)
Provides a +27 Volt input for use by the power supply modules.
Power Supply Module Interface
Each power supply module has a series of three different connectors to
provide the needed inputs/outputs to the C-CCP backplane. These
include a VCC/Ground input connector, a Harting style multiple pin
interface, and a +15 V/Analog Ground output connector. The Transceiver
Power Module converts 27/48 Volts to a regulated +15, +6.5, +5.0 Volts
to be used by the C-CCP shelf cards.
6-10
GLI3 Connector
This connector consists of a Harting 4SU digital connector and a
6-conductor coaxial connector for RDM distribution. The connectors
provide inputs/outputs for the GLI3s in the C-CCP backplane.
These BNC connectors are located on the C-CCP backplane and routed
to the GLI3 board. This interface provides all the control and data
communications between the master GLI3 and the other GLI3, between
gateways, and for the LMF on the LAN.
BBX2 Connector
Each BBX connector consists of a Harting 2SU/1SU digital connector
and two 6-conductor coaxial connectors. These connectors provide DC,
digital, and RF inputs/outputs for the BBXs in the C-CCP backplane.
CIO Connectors
RX RF antenna path signal inputs are routed through RX Tri-Filters
(on the I/O plate), and via coaxial cables to the two MPC modules the six “A” (main) signals go to one MPC; the six “B” (diversity) to
the other. The MPC outputs the low-noise-amplified signals via the
C-CCP backplane to the CIO where the signals are split and sent to
the appropriate BBX.
A digital bus then routes the baseband signal through the BBX, to the
backplane, then on to the MCC slots.
Digital TX antenna path signals originate at the MCC24s. Each
output is routed from the MCC slot via the backplane appropriate
BBX.
TX RF path signal originates from the BBX, through the backplane to
the CIO, through the CIO, and via multi-conductor coaxial cabling to
the LPAs in the LPA shelf.
C-CCP Backplane Troubleshooting Procedure
The following table provides a standard procedure for troubleshooting
problems that appear to be related to a defective C-CCP backplane. The
table is broken down into possible problems and steps which should be
taken in an attempt to find the root cause.
NOTE
It is important to note that all steps be followed before replacing
ANY C-CCP backplane.
Digital Control Problems
No GLI3 Control via LMF (all GLI3s)
Follow the procedure in Table 6-16 for problems with GLI3 control.
Table 6-16: No GLI3 Control via LMF (all GLI3s)
StepAction
1Check the ethernet for proper connection, damage, shorts, or opens.
2Verify C-CCP backplane Shelf ID DIP switch is set correctly.
3Visually check the master GLI3 connector (both board and backplane) for damage.
No GLI3 Control through Span Line Connection (All
GLI3s)
Follow the procedure in Table 6-17 for problems with GLI3 control.
Table 6-17: No GLI3 Control through Span Line Connection (Both GLI3s)
StepAction
1Verify C-CCP backplane Shelf ID DIP switch is set correctly.
2Verify that the BTS and GLI3s are correctly configured in the OMCR/CBSC data base.
3Visually check the master GLI3 connector (both board and backplane) for damage.
4Replace the master GLI3 with a known good GLI3.
5Check the span line inputs from the top of the frame to the master GLI3 for proper connection and
damage.
MGLI3 Control Good - No Control over Co-located GLI3
Follow the procedure in Table 6-18 for problems with GLI3 control.
Table 6-18: MGLI3 Control Good - No Control over Co-located GLI3
StepAction
1Verify that the BTS and GLI3s are correctly configured in the OMCR CBSC data base.
2Check the ethernet for proper connection, damage, shorts, or opens.
3Visually check all GLI3 connectors (both board and backplane) for damage.
4Replace the remaining GLI3 with a known good GLI3.
6
No AMR Control (MGLI3 good)
Follow the procedure in Table 6-19 for problems with AMR control.
Table 6-19: MGLI3 Control Good - No Control over AMR
StepAction
1Visually check the master GLI3 connector (both board and backplane) for damage.
2Replace the master GLI3 with a known good GLI3.
3Replace the AMR with a known good AMR.
No BBX Control in the Shelf
Follow the procedure in Table 6-20 for problems with co-located GLI3.
Table 6-20: MGLI3 Control Good - No Control over Co-located GLI3s
StepAction
1Visually check all GLI3 connectors (both board and backplane) for damage.
2Replace the remaining GLI3 with a known good GLI3.
3Visually check BBX connectors (both board and backplane) for damage.
4Replace the BBX with a known good BBX.
Follow the procedure in Table 6-21 for problems with span line traffic.
Table 6-21: BBX Control Good - No (or Missing) Span Line Traffic
StepAction
1Visually check all GLI3 connectors (both board and backplane) for damage.
2Replace the remaining GLI3 with a known good GLI3.
3Visually check all span line distribution (both connectors and cables) for damage.
4If the problem seems to be limited to 1 BBX, replace the BBX with a known good BBX.
No (or Missing) MCC24 Channel Elements
Follow the procedure in Table 6-22 for problems with channel elements.
Table 6-22: No MCC-1X/MCC24E/MCC8E Channel Elements
StepAction
1Verify channel elements on a co-located MCC of the same type (CDF MccType codes:
MCC8E = 0; MCC24E = 2; MCC-1X = 3)
2Check MCC connectors (both module and backplane) for damage.
3 If the problem seems to be limited to one MCC, replace it with a known good MCC of the same
type.
4If no channel elements on any MCC, verify clock reference to CIO.
Potentially lethal voltage and current levels are routed to the
BTS equipment. This test must be carried out with a second
person present, acting in a safety role. Remove all rings, jewelry,
and wrist watches prior to beginning this test.
No DC Input Voltage to Power Supply Module
Follow the procedure in Table 6-23 for problems with DC input voltage.
Table 6-23: No DC Input Voltage to Power Supply Module
StepAction
1Verify DC power is applied to the BTS frame. Verify there are no breakers tripped.
* IMPORTANT
If a breaker has tripped, remove all modules from the applicable shelf supplied by the breaker and
attempt to reset it.
- If breaker trips again, there is probably a cable or breaker problem within the frame.
- If breaker does not trip, there is probably a defective module or sub-assembly within the
shelf.
2Verify that the C-CCP shelf breaker on the BTS frame breaker panel is functional.
3Use a voltmeter to determine if the input voltage is being routed to the C-CCP backplane by
measuring the DC voltage level on the PWR_IN cable.
- If the voltage is not present, there is probably a cable or breaker problem within the frame.
- If the voltage is present at the connector, reconnect and measure the level at the “VCC” power
6
feed clip on the distribution backplane. If the voltage is correct at the power clip, inspect the
clip for damage.
4If everything appears to be correct, visually inspect the power supply module connectors.
5Replace the power supply module with a known good module.
6If steps 1 through 4 fail to indicate a problem, the C-CCP backplane failure (possibly an open
trace) has occurred.
No DC Voltage (+5, +6.5, or +15 Volts) to a Specific GLI3,
BBX2, or Switchboard
Follow the procedure in Table 6-24 for problems with DC input voltage.
Table 6-24: No DC Input Voltage to any C-CCP Shelf Module
StepAction
1Verify steps outlined in Table 6-23 have been performed.
2Inspect the defective board/module (both board and backplane) connector for damage.
3Replace suspect board/module with known good board/module.
Table 6-25: No DC Input Voltage to any C-CCP Shelf Module
StepAction
1Inspect all Harting Cable connectors and back-plane connectors for damage in all the affected
board slots.
2Perform steps outlined in the RF path troubleshooting flowchart in this manual.
RFDS
The RFDS is used to perform Pre-Calibration Verification and
Post-Calibration Audits which limit-check the RFDS-generate and
reported receive levels of every path from the RFDS through the
directional coupler coupled paths. In the event of test failure, refer to the
following tables.
All tests fail
Follow the procedure in Table 6-26 for problems with RFDS.
Table 6-26: RFDS Fault Isolation - All tests fail
StepAction
1Check the calibration equipment for proper operation by manually setting the signal generator output
attenuator to the lowest output power setting and connecting the output port to the spectrum analyzer
rf input port.
2Set the signal generator output attenuator to -90 dBm, and switch on the rf output. Verify that the
spectrum analyzer can receive the signal, indicate the correct signal strength, (accounting for the cable
insertion loss), and the approximate frequency.
3Visually inspect RF cabling. Make sure each directional coupler forward and reflected port connects to
the RFDS antenna select unit on the RFDS.
4Check the wiring against the site documentation wiring diagram or the BTS Site Installation manual.
5Verify RGLI and TSU have been downloaded.
6Check to see that all RFDS boards show green on the front panel indicators. Visually check (both
board and backplane) for damage.
7Replace any boards that do not show green with known good boards one at a time in the following
If every receive or transmit path fails, the problem most likely lies with
the rf converter board or the transceiver board. Refer to Table 6-27 for
fault isolation procedures.
Table 6-27: RFDS Fault Isolation - All RX and TX paths fail
StepAction
1Visually check the master RF converter board (both board and backplane) for damage.
2Replace the RF converter board with a known good RF converter board.
3Visually check RXCVR TSU (both board and backplane) for damage.
4Replace the TSU with a known good TSU.
All tests fail on a single antenna
If all path failures are on one antenna port, forward and/or reflected,
follow the procedures in Table 6-28 checks.
Table 6-28: RFDS Fault Isolation - All tests fail on single antenna path
68P09255A57-2
StepAction
1Visually inspect the site interface cabinet internal cabling to the suspect directional coupler antenna
port.
2Verify the forward and reflected ports connect to the correct RFDS antenna select unit positions on the
RFDS backplane. Refer to the installation manual for details.
3Visually check ASU connectors (both board and backplane) for damage.
6
4Replace the ASU with a known good ASU.
5Replace the RF cables between the affected directional coupler and RFDS.
NOTE
Externally route the cable to bypass suspect segment.
Module Status Indicators
Each of the non-passive plug-in modules has a bi-color (green & red)
LED status indicator located on the module front panel. The indicator is
labeled PWR/ALM. If both colors are turned on, the indicator is yellow.
Each plug-in module, except for the fan module, has its own alarm
(fault) detection circuitry that controls the state of the PWR/ALM LED.
6-16
The fan TACH signal of each fan module is monitored by the AMR.
Based on the status of this signal the AMR controls the state of the
PWR/ALM LED on the fan module.
LED Status Combs All Modules (except GLI3, CSM, BBX2, MCC8/24E)
PWR/ALM LED
The following list describes the states of the module status indicator.
Solid GREEN - module operating in a normal (fault free) condition.
Solid RED - module is operating in a fault (alarm) condition due to
electrical hardware failure.
Note that a fault (alarm) indication may or may not be due to a complete
module failure and normal service may or may not be reduced or
interrupted.
DC/DC Converter LED Status Combinations
The PWR CNVTR has its own alarm (fault) detection circuitry that
controls the state of the PWR/ALM LED.
PWR/ALM LED
The following list describes the states of the bi-color LED.
Solid GREEN - module operating in a normal (fault free) condition.
Solid RED - module is operating in a fault (alarm) condition due to
electrical hardware problem.
CSM LED Status Combinations
PWR/ALM LED
The CSMs include on-board alarm detection. Hardware and
software/firmware alarms are indicated via the front panel indicators.
After the memory tests, the CSM loads OOS-RAM code from the Flash
EPROM, if available. If not available, the OOS-ROM code is loaded
from the Flash EPROM.
Solid GREEN - module is INS_ACT or INS_STBY no alarm.
Solid RED - Initial power up or module is operating in a fault (alarm)
condition.
Slowly Flashing GREEN - OOS_ROM no alarm.
Long RED/Short GREEN - OOS_ROM alarm.
Rapidly Flashing GREEN - OOS_RAM no alarm or
INS_ACT in DUMB mode.
6
Aug 2002
Short RED/Short GREEN - OOS_RAM alarm.
Long GREEN/Short RED - INS_ACT or INS_STBY alarm.
Off - no DC power or on-board fuse is open.
Solid YELLOW - After a reset, the CSMs begin to boot. During
SRAM test and Flash EPROM code check, the LED is yellow. (If
SRAM or Flash EPROM fail, the LED changes to a solid RED and
the CSM attempts to reboot.)
Figure 6-1: CSM Front Panel Indicators & Monitor Ports
68P09255A57-2
SYNC
MONITOR
PWR/ALM
Indicator
FREQ
MONITOR
FW00303
. . . continued on next page
FREQ Monitor Connector
A test port provided at the CSM front panel via a BNC receptacle allows
6
monitoring of the 19.6608 MHz clock generated by the CSM. When
both CSM 1 and CSM 2 are in an in-service (INS) condition, the CSM 2
clock signal frequency is the same as that output by CSM 1.
The clock is a sine wave signal with a minimum amplitude of +2 dBm
(800 mVpp) into a 50 Ω load connected to this port.
SYNC Monitor Connector
A test port provided at the CSM front panel via a BNC receptacle allows
monitoring of the “Even Second Tick” reference signal generated by the
CSMs.
At this port, the reference signal is a TTL active high signal with a pulse
width of 153 nanoseconds.
MMI Connector - Only accessible behind front panel. The
RS-232 MMI port connector is intended to be used primarily in
the development or factory environment, but may be used in the
field for debug/maintenance purposes.
RESET Pushbutton - Depressing the RESET pushbutton
causes a partial reset of the CPU and a reset of all board devices.
GLI3 will be placed in the OOS_ROM state
MMI Connector - The RS-232MMI port connector is intended
to be used primarily in the development or factory environment
but may be used in the field for debug/maintenance purposes.
Figure 6-2: GLI3 Front Panel Operating Indicators
LEDOPERATING STATUS
BPR A
BPR B
Connects to either a BPR or expansion cage and is wired as an
ethernet hub.
Connects to either a BPR or expansion cage and is wired as an
ethernet hub.
68P09255A57-2
AUX
Wired as an ethernet hub for direct connection to a personal comput−
er with a standard ethernet cable. It allows connection of ethernet
sniffer" when the ethernet switch is properly configured for port mon−
itoring.
GLI
RESET
Supports the cross−coupled ethernet circuits to the mate GLI using a
standard ethernet straight cable.
Pressing and releasing the switch resets all functions on the GLI3.
BPR BAUXRESET
ALARMOFF − operating normally
ON − briefly during power−up when the Alarm LED turns OFF
SLOW GREEN − when the GLI3 is INS (in−service)
Span
6
OFF − card is powered down, in initialization, or in standby
GREEN − operating normally
YELLOW − one or more of the equipped initialized spans is receiving
a remote alarm indication signal from the far end
RED − one or more of the equipped initialized spans is in an alarm
GLIBPR A
ALARM
SPAN
state
MMI
An RS−232, serial, asynchronous communications link for use as
an MMI port. This port supports 300 baud, up to a maximum of
115,200 baud communications.
MMI
ACT
STA
STATUSOFF − operating normally
100BASE-T to
BTS Packet Router
or Expansion cage
100BASE-T
Auxiliary Monitor
Port
Dual 100BASE-T
in a single RJ45
to Redundant
(Mate) GLI3
Reset Switch
Span (LED)
Alarm (LED)
MMI Port
Active (LED)
Status (LED)
ON − briefly during power−up when the Alarm LED turns OFF
SLOW GREEN − when the GLI3 is INS (in−service)
ACTIVE
Shows the operating status of the redundant cards. The redundant
card toggles automatically if the active card is removed or fails
ON − active card operating normally
OFF − standby card operating normally
The BBX module has its own alarm (fault) detection circuitry that
controls the state of the PWR/ALM LED.
The following list describes the states of the bi-color LED:
Solid GREEN - INS_ACT no alarm
Solid RED Red - initializing or power-up alarm
Slowly Flashing GREEN - OOS_ROM no alarm
Long RED/Short GREEN - OOS_ROM alarm
Rapidly Flashing GREEN - OOS_RAM no alarm
Short RED/Short GREEN - OOS_RAM alarm
Long GREEN/Short RED - INS_ACT alarm
MCC LED Status Combinations
The MCC module has LED indicators and connectors as described
below. See Figure 6-3. Note that the figure does not show the connectors
as they are concealed by the removable lens.
Troubleshooting68P09255A57-2
The LED indicators and their states are as follows:
PWR/ALM LED
RED - fault on module
ACTIVE LED
Off - module is inactive, off-line, or not processing traffic.
Slowly Flashing GREEN - OOS_ROM no alarm.
Rapidly Flashing Green - OOS_RAM no alarm.
Solid GREEN - module is INS_ACT, on-line, processing traffic.
PWR/ALM and ACTIVE LEDs
Solid RED - module is powered but is in reset or the BCP is inactive.
MMI Connectors
The RS-232 MMI port connector (four-pin) is intended to be used
primarily in the development or factory environment but may be used
in the field for debugging purposes.
The RJ-11 ethernet port connector (eight-pin) is intended to be used
primarily in the development environment but may be used in the field
for high data rate debugging purposes.
Preparing the LMF
Log into the LMF PC
Create site specific BTS directory
Download device loads
Ping LAN A
Ping LAN B
Download/Enable MGLI3s
Download/Enable GLI3s
Set Site Span Configuration
Download CSMs
Enable CSMs
Enable CSMs
Download/Enable MCCs*
Download BBXs*
Download TSU (in RFDS)
Program TSU NAM
illuminated
operational
per procedure
per procedure
per procedure
per procedure
per procedure
per procedure
per procedure
per procedure
per procedure
per procedure
per procedure
per procedure
per procedure
per procedure
per procedure
Test Set Calibrationper procedure
*MCCs may be MCC8Es, MCC24s or MCC-1Xs. BBXs may be BBXs or BBX-1Xs
Periodic maintenance of a site may also mandate re-optimization of
specific portions of the site. An outline of some basic guidelines is
included in the following tables.
NOTE
Re-optimization steps listed for any assembly detailed in the
tables below must be performed anytime an RF cable associated
with it is replaced.
Detailed Optimization/ATP Test Matrix
Table B-1 outlines in more detail the tests that would need to be
performed if one of the BTS components were to fail and be replaced. It
is also assumes that all modules are placed OOS-ROM via the LMF
until full redundancy of all applicable modules is implemented.
The following guidelines should also be noted when using this table.
NOTE
Various passive BTS components (such as the DRDCs, filter; etc.) only
require a TX calibration audit to be performed in lieu of a full path
calibration. If the TX path calibration audit fails, the entire RF path
calibration will need to be repeated. If the RF path calibration fails,
further troubleshooting is warranted.
Not every procedure required to bring the site back in service is
indicated in Table B-1. It is meant to be used as a guideline
ONLY. The table assumes that the user is familiar enough with
the BTS Optimization/ATP procedure to understand which test
equipment set ups, calibrations, and BTS site preparation will be
required before performing the Table # procedures referenced.
B-2
Whenever any C-CCP BACKPLANE is replaced, it is assumed that
only power to the C-CCP shelf being replaced is turned off via the
breaker supplying that shelf.
NOTE
When the CIO is replaced, the C-CCP shelf remains powered up. The
BBX boards may need to be removed, then re-installed into their
original slots, and re-downloaded (code and BLO data). RX and TX
calibration audits should then be performed.
If any significant change in signal level results from any
component being replaced in the RX or TX signal flow paths, it
would be identified by re-running the RX and TX calibration
audit command.
PRELIMINARY
Aug 2002
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Tbl
#
Table B-1: SC 4812ET BTS Optimization and ATP Test Matrix
Table B-1: SC 4812ET BTS Optimization and ATP Test Matrix
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Description
#
LPA or LPA Trunking Module
LPAC Cable
ETIB or Associated Cables
LPA Bandpass Filter or Combiner
Swithch Card
OPTIMIZATION AND TEST LEGEND:
RX Cables
TX Cables
DRDC or TRDC
MPC / EMPC
CIO
MCC24E/MCC8E/MCC-1X
BBX2/BBX-1X
SCCP Shelf Assembly (Backplane)
LFR
CSM/GPS
HSO/HSOX
50-pair Punchblock w/RGPS
RGD/20-pair Punchblock w/RGD
GLI3
CCD Card
D Required
* Perform if determined necessary for addtional fault isolation, repair assurance, or required for site
certification.
** Replace power supply modules one at a time so that power to the C-CCP shelf is not interrupted. If power
to the shelf is lost, all cards in the shelf must be downloaded again.
1.Perform on all carrier and sector TX paths to the C-CCP cage.
2.Perform on all carrier and sector RX paths to the C-CCP cage.
3.Perform on all primary and redundant TX paths of the affected carrier.
4.Perform on the affected carrier and sector TX path(s) (BBXR replacement affects all carrier
and sector TX paths)
5.Perform on the affected carrier and sector RX path(s) (BBXR replacement affects all carrier
RX paths)
6.Perform on all RF paths of the affected carrier and sector (RFDS replacement affects all
carriers)
7.Perform with redundant BBX for at least one sector on one carrier.
8.Verify performance by performing on one sector of one carrier only.
9Perform only if RGD/RGPS, LFR antenna, or HSO or LFR expansion was installed
10Verify performance by performing testing on one sector of each carrier.
Table C-1 outlines the relationship between the total of all code domain
channel element gain settings (digital root sum of the squares) and the
BBX Gain Set Point between 33.0 dBm and 44.0 dBm. The resultant
RF output (as measured at the top of the BTS in dBm) is shown in the
table. The table assumes that the BBX Bay Level Offset (BLO) values
have been calculated.
C
As an illustration, consider a BBX keyed up to produce a CDMA carrier
with only the Pilot channel (no MCCs forward link enabled). Pilot gain
is set to 262. In this case, the BBX Gain Set Point is shown to correlate
exactly to the actual RF output anywhere in the 33 to 44 dBm output
range. (This is the level used to calibrate the BTS).
Table C-1: BBX Gain Set Point vs. Actual BTS Output (in dBm)
Programming of each of the BTS BBX synthesizers is performed by the
BTS GLIs via the CHI bus. This programming data determines the
transmit and receive transceiver operating frequencies (channels) for
each BBX2.
1900 MHz PCS Channels
Figure D-1 shows the valid channels for the North American PCS
1900 MHz frequency spectrum. There are 10 CDMA wireline or
non-wireline band channels used in a CDMA system (unique per
customer operating system).
Figure D-1: North America PCS Frequency Spectrum (CDMA Allocation)
Table D-1 shows selected 1900 MHz CDMA candidate operating
channels, listed in both decimal and hexadecimal, and the corresponding
transmit, and receive frequencies. Center frequencies (in MHz) for
channels not shown in the table may be calculated as follows:
Actual frequencies used depend on customer CDMA system frequency
plan.
Each CDMA channel requires a 1.77 MHz frequency segment. The
actual CDMA carrier is 1.23 MHz wide, with a 0.27 MHz guard band on
both sides of the carrier.
Minimum frequency separation required between any CDMA carrier and
the nearest NAMPS/AMPS carrier is 900 kHz (center-to-center).
Channel Frequencies68P09255A57-2
D
Table D-1: 1900 MHz TX and RX Frequency vs. Channel
Figure D-2 shows the valid channels for the North American cellular
telephone frequency spectrum. There are 10 CDMA wireline or
non-wireline band channels used in a CDMA system (unique per
customer operating system).
Figure D-2: North American Cellular Telephone System Frequency Spectrum (CDMA Allocation).
Table D-2 shows selected 800 MHz CDMA candidate operating
channels, listed in both decimal and hexadecimal, and the corresponding
transmit, and receive frequencies. Center frequencies (in MHz) for
channels not shown in the table may be calculated as follows:
All channel elements transmitted from a BTS in a particular 1.25 MHz
CDMA channel are orthonogonally spread by 1 of 64 possible Walsh
code functions; additionally, they are also spread by a quadrature pair of
PN sequences unique to each sector.
Overall, the mobile uses this to differentiate multiple signals transmitted
from the same BTS (and surrounding BTS) sectors, and to synchronize
to the next strongest sector.
The PN offset per sector is stored on the BBXs, where the
corresponding I & Q registers reside.
The PN offset values are determined on a per BTS/per sector(antenna)
basis as determined by the appropriate cdf file content. A breakdown of
this information is found in Table E-1.
There are three basic RF chip delays currently in use. It is important to
determine what RF chip delay is valid to be able to test the BTS
functionality. This can be done by ascertaining if the CDF file
FineTxAdj value was set to “on” when the MCC was downloaded with
“image data”. The
processing delay (approximately 20 mS) in the BTS using any type of
mobile meeting IS-97 specifications.
FineTxAdj value is used to compensate for the
NOTE
NOTE
Observe the following guidelines:
If the FineTxAdj value in the cdf file is 101 (65 HEX), the
FineTxAdj has not been set. The I and Q values from the 0 table
MUST be used.
FineTxAdj value in the cdf file is 213 (D5 HEX), FineTxAdj has
If the
been set for the 14 chip table.
If the FineTxAdj value in the cdf file is 197 (C5 HEX), FineTxAdj
has been set for the 13 chip table.
CDF file I and Q values can be represented in DECIMAL or
HEX. If using HEX, add 0x before the HEX value. If necessary,
convert HEX values in Table E-1 to decimal before comparing
them to cdf file I & Q value assignments.
- If you are using a Qualcomm mobile, use the I and Q values from
the 13 chip delay table.
- If you are using a mobile that does not have the 1 chip offset
problem, (any mobile meeting the IS-97 specification), use the 14
chip delay table.
If the wrong I and Q values are used with the wrong
FineTxAdj parameter, system timing problems will occur. This
will cause the energy transmitted to be “smeared” over several
Walsh codes (instead of the single Walsh code that it was
assigned to), causing erratic operation. Evidence of smearing is
usually identified by Walsh channels not at correct levels or
present when not selected in the Code Domain Power Test.
This appendix provides information on setting up the HP8921 with PCS
interface, the HP8935 and the Advantest R3465. The Cybertest test set
doesn’t require any setup.
HP8921A Test Equipment Connections
Table F-1 depicts the rear panels of the HP 8921A test equipment as
configured to perform automatic tests. All test equipment is controlled
by the LMF via an IEEE-488/GPIB bus. The LMF expects each piece
of test equipment to have a factory-set GPIB address (refer to Table F-4).
If there is a communications problem between the LMF and any piece
of test equipment, you should verify that the GPIB addresses have been
set correctly and that the GPIB cables are firmly connected to the test
equipment.
Figure F-1 shows the connections when not using an external 10 MHz
Rubidium reference.
68P09255A57-2
Table F-1: HP8921A/600 Communications Test Set Rear Panel Connections Without Rubidium
From Test Set:To Interface:
8921A83203B CDMA83236A PCS
CW RF OUTCW RF INSMC-female - SMC-female
114.3 MHZ IF OUT114.3 MHZ IF INSMC-female - SMC-female
F
IQ RF INIQ RF OUTSMC-female - SMC-female
DET OUTAUX DSP INSMC-female - SMC-female
CONTROL I/OCONTROL I/O45-pin custom BUS
10 MHZ OUTSYNTH REF INBNC-male - BNC-male
HPIB INTERFACEHPIB INTERFACEHPIB cable
Follow the steps in Table F-3 to verify that the connections between the
PCS Interface and the HP8921A are correct and cables are intact. The
software also performs basic functionality checks of each instrument.
68P09255A57-2
NOTE
Table F-3: System Connectivity
StepAction
Disconnect other GPIB devices, especially system controllers,
from the system before running the connectivity software.
* IMPORTANT
- Perform this procedure after test equipment has been allowed to warm-up and stabilize for a
minimum of 60 minutes.
1Insert HP 83236A Manual Control/System card into memory card slot.
2Press the [PRESET] pushbutton.
3Press the Screen Control [TESTS] pushbutton to display the “Tests” Main Menu screen.
4Position the cursor at Select Procedure Location and select it by pressing the cursor control knob. In
the Choices selection box, select Card.
5Position the cursor at Select Procedure Filename and select it by pressing the cursor control knob. In
the Choices selection box, select SYS_CONN.
6Position the cursor at RUN TEST and select it. The software will prompt you through the
connectivity setup.
7Do the following when the test is complete,
position cursor on STOP TEST and select it
F
OR press the [K5] pushbutton.
8To return to the main menu, press the [K5] pushbutton.
9Press the [PRESET] pushbutton.
Setting HP8921A and HP83236A/B GPIB Address
Follow the steps in Table F-4 to set the HP8921A GPIB address.
Table F-4: Setting HP8921A GPIB Address
StepAction
1If you have not already done so, turn the HP8921A power on.
2Verify that the GPIB addresses are set correctly.
HP8921A HP-IB Adrs = 18, accessed by pushing LOCAL and selecting More and I/O Configure
on the HP8921A/600. (Consult test equipment OEM documentation for additional info as required).
HP83236A (or B) PCS Interface GPIB address=19. Set dip switches as follows:
Before the HP8921A CDMA analyzer is used for LMF controlled testing
it must be set up correctly for automatic testing.
Table F-5: Pretest Setup for HP8921A
StepAction
1Unplug the memory card if it is plugged in.
2Press the CURSOR CONTROL knob.
3Position the cursor at IO CONFIG (under To Screen and More) and select it.
4Select Mode and set for Talk&Lstn .
Pretest Setup for HP8935
Before the HP8935 CDMA analyzer is used for LMF controlled testing
it must be set up correctly for automatic testing.
Table F-6: Pretest Setup for HP8935
StepAction
Test Equipment Setup68P09255A57-2
1Unplug the memory card if it is plugged in.
2Press the Shift button and then press the I/O Config button.
3Press the Push to Select knob.
4Position the cursor at IO CONFIG and select it.
5Select Mode and set for Talk&Lstn.
Advantest R3465 Connection
The following diagram depicts the rear panels of the Advantest test
equipment as configured to perform automatic tests. All test equipment
is controlled by the LMF via an IEEE-488/GPIB bus. The LMF expects
each piece of test equipment to have a factory-set GPIB address (refer to
Table F-7). If there is a communications problem between the LMF and
any piece of test equipment, you should verify that the GPIB addresses
have been set correctly and that the GPIB cables are firmly connected to
the test equipment.
Figure F-3 shows the connections when not using an external 10 MHz
Rubidium reference.